MX2016005697A - Metodos para transferir materiales electricamente conductivos. - Google Patents

Metodos para transferir materiales electricamente conductivos.

Info

Publication number
MX2016005697A
MX2016005697A MX2016005697A MX2016005697A MX2016005697A MX 2016005697 A MX2016005697 A MX 2016005697A MX 2016005697 A MX2016005697 A MX 2016005697A MX 2016005697 A MX2016005697 A MX 2016005697A MX 2016005697 A MX2016005697 A MX 2016005697A
Authority
MX
Mexico
Prior art keywords
electrically conductive
methods
substrate
conductive materials
range
Prior art date
Application number
MX2016005697A
Other languages
English (en)
Other versions
MX361335B (es
Inventor
Tyler Jaye
F Cheetham Paul
Burn Darren
J Mccollum Gregory
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51897479&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MX2016005697(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of MX2016005697A publication Critical patent/MX2016005697A/es
Publication of MX361335B publication Critical patent/MX361335B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/24—Pressing or stamping ornamental designs on surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C3/00—Processes, not specifically provided for elsewhere, for producing ornamental structures
    • B44C3/02—Superimposing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)
  • Details Of Aerials (AREA)

Abstract

Se dan a conocer métodos para transferir materiales eléctricamente conductivos a un sustrato. Los métodos incluyen: a) contactar al menos una porción del sustrato con un material eléctricamente conductivo dispuesto en una película portadora; y b) aplicar calor y presión al sustrato y a la película portadora por un periodo de tiempo en un rango desde 1 a 40 segundos, a una temperatura en un rango de desde 200°F a 450°F, y a una presión en un rango desde 30 a 150 psi, tal que el material eléctricamente conductivo se adhiere al sustrato. Métodos para formar una estructura de capas también es dada a conocer.
MX2016005697A 2013-11-01 2014-10-31 Métodos para transferir materiales eléctricamente conductivos. MX361335B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361898671P 2013-11-01 2013-11-01
PCT/US2014/063406 WO2015066462A1 (en) 2013-11-01 2014-10-31 Methods of transferring electrically conductive materials

Publications (2)

Publication Number Publication Date
MX2016005697A true MX2016005697A (es) 2016-10-28
MX361335B MX361335B (es) 2018-12-03

Family

ID=51897479

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016005697A MX361335B (es) 2013-11-01 2014-10-31 Métodos para transferir materiales eléctricamente conductivos.

Country Status (11)

Country Link
US (1) US10219388B2 (es)
EP (2) EP3064045B1 (es)
JP (2) JP2016536810A (es)
KR (1) KR102045113B1 (es)
CN (1) CN106538075B (es)
ES (1) ES2842213T3 (es)
MX (1) MX361335B (es)
PL (1) PL3064045T3 (es)
RU (1) RU2664719C2 (es)
TW (1) TWI611741B (es)
WO (1) WO2015066462A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6421077B2 (ja) * 2015-05-19 2018-11-07 富士フイルム株式会社 アンテナの製造方法およびタッチセンサ
GB201811203D0 (en) 2018-07-06 2018-08-29 Conductive Transfers Ltd Conductive transfer
GB2577286B (en) 2018-09-19 2022-12-14 Conductive Transfers Ltd Transfer including an electrical component
KR102124997B1 (ko) * 2018-10-05 2020-06-22 주식회사 아이에스시 도전성 입자의 제조방법 및 그 제조방법으로 제조된 도전성 입자
CN110740575A (zh) * 2019-09-11 2020-01-31 黄诚 一种集成电路板生产加工设备
US12284767B2 (en) 2019-11-25 2025-04-22 Fujikura Ltd. Method for manufacturing wiring board, wiring board, method for manufacturing molded object, molded object
RU2736080C1 (ru) * 2019-12-10 2020-11-11 Акционерное общество "Научные приборы" Многослойный полимерный материал для лазерной гравировки и способ его получения
US20240043710A1 (en) * 2022-08-04 2024-02-08 Apple Inc. Ultraviolet-Curable Conductive Ink

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3444732A (en) * 1967-06-06 1969-05-20 Albert L Robbins Method and apparatus for determining optimum bonding parameters for thermoplastic material
US3703603A (en) * 1971-05-10 1972-11-21 Circuit Stik Inc Rub-on sub-element for electronic circuit board
JPS562435B2 (es) 1973-05-22 1981-01-20
US4775439A (en) * 1983-07-25 1988-10-04 Amoco Corporation Method of making high metal content circuit patterns on plastic boards
JPS62200790A (ja) * 1986-02-28 1987-09-04 大日本印刷株式会社 積層メンプレンシ−トの製造方法
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
JPH02129768U (es) * 1989-03-31 1990-10-25
JPH0645713A (ja) * 1991-02-07 1994-02-18 Ado Union Kenkyusho:Kk 耐熱性フレキシブル印刷配線板及びその製造方法
JP3014503B2 (ja) 1991-08-05 2000-02-28 日本特殊陶業株式会社 集積回路用パッケージ
ZA941671B (en) * 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
JPH077170U (ja) * 1993-06-30 1995-01-31 カシオ計算機株式会社 プリント基板素材およびこれを用いたプリント基板
JPH07202384A (ja) * 1993-12-28 1995-08-04 Sony Chem Corp 転写式印刷回路及びその製造方法
JPH07251045A (ja) 1994-03-16 1995-10-03 Dainippon Ink & Chem Inc 有機高分子気体分離膜およびその製法
JPH09312460A (ja) * 1996-05-20 1997-12-02 Sony Corp 回路転写物及び電気回路の形成方法
US5890429A (en) * 1997-12-10 1999-04-06 Mcdonnell Douglas Corporation Method of making and bonding a screen printed ink film carrier to an electronic device
JP4187278B2 (ja) 1998-07-08 2008-11-26 大日本印刷株式会社 非接触ｉｃカードおよびその製造方法
US6136127A (en) * 1998-10-05 2000-10-24 Chartpak, Inc. Electrically conductive adhesive transfers
GB2345196B (en) 1998-12-23 2003-11-26 Nokia Mobile Phones Ltd An antenna and method of production
US6262692B1 (en) 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
US6280552B1 (en) * 1999-07-30 2001-08-28 Microtouch Systems, Inc. Method of applying and edge electrode pattern to a touch screen and a decal for a touch screen
CN100516120C (zh) * 2000-01-21 2009-07-22 三井化学株式会社 烯烃嵌段共聚物,其制备方法和用途
JP2001211020A (ja) * 2000-01-26 2001-08-03 Asahi Glass Co Ltd 車載用対数周期ダイポールアンテナ
JP4574027B2 (ja) * 2000-02-01 2010-11-04 三井化学株式会社 ホットメルト接着剤組成物
KR20040077655A (ko) 2001-10-19 2004-09-06 슈페리어 마이크로파우더스 엘엘씨 전자 형상 증착용 테잎 조성물
JP2003331648A (ja) 2002-05-10 2003-11-21 Tsuchiya Co Ltd 導電ペースト及び電気回路の製造方法
US7550528B2 (en) * 2002-10-15 2009-06-23 Exxonmobil Chemical Patents Inc. Functionalized olefin polymers
WO2004046214A2 (en) * 2002-10-15 2004-06-03 Exxonmobil Chemical Patents Inc. Multiple catalyst system for olefin polymerization and polymers produced therefrom
JP4128885B2 (ja) * 2003-02-14 2008-07-30 ハリマ化成株式会社 微細配線パターンの形成方法
JP2005277394A (ja) * 2004-02-23 2005-10-06 Matsushita Electric Ind Co Ltd 配線基板の製造方法
JP4530789B2 (ja) * 2004-09-30 2010-08-25 帝国通信工業株式会社 回路基板の製造方法及び回路基板
JP4425165B2 (ja) * 2005-03-10 2010-03-03 株式会社トッパンＴｄｋレーベル 転写型アンテナおよびその転写方法
CN101180765B (zh) 2005-04-01 2013-06-05 日本写真印刷株式会社 显示器用透明天线和带天线的显示器用透光性构件以及带天线的壳体用构件
US20060290512A1 (en) 2005-06-22 2006-12-28 Smurfit-Stone Container Enterprises, Inc. Methods and apparatus for RFID transponder fabrication
WO2007148838A1 (en) 2006-06-19 2007-12-27 U-Gentech Co., Ltd Internal antenna for mobile phone and manufacturing method thereof
US20080057233A1 (en) 2006-08-29 2008-03-06 Harrison Daniel J Conductive thermal transfer ribbon
KR20090069908A (ko) 2007-12-26 2009-07-01 삼성전기주식회사 필름형 안테나 제조방법 및 안테나가 부착된 케이스 구조물제조방법
CA2723886C (en) * 2008-05-09 2017-01-17 Stora Enso Oyj An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof
KR20090121973A (ko) 2008-05-23 2009-11-26 삼성전기주식회사 필름형 안테나 및 이동통신 단말기
US7857998B2 (en) * 2008-11-24 2010-12-28 E. I. Du Pont De Nemours And Company High conductivity polymer thick film silver conductor composition for use in RFID and other applications
JP2010135692A (ja) * 2008-12-08 2010-06-17 Lintec Corp 転写用配線回路板及び配線回路部材
US20110304520A1 (en) 2010-06-11 2011-12-15 Illinois Tool Works Inc. Method of Manufacturing and Operating an Antenna Arrangement for a Communication Device
CN102458053A (zh) * 2010-10-15 2012-05-16 林宏明 电路板的制造方法
KR101489159B1 (ko) * 2011-12-23 2015-02-05 주식회사 잉크테크 금속 인쇄회로기판의 제조방법
EP3206229B1 (en) * 2016-02-09 2020-10-07 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Methods of manufacturing flexible electronic devices

Also Published As

Publication number Publication date
MX361335B (es) 2018-12-03
ES2842213T3 (es) 2021-07-13
PL3064045T3 (pl) 2021-02-08
RU2016121510A (ru) 2017-12-04
TW201521528A (zh) 2015-06-01
EP3687263A1 (en) 2020-07-29
KR20160102166A (ko) 2016-08-29
JP2018142750A (ja) 2018-09-13
CN106538075B (zh) 2020-04-17
US10219388B2 (en) 2019-02-26
CN106538075A (zh) 2017-03-22
EP3064045A1 (en) 2016-09-07
WO2015066462A1 (en) 2015-05-07
US20160286662A1 (en) 2016-09-29
EP3064045B1 (en) 2020-10-07
KR102045113B1 (ko) 2019-11-14
TWI611741B (zh) 2018-01-11
RU2664719C2 (ru) 2018-08-23
JP2016536810A (ja) 2016-11-24

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