TW200615390A - Vaporizing temperature sensitive materials - Google Patents

Vaporizing temperature sensitive materials

Info

Publication number
TW200615390A
TW200615390A TW094119929A TW94119929A TW200615390A TW 200615390 A TW200615390 A TW 200615390A TW 094119929 A TW094119929 A TW 094119929A TW 94119929 A TW94119929 A TW 94119929A TW 200615390 A TW200615390 A TW 200615390A
Authority
TW
Taiwan
Prior art keywords
temperature sensitive
sensitive materials
vaporizing temperature
vaporizing
substrate surface
Prior art date
Application number
TW094119929A
Other languages
English (en)
Inventor
Jeremy M Grace
Michael Long
Bruce E Koppe
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of TW200615390A publication Critical patent/TW200615390A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW094119929A 2004-06-17 2005-06-16 Vaporizing temperature sensitive materials TW200615390A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/870,623 US20050281948A1 (en) 2004-06-17 2004-06-17 Vaporizing temperature sensitive materials

Publications (1)

Publication Number Publication Date
TW200615390A true TW200615390A (en) 2006-05-16

Family

ID=34971736

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094119929A TW200615390A (en) 2004-06-17 2005-06-16 Vaporizing temperature sensitive materials

Country Status (6)

Country Link
US (1) US20050281948A1 (zh)
EP (1) EP1759035B1 (zh)
JP (2) JP2008503854A (zh)
CN (1) CN100549218C (zh)
TW (1) TW200615390A (zh)
WO (1) WO2006007280A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060141135A1 (en) * 2004-12-29 2006-06-29 Jian Wang Processes for forming layers for electronic devices using heating elements
US20070231490A1 (en) * 2006-03-29 2007-10-04 Eastman Kodak Company Uniformly vaporizing metals and organic materials
TW200815616A (en) * 2006-05-31 2008-04-01 Univ Vanderbilt Solvent-enhanced wavelength-selective infrared laser vapor deposition of polymers and applications of same
ITPD20070036A1 (it) * 2007-02-05 2008-08-06 Sincrotrone Trieste S C P A Metodo di marcatura di un oggetto basato su centri di colore
US8119204B2 (en) * 2007-04-27 2012-02-21 Semiconductor Energy Laboratory Co., Ltd. Film formation method and method for manufacturing light-emitting device
CN102131951A (zh) * 2008-07-28 2011-07-20 多摩-技术转让机关株式会社 物理气相沉积装置及物理气相沉积方法
EP2461387A4 (en) * 2009-07-31 2013-01-23 Udc Ireland Ltd VAPOR DEPOSITION MATERIAL FOR ORGANIC DEVICE AND METHOD FOR MANUFACTURING ORGANIC DEVICE
AT512949B1 (de) * 2012-06-04 2016-06-15 Leica Microsysteme Gmbh Verfahren zur Beschichtung mit einem Verdampfungsmaterial
CN111286185B (zh) * 2020-02-28 2022-05-20 珀力玛新材料(苏州)有限公司 温变调光材料、含温变调光材料的变色玻璃和其制备方法
JP7434261B2 (ja) * 2021-12-02 2024-02-20 長州産業株式会社 蒸着装置及び蒸着方法

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2447789A (en) * 1945-03-23 1948-08-24 Polaroid Corp Evaporating crucible for coating apparatus
US3023727A (en) * 1959-09-10 1962-03-06 Ibm Substrate processing apparatus
US3104178A (en) * 1960-12-23 1963-09-17 Ibm Evaporative coating method
US3607135A (en) * 1967-10-12 1971-09-21 Ibm Flash evaporating gallium arsenide
US3990894A (en) * 1969-10-29 1976-11-09 Katsuragawa Denki Kabushiki Kaisha Method of preparing photosensitive element for use in electrophotography
GB1506013A (en) * 1974-02-25 1978-04-05 Canon Kk Apertured photosensitive screens in electrophotographic apparatus
US4226899A (en) * 1978-08-21 1980-10-07 General Dynamics Corporation Electronics Division Method for fabricating controlled TCR thin film resistors
JPS59104472A (ja) * 1982-12-03 1984-06-16 Nippon Telegr & Teleph Corp <Ntt> フラツシユ蒸着方法
JPS6271666A (ja) * 1985-09-25 1987-04-02 Nhk Spring Co Ltd サ−マルヘツド
US4885211A (en) * 1987-02-11 1989-12-05 Eastman Kodak Company Electroluminescent device with improved cathode
US4769292A (en) * 1987-03-02 1988-09-06 Eastman Kodak Company Electroluminescent device with modified thin film luminescent zone
US4894307A (en) * 1988-11-04 1990-01-16 Xerox Corporation Processes for preparing and controlling the fractionation of chalcogenide alloys
JPH02156078A (ja) * 1988-12-09 1990-06-15 Hitachi Ltd 薄膜の製造方法及び電子線蒸着装置
US5195651A (en) * 1991-06-26 1993-03-23 The United States Of America As Represented By The United States Department Of Energy Ball feeder for replenishing evaporator feed
JPH0539565A (ja) * 1991-08-05 1993-02-19 Kobe Steel Ltd 昇華性材料片の蒸発槽
US5276380A (en) 1991-12-30 1994-01-04 Eastman Kodak Company Organic electroluminescent image display device
DE4201584C1 (zh) * 1992-01-22 1993-04-15 Leybold Ag, 6450 Hanau, De
JPH06223970A (ja) * 1993-01-25 1994-08-12 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子の製造方法
JP2829221B2 (ja) * 1993-06-30 1998-11-25 財団法人国際超電導産業技術研究センター 熱プラズマ蒸発法による金属基板上への酸化物の成膜方法
JPH0774111A (ja) * 1993-09-01 1995-03-17 Toshiba Corp 蒸気発生回収装置
JP3813217B2 (ja) 1995-03-13 2006-08-23 パイオニア株式会社 有機エレクトロルミネッセンスディスプレイパネルの製造方法
JP3491329B2 (ja) * 1994-03-25 2004-01-26 チッソ株式会社 有機薄膜電界発光素子およびその製造法
US5474809A (en) * 1994-12-27 1995-12-12 General Electric Company Evaporation method
JPH093626A (ja) * 1995-06-21 1997-01-07 Sanyu Denshi Kk カーボン蒸着装置
JPH1025563A (ja) * 1996-07-08 1998-01-27 Shinko Seiki Co Ltd 真空蒸着装置及び真空蒸着方法
DE69735666T2 (de) * 1996-12-17 2007-01-25 Toray Industries, Inc. Verfahren und vorrichtung zur herstellung von plasmaanzeige
US6022104A (en) * 1997-05-02 2000-02-08 Xerox Corporation Method and apparatus for reducing intercolor bleeding in ink jet printing
JP3508484B2 (ja) * 1997-07-14 2004-03-22 松下電器産業株式会社 機能性薄膜の形成方法及び形成装置
JP3775909B2 (ja) * 1997-11-07 2006-05-17 株式会社アルバック 有機薄膜製造方法、及び有機蒸着装置
US6040017A (en) * 1998-10-02 2000-03-21 Sigma Laboratories, Inc. Formation of multilayered photonic polymer composites
US6268695B1 (en) * 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
DE19956811A1 (de) * 1999-11-25 2001-06-13 Kempten Elektroschmelz Gmbh Keramischer Flash-TV-Verdampfer
DE10007059A1 (de) * 2000-02-16 2001-08-23 Aixtron Ag Verfahren und Vorrichtung zur Herstellung von beschichteten Substraten mittels Kondensationsbeschichtung
JP2002030419A (ja) * 2000-07-18 2002-01-31 Canon Inc 成膜装置および方法
US6676990B1 (en) * 2000-07-27 2004-01-13 Eastman Kodak Company Method of depositing aluminum-lithium alloy cathode in organic light emitting devices
US6515314B1 (en) * 2000-11-16 2003-02-04 General Electric Company Light-emitting device with organic layer doped with photoluminescent material
US20030129299A1 (en) * 2000-11-16 2003-07-10 Swanson Leland S. Selective deposition of emissive layer in electroluminescent displays
JP2003069193A (ja) * 2001-08-27 2003-03-07 Ari Ide フレキシブルプリント基板、その製造方法及び装置
JP4040543B2 (ja) * 2002-07-08 2008-01-30 キヤノン株式会社 液体吐出装置及び方法、パネル製造装置及び製造方法、カラーフィルタ製造方法、液晶表示パネルの製造方法、液晶表示パネルを備えた装置の製造方法
US7067170B2 (en) * 2002-09-23 2006-06-27 Eastman Kodak Company Depositing layers in OLED devices using viscous flow
JP2004134250A (ja) * 2002-10-10 2004-04-30 Tokki Corp 蒸着装置における有機材料用蒸発源及びその蒸着装置
US20050229856A1 (en) * 2004-04-20 2005-10-20 Malik Roger J Means and method for a liquid metal evaporation source with integral level sensor and external reservoir
JP4679291B2 (ja) * 2005-08-05 2011-04-27 日立造船株式会社 真空蒸着用蒸発方法および装置

Also Published As

Publication number Publication date
EP1759035A1 (en) 2007-03-07
JP2013091857A (ja) 2013-05-16
WO2006007280A1 (en) 2006-01-19
US20050281948A1 (en) 2005-12-22
JP2008503854A (ja) 2008-02-07
CN100549218C (zh) 2009-10-14
JP5767258B2 (ja) 2015-08-19
CN1969055A (zh) 2007-05-23
EP1759035B1 (en) 2011-08-17

Similar Documents

Publication Publication Date Title
TW200615390A (en) Vaporizing temperature sensitive materials
WO2005083146A3 (en) Vaporizing temperature sensitive materials for oled
WO2008112661A3 (en) Heating unit for use in a drug delivery device
EP1122801A3 (en) Thin film formation apparatus and method of manufacturing self-light-emitting device using thin film formation apparatus
EP1391946A3 (en) Apparatus for permitting transfer of organic material from a donor web to form a layer in an oled device
TW200638567A (en) Electronic device including a guest material within a layer and a process for forming the same
WO2005109095A3 (en) Method for imprint lithography at constant temperature
TW200746375A (en) Thermal interconnect and interface systems, methods of production and uses thereof
ATE371587T1 (de) Vorrichtung zur endwärmebehandlung einer verpackung mit einer thermoplastischen folie
WO2008069930A3 (en) Flexible substrates having a thin-film barrier
MX2010000678A (es) Procesos de fabricacion con tiempo de ciclo reducido para dispositivos resistivos de pelicula gruesa.
WO2008014312A3 (en) Printing on a heated substrate
TW200620465A (en) Substrate treatment device and manufacturing method for semiconductor device
TWI264473B (en) Vacuum deposition device and vacuum deposition method
TW200703511A (en) Inorganic semiconductive films and methods therefor
WO2008076320A3 (en) Processing apparatus, coated article and associated method
TW200705596A (en) Droplet discharge device, method of manufacturing liquid crystal display and liquid crystal display
WO2007100565A3 (en) Air treatment device with heated volatile dispenser
MY138591A (en) Vapor detecting method and vapor detecting device
JP2009503256A5 (zh)
ATE392492T1 (de) Verdampfervorrichtung zum beschichten von substraten
WO2007080594A3 (en) Method and apparatus for generating ion beam
MY165365A (en) Method for applying a pressure sensitive shrink label to an article
TW200622014A (en) Controlling the application of vaporized organic material
TW200624577A (en) Controlling the vaporization of organic material