JP7434261B2 - 蒸着装置及び蒸着方法 - Google Patents
蒸着装置及び蒸着方法 Download PDFInfo
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- JP7434261B2 JP7434261B2 JP2021196195A JP2021196195A JP7434261B2 JP 7434261 B2 JP7434261 B2 JP 7434261B2 JP 2021196195 A JP2021196195 A JP 2021196195A JP 2021196195 A JP2021196195 A JP 2021196195A JP 7434261 B2 JP7434261 B2 JP 7434261B2
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- vapor deposition
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- 238000007740 vapor deposition Methods 0.000 title claims description 191
- 238000000034 method Methods 0.000 title claims description 24
- 239000000758 substrate Substances 0.000 claims description 106
- 238000002347 injection Methods 0.000 claims description 80
- 239000007924 injection Substances 0.000 claims description 80
- 239000000463 material Substances 0.000 claims description 73
- 238000009792 diffusion process Methods 0.000 claims description 12
- 239000010408 film Substances 0.000 description 24
- 238000010438 heat treatment Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
本発明の一実施形態に係る図1、2の蒸着装置10は、蒸着源11、基板保持部12及び制御板13を備える。なお、蒸着装置10は、適切な真空度が維持される真空チャンバ(図示しない)内に配置される。真空チャンバには、真空チャンバ内の気体を排出させて、真空チャンバ内の圧力を低下させる真空ポンプ、真空チャンバ内に一定の気体を注入して、真空チャンバ内の圧力を上昇させるベンティング手段などが備えられていてよい。
以下、蒸着装置10の使用方法、すなわち蒸着装置10を用いた蒸着方法を説明し、あわせて蒸着装置10及びこの蒸着装置10を用いた蒸着方法の利点について説明する。
本発明は上述した実施の形態に限定されるものではなく、本発明の要旨を変更しない範囲でその構成を変更することもできる。例えば、噴射ノズルの数は特に限定されるものではなく、1本でもよく、2本、3本又は5本以上であってもよい。但し、制御板13内に近接して配置可能なサイズ等の観点から、噴射ノズルの本数は、1本以上6本以下が好ましく、2本以上4本以下がより好ましい場合もある。
11 蒸着源
12 基板保持部
13 制御板
14 噴射ノズル
15 噴射口
16 レール
A 基板
B マスク
C 蒸着膜
D 蒸着材
E マスクの開口の外縁位置
S シャドー
S1 アウターシャドー
S2 インナーシャドー
Claims (4)
- 平面視円形状の基板に対して蒸着を行う蒸着装置であって、
蒸着材を噴射する噴射口が設けられた1又は複数の噴射ノズル、
上記基板の一方の面が上記1又は複数の噴射ノズルの噴射口と対向するように上記基板を保持する基板保持部、及び
上記1又は複数の噴射ノズルの噴射口を囲い、噴射される上記蒸着材の拡散方向を制御するように、上記基板に対して垂直に配置される円筒状の制御板
を備え、
上記基板保持部が、上記基板の法線方向を回転軸として上記基板を回転可能に構成されており、
上記1又は複数の噴射ノズルと上記制御板とが、一体となって上記基板と平行に、上記基板の一端から他端まで蒸着できるような範囲で往復移動可能に構成されており、
上記円筒状の制御板の内径が上記基板の直径より小さい、蒸着装置。 - 上記1又は複数の噴射ノズルと上記基板との間の距離が調整可能に、且つ
上記制御板が、サイズの異なる他の円筒状の制御板に交換可能に構成されている請求項1に記載の蒸着装置。 - 上記1又は複数の噴射ノズルが複数の噴射ノズルであり、
それぞれの上記噴射ノズルの噴射口から異なる蒸着材が噴射される請求項1又は請求項2に記載の蒸着装置。 - 請求項1から請求項3のいずれか1項に記載の蒸着装置を用いて上記基板に対して蒸着を行う工程を備える蒸着方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021196195A JP7434261B2 (ja) | 2021-12-02 | 2021-12-02 | 蒸着装置及び蒸着方法 |
CN202211278437.2A CN116219366A (zh) | 2021-12-02 | 2022-10-19 | 蒸镀装置和蒸镀方法 |
KR1020220162178A KR20230083229A (ko) | 2021-12-02 | 2022-11-29 | 증착 장치 및 증착 방법 |
TW111145923A TWI835440B (zh) | 2021-12-02 | 2022-11-30 | 蒸鍍裝置和蒸鍍方法 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2021196195A JP7434261B2 (ja) | 2021-12-02 | 2021-12-02 | 蒸着装置及び蒸着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023082429A JP2023082429A (ja) | 2023-06-14 |
JP7434261B2 true JP7434261B2 (ja) | 2024-02-20 |
Family
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JP2021196195A Active JP7434261B2 (ja) | 2021-12-02 | 2021-12-02 | 蒸着装置及び蒸着方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7434261B2 (ja) |
KR (1) | KR20230083229A (ja) |
CN (1) | CN116219366A (ja) |
TW (1) | TWI835440B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004176126A (ja) | 2002-11-27 | 2004-06-24 | Ulvac Japan Ltd | 真空成膜装置及び真空成膜方法 |
JP2008248362A (ja) | 2007-03-30 | 2008-10-16 | Fujifilm Corp | セレン蒸着装置 |
JP2013091857A (ja) | 2004-06-17 | 2013-05-16 | Global Oled Technology Llc | 温度に敏感な材料の気化 |
CN110158036A (zh) | 2019-03-15 | 2019-08-23 | 上海视涯信息科技有限公司 | 一种蒸镀沉积设备及其使用方法 |
JP2020164920A (ja) | 2019-03-29 | 2020-10-08 | キヤノントッキ株式会社 | 成膜装置及び成膜方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3242427B2 (ja) * | 1991-09-11 | 2001-12-25 | コニカ株式会社 | 蒸着装置 |
TWI472639B (zh) | 2009-05-22 | 2015-02-11 | Samsung Display Co Ltd | 薄膜沉積設備 |
CN103966554B (zh) * | 2013-01-31 | 2018-08-07 | 日立造船株式会社 | 真空蒸镀装置和真空蒸镀方法 |
-
2021
- 2021-12-02 JP JP2021196195A patent/JP7434261B2/ja active Active
-
2022
- 2022-10-19 CN CN202211278437.2A patent/CN116219366A/zh active Pending
- 2022-11-29 KR KR1020220162178A patent/KR20230083229A/ko unknown
- 2022-11-30 TW TW111145923A patent/TWI835440B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004176126A (ja) | 2002-11-27 | 2004-06-24 | Ulvac Japan Ltd | 真空成膜装置及び真空成膜方法 |
JP2013091857A (ja) | 2004-06-17 | 2013-05-16 | Global Oled Technology Llc | 温度に敏感な材料の気化 |
JP2008248362A (ja) | 2007-03-30 | 2008-10-16 | Fujifilm Corp | セレン蒸着装置 |
CN110158036A (zh) | 2019-03-15 | 2019-08-23 | 上海视涯信息科技有限公司 | 一种蒸镀沉积设备及其使用方法 |
JP2020164920A (ja) | 2019-03-29 | 2020-10-08 | キヤノントッキ株式会社 | 成膜装置及び成膜方法 |
Also Published As
Publication number | Publication date |
---|---|
CN116219366A (zh) | 2023-06-06 |
KR20230083229A (ko) | 2023-06-09 |
TWI835440B (zh) | 2024-03-11 |
JP2023082429A (ja) | 2023-06-14 |
TW202323555A (zh) | 2023-06-16 |
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