JPS57178877A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPS57178877A
JPS57178877A JP56063990A JP6399081A JPS57178877A JP S57178877 A JPS57178877 A JP S57178877A JP 56063990 A JP56063990 A JP 56063990A JP 6399081 A JP6399081 A JP 6399081A JP S57178877 A JPS57178877 A JP S57178877A
Authority
JP
Japan
Prior art keywords
fluorine
heat generating
resin
thermal head
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56063990A
Other languages
Japanese (ja)
Inventor
Toyosaku Sato
Masayuki Nihei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP56063990A priority Critical patent/JPS57178877A/en
Publication of JPS57178877A publication Critical patent/JPS57178877A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electronic Switches (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

PURPOSE:To obtain a thermal head with limited oxidation of a heat generating body while excellent in the adhesivity between the heat generating body and a protective film and better in the wear resistance by employing a carbon-filled fluorine-contained resin film as heat generating body and a fluorine-contained resin as protective film. CONSTITUTION:An insulation layer 6 made of a resin adhesive (e.g. polyimide resin) excellent in the heat resistance is provided on a substrate 5 (e.g. metal plate and alumina plate) excellent in the heat conductivity. A heat generating resistor 7 (a film about 50-200mum thick in which carbon powder is dispersed and mixed into a fluorine-contained resin) in which electric conductors 8 and 8 face are previously arranged on both sides facing each other is adhesively laminated on the layer 6. Besides, protective film 9 made of fluorine-contained resin is provided on the resistor to make a thermal head.
JP56063990A 1981-04-30 1981-04-30 Thermal head Pending JPS57178877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56063990A JPS57178877A (en) 1981-04-30 1981-04-30 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56063990A JPS57178877A (en) 1981-04-30 1981-04-30 Thermal head

Publications (1)

Publication Number Publication Date
JPS57178877A true JPS57178877A (en) 1982-11-04

Family

ID=13245223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56063990A Pending JPS57178877A (en) 1981-04-30 1981-04-30 Thermal head

Country Status (1)

Country Link
JP (1) JPS57178877A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3609975A1 (en) * 1985-03-25 1986-10-02 Canon K.K., Tokio/Tokyo THERMAL RECORDING HEAD
DE3609691A1 (en) * 1985-03-23 1986-10-02 Canon K.K., Tokio/Tokyo THERMAL WRITING HEAD
WO2009012369A2 (en) * 2007-07-18 2009-01-22 Watlow Electric Manufacturing Company Thick film layered resistive device employing a dielectric tape
US8061402B2 (en) 2008-04-07 2011-11-22 Watlow Electric Manufacturing Company Method and apparatus for positioning layers within a layered heater system
US8557082B2 (en) 2007-07-18 2013-10-15 Watlow Electric Manufacturing Company Reduced cycle time manufacturing processes for thick film resistive devices

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3609691A1 (en) * 1985-03-23 1986-10-02 Canon K.K., Tokio/Tokyo THERMAL WRITING HEAD
DE3609975A1 (en) * 1985-03-25 1986-10-02 Canon K.K., Tokio/Tokyo THERMAL RECORDING HEAD
WO2009012369A2 (en) * 2007-07-18 2009-01-22 Watlow Electric Manufacturing Company Thick film layered resistive device employing a dielectric tape
WO2009012369A3 (en) * 2007-07-18 2009-07-30 Watlow Electric Mfg Thick film layered resistive device employing a dielectric tape
US8089337B2 (en) 2007-07-18 2012-01-03 Watlow Electric Manufacturing Company Thick film layered resistive device employing a dielectric tape
US8557082B2 (en) 2007-07-18 2013-10-15 Watlow Electric Manufacturing Company Reduced cycle time manufacturing processes for thick film resistive devices
US9486988B2 (en) 2007-07-18 2016-11-08 Watlow Electric Manufacturing Company Reduced cycle time manufacturing processes for thick film resistive devices
US8061402B2 (en) 2008-04-07 2011-11-22 Watlow Electric Manufacturing Company Method and apparatus for positioning layers within a layered heater system
US8070899B2 (en) 2008-04-07 2011-12-06 Watlow Electric Manufacturing Company Method and apparatus for positioning layers within a layered heater system

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