CN101457128A - 复合高温胶带及其制造方法 - Google Patents

复合高温胶带及其制造方法 Download PDF

Info

Publication number
CN101457128A
CN101457128A CNA2007103009629A CN200710300962A CN101457128A CN 101457128 A CN101457128 A CN 101457128A CN A2007103009629 A CNA2007103009629 A CN A2007103009629A CN 200710300962 A CN200710300962 A CN 200710300962A CN 101457128 A CN101457128 A CN 101457128A
Authority
CN
China
Prior art keywords
compound
layer
wiring board
pwb
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007103009629A
Other languages
English (en)
Inventor
吴轩
熊海锟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to CNA2007103009629A priority Critical patent/CN101457128A/zh
Priority to PCT/US2008/084808 priority patent/WO2009079182A2/en
Priority to US12/746,956 priority patent/US20100263204A1/en
Priority to KR1020107015010A priority patent/KR20100100950A/ko
Priority to EP08860892A priority patent/EP2231402A2/en
Priority to JP2010538038A priority patent/JP2011506139A/ja
Publication of CN101457128A publication Critical patent/CN101457128A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/08—Corrugated paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/05—5 or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/308—Heat stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/10—Batteries
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/28—Presence of paper
    • C09J2400/283—Presence of paper in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paper (AREA)

Abstract

本发明公开了一种复合胶带及其制造方法，包括：在纸基材层的第一表面形成离型剂层；在其第二表面形成由聚氨酯胶粘剂、聚酯胶粘剂或者二者的混合所形成的复合胶粘剂层；在复合胶粘剂层的第二表面形成塑料层；以及在塑料层的第二表面形成粘着层。该复合胶带包括：纸基材层；形成在所述纸基材层的第一表面的离型剂层；形成在所述纸基材层的第二表面的由聚氨酯胶粘剂、聚酯胶粘剂或者二者的混合所形成的复合胶粘剂层；形成在复合胶粘剂层的第二表面的塑料层；以及形成在塑料层的第二表面的粘着层。利用本发明的复合胶带不仅可以承受280度高温并持续预定时间，同时该胶带不发生分离和翘曲。此外，该复合高温胶带可以减少锡在PCB板和该复合高温胶带的粘接边缘处堆积。本复合胶带也耐酸碱等化学试剂，可用于印刷线路板制造过程中，酸洗或其他化学试剂浸泡工艺中，印刷线路板上部分区域的保护。

Description

复合高温胶带及其制造方法
技术领域
本发明涉及一种胶带及其制造方法，尤其涉及一种可用于印刷线路板(PCB)的复合高温胶带及其制造方法。
背景技术
在现有的电子器件(例如线路板)的制造过程中，印刷线路板上的特定区域需要涂布锡等，而线路板的其余区域需要使用例如保护胶带之类的特定的遮蔽件加以保护。同时，在制造过程中，印刷线路板需要在高温环境下以较短的接触时间来进行镀锡。
现有的保护胶带通常采用橡胶型胶水作为复合胶粘剂。但是橡胶型的胶粘剂的缺点在于不能耐260度或者更高的温度。这样，在经过印刷线路板的制造工艺，例如热风整平高温处理过后，会发生作为基材的纸和PET分离的现象。进一步地，由于现有技术中的橡胶型胶水需涂布达到一定的厚度，这样才能达到适当的粘接强度。这会造成最终整个胶带的厚度非常高。因此，PCB板在热风整平镀锡、波峰焊工艺中，容易产生渗锡现象，而且有时锡会在胶带和PCB板粘接的边缘产生堆积，从而导致“锡坝”。目前镀锡工艺采用的是含铅工艺，随着环保指标的执行，有铅工艺正逐步被无铅工艺而取代。有铅工艺和无铅工艺的一个重要区别在于，有铅工艺所要求的温度通常要达到250～260度，而无铅工艺则要达到280度或者以上。目前的产品已满足不了这样的要求。
为此，已经有一些专利力图解决上述问题。例如，在1998年6月2日公开的中国台湾专利TW487727中公开了一种高温保护胶带。在该胶带中加入了一金属薄膜层。在高温处理中，使金属薄膜层受热均匀，从而避免胶带边缘翘曲，发生渗锡现象。但是，所增加的金属薄膜层增加了胶带的厚度，从而也增加了锡在PCB板和胶带边缘堆积的可能性。而且金属的热膨胀系数较大，与纸和薄膜的热膨胀系数相差太大，很可能造成整个胶带基材的翘曲。
此外，四维胶带公司的CM8R和CM8G高温遮蔽纸塑复合胶带选用橡胶型胶水作为复合胶粘剂，应用的最高温度为250℃并可持续1分钟。Scapa公司的产品Scapa 657热风整平胶带的使用温度最高也仅能达到105度。
发明内容
现有技术中均无法解决问题上述问题，因此市场上需要一种经过280度并持续2分钟后，纸塑复合基材不分离，且不翘曲的较薄的高温遮蔽胶带。
因此，本发明的一个目的是提供一种复合高温胶带及其制造方法，所述复合高温胶带即使在经历280度高温并持续2分钟之后，纸塑复合基材仍然基本上不发生分离，且该复合高温胶带基本上不发生翘曲。
本发明的一个实施例的另外一个目的是提供一种复合高温胶带及其制造方法，该复合高温胶带可以减少锡在PCB板和该复合高温胶带的粘接边缘处堆积。
本发明的一个实施例的再一发明目的是提供一种应用上述的复合高温胶带制造印刷线路板的方法。
为实现上述一个或者更多个目的，本发明提供了一种复合胶带的制造方法，所述复合胶带用于制造印刷线路板，所述制造方法包括以下步骤：在纸基材层的第一表面设置一离型剂层；在该纸基材层的第二表面设置由聚氨酯胶粘剂、聚酯胶粘剂或者二者的混合所形成的复合胶粘剂层；在复合胶粘剂层的下侧设置塑料层；以及在塑料层的下侧设置粘着层。
根据本发明的一方面，提供了一种用于制造印刷线路板的复合胶带，包括：纸基材层；设置在所述纸基材层的第一表面的离型剂层；设置在所述纸基材层的第二表面的由聚氨酯胶粘剂、聚酯胶粘剂或者二者的混合所形成的复合胶粘剂层；设置在复合胶粘剂层的第二表面的塑料层；以及设置在塑料层的第二表面的粘着层。
根据本发明的另外一方面，提供了一种印刷线路板的制造方法，包括如下步骤：将根据前述的复合胶带粘贴至印刷线路板上的受保护区域的粘贴步骤；将线路板镀锡的镀锡步骤；以及取出印刷线路板并进行热风整平的整平步骤。
本发明的复合胶带与现有技术中的胶带相比，具有下述的优点：
(1)由于复合胶粘剂层采用聚氨酯胶粘剂、聚酯胶粘剂或者其混合物形成，使得复合胶带可以承受瞬间达到280度以上的高温，且此后纸塑复合基材不会发生分离和翘曲；
(2)复合胶粘剂层使得基材的厚度可以变薄，从而减少锡等的堆积。
附图简述
本发明将参照附图来进一步详细说明，其中：
图1是根据本发明的复合胶带的横截面视图；
图2是根据本发明的复合胶带的制造方法的流程图；以及
图3是根据本发明的印刷线路板的制造方法的流程图。
结合附图并参照本发明的优选实施例，本领域的技术人员能更好地理解本申请的进一步的目的、优点和方面，所给出的这些附图和实施例只是为了说明的目的。
具体实施方式
下面结合附图1—3来详细说明根据本发明的高温复合胶带1。
图1显示了根据本发明的高温复合胶带1的横截面图。该高温复合胶带1可用于电动或者电子元件的制造过程中的高温遮蔽部件，特别是用于印刷线路板制造过程中的部分区域的高温保护。通常，在PCB板的制造过程中，需要提供一耐高温的保护胶带，该胶带主要应用于PCB板的镀锡过程中保护PCB板上金手指或者其他插接孔，从而避免金手指镀上锡或插接孔堵塞等问题。此外，在用于镀锡、热风整平、波峰焊等条件下，在使用的过程中不能发生胶带脱落等问题，同时在使用之后要便于剥离胶带，且基本上不留下残胶。
根据本发明的高温复合胶带1可以应用于印刷线路板的镀锡、波峰焊等工艺，并选择性地对特定区域进行遮蔽，例如金手指等。如图1中所示，根据本发明的用于制造印刷线路板(PCB)的复合胶带1自上而下包括5层，分别为纸基材层12、离型剂层11、复合胶粘剂层13、塑料层14以及粘着层15。通常，纸基材层12由平板纸、美光纸或美纹纸制成。所述离型剂层11形成在所述纸基材层12的上侧。离型剂通常采用丙烯酸类、含氟类的离型剂，该离型剂层可以是丙烯酸乳液或其他可以离型有机硅压敏粘合剂的离型剂。
复合胶粘剂层13设置在所述纸基材层的下侧。该复合胶粘剂层13包括聚氨酯胶粘剂、聚酯胶粘剂或者二者的混合，聚氨酯胶粘剂或聚酯胶粘剂能够承受高达280度以上的高温，该聚氨酯胶粘剂或聚酯胶粘剂可以选用例如ROHM&HASS的ADCOTE 76P1-38。含有聚酯树脂的聚酯或者聚氨酯胶粘剂固化后可以瞬间承受280度以上的高温。此外，采用耐高温的聚酯、聚氨酯类胶粘剂，可使涂布的聚酯、聚氨酯类胶粘剂量减少，从而可以使得所述复合胶粘剂层13的厚度变薄，同时保证提供很强的粘接强度。
进一步地，塑料层14设置在复合胶粘剂层的下侧。所述塑料层14包括聚对苯二甲酸乙二醇酯(PET)、聚对苯二甲酸丁二醇酯(PBT)、聚酰亚胺(PI)或者聚萘二甲酸乙二醇酯(PEN)等。优选地，塑料层14可以进行电晕处理，以增加塑料层的表面能。粘着层15设置在塑料层14的下侧，该粘着层15可以由有机硅压敏粘合剂或者其他具有相似化学性能的形成。
下面结合附图2来说明根据本发明的上述实施例的复合胶带1的制造方法。图2显示了根据本发明的复合胶带的制造方法的流程图。如上所述，复合胶带1可以用于制造印刷线路板。首先，在纸基材层12的一侧设置一离型剂层11(S10)。其次，在该纸基材层12的另一侧设置由聚氨酯胶粘剂、聚酯胶粘剂或者二者的混合所形成的复合胶粘剂层13(S20)。接着，在复合胶粘剂层13的下侧设置塑料层14(S30)。最后，在塑料层14的下侧设置粘着层15(S40)。需要说明的是，上述的复合胶带1的制造步骤只是出于说明的目的。普通技术人员显然可以知道，可以将纸基材层12、离型剂层11、复合胶粘剂层13、塑料层14以及粘着层15按照适当的工艺来分别组合制造，例如先设置纸基材层12、离型剂层11的叠层，然后设置复合胶粘剂层13、塑料层14以及粘着层15的叠层，最后形成根据本发明的复合胶带1，显然普通技术人员也可以采用其他组合生产步骤。
下面结合图3来说明根据本发明复合胶带1在电子元件(例如印刷线路板)的制造方法中的应用。图3显示了根据本发明的印刷线路板的制造方法的流程图。
在印刷线路板的制造过程中，需要对印刷线路板的表面进行镀锡。如果需要，需要对PCB板表面进行打磨、抛光等。为此，需要对印刷线路板上的不需要镀锡的区域(例如金手指或者PCB板表面上的镀金区域等)进行遮蔽。根据本发明的复合胶带1可以实现这种遮蔽的目的。然后，可将印刷线路板送入高温锡炉中进行镀锡。由于锡炉中温度很高，通常要达到280度高温，普通的胶带难以承受如此高的温度，并容易发生脱落和翘曲等问题。在镀锡之后，需要取出PCB板，采用高速、高温的热风来对PCB板的表面进行风吹，并吹掉PCB板表面残余的锡，即进行所谓的“热风整平”。由于通常的胶带较厚，锡会在胶带和PCB板粘接的边缘产生堆积，从而导致“锡坝”。此外，根据工艺上的要求，在镀锡步骤之前，需要对PCB板进行必要的酸洗、水洗、干燥、上助焊剂等工序，在热风整平步骤之后，需要对PCB板水洗、干燥等工序。
根据本发明的印刷线路板的制造方法包括如下的步骤。将根据本发明的复合胶带1粘贴至印刷线路板上的受保护区域的粘贴(S100)。可选地，在该步骤之后，可以对所述复合胶带进行加热和加压(S101)。其次，对印刷电路板进行酸洗、水洗、干燥、上助焊剂等工序(S201)。再次，将粘贴有该复合胶带1的印刷线路板送入镀锡炉中进行线路板镀锡(S200)。然后，取出印刷线路板并进行热风整平(S300)，接下来，从所述受保护区域移除所述复合胶带1(S400)，最后再通过水洗，干燥等工序(S401)。但是，需要注意的是，在图3中，如果需要，步骤S401可以在S400之前进行。
采用根据本发明的一个实施例的复合胶带1，在锡炉的镀锡工艺过程中，即使在经过280度并持续2分钟的高温后，纸塑复合基材不发生分离，同时可以使基材尽可能的薄，从而减少在热风整平工艺中、锡在PCB板和胶带粘接边缘处的堆积。
此外，本发明的胶带1的复合结构可适用于高温使用环境下保护和延迟热传导的作用，例如可以应用到印刷线路板镀锡工艺中的部分区域保护。
此外，需要说明的是，本发明的复合胶带可以广泛地应用于电子产品的制造领域，其不仅可以应用于PCB板的镀锡，而且也可以应用于真空电镀、变压器以及发电机等需要高温绝缘等。
对本发明的描述本质上仅仅是示范性的，且由此没有偏离本发明的要旨的变化也在本发明的保护范围内。这些变化并不被认为偏离了本发明的精神和保护范围。

Claims (18)

1.一种复合胶带的制造方法，所述复合胶带用于制造印刷线路板，所述制造方法包括以下步骤：
在纸基材层的第一表面设置一离型剂层；
在该纸基材层的第二表面设置由聚氨酯胶粘剂、聚酯胶粘剂或者二者的混合所形成的复合胶粘剂层；
在复合胶粘剂层的下侧设置塑料层；以及
在塑料层的下侧设置粘着层。
2.根据权利要求1所述的制造方法，其特征在于，所述塑料层由聚对苯二甲酸乙二醇酯(PET)、聚对苯二甲酸丁二醇酯(PBT)、聚酰亚胺(PI)或者聚萘二甲酸乙二醇酯(PEN)所形成。
3.根据权利要求1所述的制造方法，其特征在于，所述纸基材层包括平板纸、美光纸或者美纹纸。
4.根据权利要求1所述的制造方法，其特征在于，所述离型剂层包括丙烯酸类乳液或者其他可用于离型有机硅压敏粘合剂的离型剂。
5.根据权利要求1所述的制造方法，其特征在于，所述粘着层包括有机硅压敏粘合剂。
6.根据权利要求1所述的制造方法，其特征在于，所述塑料层可经过电晕处理。
7.一种用于制造印刷线路板的复合胶带，包括：
纸基材层；
设置在所述纸基材层的第一表面的离型剂层；
设置在所述纸基材层的第二表面的由聚氨酯胶粘剂、聚酯胶粘剂或者二者的混合所形成的复合胶粘剂层；
设置在复合胶粘剂层的第二表面的塑料层；以及
设置在塑料层的第二表面的粘着层。
8.根据权利要求7所述的复合胶带，其特征在于，所述塑料层由聚对苯二甲酸乙二醇酯(PET)、聚对苯二甲酸丁二醇酯(PBT)、聚酰亚胺(PI)或者聚萘二甲酸乙二醇酯(PEN)所形成。
9.根据权利要求7所述的复合胶带，其特征在于，所述纸基材层包括平板纸、美光纸或者美纹纸。
10.根据权利要求7所述的复合胶带，其特征在于，所述离型剂层包括丙烯酸类乳液或者其他可用于离型有机硅压敏粘合剂的离型剂。
11.根据权利要求7所述的复合胶带，其特征在于，所述高温粘着层包括有机硅压敏粘合剂。
12.根据权利要求7所述的复合胶带，其特征在于，所述塑料层可经过电晕处理。
13.一种印刷线路板的制造方法，包括如下步骤：
将根据权利要求7的复合胶带粘贴至印刷线路板上的受保护区域的粘贴步骤；
将线路板镀锡的镀锡步骤；以及
取出印刷线路板并进行热风整平的整平步骤。
14.根据权利要求13所述的印刷线路板的制造方法，其特征在于，在粘贴步骤之后，对所述复合胶带进行加热和加压的步骤。
15.根据权利要求13所述的印刷线路板的制造方法，其特征在于，进一步包括，在镀锡步骤之前对印刷线路板进行酸洗、水洗、干燥、上助焊剂等步骤。
16.根据权利要求13所述的印刷线路板的制造方法，其特征在于，所述受保护区域为印刷线路板表面上的镀金区域或其它需要遮蔽保护的区域。
17.根据权利要求13所述的印刷线路板的制造方法，其特征在于，还包括从所述受保护区域移除所述复合胶带的移除步骤。
18.根据权利要求17所述的印刷线路板的制造方法，其特征在于，还包括在移除步骤之前或者之后对印刷线路板进行水洗、干燥等步骤。
CNA2007103009629A 2007-12-14 2007-12-14 复合高温胶带及其制造方法 Pending CN101457128A (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CNA2007103009629A CN101457128A (zh) 2007-12-14 2007-12-14 复合高温胶带及其制造方法
PCT/US2008/084808 WO2009079182A2 (en) 2007-12-14 2008-11-26 High temperature composite tape and method for manufacturing the same
US12/746,956 US20100263204A1 (en) 2007-12-14 2008-11-26 High temperature composite tape and method for manufacturing the same
KR1020107015010A KR20100100950A (ko) 2007-12-14 2008-11-26 고온 복합 테이프 및 이의 제조 방법
EP08860892A EP2231402A2 (en) 2007-12-14 2008-11-26 High temperature composite tape and method for manufacturing the same
JP2010538038A JP2011506139A (ja) 2007-12-14 2008-11-26 高温複合材料テープ及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2007103009629A CN101457128A (zh) 2007-12-14 2007-12-14 复合高温胶带及其制造方法

Publications (1)

Publication Number Publication Date
CN101457128A true CN101457128A (zh) 2009-06-17

Family

ID=40768252

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007103009629A Pending CN101457128A (zh) 2007-12-14 2007-12-14 复合高温胶带及其制造方法

Country Status (6)

Country Link
US (1) US20100263204A1 (zh)
EP (1) EP2231402A2 (zh)
JP (1) JP2011506139A (zh)
KR (1) KR20100100950A (zh)
CN (1) CN101457128A (zh)
WO (1) WO2009079182A2 (zh)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102270407A (zh) * 2010-06-01 2011-12-07 罗吉尔 带有标记结构的胶粘材料
CN102363718A (zh) * 2011-08-09 2012-02-29 常熟市长江胶带有限公司 高温美纹胶带
CN102417799A (zh) * 2011-11-29 2012-04-18 常熟市富邦胶带有限责任公司 复合高温胶带
CN102427680A (zh) * 2011-11-16 2012-04-25 博罗县精汇电子科技有限公司 一种单面板金手指的制造工艺
CN103059765A (zh) * 2013-01-17 2013-04-24 东莞市航达电子有限公司 一种高韧性美纹纸胶带
CN103059764A (zh) * 2013-01-17 2013-04-24 洪立志 一种高粘着力美纹纸胶带
CN103666310A (zh) * 2012-09-26 2014-03-26 广东晶华科技有限公司 一种新型的热熔布基胶带及其涂布工艺
CN104080264A (zh) * 2013-03-29 2014-10-01 日本梅克特隆株式会社 脱模薄膜和柔性印刷电路基板
CN105969241A (zh) * 2016-05-30 2016-09-28 成都市惠家胶粘制品有限公司 Pet美光纸复合耐高温胶带
CN106010330A (zh) * 2016-05-30 2016-10-12 成都市惠家胶粘制品有限公司 一种复合耐高温胶带的制备工艺
CN106084265A (zh) * 2016-05-25 2016-11-09 朱肖楠 一种热层压用复合材料及其制备方法
CN106893521A (zh) * 2017-04-11 2017-06-27 上海晶华胶粘新材料股份有限公司 一种耐高温纸基胶带及其制备工艺
CN108410376A (zh) * 2015-04-10 2018-08-17 株式会社寺冈制作所 粘接片
CN111826095A (zh) * 2019-04-17 2020-10-27 王崇庆 具有清晰显示效果的防伪胶带

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103937424A (zh) * 2014-04-03 2014-07-23 苏州华周胶带有限公司 一种高耐久美纹胶带
CN103897627A (zh) * 2014-04-22 2014-07-02 苏州华周胶带有限公司 一种压敏型美纹胶带的制作工艺
CN107128532B (zh) * 2017-06-19 2023-05-26 深圳市宝尔威精密机械有限公司 一种用于金手指贴装包裹高温胶及贴标签的全自动设备
CN112635910B (zh) * 2020-12-17 2022-08-12 惠州亿纬创能电池有限公司 一种复合膨胀膜及其制备方法和应用

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029521A1 (de) * 1980-08-04 1982-03-04 Helmuth 2058 Lauenburg Schmoock Schaltung mit aufgedruckten leiterbahnen und verfahren zu deren herstellung
US4753847A (en) * 1984-10-01 1988-06-28 Martin J. Wilheim Mold release sheet laminate
US5057372A (en) * 1989-03-22 1991-10-15 The Dow Chemical Company Multilayer film and laminate for use in producing printed circuit boards
US5120590A (en) * 1989-05-05 1992-06-09 Gould Inc. Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing
US5962099A (en) * 1992-11-12 1999-10-05 Bloch; Gilbert Pressure-sensitive paper-plastic film laminate tape
US6235386B1 (en) * 1992-11-12 2001-05-22 Gilbert Bloch Pressure-sensitive paper-plastic film laminate tape
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5780150A (en) * 1993-12-20 1998-07-14 Bloch; Gilbert Paper-film laminate sealing tape
US5804024A (en) * 1993-12-20 1998-09-08 Bloch; Gilbert Paper-film laminate sealing tape
US5989377A (en) * 1994-07-08 1999-11-23 Metallized Products, Inc. Method of protecting the surface of foil and other thin sheet materials before and during high-temperature and high pressure laminating
US6280851B1 (en) * 1998-03-23 2001-08-28 Sentrex Company, Inc. Multilayer product for printed circuit boards
US6202917B1 (en) * 1998-08-19 2001-03-20 Hughes Electronics Corporation Co-processing of adhesive curing and solder reflow in an electronic assembly operation
US6756095B2 (en) * 2001-01-10 2004-06-29 Avery Dennison Corporation Heat-sealable laminate
US6921451B2 (en) * 2002-06-28 2005-07-26 Metallized Products, Inc. Method of and apparatus for protecting thin copper foil and other shiny substrates during handling and rigorous processing, as pcb manufacture and the like, by electric-charge adherence thereto of thin release-layered plastic films and the like, and improved products produced thereby
US20040112516A1 (en) * 2002-12-13 2004-06-17 Metallized Products, Inc. Method and apparatus for electric-charge adhering of thin release-layered plastic firlms to thin copper foil substrates and the like and improved products thereby produced
JP4600640B2 (ja) * 2003-11-10 2010-12-15 信越化学工業株式会社 アクリル系接着剤シート
JP4860114B2 (ja) * 2004-03-02 2012-01-25 日東電工株式会社 熱硬化型粘接着テープ又はシート、及びその製造方法
TWI263664B (en) * 2004-08-12 2006-10-11 Four Pillars Entpr Co Ltd Release coating composition for tape
JP5382995B2 (ja) * 2006-04-11 2014-01-08 日東電工株式会社 配線回路基板用両面粘着テープ又はシートおよび配線回路基板

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102270407A (zh) * 2010-06-01 2011-12-07 罗吉尔 带有标记结构的胶粘材料
CN102363718A (zh) * 2011-08-09 2012-02-29 常熟市长江胶带有限公司 高温美纹胶带
CN102427680A (zh) * 2011-11-16 2012-04-25 博罗县精汇电子科技有限公司 一种单面板金手指的制造工艺
CN102427680B (zh) * 2011-11-16 2013-12-18 博罗县精汇电子科技有限公司 一种单面板金手指的制造工艺
CN102417799A (zh) * 2011-11-29 2012-04-18 常熟市富邦胶带有限责任公司 复合高温胶带
CN103666310A (zh) * 2012-09-26 2014-03-26 广东晶华科技有限公司 一种新型的热熔布基胶带及其涂布工艺
CN103666310B (zh) * 2012-09-26 2016-01-13 广东晶华科技有限公司 一种热熔布基胶带及其涂布工艺
CN103059764B (zh) * 2013-01-17 2014-04-02 洪立志 一种高粘着力美纹纸胶带
CN103059764A (zh) * 2013-01-17 2013-04-24 洪立志 一种高粘着力美纹纸胶带
CN103059765A (zh) * 2013-01-17 2013-04-24 东莞市航达电子有限公司 一种高韧性美纹纸胶带
CN104080264A (zh) * 2013-03-29 2014-10-01 日本梅克特隆株式会社 脱模薄膜和柔性印刷电路基板
CN104080264B (zh) * 2013-03-29 2018-05-11 日本梅克特隆株式会社 脱模薄膜和柔性印刷电路基板
CN108410376A (zh) * 2015-04-10 2018-08-17 株式会社寺冈制作所 粘接片
CN106084265A (zh) * 2016-05-25 2016-11-09 朱肖楠 一种热层压用复合材料及其制备方法
CN105969241A (zh) * 2016-05-30 2016-09-28 成都市惠家胶粘制品有限公司 Pet美光纸复合耐高温胶带
CN106010330A (zh) * 2016-05-30 2016-10-12 成都市惠家胶粘制品有限公司 一种复合耐高温胶带的制备工艺
CN106893521A (zh) * 2017-04-11 2017-06-27 上海晶华胶粘新材料股份有限公司 一种耐高温纸基胶带及其制备工艺
CN111826095A (zh) * 2019-04-17 2020-10-27 王崇庆 具有清晰显示效果的防伪胶带

Also Published As

Publication number Publication date
WO2009079182A3 (en) 2009-08-20
JP2011506139A (ja) 2011-03-03
US20100263204A1 (en) 2010-10-21
KR20100100950A (ko) 2010-09-15
EP2231402A2 (en) 2010-09-29
WO2009079182A2 (en) 2009-06-25

Similar Documents

Publication Publication Date Title
CN101457128A (zh) 复合高温胶带及其制造方法
CN101594993B (zh) 表面保护膜
CN102548758A (zh) 薄板玻璃基板贴合体及其制造方法
US8881381B2 (en) Method of manufacturing printed circuit board
JP2006313834A (ja) 配線回路基板の製造方法
US6445866B1 (en) Optical interconnection apparatus and method of fabricating same
JP2003298285A (ja) 補強シールドフィルム及びシールドフレキシブルプリント配線板
JP2019127501A (ja) 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板
JP2017126735A (ja) カバーレイフィルム
CN101821348A (zh) 电子部件用双面粘接片及其制造方法
TW201243012A (en) Protective tape
CN205430758U (zh) 适用于高频信号的电磁屏蔽膜
KR102267001B1 (ko) 전자부품 제조용 점착테이프
CN214693988U (zh) 氟改性离型膜
JP2018166167A (ja) キャリアフィルムおよびその製造方法、ならびに電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
JP4916057B2 (ja) Ｆｐｃ用保護フィルム、ｆｐｃ用保護フィルム付樹脂導体箔積層体およびそれを用いたフレキシブルプリント配線基板の製造方法
KR101234974B1 (ko) 연성인쇄회로기판 커버레이 적층용 이형필름
TWI634817B (zh) 用於電路板沖壓製程的覆蓋膜
TWI338546B (zh)
WO2020241298A1 (ja) 個片化された両面粘着材のシート、およびそれを用いた接着方法
CN214004511U (zh) 双面自粘性高温承载膜
JP2006348212A (ja) マスキング用粘着テープ
TW200925236A (en) Composite high temperature tape and manufacturing method thereof
CN206616181U (zh) 一种玻璃布胶带
CN117970684A (zh) 一种无基材金属网格制备on-cell触控的方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20090617