200527493 九、發明說明： I：發明所屬·^技術領域3 發明領域 本發明為有關於將塗液供給至液晶顯示裝置（LCD)等 5之FPD(平面板顯示器）所使用之玻璃基板等的基板而形成 塗膜的塗膜形成裝置及塗膜形成方法。 C先前技4椅]1 發明背景 例如於液晶顯示裝置(LCD)之製造工程上，使用光刻技 10術而於玻璃基板形成預定的電路圖案。即，將抗蝕劑供給 至玻璃基板而形成塗膜，將此塗膜予以乾燥、熱處理之後 逐次進行曝光處理、顯像處理。 在此說明將抗蝕劑供給至玻璃基板而形成塗膜的裝 置，乃可得知有具備將玻璃基板水平地真空吸著的载置 15台、將抗钱劑供給至被保持在此載置台之基板的抗姓劑供 給喷嘴、使載置台與抗姓劑供給喷嘴以水平方向相對性地 術動之移動機構的塗卿成裝置(例如，參照特許文獻υ。 由方；LCD用之玻璃基板厚度較薄，因此會有設 於載置口之吸氣孔易複製於玻璃基板表面的問題。又，會 有夕勺粒子附著於基板内面的問題。而且，由於對於載置 。之基板的裝卸上必要有預定的時間，因此流通率不一定 良好再者，隨著近年來玻璃基板之大型化而使載置台及 夕、α噴驚的大型化，由於此等要使此等構件相對性 地私動之移動機構的構成會變得大，因此也要求儘可能以 200527493 單純的構造來移動基板。 特4文獻1 ··特開平1〇〜156255號公報。 n韻^明内容】 發明概要 5 10 15 本^月係I於上述情事而完成的發明，以提供抑制在 基板表面發生之複製痕跡，且防止粒子附著於基板内面的 塗膜形成裝置及塗膜形成方法為目的。又，本發明之目的 亦在於提供搬運基板之機構的構造簡單，且能以高流程通 率形成塗膜的塗膜形成裝置及塗膜形成方法。 即’依據本發明，可提供一種塗膜形成裝置，該塗膜 成放置係面將基板朝單方向搬運而一面將預定的塗液 供給至喊絲㈣成㈣的塗獅絲置，該塗膜形成 裝置具有載台’该載台之表面預定位置設有用以喷射預定 氣體之夕數氣體噴射口、基板搬運機構，該基板搬運機構 在七述載σ上將基板朝單方向搬運、塗液供給嘴嘴，該塗 液供給喷嘴將預定的塗液供給至移動於前述載台上的基板 表面’且前述基板藉著從前述氣體噴❹噴射之氣體而以 略水平姿勢從前述載^表面浮起狀態，藉前述基板搬運機 構而搬運。 依據本發明，可提供一種塗膜形成方法，該塗膜形成 方法係一面將基板朝單方向搬運而一面將塗液供給至前述 基板而形成塗膜的塗膜形成方法，該塗膜形成方法包含有 保持基板周邊之一部分而使前述基板以略水平姿勢浮起於 表面噴射著預定氣體之載台上的步驟、一面將前述基板維 20 200527493 持成浮起狀態而朝單方向搬運 〜、、 哽於刖述載台上，且一面將預 膜的步驟 疋之塗液供給至前述基板而形成涂 發明效果 1〇 依據本發明 L 土板以從載台浮起的狀態來搬運， Ί生載σ表面的複製，能抑制粒子附著於基板内 而月b以小的力搬運基板。如+ ^ 双又’由於基板整體藉著從下=:氣體而呈被支樓的狀態，因此能容易地將基板的 持於水平，藉越抑制塗轉度不均的情形。而且 ;、人地搬運基板而進行塗布處理，因此能獲得高的 …L通率0 因 圖式簡單說明 第1圖係具有本發明之塗膜形成裝置之一實施樣態之 J謂裝4的劑塗布.顯像處理系統的概略平面 圖。 。。第2圖表示第1圖所示之塗布·顯像處理系統之第淡處 王里單元區的側面圖。 第3圖表示第1圖所示之塗布·顯像處理系統之第2熱處 理單元區的側面圖。 第4圖表示第1圖所示之塗布·顯像處理系統之第3熱處 理單元區的側面圖。 第5圖係抗蝕劑處理單元的概略平面圖。 第6圖表示基板搬運機構之概略構成的剝面圖。 第7圖（a)〜（c)係模式地表示導入載台部、塗布載台 4、搬出載台部分別的LCD基板之搬運型態的說明圖。 200527493 第8圖係抗I虫劑供給喷嘴的概略立體圖。 第9圖（a)、（b)表示設於抗蝕劑塗布裝置之其他基板搬 運機構之概略構造的平面圖及剝面圖。 弟10圖（a)〜(d)係模式地表示第9圖所示之基板搬運機 5構所構成1^0基板之搬運型態的說明圖。 第11圖（a)、（b)表示設於抗蝕劑塗布裝置之另外其他基 板搬運機構之概略構造的剝面圖。 第12圖（a)〜(f)係模式地表示第η圖所示之基板搬運機 構所構成LCD基板之搬運型態的說明圖。 10 【實施方式】 較佳實施例之詳細說明 以下參照所附圖式來詳細說明本發明之實施樣態。在 此說明將本發明運用於LCD用玻璃基板（以下稱「LCD基板」) 表面形成抗蝕劑膜的裝置及方法的情形。 15 第1圖表示進行於LCD基板形成抗蝕劑膜與曝光處理 後之抗蝕劑膜的顯像處理的抗蝕劑塗布·顯像處理系統的 概略平面圖。此抗蝕劑塗布·顯像處理系統100具有載置用 以收容多數LCD基板G之匣C的匣站（搬入搬出部）1、具有用 以對LCD基板G施予包含抗蝕劑塗布及顯像之一連串處理 20 之多數處理單元的處理站（處理部）2、用以在與曝光裝置4 之間進行LCD基板之交接的介面站（介面部）3,匣站1與介面 站3分別配置於處理站2的兩端。又，於第1圖中，將抗蝕劑 塗布、顯像處理系統100之長邊方向設為X方向，將於平面 上與X方向正交的方向設為γ方向。 200527493 匠站1具有％將EC排列於γ方向載置的載置台9、用以 在兵處理站2之間進行LCD基板〇之搬入㈣的搬運裝置 11在此載置口 9與外部之間進行以的搬運。搬運裝置^ 具有搬運臂lla，能移動於沿著Μ之配列方向即Y方向而 5 σ又置的搬運路線1G上，藉著搬運臂山而在厘C與處理站2 之間進行LCD基板G的搬運。 處理站2具有基本上延伸於χ方向ucd基板g搬運用 之平行的二列搬運線A、B，沿著搬運線八而從匿如側朝向 介面站3配列著殘渣洗淨處理單元(SCR)2卜第i熱處理單元 10區26、抗蝕劑處理單元23、第2熱處理單元區27。 又，沿著搬運線B從介面站3側朝向匣站1配列著第2熱 處理單元區27、顯像處理單元(dev)24、i線UV照射單元(i —UV)25、第3熱處理單元區28。殘渣洗淨處理單元(SCR)21 之上的一部分设置著準分子射單元(e — uv)22。又， 15準分子UV照射單元(e — uv)22係用以在殘渣洗淨之前去除 LCD基板G之有機物而設置，照射單元(i — UV)25係用 以進行顯像的脫色處理而設置。 在殘渣洗淨處理單元(SCR)21，LCD基板G於其中一面 以略水平姿勢被搬運而一面進行洗淨處理及乾燥處理。在 20 顯像處理單元(DEV)24，LCD基板一面以略水平姿勢被搬 運，一面逐次進行顯像液塗布、噴灑。在此等殘渣洗淨處 理單元(SCR)21及顯像處理單元(DEV)24，例如以滾子搬運 或帶搬運，LCD基板G之搬入口及搬出口設置於相各對的短 邊。又，對於i線UV照射單元(i — UV)25之LCD基板G的搬運 200527493 乃藉著與顯像處理單元(DEV)24之搬運機構同樣的機構連 續地進行。 抗蝕劑處理單元23如之後要詳細說明者，具有一面以 略水平安勢搬運LCD基板G而一面供給抗姓劑，而形成塗膜 5之抗姓劑塗布裝置(CT)23a、在減壓環境下曝曬LCD基板G 而使形成在LCD基板G上的塗膜所包含的揮發成分蒸發而 使塗膜乾燥的減壓乾燥裝置(VD)23b。 弟1熱處理早元站26具有對於LCD基板G施予熱處理之 熱處理單元所積層而構成之二個熱處理單元區塊(TB)31、 10 32,熱處理單元區塊(TB)32設於殘渣洗淨處理單元(SCR)2 j 側，熱處理單元區塊(TB)32設於抗蝕劑處理單元23側。此 等二個熱處理單元區塊(TB)31、32之間設置著第1搬運裝置 33 〇 如第2圖之第1熱處理單元站26之側面圖所示，熱處理 15單元區塊(TB)31具有從下依順序進行交接LCD基板G之通 路單元(PASS)61、對LCD基板G進行脫水烘乾處理之二個脫 水烘乾單元(DHP)62、63、對LCD基板G施予疏水化處理之 黏著裔處理單元(AD)64積層為4層的構成。又，熱處理單元 區塊(TB)32具有從下依順序進行交接LCD基板G之通路單 20元(PASS)65、冷卻LCD基板G之二個冷卻單元(c〇L)66、 67、對LCD基板G施予疏水化處理之黏著器處理單元(ad)68 積層為4層的構成。 第1搬運裝置33藉由通路單元(PASS)61而接受從殘渣 洗淨處理單元(SCR)21來的LCD基板G，進行上述熱處理單 200527493 兀之間之LCD基板G的搬入搬出、及藉由通路單元(pASS)65 而進行對抗蝕劑處理單元232LCD基板〇的交接。 第1搬運裝置33具有延伸於上下的導軌91、沿著導執％ 昇降的昇降構件92、以可旋轉地設置於昇降構件％上的基 5底構件93、以可前進後退地設置於基底構件幻上而保持 LCD基板的基板保持臂94。昇降構件92之昇降藉著馬達％ 來進行，基底構件93的旋轉藉著馬達96來進行，基板保持 臂94之前後動作藉著馬達97來進行。如此構成之第丨搬運裝 置33可上下動、前後動、旋轉動，對於熱處理單元區塊 10 (TB)31、32之其中任合何的單元均可存取。 第2熱處理單元站27具有對於LCD基板G施予熱處理之 熱處理單元所積層而構成之二個熱處理單元區塊(TB)34、 35，熱處理單元區塊(ΤΒ)34設於抗钱劑處理單元23側，熱 處理單元區塊(ΤΒ)35設於顯像處理單元(DEν)24側。此等二 15個熱處理單元區塊(ΤΒ)34、35之間設置著第2搬運裝置36。 如第3圖之第2熱處理單元站27之側面圖所示，熱處理 單元區塊(ΤΒ)34具有從下依順序進行交接1^]〇基板G之通 路單元(PASS)69、對LCD基板G進行預供烤處理之三個預烘 烤單元(PREBAKE)70、7；1、72積層4層的構成。又，熱處理 20單元區塊(TB)35具有從下依順序進行交接LCD基板G之通 路单元(PASS)73、冷卻LCD基板G之冷卻單元(c〇l)74、對 LCD基板G進行預供烤處理之二個預烘烤單元 (PREBAKE)75、76積層為4層的構成。 第2搬運裝置36進行藉由通路單元(?八83)69接受從抗 200527493 餘劑處理單元23來的LCD基板G，進行上述熱處理單元之間 之LCD基板G的搬入搬出、進行藉由通路單元(pass)73而對 顯像處理單元(DEV)24交接LCD基板G，以及對於將於後述 之介面站3之基板交接部即延伸·冷卻載台（Εχτ · COL)44 5之LCD基板G的交接。又，第2搬運裝置36具有與第1搬運裝 置33相同的構造，對於熱處理單元區塊(TB)34、％之其中 任何的單元均可存取。 第3熱處理單元站28具有對於LCD基板G施予熱處理之 熱處理單元所積層而構成之二個熱處理單元區塊(TB)37、 10 38 ’熱處理單元區塊(TB)37設於顯像處理單元(dev)24側， 熱處理單元區塊(TB)38設匣站1側。此等二個熱處理單元區 塊(TB)37、38之間設置著第3搬運裝置39。 如第4圖之第3熱處理單元站28之側面圖所示，熱處理 單元區塊(TB)37具有從下依順序進行交接lcd基板g之通 15路單元(PASS)77、對LCD基板G進行後烘烤處理之三個後烘 烤單元(POBAKE)78、79、80積層4層的構成。又，熱處理 單元區塊（TB)38從下依順序具有後烘烤單元 (P0BAKE)81、進行交接及冷卻LCD基板G之通路.冷卻單 元(PASS · COL)82、對LCD基板G進行後焕烤處理之二個後 20 烘烤單元(P〇BAKE)83、84積層為4層的構成。 第3搬運裝置39進行藉由通路單元(PASS)77接受從说 UV照射單元(i —UV)25來的LCD基板G，進行上述熱處理單 元之間之LCD基板G的搬入搬出、進行藉由通路·冷卻單元 (PASS · COL)82而對匣站1交接LCD基板G。又，第3搬運裝 12 200527493 置39亦具有與第1搬運裝置33相同的構造，對於熱處理單元 區塊(丁6)37、38之其中任何的單元均可存取。 處理站2配置著各處理單元及搬運裝置而如上所述以 構成一列搬運線A、B，且構成基本上的處理順序，此等搬 5運線A、B之間設置有空間4〇。且設置著可往復運動於此空 間40的梭（基板載置構件)41。此梭41建構成可保基板 G，藉由梭41而能在搬運線A、B之間進rLCD基板G的交 接。對於梭41之LCD基板G的交接乃藉著上述第1至第3搬運 裝置33、36、39來進行。 10 介面站3具有在處理站2與曝光裝置4之間進RLCD基 板G之搬入搬出的搬運裝置42、配置緩衝匣的緩衝載台 (BUF)43、具備冷卻機能之基板交接部的延伸·冷卻載台 (EXT · COL)44 ’字幕拍錄裝置(titLER)與周邊曝光裝置(ee) 上下積層之外部裝置區塊45鄰接搬運裝置而設置。搬運裝 15置42具有搬運臂42a，藉著此搬運臂42a而能在處理站2與曝 光裝置4之間進行LCD基板G之搬入搬出。 於如此構成之抗姓劑塗布.顯像處理系統1 〇〇中，首 先’配置於匣站1之載置台9的匣C内的LCD基板G藉著搬運 裝置1而被直接搬入處理站2之準分子uv照射單元（e —200527493 IX. Description of the invention: I: The invention belongs to the technical field 3 Field of the invention The present invention relates to a substrate such as a glass substrate used in an FPD (flat panel display) for supplying a coating liquid to a liquid crystal display device (LCD), etc. 5 A coating film forming apparatus and a coating film forming method for forming a coating film. C Prior Art 4 Chairs] 1 Background of the Invention For example, in a manufacturing process of a liquid crystal display device (LCD), a predetermined circuit pattern is formed on a glass substrate using a photolithography technique. That is, a resist is supplied to a glass substrate to form a coating film, and this coating film is dried, heat-treated, and sequentially subjected to exposure processing and development processing. Here, an apparatus for supplying a resist to a glass substrate to form a coating film will be described. It can be seen that there are 15 mounts provided with a vacuum suction of the glass substrate horizontally, and an anti-money agent is supplied to the mount. A coating device for the anti-surname agent supply nozzle of the substrate, and a moving mechanism for moving the mounting table and the anti-resistance agent supply nozzle in a horizontal direction relative to each other (for example, refer to Patent Document υ. Yukata; Glass substrate for LCD The thickness is thin, so there is a problem that the suction hole provided in the mounting port is easily copied on the surface of the glass substrate. Moreover, there is a problem that particles are attached to the inner surface of the substrate. Moreover, due to the mounting, the substrate is mounted and dismounted. It is necessary to have a predetermined time, so the flow rate is not necessarily good. Furthermore, with the increase in the size of glass substrates in recent years, the mounting table and the size of α and α have been increased. Since these components are relatively large, The structure of the private movement mechanism will become large, so it is also required to move the substrate with a simple structure as much as 200527493. Patent Document 4 · Japanese Patent Application Publication No. 10 ~ 156255. Summary of the Invention 5 10 15 This month is an invention completed based on the above-mentioned circumstances, and aims to provide a coating film forming apparatus and a coating film forming method that suppress the occurrence of replication marks on the substrate surface and prevent particles from adhering to the inner surface of the substrate. It is also an object of the present invention to provide a coating film forming apparatus and a coating film forming method that have a simple structure of a mechanism for transporting a substrate and can form a coating film with a high flow rate. That is, according to the present invention, a coating film forming apparatus can be provided, which The coating film formation placing surface transports the substrate in one direction and supplies a predetermined coating liquid to a lion-shaped silk threading device. The coating film forming device has a stage. The stage is provided at a predetermined position on the surface of the stage. The number of gas ejection openings on which the predetermined gas is ejected, and the substrate conveying mechanism, which conveys the substrate in one direction on the load σ, and the coating liquid supply nozzle supplies the predetermined coating liquid to the nozzle. The substrate is moved on the surface of the substrate, and the substrate is floated from the surface of the substrate in a slightly horizontal posture by the gas sprayed from the gas jet. According to the present invention, it is possible to provide a coating film forming method which is a coating film forming method of forming a coating film while supplying a coating liquid to the substrate while conveying the substrate in one direction, The coating film forming method includes the steps of holding a part of the periphery of the substrate and causing the substrate to float in a horizontal position on a surface on which a predetermined gas is sprayed, while holding the substrate dimension 20 200527493 in a floating state in one direction. Carrying ~ ,, and 哽 on the stage, and the coating liquid of the pre-filming step 疋 is supplied to the aforementioned substrate to form the coating effect. 10 According to the present invention, the L slab is transported in a state floating from the stage. The duplication of the σ surface can prevent particles from adhering to the substrate while carrying the substrate with a small force. For example, the double substrate is in a state of being supported because of the entire substrate through the bottom =: gas, Therefore, it is possible to easily hold the substrate at a horizontal level, and to suppress the unevenness of the coating rotation. In addition, since the substrate is transported by humans for coating treatment, a high ... L pass rate can be obtained. 0 The diagram is briefly explained. The first diagram is a J-pack 4 having one embodiment of the coating film forming apparatus of the present invention. Agent coating. Schematic plan view of the imaging processing system. . . Fig. 2 is a side view of the Wangli unit area of the weak spot of the coating and developing processing system shown in Fig. 1. Fig. 3 is a side view of the second heat treatment unit area of the coating and developing treatment system shown in Fig. 1. Fig. 4 is a side view of the third heat treatment unit area of the coating and developing treatment system shown in Fig. 1. Fig. 5 is a schematic plan view of a resist processing unit. Fig. 6 is a peeling diagram showing a schematic configuration of the substrate conveyance mechanism. FIGS. 7 (a) to (c) are explanatory diagrams schematically showing the conveyance patterns of the LCD substrates in the introduction stage portion, the coating stage 4, and the unloading stage portion. 200527493 Figure 8 is a schematic perspective view of an anti-I insecticide supply nozzle. Figs. 9 (a) and (b) are a plan view and a peeling view showing a schematic structure of another substrate transporting mechanism provided in the resist coating apparatus. Figures 10 (a) to (d) are explanatory diagrams schematically showing the conveyance patterns of 1 ^ 0 substrates constructed by the substrate carrier 5 structure shown in FIG. 9. Figures 11 (a) and (b) are peeling diagrams showing the schematic structure of another substrate conveyance mechanism provided in the resist coating apparatus. Figs. 12 (a) to (f) are explanatory diagrams schematically showing the conveyance pattern of the LCD substrate constituted by the substrate conveyance mechanism shown in Fig. N. 10 [Embodiment] Detailed description of the preferred embodiment The embodiment of the present invention will be described in detail below with reference to the attached drawings. Here, a case where the present invention is applied to an apparatus and method for forming a resist film on the surface of a glass substrate for LCD (hereinafter referred to as "LCD substrate") will be described. 15 FIG. 1 is a schematic plan view of a resist application and development processing system for developing a resist film on an LCD substrate and developing the resist film after exposure processing. This resist coating and development processing system 100 has a cassette station (carry-in and carry-out section) on which a cassette C for accommodating a large number of LCD substrates G is placed. 1. One is a processing station (processing section) with a plurality of processing units of a series of processing 20 2. An interface station (interface) 3 for transferring LCD substrates to and from the exposure device 4; a box station 1 and an interface station 3 are respectively arranged At both ends of processing station 2. In Fig. 1, the longitudinal direction of the resist coating and developing processing system 100 is set to the X direction, and the direction orthogonal to the X direction on the plane is set to the γ direction. 200527493 Carpenter's station 1 has a mounting table 9 with ECs arranged in the γ direction, and a carrying device 11 for carrying in and out of the LCD substrate between the soldier processing station 2 and between the mounting port 9 and the outside. To carry. The carrying device ^ has a carrying arm 11a, and can move on the carrying route 1G along the arrangement direction of M, namely the Y direction, and 5 σ, and carry the LCD substrate G between the centrifugal C and the processing station 2 by the carrying arm mountain. Removal. The processing station 2 has two parallel rows of conveying lines A and B extending substantially in the χ direction to transfer ucd substrates g. A residue cleaning processing unit (SCR) is arranged along the conveying line 8 from the side to the interface station 3. The second heat treatment unit 10 area 26, the resist processing unit 23, and the second heat treatment unit area 27. A second heat treatment unit area 27, a development processing unit (dev) 24, an i-line UV irradiation unit (i-UV) 25, and a third heat treatment unit are arranged along the transfer line B from the interface station 3 side toward the cassette station 1. Area 28. An excimer emission unit (e — uv) 22 is provided in a part above the residue cleaning processing unit (SCR) 21. The 15 excimer UV irradiation unit (e — UV) 22 is provided to remove organic matter of the LCD substrate G before the residue is washed, and the irradiation unit (i — UV) 25 is provided to perform decolorization processing for development. . In the residue cleaning processing unit (SCR) 21, the LCD substrate G is conveyed in a slightly horizontal position on one side, and is cleaned and dried on the other side. In the 20 development processing unit (DEV) 24, one side of the LCD substrate is transported in a slightly horizontal posture, and the developing solution is applied and sprayed one by one. The residue cleaning processing unit (SCR) 21 and the development processing unit (DEV) 24 are, for example, transported by rollers or belts, and the entrance and exit of the LCD substrate G are provided on the short sides of each pair. In addition, the transfer of the LCD substrate G of the i-line UV irradiation unit (i-UV) 25 200527493 is continuously performed by the same mechanism as the transfer mechanism of the development processing unit (DEV) 24. As will be described in detail later, the resist processing unit 23 has an anti-surname coating device (CT) 23a that supplies the anti-surname agent while transporting the LCD substrate G at a slightly horizontal level, and forms a coating film 5. A reduced-pressure drying device (VD) 23b that exposes the LCD substrate G to the environment to evaporate volatile components contained in the coating film formed on the LCD substrate G to dry the coating film. Brother 1 heat treatment early element station 26 has two heat treatment unit blocks (TB) 31, 10 32 formed by stacking heat treatment units that apply heat treatment to the LCD substrate G. The heat treatment unit block (TB) 32 is provided for residue cleaning The processing unit (SCR) 2 j side, and the heat treatment unit block (TB) 32 are provided on the resist processing unit 23 side. A first transfer device 33 is provided between these two heat treatment unit blocks (TB) 31 and 32. As shown in the side view of the first heat treatment unit station 26 in FIG. 2, the 15 heat treatment unit block (TB) 31 is heat treated. It has a pass unit (PASS) 61 that transfers the LCD substrate G in order from below, two dehydration and drying units (DHP) 62 and 63 that dehydrate and dry the LCD substrate G, and applies a hydrophobic treatment to the LCD substrate G. The AD Adhesive Processing Unit (AD) 64 is composed of 4 layers. In addition, the heat treatment unit block (TB) 32 has a passageway 20 yuan (PASS) 65 for sequentially transferring the LCD substrate G from the bottom, two cooling units (c0) 66 and 67 for cooling the LCD substrate G, and an LCD The adherent processing unit (ad) 68 to which the substrate G is subjected to a hydrophobic treatment has a multilayer structure of four layers. The first conveying device 33 receives the LCD substrate G from the residue washing processing unit (SCR) 21 through the passage unit (PASS) 61, and carries in and out the LCD substrate G between the above-mentioned heat treatment sheet 200527493 and The via unit (pASS) 65 transfers the resist processing unit 232 to the LCD substrate 0. The first conveying device 33 includes a guide rail 91 extending up and down, an elevating member 92 for elevating and lowering along the guide%, a base 5 base member 93 rotatably provided on the elevating member%, and a base member movably provided forward and backward. The substrate holding arm 94 holds the LCD substrate. The raising and lowering member 92 is raised and lowered by the motor%, the base member 93 is rotated by the motor 96, and the substrate holding arm 94 is moved forward and backward by the motor 97. The thus-constructed conveying device 33 can be moved up, down, back and forth, and can be accessed to any one of the heat treatment unit blocks 10 (TB) 31 and 32. The second heat treatment unit station 27 has two heat treatment unit blocks (TB) 34 and 35 formed by stacking heat treatment units that apply heat treatment to the LCD substrate G. The heat treatment unit block (TB) 34 is provided in the anti-money agent treatment unit. On the 23 side, the heat treatment unit block (TB) 35 is provided on the development processing unit (DEν) 24 side. A second transfer device 36 is provided between the two 15 heat treatment unit blocks (TBs) 34 and 35. As shown in the side view of the second heat treatment unit station 27 in FIG. 3, the heat treatment unit block (TB) 34 has a pass-through unit (PASS) 69 for the substrate G, and an LCD substrate G Three pre-baking units (PREBAKE) 70, 7; 1, 72 for pre-baking treatment are formed by stacking 4 layers. In addition, the heat-treated 20-unit block (TB) 35 has a passage unit (PASS) 73 that transfers the LCD substrate G in order from below, a cooling unit (c0) 74 that cools the LCD substrate G, and pre-supply of the LCD substrate G The two pre-baking units (PREBAKE) 75 and 76 of the baking process are laminated in four layers. The second conveying device 36 receives the LCD substrate G from the anti-200527493 residual agent processing unit 23 through the passage unit (? 八 83) 69, carries in and out the LCD substrate G between the heat treatment units, and performs the passage through the passage unit. (pass) 73 and the LCD substrate G is transferred to the development processing unit (DEV) 24, and the LCD substrate G of the extension and cooling stage (Eχτ · COL) 44 5 which is to be transferred to the substrate transfer portion of the interface station 3 to be described later Handover. The second conveying device 36 has the same structure as the first conveying device 33, and can access any one of the heat treatment unit blocks (TB) 34 and%. The third heat treatment unit station 28 has two heat treatment unit blocks (TB) 37 and 10 38 'heat treatment unit blocks (TB) 37 which are formed by stacking the heat treatment units that apply heat treatment to the LCD substrate G, and are provided in the development processing unit. (dev) 24 side, heat treatment unit block (TB) 38 is provided on the cassette station 1 side. A third transfer device 39 is provided between these two heat treatment unit blocks (TB) 37 and 38. As shown in the side view of the third heat treatment unit station 28 in FIG. 4, the heat treatment unit block (TB) 37 has a 15-pass unit (PASS) 77 for transferring the LCD substrate g in order from the bottom, and the LCD substrate G Three post-baking units (POBAKE) 78, 79, 80 in a post-baking process are composed of 4 layers. In addition, the heat treatment unit block (TB) 38 has a post-baking unit (P0BAKE) 81, a path for transferring and cooling the LCD substrate G from the bottom, a cooling unit (PASS · COL) 82, and a post-regeneration of the LCD substrate G. The two post-baking units (P0BAKE) 83 and 84, which are the two after-bake treatments, have a four-layer structure. The third conveying device 39 receives the LCD substrate G from the UV irradiation unit (i-UV) 25 through the passage unit (PASS) 77, carries in and out the LCD substrate G between the heat treatment units, and performs the passage through the passage. · Cooling unit (PASS · COL) 82 and transfer the LCD board G to the cassette station 1. In addition, the third transfer device 12 200527493 and 39 also have the same structure as the first transfer device 33, and can access any of the heat treatment unit blocks (D6) 37 and 38. The processing station 2 is provided with processing units and conveying devices, as described above, and constitutes a line of conveying lines A and B, and constitutes a basic processing sequence. A space 40 is provided between the conveying lines A and B. A shuttle (substrate mounting member) 41 is provided which can reciprocate in this space 40. The shuttle 41 is configured to secure the substrate G, and the shuttle 41 can transfer the rLCD substrate G between the transfer lines A and B. The transfer of the LCD substrate G of the shuttle 41 is performed by the first to third transfer devices 33, 36, and 39 described above. 10 The interface station 3 includes a conveying device 42 for carrying in and out of the RLCD substrate G between the processing station 2 and the exposure device 4, a buffer stage (BUF) 43 provided with a buffer box, and an extension and cooling of the substrate transfer section with a cooling function. The stage (EXT · COL) 44 ′ is a caption recording device (titLER) and a peripheral exposure device (ee). The external device block 45 laminated on top and bottom is provided adjacent to the carrying device. The conveying device 42 has a conveying arm 42a, and the LCD substrate G can be carried in and out between the processing station 2 and the exposure device 4 by the conveying arm 42a. In the anti-surname agent coating and development processing system 100 constructed in this way, first, the LCD substrate G disposed in the box C of the mounting table 9 of the box station 1 is directly transferred into the processing station 2 by the transfer device 1. Excimer UV irradiation unit (e —
20 UV)22而進行殘渣處理。接著藉搬運裝置11而將LCD基板G 捣C入/查洗淨處理單元(SCR)21而洗淨殘清。殘逢洗淨處理 後，藉著例如滾子搬運而將LCD基板G搬出於屬於第1熱處 理單元區26之熱處理單元區塊（TB)31的通路單元 (PASS)61 〇 13 200527493 配置於通路單元基板G於最初被搬運 於熱處理單元區塊(TB)31之脫水烘烤單元(DHP)62、63之其 中任何者並被加熱處理，接著搬運至熱處理單元區塊 (TB)32之冷卻單元66、67而冷卻後，為了提高抗蝕劑之定 5像性而搬運至熱處理單元區塊(TB)31之黏著器（AD)64及熱 處理單兀區塊(TB)32之黏著器（AD)68之其中任何者，在此 藉著HMDS而能進行黏著率處理(疏水化處理）。之後，lCd 基板G被搬運至冷卻單元66、67並冷卻，而且被搬運至熱處 理單元區塊(TB)32之通路(PASS)65。進行如此一連串的處 10理之際之LCD基板G之搬運處理全部藉第1搬運裝置33進 行。 配置於通路單元(PASS)65的LCD基板G設置於通路單 元(PASS)65内，例如藉著滾子搬運機構等之基板搬運機構 而搬入抗蝕劑處理單元23内。如將於之後要說明之於抗蝕 15劑塗布裝置(CT)23a，一面以水平姿勢搬運LCD基板G而一 面供給抗蝕劑而形成塗膜，其後以減壓乾燥裝置（VD)23b 對於塗膜施予減壓乾燥處理。其後，LCD基板G藉著設置在 減壓乾燥裝置（VD)23b之基板搬運臂而從抗蝕劑處理單元 23交接至屬於第2熱處理單元區27之熱處理單元區塊 20 (TB)34之通道單元(PASS)69。 配置於通路單元(PASS)69之LCD基板G，藉第2搬運裝 置36而被搬運至熱處理單元區塊（TB)34之預烘烤單元 (PREBAKE)70、71、72及熱處理單元區塊(ΤΒ)35之預烘烤 單元(PREBAKE)75、76之其中任何者並被預烘烤處理，之 200527493 後被搬運至熱處理單元區塊(ΤΒ)35的冷卻單元（c〇L)74而 冷卻至預疋溫度。藉第2搬運裝置36而而進一步被搬運至熱 處理單元區塊(TB)35之通路單元(PASS)73。 之後，LCD基板G藉第2搬運裝置36而被搬運至介面站3 5之延伸.冷卻載台（EXT · C〇L)44，且因應必要藉介面站3 之搬運裝置24而搬運至外部裝置區塊45的周邊曝光裝置 (EE)，在此進行用以去除抗蝕劑膜之外周部（不要部分）的曝 光。接著，LCD基板G藉著搬運裝置42而搬運至曝光裝置4 且在此以預定圖案對於LCD基板G上的抗蝕劑膜施予曝光 10處理。又，有LCD基板G暫時被收容在緩衝載台（buf)43卜 之緩衝匣，之後被搬運至曝光裝置4的情形。 曝光結束後，LCD基板G藉介面站3之搬運裝置42而被 搬入外部裝置區塊45之上段的字幕拍錄裝置(TITLER)而於 LCD基板G標記預定資訊後，載置於延伸·冷卻載台（Εχτ . 15 COL)44。LCD基板G藉第2搬運裝置36而從延伸·冷卻載台 (EXT · COL)44搬運至屬於第2熱處理單元區27之熱處理單 元區塊(TB)35的通路單元(paSS)73。 以作用從通路單元（PASS)73延長至顯像處理單元 (DEV)24之例如滾子搬運機構，而將LCD基板G從通路單元 2〇 (PASS)73搬入顯像處理單元（DEV)24。在顯像處理單元 (DEV)24例如以水平姿勢一面搬運基板而一面將顯像液塗 上於LCD基板G上，之後暫時停止搬運LCD基板g而將LCD 基板G傾斜預定角度而將顯像液淋在LCD基板G上，而且以 此狀態對於LCD基板G供給淋洗液而洗滌顯像液。其後使 15 200527493 LCD基板G回復到水平姿勢而再次開始搬運，並將乾燥用氮 氣或空氣吹付於LCD基板G而使LCD基板G乾燥。 顯像處理結束後，LCD基板G藉著連續的搬運機構，例 如滾子搬運而從顯像處理單元（DEV)24搬運至i線UV照射 5 早元(i — UV)25 ’並對於LCD基板G施予脫色處理。之後， LCD基板G藉著i線UV照射單元(i - uV)25内的滾子搬運機 構而被搬出至屬於第3熱處理單元區28之熱處理單元區塊 (TB)37的通路單元(PASS)77。 配置於通路單元(PASS)的LCD基板G藉著第3搬運裝置 10而被搬運至熱處理單元區塊（TB)37之後烘烤單元 (POBAKE)78 ' 79、80及熱處理單元區塊(tb)38之後烘烤單 元（ΡΟΒΑΚΕ)81、83、84之其中任何者而被施予後烘烤處 理，其後被搬運至熱處理單元區塊(ΤΒ)38之通路·冷卻單 元(PASS · COL)82而被冷卻至預定溫度後，藉著匣站丨的搬 15 運裝置11而被收容於配置在匣站1之預定的gc。 其次詳細地說明抗蝕劑處理單元23。第5圖為抗蝕劑處 理單元23的概略平面圖。 抗蝕劑塗布裝置（CT)23a具有於表面預定位置設有用 以喷射預定氣體之多數氣體噴射口 16a的載台12、在載台12 20上朝X方向搬運的基板搬運機構13、將抗蝕劑供給至移動在 載台12上之LCD基板G表面的抗蝕劑供給噴嘴14。又，減壓 乾燥裝置(VD)23b具有用以載置LCD基板G的載置台π、可 收容載置台17及載置於載置s172LCD基板〇的處理室 18。而且，抗蝕劑處理單元23具有將!^：!)基板G從抗蝕劑塗 16 200527493 布I置(CT)23a朝向減壓乾燥裝置(VD)23b搬運，且將LCD 基板G從減壓乾燥裝置（VD)23b朝向設置在熱處理單元區 塊(TB)34之通路單元(PAsS)69搬運的基板搬運臂19。 第6圖表示基板搬運機構π之概略構成的剝面圖。基板 5 I運機構13具有保持LCD基板G之Y方向端之一部分的保 持構件15a、15b、延伸於X方向而配置於載台12之γ方向側 面的直線導執51a、51b、保持該保持構件15&、15b而與直 線導軌51a、5lb嵌合的連結構件50、使連結構件5〇往返於X 方向的X軸驅動機構53。 10 保持構件15a、15b分別具有一個以上設於台座部49之 用以吸著保持LCD基板G之吸著塾48的構造，吸著墊48藉著 使真空泵等減壓機構52進行動作而能吸著保持LCD基板 G。吸著墊48以在LCD基板G未塗布抗蝕劑之部分的内面 側’亦即在LCD基板G之内面周緣部，保持LCD基板G。有 15關於X軸驅動機構53例如可舉出有帶驅動機構、球螺絲、空 氣滑動件、電動滑動件等。 載台12從LCD基板G之搬運方向的上游朝向下游區分 為導入載台部12a、塗布載台部12b、搬出載台部12c。導入 載台部12a係用以將LCD基板G從熱處理單元區塊(TB)32之 20通路單元(PASS)65朝向塗布載台部12b搬運的區域。於塗布 載台部12b配置著抗蝕劑供給噴嘴14，於此將塗液供給至 LCD基板G而形成塗膜。搬出載台部12c係用以將形成有塗 膜之LCD基板G朝向減壓乾燥裝置(VD)23b搬出的區域。 第7圖⑻〜(c)係分別模式地表示導入載台部12a、塗布 17 200527493 載台部12b、搬出載台部12C中的LCD基板G的搬運塑態的說 明圖。 如第5圖及第7圖（a)所示，於導入載台部i2a從其表面朝 向上方噴射氮氣或空氣等氣體之氣體喷射口 16a設置於預 5定位置，以使藉由此氣體噴射口 16a噴射之氣體而將LCD基 板G保持成為從導入載台部12a以略水平姿勢浮起的狀態。 為了提高LCD基板G的平面度，最好是弄短氣體噴射口 16a 的直徑而多設氣體噴射口 16 a的配置數。 如第5圖及第7圖（b)所示，於塗布載台部12b除了設置氣 10體喷射口 16a且於其表面之預定位置設置著吸氣口 16b。此 塗布載台部12b藉著調整從氣體噴射口 16a來的氣體喷射量 與從吸氣口 16b來的氣體吸氣量，而能以比導入載台部12a 及搬出載台部12c更高精確度來調整LCD基板g的浮起高 度0 15 如第5圖及第7圖⑷所示，於搬出載台部12c除了設置用 以使LCD基板G浮起的氣體喷射口 16a，更設置可昇起1^；1：) 基板G之上昇銷47以將朝向搬出載台部12c搬運而來之匕口^ 基板G交接至基板搬運臂19。 如此一來，抗蝕劑塗布裝置(CT)23a能將LCD基板G保 20持成距罐載台12為預定距離浮起的狀態。因此，要使保持 構件l5a、说保持LCD基板G而移動連結構件5〇，就不必要 大的力量。即，X軸驅動機構53不必要大的力矩，藉此可達 到基板搬運機構13的小型化。 第8圖表不抗#劑供給喷嘴〗4的概略立體圖。抗姓劑供 18 200527493 給喷嘴14具有於單方向長尺狀之箱體14a設置著將抗蝕劑 吐出成略帶狀之切縫狀的抗蝕劑吐出口 14b。此抗蝕劑供給 喷嘴14以使箱體14a之長邊方向一致於Y方向的狀態，藉著 喷嘴昇降機構30而自由昇降地安裝於配置在塗布載台部 5 12}3之約中央部位置的噴嘴保持部20。 用以測定抗蝕劑吐出口 14b與LCD基板G之間隔的感測 器20安裝於抗蝕劑供給噴嘴14，喷嘴昇降機構3〇依據此感 測器29的測定值而控制抗蝕劑供給噴嘴14的位置。抗蝕劑 供給喷嘴14的長度比LCD基板G之寬度(Y方向長度）短，而 10建構成於LCD基板G之周緣的一定區塊不會形成塗膜的狀 態。 於設置於減壓乾燥裝置(VD)23b之載置台17表面，在預 定位置設置著用以支撐LCD基板G之防撞銷（圖式未顯 不）。處理室18具有由被固定的下部容器與自由昇降的上部 15蓋體所構成之上下二分割構造。基板搬運臂19可朝向X方 向、Y方向、Z方向（鉛直方向）移動。 其次’說明前述構造之抗蝕劑處理單元23中的LCD基 板G的處理步驟。又，熱處理單元區塊(TB)32之通路單元 (PASS)65朝向抗蝕劑處理單元23之LCD基板g的搬運，乃藉 20著使用設置在通路單元(PASS)65之滾子46之旋轉的滾子搬 運機構而進行。 於最初，使保持構件15a、丨汕待機在熱處理單元區塊 (TB)32側’在載台之各部設成能使LCD基板G浮起於預定高 度的狀悲。接著藉由滾子搬運機構而從熱處理單元區塊 19 200527493 (ΤΒ)32之通路單元(PASS)65使Lcd基板⑽入導入載台部 基板G之。p分尚為滾子46所支撐的狀態而使 LCD基板〇之丫方向端侏持於保持構件…、⑸。接著使滾 子46所構成之搬運速度與保持構件⑸、⑸的移動速度配 5合，而將LCD基板G搬入載台12之導入載台部na。在導入 載台部12_如將LCD基板G以浮起於其表面ΐ5〇μπι的狀態 來搬運。 LCD基板G隨著朝向基板搬運機構13之驅動所構成之 保持構件15a、15b之X方向移動，而被搬入塗布載台部121)。 1〇在塗布載台部12b藉著從氣體喷射口 16a來的氣體喷射及從 吸氣口 16b來的吸氣而能例如將LCD基板〇之浮起高度達到 距其表面40//m的範圍。 LCD基板G通過抗蝕劑供給喷嘴14之下方之際，抗蝕劑 從抗蝕劑供給噴嘴14吐出至LCD基板G而形成塗膜。例如塗 15布載台部12b中的基板搬運速度可設為150mm/秒。如此一 來，藉著將LCD基板G之浮起高度弄低而能更提高LCD基板 G的平面度，因此能形成厚度均一的塗膜。20 UV) 22 and residue treatment. Next, the LCD substrate G is mashed into the cleaning processing unit (SCR) 21 by the conveying device 11 to clean and remain. After the cleaning process, the LCD substrate G is moved out of the heat treatment unit block (TB) 31 of the first heat treatment unit block 26 (pass) 61 (pass) 61 〇13 200527493 by the roller conveyance. The substrate G is first transferred to any one of the dehydration baking units (DHP) 62 and 63 of the heat treatment unit block (TB) 31 and heat-processed, and then transferred to the cooling unit 66 of the heat treatment unit block (TB) 32 After cooling down to 67, the adhesive is transferred to the heat treatment unit block (TB) 31 adhesive (AD) 64 and heat treatment unit block (TB) 32 adhesive (AD) in order to improve the specificity of the resist. Any of 68 can be subjected to adhesion treatment (hydrophobization treatment) by HMDS. After that, the 1Cd substrate G is transferred to the cooling units 66 and 67 and cooled, and is transferred to the passage 65 (PASS) 65 of the thermal processing unit block (TB) 32. When carrying out such a series of processes, all the handling processes of the LCD substrate G are carried out by the first carrying device 33. The LCD substrate G disposed in the passage unit (PASS) 65 is installed in the passage unit (PASS) 65, and is carried into the resist processing unit 23 by a substrate transfer mechanism such as a roller transfer mechanism. As will be described later, in the resist 15-agent coating device (CT) 23a, the LCD substrate G is conveyed in a horizontal posture while the resist is supplied to form a coating film, and then a vacuum drying device (VD) 23b is used. The coating film was dried under reduced pressure. Thereafter, the LCD substrate G is transferred from the resist processing unit 23 to the heat treatment unit block 20 (TB) 34 belonging to the second heat treatment unit area 27 by the substrate transfer arm provided in the vacuum drying device (VD) 23b. Channel unit (PASS) 69. The LCD substrate G arranged in the pass unit (PASS) 69 is transported to the pre-baking unit (PREBAKE) 70, 71, 72 and the heat treatment unit block (PREBAKE) 70 of the heat treatment unit block (TB) 34 by the second conveying device 36. Any one of PREBAKE 75, 76 of TB) 35 is pre-baked, and after 200527493, it is transferred to cooling unit (c0) 74 of heat treatment unit block (TB) 35 for cooling To pre-clog temperature. It is further transported to the path unit (PASS) 73 of the thermal processing unit block (TB) 35 by the second transport device 36. After that, the LCD substrate G is transferred to the extension of the interface station 35 by the second transfer device 36. The cooling stage (EXT · COL) 44 is transferred to the external device by the transfer device 24 of the interface station 3 as necessary. The peripheral exposure device (EE) of the block 45 performs exposure for removing the outer peripheral portion (unnecessary portion) of the resist film. Next, the LCD substrate G is conveyed to the exposure device 4 by the conveying device 42, and the resist film on the LCD substrate G is subjected to exposure 10 in a predetermined pattern. In addition, the LCD substrate G may be temporarily stored in a buffer box of a buffer stage (buf) 43 and then transferred to the exposure device 4. After the exposure is over, the LCD substrate G is moved into the caption recording device (TITLER) above the external device block 45 by the carrying device 42 of the interface station 3. After the LCD substrate G is marked with predetermined information, it is placed on the extension and cooling load.台 （Εχτ. 15 COL） 44. The LCD substrate G is transferred from the extension / cooling stage (EXT · COL) 44 to the passage unit (paSS) 73 of the heat treatment unit block (TB) 35 belonging to the second heat treatment unit area 27 by the second transfer device 36. The LCD substrate G is moved from the passage unit 20 (PASS) 73 into the development processing unit (DEV) 24, for example, by a roller transport mechanism extending from the passage unit (PASS) 73 to the development processing unit (DEV) 24. In the development processing unit (DEV) 24, for example, the developing liquid is coated on the LCD substrate G while carrying the substrate in a horizontal posture, and then the LCD substrate G is temporarily stopped and the LCD substrate G is inclined at a predetermined angle to develop the developing liquid. It is showered on the LCD substrate G, and an eluent is supplied to the LCD substrate G in this state to wash the developing solution. Thereafter, the LCD substrate G was returned to a horizontal posture and the conveyance was started again, and the nitrogen or air for drying was blown onto the LCD substrate G to dry the LCD substrate G. After the development process is completed, the LCD substrate G is transferred from the development processing unit (DEV) 24 to the i-line UV irradiation by a continuous transfer mechanism, such as a roller transfer, and 5 UV rays (i — UV) 25 ′ are applied to the LCD substrate. G is given a decoloring treatment. Thereafter, the LCD substrate G is carried out to the passage unit (PASS) of the heat treatment unit block (TB) 37 belonging to the third heat treatment unit region 28 by the roller conveyance mechanism in the i-ray UV irradiation unit (i-uV) 25. 77. The LCD substrate G disposed in the pass unit (PASS) is transferred to the heat treatment unit block (TB) 37 by the third transfer device 10, and then the baking unit (POBAKE) 78 '79, 80, and the heat treatment unit block (tb) After 38, any one of the baking units (ΡΟΒΑΚΕ) 81, 83, and 84 is subjected to a post-baking treatment, and is then transferred to the passageway / cooling unit (PASS · COL) 82 of the heat treatment unit block (TB) 38 and After being cooled to a predetermined temperature, it is accommodated in a predetermined gc arranged in the magazine station 1 by the carrying device 11 of the magazine station 丨. Next, the resist processing unit 23 will be described in detail. Fig. 5 is a schematic plan view of the resist processing unit 23. The resist coating device (CT) 23a has a stage 12 provided with a plurality of gas injection ports 16a for ejecting a predetermined gas at a predetermined position on the surface, a substrate transfer mechanism 13 for carrying the X direction on the stage 12 20, and a resist The agent is supplied to a resist supply nozzle 14 which is moved on the surface of the LCD substrate G on the stage 12. The reduced-pressure drying device (VD) 23b includes a mounting table π for mounting the LCD substrate G, a mounting table 17 that can be accommodated, and a processing chamber 18 for mounting the s172 LCD substrate 0. Furthermore, the resist processing unit 23 has a function of transferring the substrate G from the resist coating 16 200527493 (CT) 23a to the decompression drying device (VD) 23b, and decompressing the LCD substrate G from the decompression device. The drying device (VD) 23b faces the substrate conveying arm 19 conveyed by the path unit (PAsS) 69 provided in the heat treatment unit block (TB) 34. FIG. 6 is a peeling diagram showing a schematic configuration of the substrate conveyance mechanism π. The substrate 5 transport mechanism 13 includes holding members 15a and 15b that hold a part of the Y-direction end of the LCD substrate G, linear guides 51a and 51b extending in the X direction and disposed on the γ-direction side surface of the stage 12, and holding the holding members. 15 &, 15b, a coupling member 50 that fits into the linear guides 51a, 5lb, and an X-axis driving mechanism 53 that reciprocates the coupling member 50 in the X direction. 10 Each of the holding members 15a and 15b has a structure of more than one suction chuck 48 provided on the pedestal portion 49 for holding and holding the LCD substrate G. The suction pad 48 can suck by operating a pressure reducing mechanism 52 such as a vacuum pump. Hold the LCD substrate G. The suction pad 48 holds the LCD substrate G on the inner surface side of the portion where the LCD substrate G is not coated with a resist, that is, on the peripheral edge portion of the inner surface of the LCD substrate G. Examples of the X-axis driving mechanism 53 include a belt driving mechanism, a ball screw, an air slider, and an electric slider. The stage 12 is divided into the introduction stage part 12a, the coating stage part 12b, and the carry-out stage part 12c from the upstream to the downstream of the conveyance direction of the LCD substrate G. The introduction stage portion 12a is an area for transporting the LCD substrate G from the 20-pass unit (PASS) 65 of the heat treatment unit block (TB) 32 toward the coating stage portion 12b. A resist supply nozzle 14 is arranged on the coating stage portion 12b, and a coating liquid is supplied to the LCD substrate G to form a coating film. The carry-out stage portion 12c is an area for carrying out the LCD substrate G on which the coating film has been formed toward the vacuum drying device (VD) 23b. Figs. 7 (a) to (c) are explanatory diagrams schematically showing the conveyance state of the LCD substrate G in the introduction stage portion 12a, the coating 17 200527493 stage portion 12b, and the unloading stage portion 12C. As shown in FIG. 5 and FIG. 7 (a), a gas injection port 16a for injecting a gas such as nitrogen or air from the surface of the introduction stage portion i2a upward is provided at a predetermined position so that the gas is ejected by the gas. The gas sprayed from the port 16a holds the LCD substrate G in a state of floating from the introduction stage portion 12a in a slightly horizontal posture. In order to improve the flatness of the LCD substrate G, it is preferable to increase the number of the gas injection ports 16 a by shortening the diameter of the gas injection ports 16 a. As shown in FIG. 5 and FIG. 7 (b), the coating stage portion 12b is provided with a gas 10-body ejection port 16a and a suction port 16b at a predetermined position on the surface in addition to the gas 10-body ejection port 16a. The coating stage portion 12b can adjust the gas injection amount from the gas injection port 16a and the gas intake amount from the suction port 16b, so that the coating stage portion 12b can be more accurate than the introduction stage portion 12a and the removal stage portion 12c. As shown in FIG. 5 and FIG. 7 (a), the lifting height of the LCD substrate g can be adjusted to 15 degrees. In addition to the gas ejection port 16a for lifting the LCD substrate G, the lift-out stage 12c is provided with a liftable height. 1); 1) The rising pin 47 of the substrate G transfers the substrate G to the substrate transfer arm 19 with a dagger ^ that is carried toward the carrying-out stage portion 12c. In this way, the resist application device (CT) 23a can hold the LCD substrate G 20 in a state where it is floated at a predetermined distance from the tank stage 12. Therefore, a large force is not necessary to move the connection member 50 by holding the holding member 15a, that is, holding the LCD substrate G. That is, the X-axis drive mechanism 53 does not need a large torque, and thereby the miniaturization of the substrate transport mechanism 13 can be achieved. Fig. 8 is a schematic perspective view of the anti- # agent supply nozzle. Anti-surname agent supply 18 200527493 A nozzle 14 having a slit-shaped box body 14a in one direction is provided with a slit-shaped resist discharge port 14b for discharging the resist into a slightly band-like shape. This resist supply nozzle 14 is mounted in a state where the longitudinal direction of the case 14a coincides with the Y direction, and is freely lifted and lowered by the nozzle lifting mechanism 30 at a position about the center of the coating stage 5 12} 3.的 Nozzle holding section 20. A sensor 20 for measuring the distance between the resist discharge port 14b and the LCD substrate G is mounted on the resist supply nozzle 14, and the nozzle lifting mechanism 30 controls the resist supply nozzle based on the measurement value of the sensor 29. 14 positions. The length of the resist supply nozzle 14 is shorter than the width (length in the Y direction) of the LCD substrate G, and a certain area formed on the peripheral edge of the LCD substrate G does not form a coating film. A bumper pin (not shown in the figure) for supporting the LCD substrate G is provided on a surface of the mounting table 17 provided on the vacuum drying device (VD) 23b at a predetermined position. The processing chamber 18 has an upper and lower two-part structure consisting of a fixed lower container and an upper and lower cover 15 that can be raised and lowered. The substrate transfer arm 19 is movable in the X direction, the Y direction, and the Z direction (vertical direction). Next, the processing steps of the LCD substrate G in the resist processing unit 23 having the foregoing configuration will be described. In addition, the passage unit (PASS) 65 of the heat treatment unit block (TB) 32 is moved toward the LCD substrate g of the resist processing unit 23 by rotating the roller 46 provided in the passage unit (PASS) 65 by 20 Roller conveyor. Initially, the holding members 15a and Shan stand on the side of the heat treatment unit block (TB) 32 'on each part of the stage so that the LCD substrate G can float to a predetermined height. Then, the Lcd substrate is introduced into the substrate stage G from the heat treatment unit block 19 200527493 (TB) 32 via the pass unit (PASS) 65 by a roller conveying mechanism. The p-point is still in a state supported by the roller 46, so that the y-direction end of the LCD substrate 0 is held in a holding member ..., ⑸. Next, the conveying speed constituted by the rollers 46 and the moving speed of the holding members ⑸ and ⑸ are matched to each other, and the LCD substrate G is carried into the introduction stage na of the stage 12. In the introduction stage 12_, the LCD substrate G is carried in a state of being floated on its surface by 50 μm. The LCD substrate G is carried into the coating stage 121 as it moves toward the X direction of the holding members 15a and 15b constituted by the driving of the substrate transport mechanism 13.) 10. The coating stage portion 12b can raise the height of the LCD substrate 0 to a range of 40 // m from the surface by, for example, gas injection from the gas injection port 16a and suction from the air intake port 16b. . When the LCD substrate G passes below the resist supply nozzle 14, the resist is discharged from the resist supply nozzle 14 to the LCD substrate G to form a coating film. For example, the substrate transfer speed in the 15-coat stage portion 12b can be set to 150 mm / second. In this way, the flatness of the LCD substrate G can be further improved by lowering the floating height of the LCD substrate G, so that a coating film having a uniform thickness can be formed.
又’抗蝕劑供給喷嘴14的高度依據感測器29之測定信 號而對於每個LCD基板G進行調整，惟，一般多數的LCD基 20 板〇的搬運狀態相同，因此以在最初處理之LCD基板G或假 基板來調節抗#劑供給喷嘴14的高度的話，之後幾乎無必 要調整抗蝕劑供給喷嘴14的高度。又，從抗蝕劑供給喷嘴 14來的抗蝕劑之問始吐出/吐出結束的時序可利用感測器 29之測定信號而決定，亦可另外設置用以檢測LCD基板G 20 200527493 位置之感測器而依據從此感測器來的信號來決定。 藉著通過塗布載台部12b而形成塗膜的[(：1)基板G隨著 保持構件15a、15b的移動而被搬運至搬出載台部12c。在搬 出載σ部12c ’ LCD基板G被設成例如浮起距其表面1〆m 5的狀怨。若基板G整體達到搬出載台部12C之上，則 解除以保持構件15a、15b所構成之吸著保持，且使昇降銷 47上昇而將LCD基板G帶上預定的高度。 接著，基板搬運臂19存取其藉著昇降銷47而帶上的 LCD基板G。基板搬運臂19若是在LCD基板G之Y方向端把 10持LCD基板G的話，則使昇降銷47下降。又，基板搬運臂19 將已把持之LCD基板G載置於減壓乾燥裝置(vD)23b之載置 台17上。之後密閉處理室18並使其内部減壓而乾燥塗膜。 若是結束LCD基板G之減壓乾燥裝置（vD)23b之處 理，則開啟處理室18使3荏搬運臂19存取已載置在載置台17 15的1^13基板G而把持LCD基板G，並將LCD基板G搬運至熱 處理單元區塊(TB)34之通路單元(PASS)69。另一方面，將 LCD基板G交接至昇降銷47後之保持構件15a、15b為了要搬 運其次要處理之LCD基板G,乃回到熱處理單元區塊(tb)32 側，之後反覆上述處理步驟。 20 此塗布形成方法之LCD基板G以總是從載台12浮起的 狀態被搬運，因此不會發生載置台12表面的複製而能抑制 粒子附者於LCD基板G的内面。又，由於用以將抗姓劑塗布 於LCD基板G之管路可弄得短，因此可獲得高的流通率。 如此塗布裝置(CT)23a中的LCD基板G的搬運方法上， 21 200527493 直至保持構件15a、15b於搬出載台部12c將LCD基板G交接 至幵降銷47而回到熱處理單元區塊(TB)32側為止，無法將 其次應處理之LCD基板G搬入導入載台12a。因此於以下說 明於抗姓劑塗布裝置(CT)23a更佳裝備的基板冑運機構。 5 第9圖表示設置於抗蝕劑塗布裝置(CT)23a之其他基板 搬運機構之概略構造的平面圖（第9圖⑻及剝面圖（第9圖 (b))。此基板搬運機構55具有保持1^〇基板〇之¥方向端的 保持構件85a、85b、分別嵌合於直線導執51a、與之前 說明之基板搬運機構13相同）且將保持構件85a、8讣分別保 10持成自由滑動於Y方向的移動體86a、86b、使移動體86a、 86b分別而個別地移動於χ方向的χ軸驅動機構53a、5补。 保持構件85a、85b分別具有於x方向長的形狀，而具有 多數吸著墊48以能在χ方向寬廣的範圍保持LCD基板〇之¥ 方向端。藉此，使保持構件85a、85b分別單獨保持1^1)基 15板G而使保持構件85a、85b朝向乂方向移動，亦能防止匕⑶ 基板〇在Y方向的發生搖動而能使LCD基板G的搬運姿勢穩 定。又，保持構件85a、85b分別藉著圖式未顯示之γ方向滑 動機構而自由地滑動於γ方向。 第10圖係模式地表示此基板搬運機構55所構成之LCD 2〇基板G之搬運型恶的說明圖。於最初將保持構件85b配置於 遠離γ方向的位置以使其不會接觸被搬入導入載台部的 LCD基板G，另一方面於導入載台部12a將保持構件85a配置 於此保持LCD基板⑽丫方向端的位置，使保持構件心保 持被搬入導入载台部12a的LCD基板G(第10圖（a))。 22 200527493 /、-人，使保持構件85a朝向X方向移動，將LCD基板^ ，向塗布載台部12b搬入，而在此進行塗膜的形成。又，若 是LCD基板G整體搬入塗布載台部12b，則導入載台部12& 形成能將其次要處理之LCD基板G予以搬人的狀態，因此能 5將保持構件85b於導入載台部12a移動至能保持l(：d基板g 之γ方向端的位置（第10圖卬乃。 接著，保持構件85b保持新搬入導入載台部12a的lcd 基板G’而開始朝向塗布載台部12b搬運。另一方面，保持構 件85a將已形成塗膜之LCD基板G朝向搬出載台部以搬 1〇運，而在此交接至昇降銷47(第1〇圖（c))。之後，保持構件 85a以遂離載台12的狀態而回到導入載台部仏側以達到不 έ衝犬保持構件85b要搬運的LCD基板g(第1〇圖（d))。其 次，若是保持在保持構件85b之LCD基板G，整體搬入塗布載 台部12b，則新的LCD基板G被搬入導入載台部i2a，而使保 15持構件85a移動至能保持LCD基板〇之¥方向端的位置。之 後，保持構件85a、85b反覆與上述保持構件85a相同的動作。 接著進一步說明其他基板搬運機構。第n圖表示設置 於抗蝕劑塗布裝置（CT)23a之另外其他基板搬運機構之概 略構造的剝面圖。此基板搬運機構56具有於載台12之丫方向 2〇側面各設置二條的直線導軌51a〜51d、分別嵌合於直線導 轨51a〜51d的移動體88a〜88d、分別設置於移動體88a、88b 的昇降機構89a、89b、分別保持於昇降機構89a、8%之保 持構件15a、15b、分別設置於移動體88c、88d的保持構件 15c、15d、使保持構件15c、15d分別滑動於γ軸方向的丫軸 23 200527493 驅動機構8 9 c、8 9 d、使移動體8 8 a〜8 8 d分別朝向χ方向滑動 的X軸驅動機構53a〜53d。 第η圖⑻表示保持構件15a、15b構成一组而保持著 LCD基板G的狀恶’第11圖（b)表示保持構件以、⑼構成 5 -組而保持著LCD基板⑽狀態]呆持構件⑸、⑽搬運 LCD基板G之際，保持構件…、⑽之分別的移動就垂直面 S(參照第11圖⑻)成為對象那般，同樣地控制χ軸驅動機構 53a、53b及昇降機構89a、89b的驅動。保持構件i5c、⑸ 搬運LCD基板G之際，亦同樣地控制χ軸驅動機構53c、53d 10 及昇降機構89c、89d的驅動。 第12圖表不保持構件15a〜15d之動作的說明圖。首 先，以保持構件15a〜15d保持從熱處理單元區塊(TB)32之 通路單元(PASS)65搬運至導入載台部12a而來的1^〇基板(；} 的情形下，乃將保持構件15〇 15d設成遠離載台12而向γ 15 方向的狀態（第12圖（a))。 若是保持構件15a、15b保持LCD基板G，則使保持構件 15a 15b朝向塗布載台部i2b側而將抗餘劑塗布於lcd基板 G。另一方面，將保持構件15c、15d靠近載台12以使保持構 件15a〜15d能接受其次從通路單元（PASS)65搬運而來之 20 LCD基板G (第 12圖（b))。 保持著已形成塗膜之LCD基板G的保持構件15a、15b 朝向搬出載台逝12c之後，在此將保持的LCD基板G交接至 昇降銷47(未顯示於第12圖）。相對於此，保持構件15卜 保持從熱處理單元區塊(TB)32之通路單元(PASS)65朝向導 24 200527493 入載台部12a搬運而來之乙^^基板G，而開始朝向塗布載台 部12b側的移動（第12圖（c))。 其次，使保持構件15a、15b降下至比保持構件i5c、i5d 更低的位置之後，以此狀態回到導人載台部12a側（參照第 5 11圖⑻），之後將保持構件…、15b之高度調整成能保持新 的LCD基板G的高度。相對於此，保持構件15〇、⑸將lcd 基板G朝向塗布載台部12b側搬運，而kLCD基板g，形成塗 膜（第12圖（d))。 到達搬出載台部12c之保持構件15c、15d以搬出載台部 10 l2c將已保持之LCD基板G，交接於昇降銷47(第12圖未顯 不）。又，保持構件15a · 15b保持從熱處理單元區塊(TB)32 之通路單元（PASS)65搬運至導入載台部丨仏的以^基板 G’’，而開始朝向塗布載台部12b側移動（第12圖（6))。 接著，將保持構件15c、I5d遠離載台12，並以此狀態 15回到導入載台部12a(第U圖（f))。之後，保持構件15c、15d 分別藉著反覆上述過程而逐次搬運LCD基板G。於使用如此 的基板搬運機構55、56的情形下，能連續搬運LCD基板而 進行塗膜之形成處理，因此能獲得高的流通率。 以上$兒明了本發明之貫施樣態，惟，本發明並非僅限 20於如此樣態者。例如可將LCD基板G從熱處理單元區塊 (TB)32之通路單元（PASS)65搬運至抗蝕劑塗布裝置 (CT)23a的搬入，乃於通路單元(pASS)設置基板搬運臂，且 於導入載台部12a設置昇降銷，此基板搬運臂將已保持之 LCD基板交接至昇降銷，並藉著下降昇降銷而在導入載台 25 200527493 部12a的^面近旁使保持構件l5a、祝保持lcd基板〇。 又月】已。兄明保持構件15a、15b以其搬運方向前頭部 來保持LCD基板G而構成拉著LCD基板G以進行搬運的樣 態，然而亦可保持構件15a、15b以其搬運方向後側部來保 5持LCD基板G而推著LCD基板G那般地搬運。而|，基板搬 運機構65使保持構件15卜15d以Y方向自由滑動，惟，亦可 將保持構件l5a、l5b建構成在搬運LCD基板G之高度與比搬 運LCD基板G之高度更高的位置之間自由昇降的構成。藉 此，能使保持構件15a、15b不會衝突保持構件15c、15d而 10而使其專父互地搬運LCD基板G。於上述說明中，以抗钱劑 作為塗膜，惟，塗膜並非僅限於此，亦可為反射防止膜或 不具有感光性的絕緣膜等。 產業上的利用性 本發明適用於將抗蝕劑膜形成在LCD基板等大型基板 15 之抗蝕劑膜形成裝置及抗蝕劑膜形成方法。 【圖式簡單說明】 第1圖係具有本發明之塗膜形成裝置之一實施樣態之 抗鍅劑塗膜裝置的抗蝕劑塗布·顯像處理系統的概略平面 圖。 20 第2圖表示第1圖所示之塗布·顯像處理系統之第1熱處 理早7〇區的側面圖。 第3圖表示第1圖所示之塗布·顯像處理系統之第2熱處 理早兀區的側面圖。 第4圖表示第1圖所示之塗布·顯像處理系統之第3熱處 26 200527493 理單元區的側面圖。 第圖係抗蝕劑處理單元的概略平面圖。 圖表示基板搬運機構之概略構成的剝面圖。 #圖、(a)〜（c)係模式地表示導入載台部、塗布栽台 I5①出載σ邛分別的LCD基板之搬運型態的說明圖。 第8圖係抗蝕劑供給噴嘴的概略立體圖。 第9圖（a)、⑻表示設於抗餘劑塗布裝置之其他基板搬 運機構之概略構造的平面圖及剝面圖。 弟〇H (a)〜(①係模式地表示第9圖所示之基板搬運機 10構所構成LCD基板之搬運型態的說明圖。 第11圖（a)、（b)表示設於抗餘劑塗布裝置之另外其他美 板搬運機構之概略構造的剝面圖。 第12圖⑻〜(f)係模式地表示第11圖所示之基板搬運機 構所構成LCD基板之搬運型態的說明圖。 15 【主要元件符號說明】 1 匣站 11a 搬運臂 2 處理站 12a 導入載台部 3 介面站 12b 塗布載台部 4 曝光裝置 12c 搬出載台部 G、 G’ 基板 13 基板搬運機構 C 匣 14 抗蝕劑供給噴嘴 9 載置台 14a 箱體 10 搬運路線 14b 抗蝕劑吐出口 11 搬運裝置 15a、 ^15d保持構件 27 200527493 16a 氣體噴射口 16b 吸氣π 17 載置台 18 處理室 A、 Β 搬運線 19 基板搬運臂 20 感測器 21 殘渣洗淨處理單元(SCR) 22 準分子UV照射單元(e__ UV) 23 抗蝕劑處理單元 23a 抗蝕劑塗布裝置(CT) 23b 減壓乾燥裝置(VD) 24 顯像處理單元(DEV) 25 i線UV照射單元(i 一 UV) 26 第1熱處理單元區 27 第2熱處理單元區 28 第3熱處理單元區 29 感測器 30 噴嘴昇降機構 3卜 32 熱處理單元區塊 33 第1搬運裝置 34、 35 熱處理單元區塊(TB) 36 第2搬運裝置 38熱處理單元區塊(tb) 第3搬運裝置 空間 梭 搬運裝置 搬運臂 緩衝載台 延伸·冷卻載台(ΕΧΤ · COL) 外部裝置區塊 滾子 昇降銷 吸著墊 台座部 連結構件 、51b 直線導軌 減壓機構 53a〜d X軸驅動機構 56 基板搬運機構 通路單元(PASS) 63 脫水烘乾單元 黏著器處理單元(AD) 通路單元(PASS) 67 冷卻單元(COL) 28 200527493 68 黏著器處理單元(AD) 86a、 86b 移動體 69 通路單元(PASS) 88a〜88d 移動體 70 〜72 預烘烤單元 89a、 89b 昇降機構 (PREBAKE) 89c、 89d Y軸驅動機構 73 通路單元(PASS) 91 導軌 74 冷卻單元(COL) 92 昇降構件 75 預烘烤單元(PREBAKE) 93 基底構件 76 預烘烤單元(PREBAKE) 94 基板保持臂 77 通路單元(PASS) 95〜97 馬達 78- -81後烘烤單元(POBAKE) 100 抗#劑塗布·顯像處理 82 通路·冷卻單元(PASS · 系統 COL) 83、84後烘烤單元(POBAKE) 85a、85b 保持構件 29The height of the resist supply nozzle 14 is adjusted for each LCD substrate G in accordance with the measurement signal from the sensor 29. However, most LCD substrates 20 generally have the same transport state. If the height of the anti-agent supply nozzle 14 is adjusted by the substrate G or the dummy substrate, it is almost unnecessary to adjust the height of the resist supply nozzle 14 thereafter. In addition, the timing of the start / discharge of the resist from the resist supply nozzle 14 can be determined by the measurement signal of the sensor 29, or a sensor for detecting the position of the LCD substrate G 20 200527493 can be provided separately. The sensor is determined based on the signal from the sensor. The [(: 1) substrate G formed by coating the stage portion 12b with a coating film [[: 1]] is carried to the carry-out stage portion 12c as the holding members 15a and 15b move. In the unloading sigma portion 12c ', the LCD substrate G is set to float, for example, 1〆m 5 from its surface. When the substrate G as a whole reaches above the carrying-out stage portion 12C, the suction holding by the holding members 15a and 15b is released, and the lifting pin 47 is raised to raise the LCD substrate G to a predetermined height. Next, the substrate transfer arm 19 accesses the LCD substrate G which it has carried by the lift pins 47. If the substrate transfer arm 19 holds the LCD substrate G at the Y-direction end of the LCD substrate G, the lifting pin 47 is lowered. The substrate transfer arm 19 places the held LCD substrate G on a mounting table 17 of a vacuum drying device (vD) 23b. Thereafter, the processing chamber 18 is hermetically closed and the inside thereof is decompressed to dry the coating film. If the processing of the vacuum drying device (vD) 23b of the LCD substrate G is finished, the processing chamber 18 is opened so that the 3 荏 transfer arm 19 accesses the 1 ^ 13 substrate G which has been placed on the mounting table 17 15 and holds the LCD substrate G. The LCD substrate G is transferred to a pass unit (PASS) 69 of the heat treatment unit block (TB) 34. On the other hand, the holding members 15a, 15b after the LCD substrate G is transferred to the lift pins 47 are returned to the heat treatment unit block (tb) 32 side in order to transport the LCD substrate G to be processed next, and then the above-mentioned processing steps are repeated. 20 Since the LCD substrate G in this coating formation method is always lifted from the stage 12, the surface of the stage 12 is not duplicated and particle attachment to the inner surface of the LCD substrate G can be suppressed. In addition, since the pipe for applying the anti-surname agent to the LCD substrate G can be made short, a high flow rate can be obtained. As described above, in the method for transporting the LCD substrate G in the coating device (CT) 23a, 21 200527493 until the holding members 15a and 15b transfer the LCD substrate G to the lowering pin 47 at the carrier stage 12c and return to the heat treatment unit block (TB ) Up to the 32 side, the next-to-be-processed LCD substrate G cannot be carried into the introduction stage 12a. Therefore, a substrate transport mechanism which is better equipped with the anti-surname agent coating device (CT) 23a will be described below. 5 FIG. 9 is a plan view (FIG. 9) and a peeling view (FIG. 9 (b)) of a schematic structure of another substrate conveying mechanism provided in the resist coating device (CT) 23a. This substrate conveying mechanism 55 has The holding members 85a, 85b holding the end of the ¥ direction of the 1 ^ 〇 substrate 0 are respectively fitted to the linear guide 51a, which is the same as the substrate conveying mechanism 13 described above), and the holding members 85a and 8 讣 are held at 10 to slide freely The moving bodies 86a, 86b in the Y direction, and the x-axis driving mechanisms 53a, 5 that move the moving bodies 86a, 86b individually in the x direction are supplemented. Each of the holding members 85a and 85b has a shape that is long in the x direction, and includes a plurality of absorbing pads 48 that can hold the end of the LCD substrate 0 in a wide range in the x direction. Thereby, holding the holding members 85a and 85b individually holding 1 ^ 1) the base 15 plate G and moving the holding members 85a and 85b toward the 乂 direction can also prevent the substrate from being shaken in the Y direction and can make the LCD substrate G's carrying posture is stable. The holding members 85a and 85b are freely slidable in the γ direction by a γ-direction sliding mechanism (not shown). FIG. 10 is an explanatory diagram schematically showing a transport-type evil of the LCD 20 substrate G constituted by the substrate transport mechanism 55. FIG. Initially, the holding member 85b is arranged at a position away from the γ direction so as not to contact the LCD substrate G carried into the introduction stage portion. On the other hand, the holding member 85a is arranged to hold the LCD substrate in the introduction stage portion 12a. The position of the Y-direction end holds the holding member center to the LCD substrate G carried into the introduction stage portion 12a (Fig. 10 (a)). 22 200527493 /,-A person moves the holding member 85a in the X direction, carries the LCD substrate ^ into the coating stage portion 12b, and forms a coating film there. In addition, if the entire LCD substrate G is carried into the coating stage portion 12b, the introduction stage portion 12 & forms a state in which the LCD substrate G to be processed next can be transferred to a person, so that the holding member 85b can be moved to the introduction stage portion 12a. It moves to a position where the γ-direction end of l (: d substrate g can be held (Fig. 10). Next, the holding member 85b holds the lcd substrate G 'newly loaded into the introduction stage portion 12a and starts to move toward the coating stage portion 12b. On the other hand, the holding member 85a transports the LCD substrate G on which the coating film has been formed toward the carrying-out stage section, and then transfers it to the lifting pin 47 (Fig. 10 (c)). Thereafter, the holding member 85a The LCD substrate g to be transported by the dog holding member 85b is returned to the side of the introduction stage in a state of being separated from the carrier 12 (Fig. 10 (d)). Second, if it is held on the holding member 85b The entire LCD substrate G is carried into the coating stage portion 12b, and a new LCD substrate G is carried into the introduction stage portion i2a, and the holding member 85a is moved to a position capable of holding the ¥ direction end of the LCD substrate 0. After that, The members 85a and 85b repeat the same operation as the above-mentioned holding member 85a. Further description of other substrate conveying mechanisms. FIG. N shows a peeling diagram of a schematic structure of another substrate conveying mechanism provided in the resist coating device (CT) 23a. This substrate conveying mechanism 56 is provided in the direction 2 of the stage 12. 〇 Two linear guides 51a to 51d are provided on each side, moving bodies 88a to 88d fitted to the linear guides 51a to 51d, lifting mechanisms 89a and 89b respectively provided on the moving bodies 88a and 88b, and each is held by the lifting mechanism 89a. , 8% of holding members 15a, 15b, holding members 15c, 15d respectively provided on the moving bodies 88c, 88d, and y-axes that slide the holding members 15c, 15d in the γ-axis direction 23 200527493 Drive mechanism 8 9 c, 8 9 d. X-axis driving mechanisms 53a to 53d that slide the moving bodies 8 8 a to 8 8 d in the χ direction. Fig. n shows that the holding members 15a and 15b form a group and hold the LCD substrate G. (B) of FIG. 11 shows that the holding members are held in a 5-unit group with ⑼ to hold the LCD substrate]] When the holding members ⑸ and ⑽ transport the LCD substrate G, the respective movements of the holding members ..., ⑽ are perpendicular to the plane S ( (Refer to Figure 11⑻) Control the driving of the χ-axis driving mechanisms 53a and 53b and the lifting mechanisms 89a and 89b in the same manner. When the holding members i5c and ⑸ carry the LCD substrate G, the χ-axis driving mechanisms 53c and 53d 10 and the lifting mechanisms 89c and 89d are also controlled in the same manner. The driving of the twelfth chart does not show the operation of the holding members 15a to 15d. First, the holding members 15a to 15d are used to hold the passage unit (PASS) 65 from the heat treatment unit block (TB) 32 to the introduction stage 12a. In the case of the 1 ^ 〇 substrate (;), the holding member 1515d is placed away from the stage 12 and moved in the direction of γ 15 (Fig. 12 (a)). When the holding members 15a and 15b hold the LCD substrate G, the holding members 15a and 15b are applied to the lcd substrate G with the holding members 15a and 15b facing the coating stage portion i2b. On the other hand, the holding members 15c and 15d are brought close to the stage 12 so that the holding members 15a to 15d can receive the 20 LCD substrate G, which is then transported from the passage unit (PASS) 65 (Fig. 12 (b)). After the holding members 15a and 15b that hold the LCD substrate G on which the coating film has been formed are moved toward the carrying-out stage 12c, the held LCD substrate G is transferred to the lift pins 47 (not shown in FIG. 12). On the other hand, the holding member 15b holds the substrate G transferred from the passage unit (PASS) 65 of the heat treatment unit block (TB) 32 toward the guide 24 200527493 into the stage portion 12a, and starts to face the coating stage. Movement of the part 12b side (FIG. 12 (c)). Next, after lowering the holding members 15a and 15b to positions lower than the holding members i5c and i5d, return to the guide stage 12a side in this state (refer to Figure 5 and 11), and then hold the holding members ..., 15b. The height is adjusted to maintain the height of the new LCD substrate G. On the other hand, the holding members 15 and 15 carry the lcd substrate G toward the coating stage portion 12b, and kLCD the substrate g to form a coating film (Fig. 12 (d)). Reaching the holding members 15c and 15d of the carrying-out stage portion 12c to carry out the carrying-out portion 10 l2c transfers the held LCD substrate G to the lift pin 47 (not shown in Fig. 12). In addition, the holding members 15a and 15b hold the substrates G '' transported from the passage unit (PASS) 65 of the heat treatment unit block (TB) 32 to the introduction stage section, and start moving toward the coating stage section 12b side. (Figure 12 (6)). Next, the holding members 15c and I5d are separated from the stage 12 and returned to the introduction stage portion 12a in this state 15 (FIG. U (f)). Thereafter, the holding members 15c and 15d successively carry the LCD substrate G by repeating the above-mentioned processes, respectively. In the case where such substrate conveyance mechanisms 55 and 56 are used, since the LCD substrate can be continuously conveyed to form a coating film, a high flow rate can be obtained. The above descriptions show the consistent application mode of the present invention, but the present invention is not limited to such a mode. For example, the LCD substrate G can be transferred from the pass unit (PASS) 65 of the heat treatment unit block (TB) 32 to the resist coating device (CT) 23a. A substrate transfer arm is provided in the pass unit (pASS), and The introduction stage portion 12a is provided with a lifting pin. This substrate transfer arm transfers the held LCD substrate to the lifting pin, and by lowering the lifting pin, the holding member 15a and the holding member 15a are held near the surface of the introduction stage 25 200527493 portion 12a. lcd substrate 0. Another month] already. The brother holding members 15a and 15b hold the LCD substrate G in the front direction of the carrying direction to form the state where the LCD substrate G is pulled for transportation. However, the holding members 15a and 15b can be held in the rear side of the carrying direction. 5 Hold the LCD substrate G and carry the LCD substrate G in the same manner. The substrate transport mechanism 65 allows the holding members 15b and 15d to slide freely in the Y direction. However, the holding members 15a and 15b may be constructed at a position where the height of the LCD substrate G is higher than the height of the LCD substrate G. The composition of free lifting between. Thereby, the holding members 15a and 15b can prevent the holding members 15c and 15d from interfering with each other and the exclusive parent can carry the LCD substrate G to each other. In the above description, the anti-money agent is used as the coating film, but the coating film is not limited to this, and it may be an anti-reflection film or an insulating film having no photosensitivity. Industrial Applicability The present invention is applicable to a resist film forming apparatus and a resist film forming method for forming a resist film on a large substrate 15 such as an LCD substrate. [Brief description of the drawings] FIG. 1 is a schematic plan view of a resist coating and developing processing system having an anti-dust coating film device as an embodiment of the coating film forming device of the present invention. 20 FIG. 2 is a side view of the first heat treatment zone 70 of the coating and developing processing system shown in FIG. 1. Fig. 3 is a side view of the second heat treatment early zone of the coating and developing processing system shown in Fig. 1. Fig. 4 shows a side view of the third thermal processing unit of the coating and developing processing system shown in Fig. 26 200527493. The first figure is a schematic plan view of a resist processing unit. The figure is a peeling view showing a schematic configuration of a substrate conveyance mechanism. # 图, (a) to (c) are explanatory diagrams schematically showing the conveyance patterns of the LCD substrates into which the introduction stage section and the coating stage I5① load σ 邛. Fig. 8 is a schematic perspective view of a resist supply nozzle. Figs. 9 (a) and (9) are a plan view and a peeling diagram showing the schematic structure of another substrate transporting mechanism provided in the anti-residue coating device. 〇H (a) ~ (① are explanatory diagrams schematically showing the conveying pattern of the LCD substrate constituted by the substrate conveyer 10 structure shown in Fig. 9. Fig. 11 (a) and (b) show the structure of Exfoliation views of the outline structure of the other US plate conveying mechanism of the residual agent coating device. Fig. 12 (f) to (f) are diagrams schematically showing the conveying type of the LCD substrate constituted by the substrate conveying mechanism shown in Fig. 11. Fig. 15 [Description of main component symbols] 1 Box station 11a Carrying arm 2 Processing station 12a Introduction stage section 3 Interface station 12b Coating stage section 4 Exposure device 12c Unloading stage section G, G 'Substrate 13 Substrate conveying mechanism C cassette 14 Resist supply nozzle 9 Mounting table 14a Cabinet 10 Transport route 14b Resist discharge port 11 Transfer device 15a, 15d holding member 27 200527493 16a Gas injection port 16b Suction pi 17 Mounting table 18 Processing chambers A and B Line 19 Substrate carrying arm 20 Sensor 21 Residue cleaning processing unit (SCR) 22 Excimer UV irradiation unit (e__ UV) 23 Resist processing unit 23a Resist coating device (CT) 23b Decompression drying device (VD ) 24 Development Processing Sheet (DEV) 25 i-ray UV irradiation unit (i-UV) 26 1st heat treatment unit area 27 2nd heat treatment unit area 28 3rd heat treatment unit area 29 Sensor 30 Nozzle lifting mechanism 3 bu 32 heat treatment unit block 33 1st Transfer unit 34, 35 Heat treatment unit block (TB) 36 Second transfer unit 38 Heat treatment unit block (tb) Third transfer unit Space shuttle transfer unit Transfer arm buffer stage extension / cooling stage (EXT · COL) External device Block roller lifting pin suction pad mounting base connection member, 51b linear guide decompression mechanism 53a ~ d X-axis drive mechanism 56 substrate conveying mechanism passage unit (PASS) 63 dehydration drying unit adhesive processing unit (AD) passage unit (PASS) 67 Cooling unit (COL) 28 200527493 68 Adhesive processing unit (AD) 86a, 86b Moving body 69 Passage unit (PASS) 88a to 88d Moving body 70 to 72 Pre-baking unit 89a, 89b Lifting mechanism (PREBAKE) 89c, 89d Y-axis drive mechanism 73 Passage unit (PASS) 91 Guide rail 74 Cooling unit (COL) 92 Lifting member 75 Prebake unit (PREBAKE) 93 Base member 76 Prebake unit (PREBAKE) 94 base Plate holding arm 77 Pass-through unit (PASS) 95 ~ 97 Motor 78- -81 Post-baking unit (POBAKE) 100 Anti-agent coating and development processing 82 Pass-through cooling unit (PASS system COL) 83, 84 post-baking Unit (POBAKE) 85a, 85b holding member 29