TW200617993A - Thick-film conductor paste - Google Patents
Thick-film conductor pasteInfo
- Publication number
- TW200617993A TW200617993A TW094118843A TW94118843A TW200617993A TW 200617993 A TW200617993 A TW 200617993A TW 094118843 A TW094118843 A TW 094118843A TW 94118843 A TW94118843 A TW 94118843A TW 200617993 A TW200617993 A TW 200617993A
- Authority
- TW
- Taiwan
- Prior art keywords
- thick
- windshield
- antimony oxide
- antimony
- composition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/008—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character comprising a mixture of materials covered by two or more of the groups C03C17/02, C03C17/06, C03C17/22 and C03C17/28
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
- C03C8/12—Frit compositions, i.e. in a powdered or comminuted form containing lead containing titanium or zirconium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/119—Deposition methods from solutions or suspensions by printing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Composite Materials (AREA)
- Glass Compositions (AREA)
- Conductive Materials (AREA)
- Non-Adjustable Resistors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Surface Treatment Of Glass (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/881,920 US20060001009A1 (en) | 2004-06-30 | 2004-06-30 | Thick-film conductive paste |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200617993A true TW200617993A (en) | 2006-06-01 |
Family
ID=35285391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094118843A TW200617993A (en) | 2004-06-30 | 2005-06-08 | Thick-film conductor paste |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060001009A1 (zh) |
EP (1) | EP1621525A3 (zh) |
JP (1) | JP2006016298A (zh) |
KR (1) | KR100786002B1 (zh) |
CN (1) | CN1716458A (zh) |
TW (1) | TW200617993A (zh) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7462304B2 (en) | 2005-04-14 | 2008-12-09 | E.I. Du Pont De Nemours And Company | Conductive compositions used in the manufacture of semiconductor device |
US7556748B2 (en) * | 2005-04-14 | 2009-07-07 | E. I. Du Pont De Nemours And Company | Method of manufacture of semiconductor device and conductive compositions used therein |
US7494607B2 (en) * | 2005-04-14 | 2009-02-24 | E.I. Du Pont De Nemours And Company | Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom |
US7435361B2 (en) | 2005-04-14 | 2008-10-14 | E.I. Du Pont De Nemours And Company | Conductive compositions and processes for use in the manufacture of semiconductor devices |
US7326367B2 (en) * | 2005-04-25 | 2008-02-05 | E.I. Du Pont De Nemours And Company | Thick film conductor paste compositions for LTCC tape in microwave applications |
TW200926210A (en) * | 2007-09-27 | 2009-06-16 | Murata Manufacturing Co | Ag electrode paste, solar battery cell, and process for producing the solar battery cell |
US7485245B1 (en) | 2007-10-18 | 2009-02-03 | E.I. Du Pont De Nemours And Company | Electrode paste for solar cell and solar cell electrode using the paste |
WO2009052343A1 (en) * | 2007-10-18 | 2009-04-23 | E. I. Du Pont De Nemours And Company | Conductive compositions and processes for use in the manufacture of semiconductor devices: flux materials |
TW201007770A (en) * | 2008-06-06 | 2010-02-16 | Du Pont | Glass compositions used in conductors for photovoltaic cells |
WO2010011429A1 (en) * | 2008-06-26 | 2010-01-28 | E. I. Du Pont De Nemours And Company | Glass compositions used in conductors for photovoltaic cells |
US8076777B2 (en) * | 2008-06-26 | 2011-12-13 | E. I. Du Pont De Nemours And Company | Glass compositions used in conductors for photovoltaic cells |
CN102066275A (zh) * | 2008-09-04 | 2011-05-18 | 日本电气硝子株式会社 | 电极形成用玻璃组合物和电极形成材料 |
CN101462832B (zh) * | 2009-01-12 | 2013-07-17 | 付明 | 一种环保型汽车挡风玻璃除霜加热线银浆料 |
CN102317227A (zh) * | 2009-02-24 | 2012-01-11 | 日本电气硝子株式会社 | 电极形成用玻璃组合物和电极形成材料 |
CN102348657A (zh) * | 2009-04-09 | 2012-02-08 | E.I.内穆尔杜邦公司 | 用于光伏电池导体中的玻璃组合物 |
JP2012523366A (ja) * | 2009-04-09 | 2012-10-04 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 光起電力セル用の導体中に使用されるガラス組成物 |
CN102369168A (zh) * | 2009-04-09 | 2012-03-07 | E.I.内穆尔杜邦公司 | 用于光伏电池导体中的玻璃组合物 |
CN101864201B (zh) * | 2009-04-15 | 2012-11-07 | 深圳市奥迪博士科技有限公司 | 导电发热钢化玻璃介质浆料及其制造方法 |
JP5246808B2 (ja) * | 2010-04-07 | 2013-07-24 | 太陽ホールディングス株式会社 | 導電ペースト及び導電パターン |
KR101311098B1 (ko) * | 2010-04-07 | 2013-09-25 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | 도전 페이스트 및 도전 패턴 |
WO2011163534A1 (en) | 2010-06-24 | 2011-12-29 | E. I. Du Pont De Nemours And Company | Process for the formation of a silver back anode of a silicon solar cell |
KR101309809B1 (ko) | 2010-08-12 | 2013-09-23 | 제일모직주식회사 | 태양전지용 알루미늄 페이스트 및 이를 이용한 태양전지 |
WO2012023413A1 (ja) * | 2010-08-17 | 2012-02-23 | 日本電気硝子株式会社 | 電極形成用ガラス及びこれを用いた電極形成材料 |
JP5850388B2 (ja) * | 2010-08-26 | 2016-02-03 | 日本電気硝子株式会社 | 電極形成用ガラス及びこれを用いた電極形成材料 |
KR101795112B1 (ko) | 2010-10-28 | 2017-11-07 | 헤레우스 프레셔스 메탈즈 노스 아메리카 콘쇼호켄 엘엘씨 | 금속 첨가제를 함유하는 태양 전지 금속화 |
KR101199194B1 (ko) * | 2010-10-28 | 2012-11-07 | 엘지이노텍 주식회사 | 태양 전지의 전면 전극용 페이스트 조성물 및 태양 전지 |
BE1020040A3 (fr) * | 2011-06-28 | 2013-04-02 | Agc Glass Europe | Vitrage chauffant. |
US20130056060A1 (en) * | 2011-09-07 | 2013-03-07 | E I Du Pont De Nemours And Company | Process for the production of lfc-perc silicon solar cells |
CN102503149B (zh) * | 2011-09-22 | 2014-06-25 | 上海交通大学 | 一种太阳能电池正极银浆用低铅玻璃粉及其制备方法 |
CN102403049B (zh) * | 2011-11-22 | 2013-11-13 | 华东微电子技术研究所合肥圣达实业公司 | 一种防雷型ZnO压敏电阻用无铅电极银浆料及其制备方法 |
US9039942B2 (en) | 2011-12-21 | 2015-05-26 | E I Du Pont De Nemours And Company | Lead-free conductive paste composition and semiconductor devices made therewith |
EP2607327A1 (en) * | 2011-12-23 | 2013-06-26 | Heraeus Precious Metals GmbH & Co. KG | Thick-film composition containing antimony oxides and their use in the manufacture of semi-conductor devices |
US20130183795A1 (en) * | 2012-01-16 | 2013-07-18 | E I Du Pont De Nemours And Company | Solar cell back side electrode |
CA2896539C (en) * | 2012-12-26 | 2018-07-03 | Quest Diagnostics Investments Incorporated | C peptide detection by mass spectrometry |
JP2016186996A (ja) * | 2015-03-27 | 2016-10-27 | 三菱電機株式会社 | 固定抵抗器の耐硫化性評価方法および固定抵抗器の耐硫化性評価装置 |
JP6771989B2 (ja) * | 2016-08-09 | 2020-10-21 | ヒロセ電機株式会社 | 回路基板用電気コネクタ |
JP2022544498A (ja) * | 2019-08-13 | 2022-10-19 | サン-ゴバン グラス フランス | ガラス基材上の銀ワイヤの腐食低減 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3583931A (en) * | 1969-11-26 | 1971-06-08 | Du Pont | Oxides of cubic crystal structure containing bismuth and at least one of ruthenium and iridium |
US3928243A (en) * | 1974-07-03 | 1975-12-23 | Gen Motors Corp | Thick film resistor paste containing tantala glass |
US4312770A (en) * | 1979-07-09 | 1982-01-26 | General Motors Corporation | Thick film resistor paste and resistors therefrom |
JPS5721009A (en) * | 1980-07-11 | 1982-02-03 | Murata Manufacturing Co | Electrode paste for semiconductor porcelain |
US4775511A (en) * | 1986-07-08 | 1988-10-04 | William Kono | Method of sulfide tarnish inhibiting of silver-copper, silver-gold and silver-copper-gold alloys |
JP2568075B2 (ja) * | 1986-11-20 | 1996-12-25 | 旭硝子株式会社 | 導体用組成物 |
JPH0277473A (ja) * | 1988-09-14 | 1990-03-16 | Hitachi Chem Co Ltd | 無機導電塗料 |
JPH02213432A (ja) * | 1989-02-10 | 1990-08-24 | Dai Ichi Kogyo Seiyaku Co Ltd | 導電性組成物 |
FR2657343B1 (fr) * | 1990-01-19 | 1993-01-29 | Saint Gobain Vitrage Int | Couche mince pour vitrage de protection solaire. |
JPH03227376A (ja) * | 1990-01-31 | 1991-10-08 | Hitachi Chem Co Ltd | 無機導電性塗料の製造方法 |
JPH04291901A (ja) * | 1991-03-20 | 1992-10-16 | Sumitomo Metal Mining Co Ltd | 抵抗被膜形成用組成物 |
JPH04342771A (ja) * | 1991-05-17 | 1992-11-30 | Yamamura Glass Co Ltd | 透明導電膜形成用ペースト及び透明導電膜形成方法 |
US5296413A (en) * | 1991-12-03 | 1994-03-22 | E. I. Du Pont De Nemours And Company | Automotive glass thick film conductor paste |
JPH0640821A (ja) * | 1992-07-24 | 1994-02-15 | Toshiba Silicone Co Ltd | 防カビ性ポリオルガノシロキサン組成物 |
JPH06252524A (ja) * | 1993-02-26 | 1994-09-09 | Asahi Glass Co Ltd | 導体付きセラミックス基板の製造方法 |
JPH0820734A (ja) * | 1994-07-06 | 1996-01-23 | Sumitomo Osaka Cement Co Ltd | 導電性塗料および透明導電性膜 |
US5439852A (en) * | 1994-08-01 | 1995-08-08 | E. I. Du Pont De Nemours And Company | Cadmium-free and lead-free thick film conductor composition |
JPH08148787A (ja) * | 1994-11-21 | 1996-06-07 | Sumitomo Kinzoku Ceramics:Kk | 厚膜ペースト |
JPH1087344A (ja) | 1996-09-10 | 1998-04-07 | Toru Yamamoto | 分相化透明導電膜及びその製造方法 |
US6139652A (en) * | 1997-01-23 | 2000-10-31 | Stern-Leach | Tarnish-resistant hardenable fine silver alloys |
-
2004
- 2004-06-30 US US10/881,920 patent/US20060001009A1/en not_active Abandoned
-
2005
- 2005-04-25 EP EP05009023A patent/EP1621525A3/en not_active Withdrawn
- 2005-06-08 TW TW094118843A patent/TW200617993A/zh unknown
- 2005-06-27 JP JP2005186595A patent/JP2006016298A/ja not_active Withdrawn
- 2005-06-29 KR KR1020050056722A patent/KR100786002B1/ko not_active IP Right Cessation
- 2005-06-30 CN CNA2005100822539A patent/CN1716458A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2006016298A (ja) | 2006-01-19 |
KR20060048660A (ko) | 2006-05-18 |
KR100786002B1 (ko) | 2007-12-14 |
EP1621525A3 (en) | 2007-04-25 |
EP1621525A2 (en) | 2006-02-01 |
US20060001009A1 (en) | 2006-01-05 |
CN1716458A (zh) | 2006-01-04 |
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