201243012 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種對經過回焊工程的基板作保護之保 護膠帶。 【先前技術】 以往’在將電阻或電容器、1C等之電子零件連接於基 板之際’首先，將焊錫塗佈於基板上的連接部，再將適合 的電子零件裝載於其上，而進入回焊工程。於回焊工程中 ’係藉由熱而使焊錫熔解，然後，將焊錫冷卻凝固，藉此 而將基板上之連接部與電子零件作連接。 在此，在基板經過上述回焊工程之際，有時已熔解的 焊錫會飛散。此時，於基板上之連接有電子零件之連接部 以外的部位，特別是靠近連接部的地方，會被所飛散的焊 錫附著，而成爲電性故障的原因，或外觀變差。於是，爲 了防止在回焊工程中，所飛散的焊錫附著，而在靠近連接 部的地方預先貼附了保護膠帶。藉此，即使萬一在靠近連 接部的地方有焊錫飛散時，也只會附著在保護膠帶的表面 ，而可防止附著在位於其下面之靠近連接部的地方。 然而，習知的保護膠帶，係於聚醯亞胺（PI)上層積有 作爲耐熱性高的黏著層之矽系樹脂等而成的構造，因此當 保護膠帶的溫度於回焊工程中遇熱而上升時，會導致貼附 於基板側的黏著層之黏著力，變得較初期狀態更強。在這 樣的情況下，會導致：於後續工程中，難以將保護膠帶從201243012 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a protective tape for protecting a substrate subjected to reflow engineering. [Prior Art] In the past, when a resistor, capacitor, or electronic component such as 1C was connected to a substrate, first, solder was applied to a connection portion on a substrate, and then appropriate electronic components were mounted thereon. Welding engineering. In the reflow process, the solder is melted by heat, and then the solder is cooled and solidified, whereby the connection portion on the substrate is connected to the electronic component. Here, when the substrate passes through the above-described reflow process, the melted solder sometimes scatters. At this time, a portion other than the connection portion to which the electronic component is connected to the substrate, particularly the portion close to the connection portion, is adhered by the scattered solder, which causes electrical failure or deteriorates in appearance. Therefore, in order to prevent the scattered solder from adhering during the reflow process, a protective tape is attached in advance to the portion adjacent to the joint portion. Thereby, even if solder is scattered near the joint portion, it adheres only to the surface of the protective tape, and can be prevented from adhering to the portion located below the joint portion. However, the conventional protective tape is a structure in which a bismuth resin which is an adhesive layer having high heat resistance is laminated on polyimine (PI), so that the temperature of the protective tape is heated in the reflow process. When it rises, the adhesion force of the adhesive layer attached to the substrate side becomes stronger than the initial state. In such a case, it will cause: in subsequent projects, it is difficult to remove the protective tape from
C -5- 201243012 基板剝離’或在將保護膠帶剝離之後，產生黏著層的殘留 等。其結果，產生了在保護膠帶的剝離作業上耗費時間等 ’而作業性惡化的問題。因此，對於對經過回焊工程的基 板作保護之保護膠帶，係要求即使遇熱也不會使黏著力上 升，而容易剝離者。 再者，於上述習知之保護膠帶的情況中，作爲黏著層 之矽系樹脂，係有對電子零件造成不良的影響之虞，而且 ，聚醯亞胺係價格昂貴。因此，實際上，並非使用習知的 保護膠帶，而是針對去除回焊工程後所飛散的焊錫等作對 應。 在此，就容易剝離的觀點而言，於專利文獻1中係揭 示有：一種薄型且重工性優異的黏著膠帶。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利第3 902 1 62號公報 【發明內容】 [發明所欲解決之課題] 然而，於專利文獻1中所揭示的黏著膠帶，係貼附於 LCD模組之LCD面板與背光框體之間所使用者，且爲兼 具對於來自光源的光之光反射性與遮光性的黏著膠帶。因 此，與對經過回焊工程的基板作保護之保護膠帶，其用途 或使用狀態完全不同。因而，在將專利文獻1中所揭示的 黏著膠帶貼附於基板而進入回焊工程的情況下，黏著膠帶 -6- 201243012 會於工程中遇熱而劣化，而導致難以剝離，或產生殘留等 之缺陷產生。 本發明係鑑於上述之問題而完成者，其目的爲提供一 種保護膠帶，其係能夠保護經過回焊工程的基板，而且， 即使在回焊工程中遇熱，也不會使黏著力上升，而良好地 保持剝離容易度。 [解決課題之手段] 本發明之保護膠帶，係被貼附於經過回焊工程的基板 上，且對該基板之至少一部分作保護，該保護膠帶係具有 :被貼附於前述基板上之黏著層、金屬層、以及樹脂層， 且於前述黏著層上，係至少設置有前述金屬層和前述樹脂 層。 依據上述之構造，係可藉由對基板之至少一部分作保 護的保護膠帶所有的金屬層，來將回焊工程中的熱反射及 散熱至外部。如此一來，藉由金屬層，而能不易將熱傳導 至貼附於基板上的黏著層，因此可緩和黏著層的溫度上升 。藉此，便不會導致在回焊工程後難以從基板剝離，或在 剝離後產生殘留，故可防止作業性的惡化。此外，即使保 護膠帶被彎曲，藉由保護膠帶所具有的樹脂層之彈性，而 可緩和因彎曲而對金屬層所造成的影響。因而，藉由樹脂 層而可防止在將保護膠帶從基板剝離之際金屬層的破裂。 此外，於本發明之保護膠帶中，前述樹脂層及前述金 屬層，係亦可依照該樹脂層、該金屬層的順序被設置於前 201243012 述黏著層上。 依據上述的構造，即使在依照樹脂層、金屬層的順序 被設置於黏著層上的情況下，藉由金屬層，也能不易將熱 傳導至貼附於基板上的黏著層，進而，藉由樹脂層的彈性 ，而可緩和因彎曲而對金屬層所造成的影響。 此外，於本發明之保護膠帶中，前述樹脂層及前述金 屬層，係亦可依照該金屬層、該樹脂層的順序被設置於前 述黏著層上。 依據上述的構造，即使在依照金屬層、樹脂層的順序 被設置於黏著層上的情況下，藉由金屬層，也能不易將熱 傳導至貼附於基板上的黏著層，進而，藉由樹脂層的彈性 ，而可緩和因彎曲而對金屬層所造成的影響。 此外，於本發明之保護膠帶中，前述金屬層的厚度， 係亦可爲6μιη〜30μιη。 依據上述之構造，由於金屬層的厚度適當，因此變得 容易將熱有效地反射及散熱。此外，藉由金屬層的厚度， 而不會使保護膠帶過硬而難以剝離，或需要大量的材料而 造成高成本。 此外，於本發明之保護膠帶中，前述金屬層，係亦可 由鋁所形成。 依據上述之構造，由於金屬層是由適當的材料所形成 ，因此可更有效地將熱反射及散熱至外部。藉此，便能Η 加緩和黏著層的溫度上升，且可在剝離作業中容易地將保 護膠帶剝離，而使作業效率提升。 -8 - 201243012 此外，於本發明之保護膠帶中，於前述回焊工程中， 前述基板之溫度最高爲270 °C亦可。 依據上述之構造，於前述回焊工程中，即使基板之溫 度成爲最高爲270°C的情況下，也可適用保護膠帶。 此外，於本發明之保護膠帶中，前述回焊工程，係亦 可以紅外線作爲熱源。 依據上述之構造，係藉由金屬層，而能將在以紅外線 作爲熱源的回焊工程中之熱反射及散熱至外部。如上所述 ，即使年以紅外線作爲熱源的回焊工程中，亦可適用保護 膠帶。 [發明效果] 依據本發明之保護膠帶，係藉由金屬層，而能不易將 熱傳導至貼附於基板上的黏著層，因此可緩和黏著層的溫 度上升。藉此，便不會導致在回焊工程後難以從基板剝離 ，或在剝離後產生殘留，故可防止作業性的惡化。此外， 藉由樹脂層而可防止在將保護膠帶從基板剝離之際金屬層 的破裂。 【實施方式】 以下，針對本發明之適合的實施形態，一邊參照附圖 一邊進行說明。 (保護膠帶） £ -9- 201243012 使用第1圖及第2圖，來說明本實施形態之保護膠帶 1之槪要。本實施形態之保護膠帶1，係被貼附於經過回 焊工程的基板30上，且對基板30之至少一部分作保護， 該保護膠帶係具有：被貼附於基板30上之黏著層11、金 屬層14、以及樹脂層13，且於黏著層11上，係至少設置 有金屬層14和樹脂層13。此外，第1圖及第2圖所展示 之保護膠帶1，係將樹脂層13及金屬層14，依照樹脂層 13、金屬層14的順序設置在黏著層11上。另外，並不限 定於此等，樹脂層13及金屬層14，係亦可依照金屬層14 、樹脂層13的順序被設置於黏著層Π上。在此，於本實 施形態之回焊工程中，於基板30之溫度，係最高爲270°C 〇 如第1圖所示，保護膠帶1，係如一般的膠帶般將長 尺狀者捲繞成滾筒狀地作收納，使用時，係由作業者的手 等來切取成所需的大小。此外，已被切取的保護膠帶1， 係使黏著層1 1爲基板3 0之表面側而被貼附於基板3 0上 之所欲保護的部位。 保護膠帶1，係從貼附於基板3 0之側起，依序層積有 :黏著層11、樹脂層13、以及金屬層14而形成。另外， 金屬層14,係藉由黏著劑層12而被貼附於樹脂層13上。 此外，位於保護膠帶1之最外層的金屬層14，係可將回焊 工程的熱70反射，並且，將進入金屬層14的熱7 0a散熱 到外部。因此，保護膠帶1，係能不易將熱傳導至位於金 屬層14的下面之黏著層11。另外，保護膠帶1，係即使 -10- 201243012 在從貼附於基板30之側起，依序層積有：黏著層11、金 屬層14、以及樹脂層13的情況下，藉由金屬層14，也可 將已透過樹脂層13的熱70反射，並且，將進入的熱70a 散熱至外部。 (保護膠帶之使用方法） 具體而言，參照第2圖來對保護膠帶1之使用方法加 以說明。本實施形態之基板3 0，係使用稱爲可撓性印刷基 板（FPC)者。該基板30，係被配置於後述第3圖之回焊工 程中所使用的支撐板20上。此外，於基板30上，係設置 有將電子零件40等作連接的連接部35a、35b。在第2圖 的情況下，於連接部35a，係透過焊錫45來將電子零件 作連接，且於連接部35b，係貼附有保護膠帶1。如此 一來，貼附於基板30的保護膠帶1，也同時被貼附於支撐 板20的表面，且藉由保護膠帶1而使基板30固定於支撐 板20上。如上所述，藉由將保護膠帶1貼附於沒有連接 電子零件40的連接部35b處，而防止回焊工程中焊錫45 熔解，而導致飛散的焊錫45附著於基板30上。另外，保 護膠帶1，並不限定於基板30之連接部35b，而是可適當 地貼附於基板30上之所欲保護的部分。 在此，如上所述，如本實施形態之基板3 0之類的可 撓性印刷基板，係多半會在作業時頻繁地被彎曲。隨著上 述情況的發生，有時用以保護基板30之保護膠帶1也會 跟著彎曲。此外，由於在將保護膠帶1從基板30剝離之C -5- 201243012 Substrate peeling' or after peeling off the protective tape, residual adhesive layer or the like occurs. As a result, there is a problem that it takes time and the like to peel off the protective tape, and the workability is deteriorated. Therefore, the protective tape for protecting the substrate subjected to the reflow process requires that the adhesion is not increased even if it is heated, and it is easy to peel off. Further, in the case of the above-mentioned conventional protective tape, the lanthanum resin as the adhesive layer is adversely affected by the electronic component, and the polyimide is expensive. Therefore, in practice, it is not a conventional protective tape, but a solder which is scattered after the reflow process is removed. Here, from the viewpoint of easy peeling, Patent Document 1 discloses an adhesive tape which is thin and excellent in reworkability. [Prior Art Document] [Patent Document 1] Japanese Patent No. 3 902 1 62 [Invention] [Problems to be Solved by the Invention] However, the adhesive tape disclosed in Patent Document 1 is attached. It is attached to the user between the LCD panel and the backlight frame of the LCD module, and is an adhesive tape that has both light reflectivity and light blocking property to light from the light source. Therefore, the protective tape used to protect the substrate subjected to the reflow process is completely different in use or use state. Therefore, when the adhesive tape disclosed in Patent Document 1 is attached to the substrate and enters the reflow process, the adhesive tape-6-201243012 is deteriorated by heat during the process, resulting in difficulty in peeling off, or residue. The defect is generated. The present invention has been made in view of the above problems, and an object thereof is to provide a protective tape capable of protecting a substrate subjected to reflow engineering, and which does not cause an increase in adhesion even if it is heated in a reflow process. The ease of peeling is well maintained. [Means for Solving the Problem] The protective tape of the present invention is attached to a substrate subjected to a reflow process, and at least a part of the substrate is protected, the protective tape having an adhesive attached to the substrate The layer, the metal layer, and the resin layer, and at least the metal layer and the resin layer are provided on the adhesive layer. According to the above configuration, the heat in the reflow process can be reflected and radiated to the outside by protecting all the metal layers of the protective tape against at least a portion of the substrate. As a result, the metal layer can easily conduct heat to the adhesive layer attached to the substrate, so that the temperature rise of the adhesive layer can be alleviated. As a result, it is difficult to peel off from the substrate after the reflow process or to cause residue after peeling, so that workability can be prevented from deteriorating. Further, even if the protective tape is bent, the influence of the bending on the metal layer can be alleviated by the elasticity of the resin layer which the protective tape has. Therefore, the breakage of the metal layer when the protective tape is peeled off from the substrate can be prevented by the resin layer. Further, in the protective tape of the present invention, the resin layer and the metal layer may be provided on the adhesive layer of the first 201243012 in the order of the resin layer and the metal layer. According to the above configuration, even in the case where the resin layer or the metal layer is provided on the adhesive layer in the order of the resin layer or the metal layer, it is difficult to conduct heat to the adhesive layer attached to the substrate by the metal layer, and further, by the resin The elasticity of the layer can alleviate the effect on the metal layer caused by the bending. Further, in the protective tape of the present invention, the resin layer and the metal layer may be provided on the adhesive layer in the order of the metal layer and the resin layer. According to the above configuration, even in the case where the metal layer or the resin layer is provided on the adhesive layer in the order of the metal layer or the resin layer, it is difficult to conduct heat to the adhesive layer attached to the substrate by the metal layer, and further, by the resin The elasticity of the layer can alleviate the effect on the metal layer caused by the bending. Further, in the protective tape of the present invention, the thickness of the metal layer may be 6 μm to 30 μm. According to the above configuration, since the thickness of the metal layer is appropriate, it becomes easy to efficiently reflect and dissipate heat. Further, by the thickness of the metal layer, the protective tape is not too hard to be peeled off, or a large amount of material is required to cause high cost. Further, in the protective tape of the present invention, the metal layer may be formed of aluminum. According to the above configuration, since the metal layer is formed of a suitable material, heat can be more efficiently reflected and radiated to the outside. Thereby, the temperature rise of the adhesive layer can be alleviated, and the protective tape can be easily peeled off during the peeling operation, and the work efficiency can be improved. -8 - 201243012 Further, in the protective tape of the present invention, in the above-mentioned reflow process, the temperature of the substrate may be at most 270 °C. According to the above configuration, in the above-described reflow process, the protective tape can be applied even when the temperature of the substrate is at most 270 °C. Further, in the protective tape of the present invention, the above-mentioned reflow process may also use infrared rays as a heat source. According to the above configuration, heat in the reflow process using infrared rays as a heat source can be reflected and radiated to the outside by the metal layer. As described above, a protective tape can be applied even in a reflow process in which infrared rays are used as a heat source. [Effect of the Invention] According to the protective tape of the present invention, since the metal layer is used, it is difficult to conduct heat to the adhesive layer attached to the substrate, so that the temperature of the adhesive layer can be alleviated. Thereby, it is not difficult to peel off from the substrate after the reflow process, or it remains after peeling, so that workability can be prevented from deteriorating. Further, it is possible to prevent cracking of the metal layer when the protective tape is peeled off from the substrate by the resin layer. [Embodiment] Hereinafter, a suitable embodiment of the present invention will be described with reference to the drawings. (Protective tape) £ -9- 201243012 A brief description of the protective tape 1 of the present embodiment will be described using Figs. 1 and 2 . The protective tape 1 of the present embodiment is attached to the substrate 30 subjected to the reflow process, and at least a part of the substrate 30 is protected. The protective tape has an adhesive layer 11 attached to the substrate 30, The metal layer 14 and the resin layer 13 are provided with at least a metal layer 14 and a resin layer 13 on the adhesive layer 11. Further, in the protective tape 1 shown in Figs. 1 and 2, the resin layer 13 and the metal layer 14 are provided on the adhesive layer 11 in the order of the resin layer 13 and the metal layer 14. Further, the resin layer 13 and the metal layer 14 may be provided on the adhesive layer in the order of the metal layer 14 and the resin layer 13 in order not to be limited thereto. Here, in the reflow process of the present embodiment, the temperature of the substrate 30 is up to 270 ° C. As shown in Fig. 1, the protective tape 1 is wound as a long tape. It is stored in a roll shape, and when used, it is cut into a desired size by the operator's hand or the like. Further, the protective tape 1 which has been cut out is such that the adhesive layer 1 1 is the surface side of the substrate 30 and is attached to the portion to be protected on the substrate 30. The protective tape 1 is formed by laminating the adhesive layer 11, the resin layer 13, and the metal layer 14 from the side attached to the substrate 30. Further, the metal layer 14 is attached to the resin layer 13 by the adhesive layer 12. Further, the metal layer 14 located at the outermost layer of the protective tape 1 reflects the heat 70 of the reflow process and dissipates the heat 70a entering the metal layer 14 to the outside. Therefore, the protective tape 1 can easily conduct heat to the adhesive layer 11 located under the metal layer 14. In addition, in the protective tape 1, even if -10-201243012 is laminated from the side attached to the substrate 30, the adhesive layer 11, the metal layer 14, and the resin layer 13 are laminated in this order, by the metal layer 14 It is also possible to reflect the heat 70 that has passed through the resin layer 13, and to dissipate the incoming heat 70a to the outside. (Method of Using Protective Tape) Specifically, the method of using the protective tape 1 will be described with reference to Fig. 2 . In the substrate 30 of the present embodiment, a flexible printed substrate (FPC) is used. The substrate 30 is placed on the support plate 20 used in the reflow process of Fig. 3 which will be described later. Further, on the substrate 30, connection portions 35a and 35b for connecting the electronic component 40 and the like are provided. In the case of Fig. 2, the electronic component is connected to the connecting portion 35a via the solder 45, and the protective tape 1 is attached to the connecting portion 35b. As a result, the protective tape 1 attached to the substrate 30 is also attached to the surface of the support plate 20, and the substrate 30 is fixed to the support plate 20 by the protective tape 1. As described above, by attaching the protective tape 1 to the connecting portion 35b where the electronic component 40 is not attached, the solder 45 is prevented from being melted in the reflow process, and the scattered solder 45 is attached to the substrate 30. Further, the protective tape 1 is not limited to the connecting portion 35b of the substrate 30, but may be attached to the portion to be protected on the substrate 30 as appropriate. Here, as described above, the flexible printed circuit board such as the substrate 30 of the present embodiment is often bent frequently during work. As the above occurs, the protective tape 1 for protecting the substrate 30 is sometimes bent. In addition, since the protective tape 1 is peeled off from the substrate 30
C -11 - 201243012 際，保護膠帶1也會被彎曲，因此保護膠帶1，係除了對 於由回焊工程所致之熱的對策以外，亦將具有即使彎曲也 不易破裂的柔軟性和強度一事納入考量，而對各構成的材 料或厚度等加以設定。 對本實施形態之保護膠帶1之各構成進行說明。 (金屬層） 首先，針對保護膠帶1之金屬層14進行說明。金屬 層1 4，係藉由黏著劑層1 2而被貼附於後述之樹脂層1 3上 ，且被配置於保護膠帶1的最外層，並具有將回焊工程中 的熱反射，或散熱的功用。此外，該金屬層14的厚度， 係較理想爲6μπι〜30μιη。此乃因爲金屬層14的厚度若較 6μιη更薄，則在剝離作業之際會變得容易破裂，或變得難 以散熱。另一方面，乃因爲金屬層14的厚度若較30μπι更 厚’則會因爲厚度而使保護膠帶1變得過硬而難以剝離， 或需要大量的材料而造成高成本。此外，金屬層14，係亦 可爲鋁、銀、銅等之金屬電鍍，且亦可利用金屬箔。其中 ’就容易將回焊工程中的熱反射，並且散熱的特性而言， 較理想爲在金屬層14方面使用鋁。 依據該構成，由於可更有效地將熱反射及散熱至外部 ，因此可緩和黏著層11的溫度上升，且可在剝離作業中 容易地將保護膠帶剝離，而使作業效率提升。 此外，由於金屬層14的厚度適當，因此變得容易將 熱有效地反射及散熱。進而，藉由金屬層14的厚度，而C -11 - 201243012, the protective tape 1 is also bent, so the protective tape 1 is included in the softness and strength which are not easily broken even if it is bent, in addition to the countermeasure against the heat caused by the reflow process. The material, thickness, and the like of each constituent are set in consideration. Each configuration of the protective tape 1 of the present embodiment will be described. (Metal Layer) First, the metal layer 14 of the protective tape 1 will be described. The metal layer 14 is attached to the resin layer 13 to be described later by the adhesive layer 12, and is disposed on the outermost layer of the protective tape 1, and has heat reflection or reheating in the reflow process. The function. Further, the thickness of the metal layer 14 is preferably 6 μm to 30 μm. This is because if the thickness of the metal layer 14 is thinner than 6 μm, it may be easily broken during the peeling operation or it may become difficult to dissipate heat. On the other hand, because the thickness of the metal layer 14 is thicker than 30 μm, the protective tape 1 becomes too hard to be peeled off due to the thickness, or a large amount of material is required to cause high cost. Further, the metal layer 14 may be plated with a metal such as aluminum, silver or copper, and a metal foil may also be used. Among them, it is easy to use heat reflection in the reflow process, and in terms of heat dissipation characteristics, it is preferable to use aluminum in the metal layer 14. According to this configuration, since the heat can be more effectively reflected and radiated to the outside, the temperature rise of the adhesive layer 11 can be alleviated, and the protective tape can be easily peeled off during the peeling operation, and the work efficiency can be improved. Further, since the thickness of the metal layer 14 is appropriate, it becomes easy to efficiently reflect and dissipate heat. Further, by the thickness of the metal layer 14,
-12- 201243012 不會使保護膠帶1變得過硬而難以剝離，或需要大量的材 料而造成高成本。 (黏著劑層） 黏著劑層12，係介於金屬層14與樹脂層13之間，且 具有將金屬層1 4貼附於樹脂層1 3上的功用。該黏著劑層 1 2，係藉由聚氨基甲酸酯系黏著劑或聚酯系黏著劑所形成 ，且其厚度爲1〜6μηι。 (樹脂層） 接著，針對保護膠帶1之樹脂層13進行說明。樹脂 層13，係藉由黏著劑層12而與已被貼附的金屬層14 一起 被設置於後述之黏著層11上。在第1圖的情況下，樹脂 層13，係介於金屬層14與黏著層11之間，且藉由黏著劑 層12而被貼合於金屬層14。且，樹脂層13，係防止在將 保護膠帶1剝離之際金屬層14的破裂。 樹脂層13，係藉由聚對苯二甲酸乙二酯（PET)、聚醯 亞胺（PI)、環氧（樹脂）等之樹脂而形成。其中，就防止在 將保護膠帶1剝離之際金屬層14的破裂，並且不會過度 耗費成本的觀點而言，較理想爲使用聚對苯二甲酸乙二酯 。此外，樹脂層13的厚度，係爲6μιη〜50μιη。此乃因爲 樹脂層13的厚度若較6μιη更薄，則在緩和對於金屬層14 彎曲所造成的影響一事會變得較爲困難。另一方面，乃因 爲樹脂層13的厚度若較5 Ομιη更厚，則會因爲厚度而使保-12- 201243012 Does not make the protective tape 1 too hard to be peeled off, or requires a large amount of material and causes high cost. (Adhesive Layer) The adhesive layer 12 is interposed between the metal layer 14 and the resin layer 13, and has a function of attaching the metal layer 14 to the resin layer 13. The adhesive layer 12 is formed of a polyurethane adhesive or a polyester adhesive, and has a thickness of 1 to 6 μm. (Resin Layer) Next, the resin layer 13 of the protective tape 1 will be described. The resin layer 13 is provided on the adhesive layer 11 to be described later together with the metal layer 14 to be attached by the adhesive layer 12. In the case of Fig. 1, the resin layer 13 is interposed between the metal layer 14 and the adhesive layer 11, and is bonded to the metal layer 14 by the adhesive layer 12. Further, the resin layer 13 prevents cracking of the metal layer 14 when the protective tape 1 is peeled off. The resin layer 13 is formed of a resin such as polyethylene terephthalate (PET), polyimine (PI), or epoxy (resin). Among them, polyethylene terephthalate is preferably used from the viewpoint of preventing cracking of the metal layer 14 at the time of peeling off the protective tape 1, without excessive cost. Further, the thickness of the resin layer 13 is 6 μm to 50 μm. This is because if the thickness of the resin layer 13 is thinner than 6 μm, it is difficult to alleviate the influence on the bending of the metal layer 14. On the other hand, because the thickness of the resin layer 13 is thicker than 5 Ομιη, it is guaranteed by the thickness.
C -13- 201243012 護膠帶1變得過硬而難以剝離，或需要大量的材料而造成 高成本。另外，於樹脂層13所使用的聚對苯二甲酸乙二 酯，係在約180 °C的溫度下會變成黃色而開始熱變形，且 在約24 0 °C的溫度下會收縮。因此，本實施形態之金屬層 1 4，係將熱反射及散熱，以免樹脂層1 3的溫度到達會開 始變色的1 8 0 °C。 另外，在第1圖的情況下，樹脂層13，係雖介於金屬 層14與黏著層11之間，但亦可被設置於金屬層14之表 面上（保護膠帶1的最外層）β此時，不但能具有緩和對於 金屬層14的彎曲所造成的影響之功用，而且也具有保護 金屬層14不受酸性之藥品等影響之功用。 依據如上所述之樹脂層13的構造，即使保護膠帶1 被彎曲，藉由樹脂層Π之彈性，而可緩和因彎曲而對金 屬層14所造成的影響。因而’藉由樹脂層13而可肪止在 將保護膠帶1從基板30剝離之際金屬層14的破裂。 (黏著層） 接著，針對保護膠帶1之黏著層11進行說明。黏著 層11，係被配置於接觸於基板30之側，且與層積於被層 積在金屬層14的樹脂層13 —起被貼附於基板30上。黏 著層11，係藉由丙烯酸系、橡膠系、矽系、及氨基甲酸酯 系等之樹脂而形成。此等當中’若考慮透明性或黏著力的 安定性等，則黏著層11 ’係以使用丙烯酸系樹脂來形成較 爲理想。此外，黏著層11的厚度，係爲5μιη〜2〇μηι。此 201243012 乃因爲黏著層11的厚度若較5μηι更薄，則會變得難以貼 附於基板30，且若較20μιη更厚，則會變得容易在將保護 膠帶1剝離之際產生殘留。另外，在黏著層11爲由丙烯 酸系樹脂所形成的情況下，一旦施加250 °C以上的熱便會 開始劣化，因此加諸於黏著層1 1的熱之溫度，係有必要 設定在至少2 5 0 °C以下。 (基板） 接著，針對貼附有具有如上所述之構造的保護膠帶1 之基板3 0進行說明。本實施形態之基板3 0，係爲可撓性 印刷基板（FPC)。基板30，係將無圖示的訊號用配線圖案 或接地用配線圖案等之複數的配線圖案，設置於由聚醯亞 胺所形成之基底構件上，且於其表面上，係藉由絕緣層等 所覆蓋。於具有這樣的構造之基板30上，係設置有連接 部35a及連接部35b，且藉由焊錫45來將配置於連接部 35a的連接端子與配置於電子零件40的連接端子作接著， 而使兩者電連接。另外，由聚醯亞胺所形成的基板3 0，係 能耐受3 00 °C以上的熱。此外，如第2圖所示，使保護膠 帶1貼附於基板30之沒有連接電子零件40的連接部35b 處，以防止回焊工程中所飛散的焊錫45附著於基板30上 。另外，於本實施形態中，雖基板3 0是使用可撓性印刷 基板（FPC)，但亦可使用其他種類的基板。 (回焊工程）C -13- 201243012 The protective tape 1 becomes too hard to be peeled off, or a large amount of material is required to cause high cost. Further, the polyethylene terephthalate used in the resin layer 13 turns yellow at a temperature of about 180 ° C to start thermal deformation, and shrinks at a temperature of about 240 ° C. Therefore, the metal layer 14 of the present embodiment reflects heat and dissipates heat so that the temperature of the resin layer 13 does not reach 180 °C which starts to change color. Further, in the case of Fig. 1, the resin layer 13 is interposed between the metal layer 14 and the adhesive layer 11, but may be provided on the surface of the metal layer 14 (the outermost layer of the protective tape 1). In addition, it has the function of alleviating the influence on the bending of the metal layer 14, and also has the function of protecting the metal layer 14 from the acidic drug or the like. According to the configuration of the resin layer 13 as described above, even if the protective tape 1 is bent, the influence on the metal layer 14 due to the bending can be alleviated by the elasticity of the resin layer. Therefore, the crack of the metal layer 14 can be prevented by the resin layer 13 when the protective tape 1 is peeled off from the substrate 30. (Adhesive Layer) Next, the adhesive layer 11 of the protective tape 1 will be described. The adhesive layer 11 is disposed on the side in contact with the substrate 30, and is attached to the substrate 30 together with the resin layer 13 laminated on the metal layer 14. The adhesive layer 11 is formed of a resin such as acrylic, rubber, lanthanide or urethane. In the above, it is preferable to form the adhesive layer 11' by using an acrylic resin in consideration of transparency or adhesion stability. Further, the thickness of the adhesive layer 11 is 5 μm to 2 μm. In the case of the thickness of the adhesive layer 11, if it is thinner than 5 μm, it becomes difficult to adhere to the substrate 30, and if it is thicker than 20 μm, it tends to cause residue when the protective tape 1 is peeled off. Further, when the adhesive layer 11 is formed of an acrylic resin, heat of 250 ° C or more is started to deteriorate, so the temperature of the heat applied to the adhesive layer 11 is required to be set at least 2 Below 5 0 °C. (Substrate) Next, the substrate 30 to which the protective tape 1 having the above-described configuration is attached will be described. The substrate 30 of the present embodiment is a flexible printed circuit board (FPC). The substrate 30 is provided on a base member formed of polyimide by a plurality of wiring patterns such as a signal wiring pattern or a ground wiring pattern (not shown), and is provided on the surface thereof by an insulating layer. Etc. The substrate 30 having such a structure is provided with a connection portion 35a and a connection portion 35b, and the connection terminal disposed on the connection portion 35a and the connection terminal disposed on the electronic component 40 are connected by the solder 45. Both are electrically connected. Further, the substrate 30 formed of polyimine can withstand heat of 300 ° C or higher. Further, as shown in Fig. 2, the protective tape 1 is attached to the connecting portion 35b of the substrate 30 to which the electronic component 40 is not attached, so as to prevent the solder 45 scattered in the reflow process from adhering to the substrate 30. Further, in the present embodiment, the substrate 30 is a flexible printed circuit board (FPC), but other types of substrates may be used. (reflow welding project)
S -15- 201243012 接著，使用第3圖，來針對本實施形態之回焊工程進 行說明。首先，針對回焊工程中所使用的回焊裝置50進 行說明。回焊裝置50，係具有：基底部51、輸送帶52、 以及熱爐部55。基底部51，係具有長尺狀的框體，且成 爲回焊裝置50的基底。輸送帶52，係被設置於基底部51 上，且在內部設置有複數個保持一定的距離並在相同方向 上並排地作配列的輥53，並以覆蓋各輥5 3上下面的方式 來架設帶。輥53,係剖面呈圓形之細長的圓柱狀，且藉由 讓各輥53以圓的中心爲軸作旋轉，而使輸送帶52的帶在 左右方向移動。熱爐部55，係全長爲2m，且在其內部係 設置有紅外線照射部56，而能夠朝向輸送帶52上照射紅 外線。此外，紅外線照射部5 6，係與輸送帶5 2之間隔著 一定的間隔地作設置。藉此，能夠對經過輸送帶5 2上的 基板3 0，從紅外線照射部5 6照射紅外線。 在此，於回焊工程前，係在支撐板20上配列複數個 基板30，且將保護膠帶1貼附於未連接有電子零件4〇的 連接部35b。此時，保護膠帶1，係以使基板30固定於支 撐板20的方式，也同時被貼附於支撐板20上。另外，保 護膠帶1之黏著層1 1，係爲了接觸到基板3 0而被貼附有 保護膠帶1。接著，將焊錫膏塗佈於基板30的連接部35a ’並在其上放置電子零件40，而進行回焊的準備。 然後，如第3圖（a)所示，將配列有如上述般所準備的 基板30之支撐板20’放置在輸送帶52上。接著，藉由輸 送帶52之各輥53旋轉，輸送帶52會朝向圖的右方向移S -15- 201243012 Next, the reflowing project of the present embodiment will be described using Fig. 3 . First, the reflow device 50 used in the reflow process will be described. The reflow device 50 has a base portion 51, a conveyor belt 52, and a hot furnace portion 55. The base portion 51 has a long-sized frame and serves as a base for the reflow device 50. The conveyor belt 52 is disposed on the base portion 51, and is internally provided with a plurality of rollers 53 which are held at a certain distance and arranged side by side in the same direction, and are erected so as to cover the upper and lower surfaces of the rollers 5 3 . band. The roller 53 has an elongated cylindrical shape in a circular cross section, and the belt of the conveyor belt 52 is moved in the left-right direction by rotating each roller 53 about the center of the circle. The hot furnace portion 55 has a total length of 2 m and is provided with an infrared ray irradiation portion 56 inside, and is capable of illuminating the conveyor belt 52 with an infrared ray. Further, the infrared ray irradiation unit 526 is provided at a constant interval from the conveyor belt 52. Thereby, infrared rays can be irradiated from the infrared ray irradiation unit 56 to the substrate 30 passing through the conveyor belt 52. Here, before the reflow process, a plurality of substrates 30 are arranged on the support plate 20, and the protective tape 1 is attached to the connection portion 35b to which the electronic component 4 is not connected. At this time, the protective tape 1 is attached to the support plate 20 at the same time so that the substrate 30 is fixed to the support plate 20. Further, the adhesive layer 1 of the protective tape 1 is attached with a protective tape 1 in order to contact the substrate 30. Next, solder paste is applied to the connection portion 35a' of the substrate 30, and the electronic component 40 is placed thereon to prepare for reflow. Then, as shown in Fig. 3(a), the support plate 20' on which the substrate 30 prepared as described above is placed is placed on the conveyor belt 52. Then, by the rotation of the rollers 53 of the conveyor belt 52, the conveyor belt 52 is moved toward the right direction of the drawing.
-16- 201243012 動，且配列有基板30的支撐板20也會跟著一起移動。藉 由輸送帶52而朝向右方向移動的基板30’係如第3圖（b) 所示，之後會到達熱爐部5 5之下方的位置’而從紅外線 照射部5 6照射紅外線到基板3 0上。此時’在熱爐部5 5 下方作移動的基板30，係耗費3分鐘在全長2m的熱爐部 55內作移動。而，移動中基板30上的溫度，係從熱爐部 5 5最初的位置開始溫度會緩緩地上升，之後會到達最高溫 度2 70 °C，且隨著移動到熱爐部55最後的位置處溫度會緩 緩下降。藉由此溫度（270 °C)的熱，而塗佈在連接部35a的 焊錫45會被熔解，且連接部35a與電子零件40所配置的 連接端子，會藉由焊錫45而被接著，而使兩者電連接。 另外，如第3圖（b)所示，加諸於保護膠帶1上的熱，會藉 由金屬層14而傳導至支撐板20上溫度較低的部位。如此 —來，保護膠帶1之黏著層11的溫度，會藉由金屬層14 而將紅外線反射到外部，且由紅外線所產生的熱會被散熱 ’因此至少會抑制在黏著層1 1開始劣化的2 5 0 °C以下。另 外’於第3圖中，本實施形態之回焊工程，係雖以紅外線 作爲熱源’但沒有必要限定於此。例如，亦可爲藉由熱風 吹拂而進行焊接的工程。只要是能藉由保護膠帶1之金屬 層14來將熱反射及散熱者任何手段皆可使用。 如此一來，藉由對基板30之至少一部分作保護的保 護膠帶1所有之金屬層14,而可將回焊工程中之熱反射及 散熱至外部。如此一來，藉由金屬層14，而能不易將熱傳 導至貼附於基板30上的黏著層11，因此可緩和黏著層n £ -17- 201243012 的溫度上升。藉此，便不會導致在回焊工程後難以從基板 3 0剝離，或在剝離後產生殘留，而可防止作業性的惡化。 此外，藉由金屬層14，而可將在以紅外線作爲熱源的 回焊工程中之熱反射及散熱至外部。如此一來，即使在以 紅外線作爲熱源的回焊工程中，亦可適用保護膠帶1。 此外，於前述回焊工程中，即使基板30之溫度成爲 最高爲270°C的情況下，也可適用本實施形態之保護膠帶 (實施例1與比較例1) 接著，使用本實施形態之保護膠帶1的實施例1及比 較例1來具體地說明本發明。 於實施例1中，使用第1圖所展示之本發明的保護膠 帶1，並由金屬層14、樹脂層13、以及黏著層11所構成 。具體而言，金屬層14，係由鋁（A1)箔所形成，且其厚度 爲9μηι。此外，樹脂層13，係由聚對苯二甲酸乙二酯 (PET)所形成，且其厚度爲12μπι。再者，黏著層11，係藉 由丙烯酸系樹脂所形成，且其厚度爲ΙΟμιη。另一方面， 比較例，係不使用金屬層14，而是僅以由聚對苯二甲酸乙 二酯（PET)所成之樹脂層13及由丙烯酸系樹脂所成之黏著 層11的構造來姑且進行了實驗，但保護膠帶會收縮而無 法測定。因此，於比較例1中，係使用了僅由環氧樹脂所 成之樹脂層13及丙烯酸系樹脂所成之黏著層11的構造。 接著，就評估方法而言，係進行了使用有依US Z 023 7 -18- 201243012 所規定的黏者膠帶、黏著薄片試驗方法的剝離試驗。具體 而言，係將切割成寬10mm、長100mm的保護膠帶1，貼 附於由不鏽鋼材料所構成的試驗板上，且藉由拉力試驗機 來測量將保護膠帶1從試驗板朝1 8 0°方向拉扯剝離時的拉 力。 在第3圖所示之回焊工程的前後，實施了如上所述般 的剝離試驗。也就是說，分別於在紅外線下基板3 0之溫 度成爲270°C的回焊工程之前、實施第1次回焊工程之後 、實施第3次回焊工程之後實施了剝離實驗。另外，試驗 ，係於實施例1及比較例1中各準備4種試樣的試驗品， 並測量了各自的拉力。將其結果展示於第4圖。 依據第4圖所示的試驗結果，回焊工程前的測量値， 係於實施例1、比較例1中拉力的平均値皆相同爲0.27N ，並無差異。其後，若於經過1次回焊工程之後實施試驗 ，則實施例1的拉力平均値爲0.3 ON，而比較例1的拉力 平均値成爲0.61N，兩者的拉力出現了差異。接著，若於 經過3次回焊工程之後實施試驗，則相對於實施例1的拉 力平均値爲0.33N，比較例1的拉力平均値成爲1.04N， 兩者的拉力出現了較大的差異。此外，可得知：於實施例 1中，通過1次回焊工程時，拉力爲1.1倍，經過3次回 焊工程時，雖拉力爲1.22倍幾乎沒有改變地推移，但於 比較例1中，通過1次回焊工程時，拉力爲2.25倍，通 過3次回焊工程時，大大地上升至3.85倍。此乃認爲是 因爲在比較例1的情況下，由於不具有金屬層14，因此無 -19- 201243012 法將熱反射及散熱，而使其下面的黏著層11的溫度上升 。也就是說，認爲：藉由回焊工程的熱，而導致黏著層11 的溫度上升至黏著層11會開始劣化的25 0°C以上，且黏著 層11的材料會分解而使黏著力變強，其結果造成在從試 驗板60剝離時的拉力變大。另一方面，在實施例1的情 況中，係由於最外層爲金屬層14，因此，藉由金屬層14 而將熱反射及散熱，且不易將熱傳導至黏著層11，而黏著 層11的溫度便不會上升到250 °c以上。因此，黏著層11 的黏著力，會保持在起始的狀態，且在從基板30將保護 膠帶1剝離時的拉力也不太會改變，而在從試驗板60剝 離時，也不會導致黏著層11的殘留產生。如上所述，可 獲得實施例1係全部的試驗品皆爲『〇』，而比較例爲『 X』的綜合評價。 (實施例2〜4與比較例2) 接著’使用本實施形態之保護膠帶1的實施例2〜4 及比較例2來具體地說明本發明。 實施例2、3及比較例2，雖皆具有與本實施形態之保 護膠帶1同樣的構造，但僅金屬層14的厚度各不相同。 具體而言，於實施例2中之金屬層14的厚度爲6μιη、實 施例3中之金屬層14的厚度爲9μιη、比較例2中之金屬 層14的厚度爲〇.1μπ1。另外，其他的厚度係與第4圖所 示之實施例1相同。此外，實施例4，係於黏著層11上設 置有厚度爲9μηι之金屬層14，且進一步於金屬層14之上 -20- 201243012 ，層積有由12μπι之聚醯亞胺（PI)所構成之樹脂層13。在 該實施例4的情況中，藉由聚醯亞胺（PI)所構成之樹脂層 13，而防止在將保護膠帶1從基板30剝離之際金屬層14 的破裂。進而，由於由聚醯亞胺（PI)所構成之樹脂層13係 位於保護膠帶1的最外層，因此也可保護金屬層14不受 酸性等之藥品影響。 使用具有如上述般的構造之實施例2〜4及比較例2， 分別於實施回焊工程之前、實施第1次回焊工程之後、實 施第3次回焊工程之後實施了前述剝離實驗。此外，將實 施例2〜4及比較例2的保護膠帶，投入溫度不同的熱風 乾燥機3分鐘，並在那之後實施了剝離試驗。另外，於熱 風乾燥機之試驗中，係分別實施了在2 00 °C的溫度下加熱 3分鐘的試驗，和在270 °C的溫度下加熱3分鐘的試驗。 將其結果展示於第5圖。 依據第5圖所展示的試驗結果，回焊工程前的測量値 如下：實施例2爲0.38N、實施例3爲0.45N、實施例4 爲0.3 2N、比較例2爲0.1 7N。接著，若在通過i次回焊 工程之後實施試驗，則實施例2爲0.43N、實施例3爲 0.51N、實施例4爲0.39N'比較例2爲0.52N。此外，若 在通過3次回焊工程之後實施試驗，則實施例2爲0.4 9N 、實施例3爲0.55N、實施例4爲0.3 6N、比較例2爲 0.62N。如上所述，於金屬層14的厚度不同，以及金屬層 I4上之樹脂層13的有無方面，即使實施3次回焊工程， 拉力也沒有太大的差異。The -16-201243012 is moved, and the support plate 20 with the substrate 30 is also moved together. The substrate 30' that moves in the right direction by the conveyor belt 52 is as shown in Fig. 3(b), and then reaches the position 'below the lower portion of the hot furnace portion 55', and irradiates infrared rays from the infrared ray irradiation portion 56 to the substrate 3. 0 on. At this time, the substrate 30 which was moved under the hot-melting portion 5 5 was moved in the hot-melt portion 55 having a total length of 2 m for 3 minutes. On the other hand, the temperature on the substrate 30 during the movement gradually rises from the initial position of the hot furnace portion 55, and then reaches the maximum temperature of 2 70 ° C, and moves to the last position of the hot furnace portion 55. The temperature will drop slowly. By the heat of this temperature (270 ° C), the solder 45 applied to the connection portion 35a is melted, and the connection portion where the connection portion 35a and the electronic component 40 are disposed is followed by the solder 45. Make the two electrically connected. Further, as shown in Fig. 3(b), the heat applied to the protective tape 1 is conducted to the lower temperature portion of the support plate 20 by the metal layer 14. As a result, the temperature of the adhesive layer 11 of the protective tape 1 is reflected by the metal layer 14 to the outside, and the heat generated by the infrared rays is dissipated by heat. Therefore, at least the deterioration of the adhesive layer 11 is suppressed. 2 5 0 °C or less. Further, in Fig. 3, the reflow process of the present embodiment is based on infrared rays as a heat source, but is not necessarily limited thereto. For example, it is also possible to perform welding by hot air blowing. Any means that can reflect and dissipate heat by the metal layer 14 of the protective tape 1 can be used. In this manner, by protecting at least a portion of the substrate 30, all of the metal layer 14 of the protective tape 1 can reflect and dissipate heat from the reflow process to the outside. As a result, the metal layer 14 can easily transfer heat to the adhesive layer 11 attached to the substrate 30, so that the temperature rise of the adhesive layer n £ -17 - 201243012 can be alleviated. Thereby, it is not difficult to peel off from the substrate 30 after the reflow process, or it is left after peeling, and the workability can be prevented from deteriorating. Further, by the metal layer 14, heat in the reflow process using infrared rays as a heat source can be reflected and radiated to the outside. In this way, the protective tape 1 can be applied even in a reflow process using infrared rays as a heat source. Further, in the above-described reflow process, the protective tape of the present embodiment can be applied even when the temperature of the substrate 30 is at most 270 ° C (Example 1 and Comparative Example 1) Next, the protection of the present embodiment is used. The present invention will be specifically described in Example 1 of Comparative Example 1 and Comparative Example 1. In the first embodiment, the protective tape 1 of the present invention shown in Fig. 1 is used, and is composed of a metal layer 14, a resin layer 13, and an adhesive layer 11. Specifically, the metal layer 14 is formed of an aluminum (A1) foil and has a thickness of 9 μm. Further, the resin layer 13 is formed of polyethylene terephthalate (PET) and has a thickness of 12 μm. Further, the adhesive layer 11 is formed of an acrylic resin and has a thickness of ΙΟμηη. On the other hand, in the comparative example, the metal layer 14 is not used, but only the resin layer 13 made of polyethylene terephthalate (PET) and the adhesive layer 11 made of an acrylic resin are used. The experiment was carried out, but the protective tape shrinks and cannot be measured. Therefore, in Comparative Example 1, a structure in which the resin layer 13 made of only an epoxy resin and the adhesive layer 11 made of an acrylic resin were used was used. Next, in terms of the evaluation method, a peeling test using a test method of an adhesive tape or an adhesive sheet specified in US Z 023 7 -18-201243012 was carried out. Specifically, the protective tape 1 cut into a width of 10 mm and a length of 100 mm is attached to a test plate composed of a stainless steel material, and the protective tape 1 is measured from the test plate toward the 1 800 by a tensile tester. Pulling the pulling force in the direction of peeling. The peeling test as described above was carried out before and after the reflow process shown in Fig. 3. In other words, the peeling test was carried out before the reflow process in which the temperature of the substrate 30 in the infrared ray was 270 ° C, after the first reflow process was performed, and after the third reflow process was performed. Further, in the test, the test pieces of the four kinds of samples were prepared in each of Example 1 and Comparative Example 1, and the respective tensile forces were measured. The results are shown in Figure 4. According to the test results shown in Fig. 4, the measured enthalpy before the reflow process was the same as the average enthalpy of the tensile force in Example 1 and Comparative Example 1 being 0.27 N, and there was no difference. Thereafter, if the test was carried out after one reflow process, the average tensile force of Example 1 was 0.3 ON, and the average tensile force of Comparative Example 1 was 0.61 N, and the tensile force of the two was different. Then, if the test was carried out after three times of reflowing, the average tensile force of the tensile force of Example 1 was 0.33 N, and the average tensile strength of Comparative Example 1 was 1.04 N, and the tensile force of the two showed a large difference. Further, in the first embodiment, in the case of the first reflow process, the tensile force was 1.1 times, and when the reflow process was performed three times, the tensile force was changed to 1.22 times with almost no change, but in the comparative example 1, When the reflowing project was carried out once, the pulling force was 2.25 times, and when it was passed through the three reflowing projects, it greatly increased to 3.85 times. This is considered to be because in the case of Comparative Example 1, since the metal layer 14 is not provided, the heat is not reflected and dissipated by the -19-201243012 method, and the temperature of the adhesive layer 11 underneath is raised. That is to say, it is considered that the temperature of the adhesive layer 11 rises to a temperature above 25 ° C where the adhesive layer 11 starts to deteriorate by the heat of the reflow process, and the material of the adhesive layer 11 is decomposed to change the adhesive force. Strong, as a result, the tensile force at the time of peeling from the test plate 60 becomes large. On the other hand, in the case of Embodiment 1, since the outermost layer is the metal layer 14, heat is radiated and dissipated by the metal layer 14, and heat is not easily conducted to the adhesive layer 11, and the temperature of the adhesive layer 11 is maintained. It will not rise above 250 °c. Therefore, the adhesive force of the adhesive layer 11 is maintained at the initial state, and the tensile force when the protective tape 1 is peeled off from the substrate 30 is less likely to change, and does not cause adhesion when peeled off from the test plate 60. The residue of layer 11 is produced. As described above, it was found that all of the test articles of Example 1 were "〇", and the comparative example was a comprehensive evaluation of "X". (Examples 2 to 4 and Comparative Example 2) Next, the present invention will be specifically described using Examples 2 to 4 and Comparative Example 2 of the protective tape 1 of the present embodiment. In Examples 2, 3 and Comparative Example 2, the same structure as the protective tape 1 of the present embodiment was obtained, but only the thickness of the metal layer 14 was different. Specifically, the thickness of the metal layer 14 in Example 2 was 6 μm, the thickness of the metal layer 14 in Example 3 was 9 μm, and the thickness of the metal layer 14 in Comparative Example 2 was 〇.1 μπ1. Further, the other thicknesses are the same as those of the first embodiment shown in Fig. 4. In addition, in the embodiment 4, the metal layer 14 having a thickness of 9 μm is disposed on the adhesive layer 11, and further, the metal layer 14 is -20-201243012, and the layer is composed of 12 μm of polyimine (PI). The resin layer 13. In the case of the fourth embodiment, the resin layer 13 composed of polyimine (PI) prevents the cracking of the metal layer 14 when the protective tape 1 is peeled off from the substrate 30. Further, since the resin layer 13 composed of polyimine (PI) is located on the outermost layer of the protective tape 1, the metal layer 14 can be protected from chemicals such as acid. Using the examples 2 to 4 and the comparative example 2 having the above-described structures, the peeling test was carried out before the reflow process was carried out, after the first reflow process was performed, and after the third reflow process was carried out. Further, the protective tapes of Examples 2 to 4 and Comparative Example 2 were placed in a hot air dryer having different temperatures for 3 minutes, and then a peeling test was carried out. Further, in the test of the hot air dryer, the test was carried out by heating at a temperature of 200 ° C for 3 minutes and at a temperature of 270 ° C for 3 minutes. The results are shown in Figure 5. According to the test results shown in Fig. 5, the measurement 前 before the reflow process was as follows: Example 2 was 0.38 N, Example 3 was 0.45 N, Example 4 was 0.3 2 N, and Comparative Example 2 was 0.1 7 N. Next, if the test was carried out after passing through the i-return-welding process, Example 2 was 0.43 N, Example 3 was 0.51 N, and Example 4 was 0.39 N'. Comparative Example 2 was 0.52 N. Further, if the test was carried out after passing through three reflow processes, Example 2 was 0.49N, Example 3 was 0.55N, Example 4 was 0.36N, and Comparative Example 2 was 0.62N. As described above, in terms of the thickness of the metal layer 14 and the presence or absence of the resin layer 13 on the metal layer I4, even if the reflow process is performed three times, the tensile force is not greatly different.
C -21 - 201243012 此外，於在20 0°C的溫度下加熱3分鐘後之熱風乾燥 機的試驗中，實施例2爲0.44N '實施例3爲0.48N、實 施例4爲0.35N、比較例2爲0.34N。然而，於在270。(：的 溫度下加熱3分鐘後之熱風乾燥機的試驗中，實施例2爲 0.41N、實施例3爲0.38N、實施例4爲0.37N，而相對於 在200°C的溫度下加熱3分鐘後之熱風乾燥機的試驗中並 沒有太大的變化，在比較例2的情況中，保護膠帶會收縮 而無法測量。 此乃認爲在比較例2的情況中，由於金屬層1 4的厚 度較薄，因此在270°C的溫度之熱風乾燥機試驗中，金屬 層14並無法耐熱。由其結果得知：在金屬層14的厚度至 少爲6μιη以上的情況下，不論是在3次的回焊工程之實施 後’或投入在270°C的溫度下加熱3分鐘後之熱風乾燥機 之後，黏著層11的黏著力也不太會提升。 如此一來，依據使用了實施例及比較例的試驗，藉由 保護膠帶1所具有之金屬層14，而可將回焊工程中之熱反 射及散熱至外部。如此一來，藉由金屬層14，而能不易將 熱傳導至貼附於基板30上的黏著層11，因此可緩和黏著 層Η的溫度上升。藉此，便不會導致在回焊工程後難以 從基板3 0剝離，或在剝離後產生殘留，而可防止作業性 的惡化。 此外，若金屬層14的厚度爲6 μιη以上，則由於金屬 層14的厚度成爲適中，而變得容易將熱有效地反射及散 熱0 -22- 201243012 此外，於前述回焊工程中，即使基板30之溫度成爲 最高爲270°C的情況，也可適用本實施形態之保護膠帶1 〇 以上，雖對本發明之實施例作了說明，但不過是將具 體例作了例示，並不特別對本發明作限定，具體的構造等 係可適當設計變更。此外，發明之實施形態中所記載的作 用及效果，只不過是列舉出由本發明所產生之最適當的作 用及效果，依據本發明所產生之作用及效果，並不限定於 本發明之實施形態所記載者。 [產業上之可利用性] 本發明，係可適用於用以保護經過回焊工程的基板之 保護膠帶。 【圖式簡單說明】 [第1圖]係展示本實施形態之保護膠帶的外觀及橫剖 面之說明圖。 [第2圖]係展示將本實施形態之保護膠帶貼附於基板 的狀態之說明圖。 [第3圖]係展示本實施形態之回焊工程的說明圖。 [第4圖]係展示使用本實施形態之保護膠帶的實施例 1及比較例1的剝離試驗結果之說明圖。 [第5圖]係展示使用本實施形態之&護膠帶的實施例 2〜4及比較例2的剝離試驗結果之說明圖。C -21 - 201243012 In addition, in the test of the hot air dryer after heating at a temperature of 20 ° C for 3 minutes, Example 2 was 0.44 N 'Example 3 was 0.48 N, and Example 4 was 0.35 N, comparison Example 2 is 0.34N. However, at 270. In the test of the hot air dryer after heating at a temperature of 3 minutes, Example 2 was 0.41 N, Example 3 was 0.38 N, and Example 4 was 0.37 N, and heating was carried out at a temperature of 200 ° C. There was not much change in the test of the hot air dryer after one minute. In the case of Comparative Example 2, the protective tape was shrunk and could not be measured. This is considered to be due to the case of the metal layer 14 in the case of Comparative Example 2. Since the thickness is thin, the metal layer 14 is not heat-resistant in the hot air dryer test at a temperature of 270 ° C. As a result, it is found that the thickness of the metal layer 14 is at least 6 μm or more, regardless of the number of times. After the implementation of the reflow process, or after the hot air dryer heated at 270 ° C for 3 minutes, the adhesion of the adhesive layer 11 is less likely to increase. Thus, the examples and comparative examples are used. In the test, the heat in the reflow process can be reflected and dissipated to the outside by protecting the metal layer 14 of the adhesive tape 1. Thus, by the metal layer 14, it is difficult to conduct heat to the substrate. Adhesive layer 11 on 30, thus relaxing The temperature of the layer is increased, whereby it is difficult to peel off from the substrate 30 after the reflow process, or residue after peeling, and deterioration of workability can be prevented. Further, if the thickness of the metal layer 14 is 6 μm or more, since the thickness of the metal layer 14 is moderate, it is easy to effectively reflect and dissipate heat. 0 -22- 201243012 In addition, in the above reflow process, even if the temperature of the substrate 30 is up to 270 ° C In the case of the protective tape of the present embodiment, the embodiment of the present invention is described. However, the specific examples are exemplified, and the present invention is not particularly limited. The specific configuration may be In addition, the functions and effects described in the embodiments of the invention are merely the most appropriate actions and effects produced by the present invention, and the actions and effects produced by the present invention are not limited to the present invention. [Industrial Applicability] The present invention is applicable to a protective tape for protecting a substrate subjected to a reflow process. [Brief 1] is an explanatory view showing the appearance and cross section of the protective tape of the present embodiment. [Fig. 2] is an explanatory view showing a state in which the protective tape of the present embodiment is attached to a substrate. Fig. 3 is an explanatory view showing the reflowing process of the present embodiment. [Fig. 4] is an explanatory view showing the results of the peeling test of Example 1 and Comparative Example 1 using the protective tape of the present embodiment. Fig. 4 is an explanatory view showing the results of peeling tests of Examples 2 to 4 and Comparative Example 2 using the & protective tape of the present embodiment.
C -23- 201243012 【主要元件符號說明】 1 :保護膠帶 1 1 :黏著層 1 3 :樹脂層 1 4 :金屬層 70 :熱 -24C -23- 201243012 [Description of main component symbols] 1 : Protective tape 1 1 : Adhesive layer 1 3 : Resin layer 1 4 : Metal layer 70 : Heat -24