WO2011005021A3 - 증착장치의 증착용 기판, 상기 증착용 기판을 사용한 성막 방법 및 유기전계발광표시장치의 제조방법 - Google Patents

증착장치의 증착용 기판, 상기 증착용 기판을 사용한 성막 방법 및 유기전계발광표시장치의 제조방법 Download PDF

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Publication number
WO2011005021A3
WO2011005021A3 PCT/KR2010/004411 KR2010004411W WO2011005021A3 WO 2011005021 A3 WO2011005021 A3 WO 2011005021A3 KR 2010004411 W KR2010004411 W KR 2010004411W WO 2011005021 A3 WO2011005021 A3 WO 2011005021A3
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WIPO (PCT)
Prior art keywords
deposition
substrate
film
manufacturing
forming
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PCT/KR2010/004411
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English (en)
French (fr)
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WO2011005021A2 (ko
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노재상
홍원의
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주식회사 엔씰텍
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Priority to US13/988,875 priority Critical patent/US8951891B2/en
Publication of WO2011005021A2 publication Critical patent/WO2011005021A2/ko
Publication of WO2011005021A3 publication Critical patent/WO2011005021A3/ko

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24545—Containing metal or metal compound

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

본 발명은 기판을 제공하고, 상기 기판 상에 주울 가열용 발열 도전층을 형성하고, 상기 주울 가열용 발열 도전층 상에 홈 또는 홀을 구비하는 제1절연막을 형성하고, 상기 홈 또는 홀을 구비하는 제1절연막의 상부에 증착용 물질층을 형성하고, 상기 주울 가열용 발열 도전층에 전계를 인가하여 상기 증착용 물질층을 주울 가열하는 것을 특징으로 하는증착장치의 증착용 기판, 상기 증착용 기판을 사용한 성막 방법 및 유기전계발광표시장치의 제조방법을 제공한다. 따라서, 본 발명은 대형 소자의 제작에 유리한 성막 방법을 제공할 수 있는 효과가 있다.
PCT/KR2010/004411 2009-07-10 2010-07-07 증착장치의 증착용 기판, 상기 증착용 기판을 사용한 성막 방법 및 유기전계발광표시장치의 제조방법 WO2011005021A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/988,875 US8951891B2 (en) 2009-07-10 2010-07-07 Deposition substrate of deposition apparatus, method of forming layer using the same, and method of manufacturing organic light emitting diode display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0063135 2009-07-10
KR1020090063135A KR101169001B1 (ko) 2009-07-10 2009-07-10 증착장치의 증착용 기판, 상기 증착용 기판을 사용한 성막 방법 및 유기전계발광표시장치의 제조방법

Publications (2)

Publication Number Publication Date
WO2011005021A2 WO2011005021A2 (ko) 2011-01-13
WO2011005021A3 true WO2011005021A3 (ko) 2011-04-14

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PCT/KR2010/004411 WO2011005021A2 (ko) 2009-07-10 2010-07-07 증착장치의 증착용 기판, 상기 증착용 기판을 사용한 성막 방법 및 유기전계발광표시장치의 제조방법

Country Status (4)

Country Link
US (1) US8951891B2 (ko)
KR (1) KR101169001B1 (ko)
TW (1) TWI450989B (ko)
WO (1) WO2011005021A2 (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5677785B2 (ja) 2009-08-27 2015-02-25 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
KR20130004830A (ko) 2011-07-04 2013-01-14 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
KR101971199B1 (ko) * 2012-09-21 2019-08-14 삼성디스플레이 주식회사 유기층 증착 장치, 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
KR20140102518A (ko) * 2013-02-14 2014-08-22 삼성디스플레이 주식회사 도너 필름, 이의 제조 방법 및 이를 이용한 유기 발광 표시 장치의 제조 방법
KR102081284B1 (ko) 2013-04-18 2020-02-26 삼성디스플레이 주식회사 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조 방법 및 유기발광 디스플레이 장치
JP2015069806A (ja) * 2013-09-27 2015-04-13 株式会社ジャパンディスプレイ 有機エレクトロルミネッセンス表示装置の製造方法
KR101958397B1 (ko) 2015-05-15 2019-03-15 주식회사 다원시스 유기막 증착 장치와, 방법 및 유기막 장치
CN105132868B (zh) * 2015-09-25 2019-09-27 京东方科技集团股份有限公司 蒸发源及其制作方法、蒸镀方法
TWI606132B (zh) * 2016-01-27 2017-11-21 國立清華大學 有機發光元件之有機層的製作方法
KR101671978B1 (ko) 2016-03-08 2016-11-03 주식회사 다원시스 줄열을 이용하여 유기막을 증착하는 유기막증착용 도너기판 및 이의 제조방법
KR101801548B1 (ko) * 2016-06-16 2017-11-27 한국과학기술원 방사선 손상에 대해 자가복구가 가능한 전계효과 트랜지스터 및 그의 손상복구 시스템
KR20160128270A (ko) 2016-10-26 2016-11-07 주식회사 다원시스 줄열을 이용하여 유기막을 증착하는 유기막증착용 도너기판
KR101975289B1 (ko) 2016-10-28 2019-05-07 주식회사 다원시스 유기 발광 소자의 제조 시스템 및 제조 방법
WO2018139822A1 (ko) * 2017-01-24 2018-08-02 주식회사 다원시스 반도체 도너 기판과, 반도체 도너 기판의 제조 방법과, 유기 발광 장치의 제조 방법 및 도너 기판 모듈
KR101967920B1 (ko) * 2017-03-21 2019-04-10 주식회사 다원시스 반도체 도너 기판, 시스템 및 유기 발광 장치의 제조 방법
CN110021715B (zh) 2018-01-09 2021-12-28 鸿富锦精密工业（深圳）有限公司 蒸镀源及有机发光二极管显示面板的制造方法
CN110600520A (zh) * 2019-09-19 2019-12-20 昆山工研院新型平板显示技术中心有限公司 一种显示面板及显示装置
CN114597138A (zh) * 2020-12-03 2022-06-07 群创光电股份有限公司 半导体封装的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001295027A (ja) * 2000-04-18 2001-10-26 Victor Co Of Japan Ltd 蒸着源、パターン形成方法、及び電子デバイスの製造方法
JP2002302759A (ja) * 2001-04-05 2002-10-18 Sony Corp 薄膜パターンの形成方法および有機電界発光表示装置の製造方法
JP2006202510A (ja) * 2005-01-18 2006-08-03 Seiko Epson Corp 有機ｅｌ装置の製造方法
JP2008174783A (ja) * 2007-01-17 2008-07-31 Fuji Electric Holdings Co Ltd パターン状の蒸着膜の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006031017A1 (en) * 2004-09-17 2006-03-23 Jae-Sang Ro Method for annealing silicon thin films using conductive layerand polycrystalline silicon thin films prepared therefrom
JP2009043572A (ja) * 2007-08-09 2009-02-26 Sony Corp 蒸発源、蒸発源の製造方法、及び有機ｅｌ表示装置の製造方法
KR100946808B1 (ko) * 2007-11-21 2010-03-11 주식회사 엔씰텍 다결정 실리콘 박막의 제조 방법, 이를 이용하여 제조된다결정 실리콘 박막, 및 이를 포함하는 박막트랜지스터
US8080811B2 (en) * 2007-12-28 2011-12-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing evaporation donor substrate and light-emitting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001295027A (ja) * 2000-04-18 2001-10-26 Victor Co Of Japan Ltd 蒸着源、パターン形成方法、及び電子デバイスの製造方法
JP2002302759A (ja) * 2001-04-05 2002-10-18 Sony Corp 薄膜パターンの形成方法および有機電界発光表示装置の製造方法
JP2006202510A (ja) * 2005-01-18 2006-08-03 Seiko Epson Corp 有機ｅｌ装置の製造方法
JP2008174783A (ja) * 2007-01-17 2008-07-31 Fuji Electric Holdings Co Ltd パターン状の蒸着膜の製造方法

Also Published As

Publication number Publication date
KR20110005531A (ko) 2011-01-18
TWI450989B (zh) 2014-09-01
US8951891B2 (en) 2015-02-10
US20130267055A1 (en) 2013-10-10
KR101169001B1 (ko) 2012-07-26
WO2011005021A2 (ko) 2011-01-13
TW201116640A (en) 2011-05-16

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