JP6941564B2 - 蒸発した材料を堆積させるための蒸発源、及び蒸発した材料を堆積させるための方法 - Google Patents
蒸発した材料を堆積させるための蒸発源、及び蒸発した材料を堆積させるための方法 Download PDFInfo
- Publication number
- JP6941564B2 JP6941564B2 JP2017557363A JP2017557363A JP6941564B2 JP 6941564 B2 JP6941564 B2 JP 6941564B2 JP 2017557363 A JP2017557363 A JP 2017557363A JP 2017557363 A JP2017557363 A JP 2017557363A JP 6941564 B2 JP6941564 B2 JP 6941564B2
- Authority
- JP
- Japan
- Prior art keywords
- evaporation source
- shielding
- raw material
- plume
- shielding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001704 evaporation Methods 0.000 title claims description 143
- 230000008020 evaporation Effects 0.000 title claims description 142
- 238000000151 deposition Methods 0.000 title claims description 82
- 239000000463 material Substances 0.000 title claims description 51
- 238000000034 method Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims description 127
- 239000002994 raw material Substances 0.000 claims description 109
- 238000009826 distribution Methods 0.000 claims description 23
- 230000001902 propagating effect Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 230000008021 deposition Effects 0.000 description 66
- 238000010438 heat treatment Methods 0.000 description 30
- 238000004140 cleaning Methods 0.000 description 24
- 239000011368 organic material Substances 0.000 description 15
- 238000001816 cooling Methods 0.000 description 10
- 230000005855 radiation Effects 0.000 description 10
- 208000028659 discharge Diseases 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 239000012809 cooling fluid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 241000284156 Clerodendrum quadriloculare Species 0.000 description 1
- 229910001021 Ferroalloy Inorganic materials 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- -1 etc.) Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
Description
Claims (14)
- 基板上に蒸発した原料物質を堆積させるための蒸発源(20)であって、
複数のノズル(22)を有する1以上の分配管(106)、及び
複数の開孔(32)を備えた遮蔽デバイス(30)であって、前記複数の開孔(32)のうちの少なくとも1つの開孔が、単一の関連付けられたノズルから放出された蒸発した原料物質のプルーム(318)を個別に形作るように構成された、遮蔽デバイス(30)を備え、
前記少なくとも1つの開孔が、円周壁(34)によって取り囲まれた通路として構成され、
前記円周壁(34)が、第1の断面内で、主たる放出方向(X)に対して第1の最大放出角度(θ)よりも大きい放出角度を有する前記プルーム(318)の前記蒸発した原料物質を遮断するように構成され、
前記円周壁(34)が、前記第1の断面と垂直な第2の断面内で、前記主たる放出方向(X)に対して第2の最大放出角度(β)よりも大きい放出角度を有する前記プルーム(318)の前記蒸発した原料物質を遮断するように構成されており、
各ノズルの出口が、前記遮蔽デバイス(30)の中へ少なくとも部分的に突出する、蒸発源。 - 前記第1の断面が水平面であり、前記第2の断面が垂直面であり、前記第1の最大放出角度(θ)が10度から45度までの角度であり、前記第2の最大放出角度が15度から60度までの角度である、請求項1に記載の蒸発源。
- 各ノズルの出口が、前記遮蔽デバイス(30)の中へ、前記遮蔽デバイス(30)に接触することなく、少なくとも部分的に突出する、請求項1または2に記載の蒸発源。
- 主たる放出方向(X)における前記円周壁の長さが、周方向において変動する、請求項1から3のいずれか一項に記載の蒸発源。
- 前記円周壁(34)の前記長さが、前記第1の断面における第1の長さ(T1)から前記第2の断面における第2の長さ(T2)へ連続的に変動する、請求項4に記載の蒸発源。
- 前記少なくとも1つの開孔が、丸い通路として、円形状の通路として、又は卵型の通路として構成されている、請求項1から5のいずれか一項に記載の蒸発源。
- 前記遮蔽デバイス(30)が、複数の分離した遮蔽ユニット(60)を備え、前記複数の分離した遮蔽ユニット(60)の各遮蔽ユニットが、前記複数の開孔(32)のうちの少なくとも1つの開孔を備える、請求項1から6のいずれか一項に記載の蒸発源。
- 前記複数の分離した遮蔽ユニット(60)のうちの少なくとも1つの遮蔽ユニットが、直線的な配置で支持構造体によって連結された、前記複数の開孔(32)のうちの2つ、3つ、4つ、又は5つ以上の開孔を備える、請求項7に記載の蒸発源。
- 前記少なくとも1つの遮蔽ユニットが、前記1以上の分配管(106)のうちの単一の分配管に連結され、前記少なくとも1つの遮蔽ユニットが、前記単一の分配管の長さ方向において、前記単一の分配管と同じように熱膨張及び収縮をする、請求項8に記載の蒸発源。
- 互いに隣接して配置された2以上の分配管(106)を備え、前記複数の分離した遮蔽ユニット(60)の各遮蔽ユニットが、前記1以上の分配管のうちの単一の分配管と連結され、前記複数のノズル(22)のうちの2つ以上の隣接するノズルの前記蒸発した原料物質のプルームを個別に形作るために、前記複数の開孔(32)のうちの2つ以上の開孔を備える、請求項7から9のいずれか一項に記載の蒸発源。
- 前記複数の分離した遮蔽ユニット(60)のうちの少なくとも1つの遮蔽ユニットが、前記複数の分離した遮蔽ユニット(60)のうちの残りの遮蔽ユニットから機械的に連結解除されている、請求項7から10のいずれか一項に記載の蒸発源。
- 前記複数の分離した遮蔽ユニット(60)のうちの少なくとも1つの遮蔽ユニットが、前記1以上の分配管から熱的に分離されている、請求項7から11のいずれか一項に記載の蒸発源。
- 基板(10)上に蒸発した原料物質を堆積させるための、請求項1から12のいずれか一項に記載の蒸発源(20)、のための遮蔽デバイス(30)であって、
複数の分離した遮蔽ユニット(60)であって、各遮蔽ユニットが、円周壁(34)によって取り囲まれた通路として構成された1以上の開孔を備え、各開孔が、前記蒸発源の単一の関連付けられたノズルから放出された蒸発した原料物質のプルーム(318)を個別に形作るように構成され、前記ノズルの出口が前記1以上の開孔のうちの開孔の中へ少なくとも部分的に突出する、遮蔽ユニット(60)を備える、遮蔽デバイス。 - 真空チャンバ内の基板(10)上に蒸発した原料物質を堆積させるための方法であって、
蒸発源(20)の1以上の分配管(106)の複数のノズル(22)であって、各々が前記基板(10)に向けて伝播する蒸発した原料物質のプルームを生成する、複数のノズル(22)を通して蒸発した原料物質を誘導すること、及び
遮蔽デバイス(30)の複数の開孔(32)によって、前記蒸発した原料物質のプルームを形作ることを含み、
前記複数の開孔のうちの少なくとも1つの開孔が、単一の関連付けられたノズルから放出された、蒸発した原料物質のプルームを個別に形作り、
前記少なくとも1つの開孔が、円周壁(34)によって取り囲まれた通路として構成され、前記円周壁(34)が、第1の断面内で、主たる放出方向(X)に対して第1の最大放出角度(θ)よりも大きい放出角度を有するプルーム(318)の前記蒸発した原料物質を遮断するように構成され、前記円周壁(34)が、前記第1の断面と垂直な第2の断面内で、前記主たる放出方向(X)に対して第2の最大放出角度(β)よりも大きい放出角度を有する前記プルーム(318)の前記蒸発した原料物質を遮断するように構成され、
各ノズルの出口が、前記遮蔽デバイス(30)の中へ少なくとも部分的に突出する、方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2016/060439 WO2017194097A1 (en) | 2016-05-10 | 2016-05-10 | Evaporation source for depositing an evaporated material, and method for depositing an evaporated material |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019216101A Division JP7201573B2 (ja) | 2019-11-29 | 2019-11-29 | 蒸発した材料を堆積させるための蒸発源、及び蒸発した材料を堆積させるための方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018521216A JP2018521216A (ja) | 2018-08-02 |
JP6941564B2 true JP6941564B2 (ja) | 2021-09-29 |
Family
ID=56083991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017557363A Active JP6941564B2 (ja) | 2016-05-10 | 2016-05-10 | 蒸発した材料を堆積させるための蒸発源、及び蒸発した材料を堆積させるための方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6941564B2 (ja) |
KR (1) | KR102058612B1 (ja) |
CN (2) | CN115074662A (ja) |
TW (1) | TWI638899B (ja) |
WO (1) | WO2017194097A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL154472A (en) * | 2003-02-16 | 2007-10-31 | Amir Satran | Cutting tool and cartridge for it |
CN110691861A (zh) * | 2018-05-04 | 2020-01-14 | 应用材料公司 | 用于沉积蒸发材料的蒸发源、真空沉积系统和用于沉积蒸发材料的方法 |
JP7036676B2 (ja) * | 2018-06-13 | 2022-03-15 | 株式会社アルバック | 真空蒸着装置用の蒸着源 |
WO2020025145A1 (en) * | 2018-08-03 | 2020-02-06 | Applied Materials, Inc. | An evaporation source to deposit evaporated source materials, a method of shielding evaporated source materials and a shielding device for an evaporation source |
CN109628886B (zh) * | 2019-01-10 | 2021-01-19 | 云谷(固安)科技有限公司 | 一种蒸镀装置、蒸镀方法、混合层和显示面板 |
CN114423881A (zh) * | 2019-09-19 | 2022-04-29 | 应用材料公司 | 蒸发源、遮板装置和蒸发方法 |
CN114645249A (zh) * | 2020-12-21 | 2022-06-21 | 应用材料公司 | 在基板上沉积已蒸发源材料的方法和沉积设备 |
KR102649397B1 (ko) | 2021-08-03 | 2024-03-21 | 엘지전자 주식회사 | 선형 증발원 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS648267A (en) * | 1987-06-30 | 1989-01-12 | Sharp Kk | Thin film forming device |
JP2009228091A (ja) * | 2008-03-25 | 2009-10-08 | Canon Inc | 蒸着装置 |
JP5247239B2 (ja) * | 2008-05-22 | 2013-07-24 | 日立造船株式会社 | 真空蒸着装置の放出部構造 |
KR20110014442A (ko) * | 2009-08-05 | 2011-02-11 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
KR101193192B1 (ko) * | 2009-09-01 | 2012-10-19 | 삼성디스플레이 주식회사 | 박막 증착 장치 |
KR101182265B1 (ko) * | 2009-12-22 | 2012-09-12 | 삼성디스플레이 주식회사 | 증발원 및 이를 포함하는 증착 장치 |
KR101558519B1 (ko) * | 2010-09-15 | 2015-10-08 | 삼성디스플레이 주식회사 | 유기물 증착 장치 및 증착 방법 |
WO2012124524A1 (ja) | 2011-03-11 | 2012-09-20 | シャープ株式会社 | 蒸着粒子射出装置および蒸着装置 |
KR20140006499A (ko) | 2012-07-05 | 2014-01-16 | 삼성디스플레이 주식회사 | 증착 장치 |
KR20140025795A (ko) * | 2012-08-22 | 2014-03-05 | 에스엔유 프리시젼 주식회사 | 선택적 선형 증발 장치 |
CN104099571A (zh) * | 2013-04-01 | 2014-10-15 | 上海和辉光电有限公司 | 蒸发源组件和薄膜沉积装置和薄膜沉积方法 |
US20170081755A1 (en) * | 2014-03-21 | 2017-03-23 | Jose Manuel Dieguez-Campo | Evaporation source for organic material |
-
2016
- 2016-05-10 WO PCT/EP2016/060439 patent/WO2017194097A1/en active Application Filing
- 2016-05-10 JP JP2017557363A patent/JP6941564B2/ja active Active
- 2016-05-10 KR KR1020177034319A patent/KR102058612B1/ko active IP Right Grant
- 2016-05-10 CN CN202210614575.7A patent/CN115074662A/zh active Pending
- 2016-05-10 CN CN201680027463.4A patent/CN107592889A/zh active Pending
-
2017
- 2017-05-02 TW TW106114450A patent/TWI638899B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN107592889A (zh) | 2018-01-16 |
KR20180116129A (ko) | 2018-10-24 |
TW201809322A (zh) | 2018-03-16 |
KR102058612B1 (ko) | 2019-12-23 |
CN115074662A (zh) | 2022-09-20 |
TWI638899B (zh) | 2018-10-21 |
WO2017194097A1 (en) | 2017-11-16 |
JP2018521216A (ja) | 2018-08-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6941564B2 (ja) | 蒸発した材料を堆積させるための蒸発源、及び蒸発した材料を堆積させるための方法 | |
JP6815390B2 (ja) | 堆積装置を操作する方法、蒸発した源材料を基板に堆積する方法、及び堆積装置 | |
KR101877908B1 (ko) | 유기 재료를 위한 증발 소스, 유기 재료를 위한 증발 소스를 갖는 장치, 및 유기 재료를 증착시키기 위한 방법 | |
KR102220321B1 (ko) | 재료 증착 어레인지먼트, 진공 증착 시스템 및 이를 위한 방법들 | |
JP2023002518A (ja) | 蒸発した材料を堆積させるための蒸発源、及び蒸発した材料を堆積させるための方法 | |
KR20200118257A (ko) | 재료 증착 소스 어레인지먼트의 분배 어셈블리를 위한 노즐, 재료 증착 소스 어레인지먼트, 진공 증착 시스템, 및 재료를 증착하기 위한 방법 | |
WO2017054890A1 (en) | Variable shaper shield for evaporators and method for depositing an evaporated source material on a substrate | |
WO2018077388A1 (en) | Measurement assembly for measuring a deposition rate, evaporation source, deposition apparatus, and method therefor | |
KR102030683B1 (ko) | 재료 증착 어레인지먼트, 진공 증착 시스템 및 이를 위한 방법 | |
JP6594986B2 (ja) | 真空堆積のための材料源アレンジメント及び材料分配アレンジメント | |
WO2019063061A1 (en) | MATERIAL DEPOSITION ARRANGEMENT, VACUUM DEPOSITION SYSTEM, AND ASSOCIATED METHODS | |
JP2020023750A (ja) | 堆積装置を操作する方法、蒸発した源材料を基板に堆積する方法、及び堆積装置 | |
WO2019210972A1 (en) | Evaporation source for depositing an evaporated material, vacuum deposition system, and method for depositing an evaporated material | |
JP2018066059A (ja) | 真空堆積チャンバ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180115 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180115 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20181105 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20181120 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20190208 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190422 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190730 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191129 |
|
C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20191129 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20191206 |
|
C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20191210 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20200124 |
|
C211 | Notice of termination of reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C211 Effective date: 20200128 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20201013 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20210413 |
|
C13 | Notice of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: C13 Effective date: 20210420 |
|
C302 | Record of communication |
Free format text: JAPANESE INTERMEDIATE CODE: C302 Effective date: 20210615 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210622 |
|
C23 | Notice of termination of proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C23 Effective date: 20210706 |
|
C03 | Trial/appeal decision taken |
Free format text: JAPANESE INTERMEDIATE CODE: C03 Effective date: 20210810 |
|
C30A | Notification sent |
Free format text: JAPANESE INTERMEDIATE CODE: C3012 Effective date: 20210810 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210906 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6941564 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |