TW200517462A - Acrylic adhesive sheet - Google Patents

Acrylic adhesive sheet

Info

Publication number
TW200517462A
TW200517462A TW093131847A TW93131847A TW200517462A TW 200517462 A TW200517462 A TW 200517462A TW 093131847 A TW093131847 A TW 093131847A TW 93131847 A TW93131847 A TW 93131847A TW 200517462 A TW200517462 A TW 200517462A
Authority
TW
Taiwan
Prior art keywords
weight
parts
adhesive sheet
acrylic adhesive
acrylic
Prior art date
Application number
TW093131847A
Other languages
English (en)
Chinese (zh)
Other versions
TWI344483B (enExample
Inventor
Kazunori Kondo
Shigehiro Hoshida
Michio Aizawa
Tadashi Amano
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200517462A publication Critical patent/TW200517462A/zh
Application granted granted Critical
Publication of TWI344483B publication Critical patent/TWI344483B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2874—Adhesive compositions including aldehyde or ketone condensation polymer [e.g., urea formaldehyde polymer, melamine formaldehyde polymer, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW093131847A 2003-11-10 2004-10-20 Acrylic adhesive sheet TW200517462A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003379817A JP4600640B2 (ja) 2003-11-10 2003-11-10 アクリル系接着剤シート

Publications (2)

Publication Number Publication Date
TW200517462A true TW200517462A (en) 2005-06-01
TWI344483B TWI344483B (enExample) 2011-07-01

Family

ID=34544534

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093131847A TW200517462A (en) 2003-11-10 2004-10-20 Acrylic adhesive sheet

Country Status (5)

Country Link
US (1) US7348057B2 (enExample)
JP (1) JP4600640B2 (enExample)
KR (1) KR20050045841A (enExample)
CN (1) CN100396747C (enExample)
TW (1) TW200517462A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448524B (zh) * 2010-09-30 2014-08-11 Ｋｃｃ公司 製造半導體封裝件之黏著組成物及黏著片
TWI512070B (zh) * 2010-09-28 2015-12-11 Ｋｃｃ公司 製造半導體之黏著組成物及膜
TWI756236B (zh) * 2016-06-23 2022-03-01 日商寺岡製作所股份有限公司 接著劑組成物及接著片

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4576140B2 (ja) * 2004-03-25 2010-11-04 日東電工株式会社 接着剤組成物および接着シート
TW200617123A (en) * 2004-09-29 2006-06-01 Shinetsu Chemical Co Acrylic flame retardant adhesive composition and acrylic flame retardant adhesive sheet
JP2006124651A (ja) * 2004-09-29 2006-05-18 Shin Etsu Chem Co Ltd アクリル系難燃性接着剤組成物およびアクリル系難燃性接着剤シート
CN1754933A (zh) * 2004-09-29 2006-04-05 信越化学工业株式会社 丙烯酸类粘合剂组合物和丙烯酸类粘合片材
JP2007049036A (ja) * 2005-08-11 2007-02-22 Nitto Denko Corp 配線回路基板
CN100365091C (zh) * 2006-04-05 2008-01-30 北京林业大学 胶合板用酚醛树脂胶及其调制方法
CN101457128A (zh) * 2007-12-14 2009-06-17 3M创新有限公司 复合高温胶带及其制造方法
WO2010019251A2 (en) * 2008-08-13 2010-02-18 Vacumet Corp. Metallized barrier material
JP5518675B2 (ja) * 2010-10-29 2014-06-11 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物
JP5888805B2 (ja) * 2011-09-01 2016-03-22 日東電工株式会社 接着フィルム及びダイシング・ダイボンドフィルム
KR102126174B1 (ko) * 2012-11-30 2020-06-24 린텍 가부시키가이샤 보호막 형성용 조성물, 보호막 형성용 시트, 및 경화 보호막을 구비한 칩
JP6166605B2 (ja) * 2013-07-05 2017-07-19 日東電工株式会社 接着剤組成物及び接着シート
CN104140774A (zh) * 2014-07-31 2014-11-12 顾湘 一种汽车部件胶粘剂的制备方法
CN104263293B (zh) * 2014-09-19 2017-04-19 华烁科技股份有限公司 一种刚挠结合印制电路板用低流动度胶粘剂、胶膜及其制备方法
KR20170089665A (ko) * 2016-01-27 2017-08-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 감압 점착제 조성물
CN106752993A (zh) * 2016-12-02 2017-05-31 陈佩珊 一种粘合剂片材
CN108410370B (zh) * 2018-03-26 2021-05-11 广东生益科技股份有限公司 一种丙烯酸酯胶粘剂及其制备方法和用途
CN110776863B (zh) * 2019-10-31 2021-08-10 湖南高瑞电源材料有限公司 一种改性锂电池陶瓷隔膜专用粘合剂及其制备方法和应用
CN114075398B (zh) * 2020-08-21 2025-03-14 宣伟(广东)新材料有限公司 涂料组合物及包含该涂料组合物所形成的涂层的涂布制品
WO2025104829A1 (ja) * 2023-11-14 2025-05-22 株式会社寺岡製作所 熱硬化型アクリル系樹脂組成物、及び接着シート又は接着テープ
CN118165679A (zh) * 2024-04-19 2024-06-11 江苏丹腾科技有限公司 一种可用于芯片加工的高分子粘接剂及其制备方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2853646C2 (de) * 1978-12-13 1982-06-09 Th. Goldschmidt Ag, 4300 Essen Hitzehärtbare Klebmittel und deren Verwendung zur Verklebung von Bremsbelägen oder Bremsbelagmassen
DE2926945C3 (de) * 1979-07-04 1982-04-01 Th. Goldschmidt Ag, 4300 Essen Hitzehärtbare Klebmittel
AU603984B2 (en) 1985-05-10 1990-12-06 E.I. Du Pont De Nemours And Company Acrylic copolymer composition and adhesive coatings therefrom
JPH0739569B2 (ja) * 1989-10-30 1995-05-01 株式会社日立製作所 無電解メッキ用下地接着剤、該接着剤を用いたプリント回路板およびその製法
JPH0715091B2 (ja) * 1990-03-05 1995-02-22 日立化成工業株式会社 フレキシブル印刷配線板用の接着剤組成物、及びこれを用いたフレキシブル印刷配線板用基材、並びにフレキシブル印刷配線板
JP2660885B2 (ja) * 1991-08-27 1997-10-08 積水化学工業株式会社 感熱型接着剤組成物及び接着シート
JPH0711092A (ja) * 1993-06-29 1995-01-13 Japan Synthetic Rubber Co Ltd 熱硬化性樹脂組成物
JPH0793497A (ja) 1993-09-22 1995-04-07 Toshiba Corp 携帯型電子装置
JPH0818224A (ja) * 1994-06-30 1996-01-19 Hitachi Ltd アディティブめっき用接着剤とそれを用いたプリント配線板の製法
KR101312197B1 (ko) * 2000-02-15 2013-09-27 히타치가세이가부시끼가이샤 반도체 장치
JP2001288437A (ja) * 2000-04-07 2001-10-16 Hitachi Kasei Polymer Co Ltd カバーレイフィルム用接着剤組成物およびその接着剤組成物を用いたフレキシブルプリント回路基板用カバーレイフィルム
JP3980810B2 (ja) * 2000-04-07 2007-09-26 日立化成ポリマー株式会社 フレキシブルプリント配線板積層用接着剤組成物および接着フィルム
JP2002146320A (ja) * 2000-11-16 2002-05-22 Hitachi Chem Co Ltd 接着剤組成物とそれを用いた接着部材と半導体搭載用基板並びに半導体装置
JP2002180021A (ja) * 2000-12-19 2002-06-26 Hitachi Chem Co Ltd 接着剤組成物、これを用いた接着フィルム、半導体チップ搭載用基板及びこれを用いた半導体装置
JP4827214B2 (ja) * 2001-03-06 2011-11-30 日立化成ポリマー株式会社 フレキシブルプリント配線板積層用接着剤組成物および接着フィルム
JP2003238580A (ja) * 2002-02-18 2003-08-27 Shikoku Chem Corp 新規リン酸エステルアミド化合物及び難燃性樹脂組成物
JP2003286391A (ja) * 2002-03-28 2003-10-10 Nippon Steel Chem Co Ltd エポキシ樹脂組成物、ワニス、このエポキシ樹脂組成物を用いたフィルム状接着剤及びその硬化物
JP2003313526A (ja) * 2002-04-19 2003-11-06 Hitachi Kasei Polymer Co Ltd フレキシブルプリント配線板積層用接着剤組成物および接着フィルム
JP4434569B2 (ja) * 2002-10-18 2010-03-17 日立化成ポリマー株式会社 ハロゲンフリー難燃性接着剤組成物及びカバーレイフィルム
JP4503239B2 (ja) * 2003-05-07 2010-07-14 京セラケミカル株式会社 難燃性接着剤組成物、フレキシブル銅張積層板、カバーレイおよび接着フィルム
JP2005139274A (ja) * 2003-11-06 2005-06-02 Mitsui Chemicals Inc 接着剤組成物
JP2005248048A (ja) * 2004-03-05 2005-09-15 Shin Etsu Chem Co Ltd 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板
TW200617123A (en) * 2004-09-29 2006-06-01 Shinetsu Chemical Co Acrylic flame retardant adhesive composition and acrylic flame retardant adhesive sheet
CN1754933A (zh) * 2004-09-29 2006-04-05 信越化学工业株式会社 丙烯酸类粘合剂组合物和丙烯酸类粘合片材
JP2006316234A (ja) * 2005-04-13 2006-11-24 Shin Etsu Chem Co Ltd 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板
TW200702413A (en) * 2005-04-13 2007-01-16 Shinetsu Chemical Co Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using the same
JP4672505B2 (ja) * 2005-04-13 2011-04-20 信越化学工業株式会社 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板
JP2006328112A (ja) * 2005-05-23 2006-12-07 Shin Etsu Chem Co Ltd 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI512070B (zh) * 2010-09-28 2015-12-11 Ｋｃｃ公司 製造半導體之黏著組成物及膜
TWI448524B (zh) * 2010-09-30 2014-08-11 Ｋｃｃ公司 製造半導體封裝件之黏著組成物及黏著片
TWI756236B (zh) * 2016-06-23 2022-03-01 日商寺岡製作所股份有限公司 接著劑組成物及接著片

Also Published As

Publication number Publication date
CN1629240A (zh) 2005-06-22
KR20050045841A (ko) 2005-05-17
JP4600640B2 (ja) 2010-12-15
CN100396747C (zh) 2008-06-25
TWI344483B (enExample) 2011-07-01
US20050101734A1 (en) 2005-05-12
US7348057B2 (en) 2008-03-25
JP2005139387A (ja) 2005-06-02

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