TW200532002A - Pressure-sensitive adhesive sheet - Google Patents

Pressure-sensitive adhesive sheet Download PDF

Info

Publication number
TW200532002A
TW200532002A TW094105544A TW94105544A TW200532002A TW 200532002 A TW200532002 A TW 200532002A TW 094105544 A TW094105544 A TW 094105544A TW 94105544 A TW94105544 A TW 94105544A TW 200532002 A TW200532002 A TW 200532002A
Authority
TW
Taiwan
Prior art keywords
adhesive
adhesive sheet
adhesive layer
hole
sheet
Prior art date
Application number
TW094105544A
Other languages
English (en)
Chinese (zh)
Other versions
TWI303268B (enExample
Inventor
Kiichiro Katoh
Kazuhiro Tsuda
Osamu Kanazawa
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200532002A publication Critical patent/TW200532002A/zh
Application granted granted Critical
Publication of TWI303268B publication Critical patent/TWI303268B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW094105544A 2004-02-27 2005-02-24 Pressure-sensitive adhesive sheet TW200532002A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004053936A JP4748941B2 (ja) 2004-02-27 2004-02-27 粘着シート

Publications (2)

Publication Number Publication Date
TW200532002A true TW200532002A (en) 2005-10-01
TWI303268B TWI303268B (enExample) 2008-11-21

Family

ID=34908770

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105544A TW200532002A (en) 2004-02-27 2005-02-24 Pressure-sensitive adhesive sheet

Country Status (9)

Country Link
US (1) US20070254136A1 (enExample)
EP (1) EP1728842A4 (enExample)
JP (1) JP4748941B2 (enExample)
KR (1) KR20060123595A (enExample)
CN (1) CN1946821B (enExample)
AU (1) AU2005217263B2 (enExample)
CA (1) CA2557409A1 (enExample)
TW (1) TW200532002A (enExample)
WO (1) WO2005083024A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100551984C (zh) * 2004-02-27 2009-10-21 琳得科株式会社 粘接片
KR101192251B1 (ko) * 2004-06-14 2012-10-17 린텍 가부시키가이샤 점착 시트
CA2617682A1 (en) * 2005-08-01 2007-02-08 Lintec Corporation Adhesive sheet
JP4810165B2 (ja) * 2005-09-06 2011-11-09 リンテック株式会社 貫通孔形成粘着シートおよびその製造方法
JP4804876B2 (ja) * 2005-10-31 2011-11-02 リンテック株式会社 貫通孔形成粘着シートおよびその製造方法
JP2008060170A (ja) * 2006-08-29 2008-03-13 Nitto Denko Corp ウォータージェットレーザダイシング用粘着シート
JP5428165B2 (ja) * 2007-03-05 2014-02-26 Ｄｉｃ株式会社 粘着テープ及びｌｃｄモジュール
CN101752125A (zh) * 2010-01-22 2010-06-23 昆山雄风彩印有限公司 易排气方便粘贴的薄膜面板结构
JP5500366B2 (ja) * 2010-07-07 2014-05-21 Ｄｉｃ株式会社 パネル固定用両面粘着テープ
JP5986452B2 (ja) * 2011-08-10 2016-09-06 バンドー化学株式会社 車両用床シート、車両の床構造体、車両の床構造体の施工方法
JPWO2013141215A1 (ja) * 2012-03-23 2015-08-03 株式会社きもと 窓貼り用フィルム
TWI591040B (zh) * 2012-10-22 2017-07-11 康寧公司 玻璃纖維網和拼接的方法
JP6603479B2 (ja) * 2015-05-18 2019-11-06 日東電工株式会社 接着フィルム、ダイシングテープ一体型接着フィルム、複層フィルム、半導体装置の製造方法および半導体装置
US10836932B2 (en) * 2015-11-27 2020-11-17 Nitto Denko Corporation Pressure-sensitive adhesive sheet and release film-supported pressure-sensitive adhesive sheet
EP3173223A1 (en) * 2015-11-27 2017-05-31 Airbus Operations GmbH A method for manufacturing an aircraft structure component
JP6829960B2 (ja) * 2015-11-27 2021-02-17 日東電工株式会社 粘着シートおよび剥離フィルム付き粘着シート
CN106872790B (zh) * 2017-02-25 2021-04-09 郑州云海信息技术有限公司 一种检测过孔损耗的方法及系统
CN108630815A (zh) * 2017-03-16 2018-10-09 上海和辉光电有限公司 一种模组背胶以及有机发光二极管显示模组
CN107805464A (zh) * 2017-11-28 2018-03-16 东莞中世拓实业有限公司 一种具有多孔胶层结构的新型广告膜
JP2019135753A (ja) * 2018-02-05 2019-08-15 リンテック株式会社 粘着シート及び半導体装置の製造方法
WO2019189404A1 (ja) 2018-03-29 2019-10-03 三菱ケミカル株式会社 粘着シート、積層シート及びそれを用いた画像表示装置
EP3918592B1 (en) 2019-02-02 2025-12-10 Avery Dennison Corporation Matte flame retardant label
JP7379200B2 (ja) * 2020-02-14 2023-11-14 日本カーバイド工業株式会社 積層フィルムおよび成形体
CN113078275B (zh) * 2021-03-24 2024-12-20 京东方科技集团股份有限公司 保护结构、oled折叠显示模组及显示装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01125345U (enExample) * 1988-02-16 1989-08-25
JPH02107682A (ja) * 1988-10-18 1990-04-19 Nichiban Co Ltd マーキングシート
JPH04100235U (enExample) * 1991-02-07 1992-08-31
US5275856A (en) * 1991-11-12 1994-01-04 Minnesota Mining And Manufacturing Company Electrically conductive adhesive web
US5609938A (en) * 1993-06-23 1997-03-11 Creative Minds Foundation, Inc. Image display apparatus with holes for opposite side viewing
JPH07164873A (ja) * 1993-12-17 1995-06-27 Chuo Yohin Kk 車両のガラス面に貼着する日除用カーフィルム
US5993961A (en) * 1995-06-07 1999-11-30 Avery Dennison Corporation Use of pressure-sensitive adhesive as a barrier coating
US5810756A (en) * 1995-05-23 1998-09-22 Lectec Corporation Method of producing a perforated medical adhesive tape
JP4548679B2 (ja) * 1999-10-08 2010-09-22 大日本印刷株式会社 体積ホログラム積層体における粘着剤層用粘着剤
US6503620B1 (en) * 1999-10-29 2003-01-07 Avery Dennison Corporation Multilayer composite PSA constructions
EP1139415B1 (en) * 2000-03-30 2009-02-25 Nitto Denko Corporation Water-permeable adhesive tape for semiconductor processing
US6739929B2 (en) * 2000-03-31 2004-05-25 Minolta Co., Ltd. Method and apparatus for producing a display panel, method for adhering an adhesive sheet and method for adhering plates
US6949297B2 (en) * 2001-11-02 2005-09-27 3M Innovative Properties Company Hybrid adhesives, articles, and methods
US6627844B2 (en) * 2001-11-30 2003-09-30 Matsushita Electric Industrial Co., Ltd. Method of laser milling
JP4398629B2 (ja) * 2002-05-24 2010-01-13 リンテック株式会社 粘着シート
WO2004061031A1 (ja) * 2002-12-27 2004-07-22 Lintec Corporation 粘着シートおよびその製造方法
JP2005075953A (ja) * 2003-09-01 2005-03-24 Lintec Corp 粘着シートおよびその製造方法
CN100551984C (zh) * 2004-02-27 2009-10-21 琳得科株式会社 粘接片
US7413787B2 (en) * 2004-10-20 2008-08-19 Agwest, Llc Adhesive sheet

Also Published As

Publication number Publication date
EP1728842A4 (en) 2009-03-11
CN1946821A (zh) 2007-04-11
CA2557409A1 (en) 2005-09-09
EP1728842A1 (en) 2006-12-06
AU2005217263A1 (en) 2005-09-09
US20070254136A1 (en) 2007-11-01
JP2005239956A (ja) 2005-09-08
KR20060123595A (ko) 2006-12-01
AU2005217263B2 (en) 2010-11-25
TWI303268B (enExample) 2008-11-21
JP4748941B2 (ja) 2011-08-17
WO2005083024A1 (ja) 2005-09-09
CN1946821B (zh) 2010-05-12

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