MX2010000678A - Procesos de fabricacion con tiempo de ciclo reducido para dispositivos resistivos de pelicula gruesa. - Google Patents

Procesos de fabricacion con tiempo de ciclo reducido para dispositivos resistivos de pelicula gruesa.

Info

Publication number
MX2010000678A
MX2010000678A MX2010000678A MX2010000678A MX2010000678A MX 2010000678 A MX2010000678 A MX 2010000678A MX 2010000678 A MX2010000678 A MX 2010000678A MX 2010000678 A MX2010000678 A MX 2010000678A MX 2010000678 A MX2010000678 A MX 2010000678A
Authority
MX
Mexico
Prior art keywords
layer
cycle time
thick film
manufacturing processes
film resistive
Prior art date
Application number
MX2010000678A
Other languages
English (en)
Inventor
Roger Brummell
Angie Privett
Larry Forbis
Original Assignee
Watlow Electric Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Watlow Electric Mfg filed Critical Watlow Electric Mfg
Publication of MX2010000678A publication Critical patent/MX2010000678A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/46—Heating elements having the shape of rods or tubes non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Details Of Resistors (AREA)
  • Laminated Bodies (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

Se proporciona un proceso para formar un dispositivo resistivo tal como una resistencia de carga o un calentador que incluye formar una capa dieléctrica sobre un sustrato, un objetivo, o una capa funcional adyacente, en donde la capa dieléctrica en una forma define una capa sencilla de cinta dieléctrica. La cinta dieléctrica se lamina en el sustrato, el objetivo, o la capa funcional adyacente a través de un ciclo de presión predeterminado sencillo, temperatura y tiempo, y después se forma una capa resistiva en la capa dieléctrica, y se forma una capa protectora sobre la capa resistiva.
MX2010000678A 2007-07-18 2008-07-14 Procesos de fabricacion con tiempo de ciclo reducido para dispositivos resistivos de pelicula gruesa. MX2010000678A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/779,745 US8557082B2 (en) 2007-07-18 2007-07-18 Reduced cycle time manufacturing processes for thick film resistive devices
PCT/US2008/070014 WO2009012239A2 (en) 2007-07-18 2008-07-14 Reduced cycle time manufacturing processes for thick film resistive devices

Publications (1)

Publication Number Publication Date
MX2010000678A true MX2010000678A (es) 2010-03-17

Family

ID=40137961

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2010000678A MX2010000678A (es) 2007-07-18 2008-07-14 Procesos de fabricacion con tiempo de ciclo reducido para dispositivos resistivos de pelicula gruesa.

Country Status (8)

Country Link
US (2) US8557082B2 (es)
EP (1) EP2176869B1 (es)
JP (1) JP5588342B2 (es)
CN (1) CN101796596B (es)
CA (1) CA2693183C (es)
MX (1) MX2010000678A (es)
TW (1) TWI425529B (es)
WO (1) WO2009012239A2 (es)

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US8557082B2 (en) 2007-07-18 2013-10-15 Watlow Electric Manufacturing Company Reduced cycle time manufacturing processes for thick film resistive devices
US8089337B2 (en) * 2007-07-18 2012-01-03 Watlow Electric Manufacturing Company Thick film layered resistive device employing a dielectric tape
US8061402B2 (en) * 2008-04-07 2011-11-22 Watlow Electric Manufacturing Company Method and apparatus for positioning layers within a layered heater system
CN105325052B (zh) * 2013-06-14 2019-10-08 山特维克株式会社 二硅化钼基陶瓷加热元件保持结构
FR3012008B1 (fr) 2013-10-11 2015-10-23 Illinois Tool Works Element chauffant a couche epaisse et equipement de cuisine comportant un tel element chauffant
EP3101077A4 (en) * 2014-01-29 2017-03-08 Nakashima Rubber Industry Co., Ltd. Pre-processing method for adhering rubber layer to inner and outer surfaces of cylindrical object-of-adherence
CN104936318A (zh) * 2015-05-14 2015-09-23 孙庄 一种厚膜加热器及其制造工艺
EP3626093A1 (de) * 2018-09-24 2020-03-25 Heraeus Nexensos GmbH Heizelement für ein system zur bereitstellung eines inhalierbaren aerosols
KR102392126B1 (ko) * 2019-08-02 2022-04-28 주식회사 케이티앤지 가열 조립체, 이를 포함하는 에어로졸 발생 장치 및 에어로졸 발생 시스템
CN114340421A (zh) * 2019-09-06 2022-04-12 日本烟草国际股份有限公司 加热器组件
EP3962234A1 (de) * 2020-08-27 2022-03-02 Heraeus Nexensos GmbH Flexibles heizelement, verfahren zur herstellung eines derartigen heizelements und verwendung eines flexiblen heizelements
CN112038027B (zh) * 2020-09-02 2022-04-05 中国电子科技集团公司第四十九研究所 一种高精度转角传感器及其电阻敏感元件的制备方法
DE102021211121A1 (de) * 2021-10-01 2023-04-06 E.G.O. Elektro-Gerätebau GmbH Heizeinrichtung und Verfahren zur Herstellung einer Heizeinrichtung
EP4167685A1 (en) * 2021-10-12 2023-04-19 MAHLE International GmbH Electric heating device, in particular for a heat exchanger
GB2618803A (en) * 2022-05-17 2023-11-22 Dyson Technology Ltd Thick film heating elements

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Also Published As

Publication number Publication date
CN101796596B (zh) 2012-07-11
US20090020905A1 (en) 2009-01-22
JP2010533980A (ja) 2010-10-28
CN101796596A (zh) 2010-08-04
JP5588342B2 (ja) 2014-09-10
EP2176869B1 (en) 2016-11-16
TWI425529B (zh) 2014-02-01
WO2009012239A2 (en) 2009-01-22
US8557082B2 (en) 2013-10-15
US20140014265A1 (en) 2014-01-16
TW200912966A (en) 2009-03-16
CA2693183A1 (en) 2009-01-22
EP2176869A2 (en) 2010-04-21
WO2009012239A3 (en) 2009-03-05
CA2693183C (en) 2015-01-27
US9486988B2 (en) 2016-11-08

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