KR101843415B1 - Protective tape - Google Patents

Abstract

Provided is a protective tape which protects a substrate passing through a solder reflow process and can maintain a good releasability property without increasing the adhesive force even in heat during a solder reflow process. The protective tape comprises: an adhesive layer adhered on a substrate; A metal layer; Resin layer; And at least the metal layer and the resin layer are provided on the adhesive layer.

Description

Protective tape {PROTECTIVE TAPE}

The present invention relates to a protective tape for protecting a substrate through a solder reflow process.

Conventionally, when an electronic component such as a resistor, a capacitor, or an IC is connected to a substrate, solder is first applied to the connection portion on the substrate, and the electronic component is mounted thereon and sent to the solder reflow process. In the solder reflow process, the solder is melted by heat, and the solder is then cooled to solidify, thereby connecting the electronic part to the connection part on the substrate.

However, when the substrate is sent to the solder reflow process, the melted solder may scatter. At this time, scattered solder easily attaches to a portion other than the connection portion to which the electronic component on the substrate is connected, especially near the connection portion, which causes electric trouble or deteriorates the appearance. Therefore, in order to prevent the solder scattered during the solder reflow process from adhering, a protective tape is attached in advance in the vicinity of the connection portion. As a result, even if the solder is scattered in the vicinity of the connection portion, it can be prevented from being attached to the surface of the protective tape and attached to the vicinity of the connection portion located on the lower surface thereof.

However, since the conventional protective tape has a structure in which a silicone resin or the like is laminated as a pressure-sensitive adhesive layer having high heat resistance to polyimide (PI), when the temperature of the protective tape rises due to heat during the solder reflow process, The adhesive strength of the adhesive layer of the pressure-sensitive adhesive layer is stronger than that of the initial state. In this case, it is difficult to detach the protective tape from the substrate in the subsequent process, or the residue of the adhesive layer remains after peeling off the protective tape. As a result, there has been a problem that workability is deteriorated, such as a time required for the peeling work of the protective tape. Therefore, the protective tape for protecting the substrate passing through the solder reflow process is required to be easily peeled off without increasing the adhesion even when heat is applied.

In addition, in the case of the conventional protective tape described above, the silicone resin as the adhesive layer may adversely affect the electronic parts, and the polyimide is expensive. Therefore, in practice, the solder scattered after the solder reflow process is removed without using the conventional protective tape.

From the viewpoint of easy removal, Patent Document 1 discloses an adhesive tape which is thin and excellent in reworkability.

Japanese Patent Publication No. 3902162

However, the adhesive tape disclosed in Patent Document 1 is used by attaching between an LCD panel of a LCD module and a backlight case, and is an adhesive tape having light reflectivity and light shielding property against light from a light source. Therefore, the use and the use state are completely different from the protective tape which protects the board passing through the solder reflow process. Therefore, when the adhesive tape disclosed in Patent Document 1 is attached to the substrate and sent to the solder reflow process, the adhesive tape deteriorates due to heat during the process, which makes it difficult to peel off the adhesive tape, and inconveniences such as residue are generated.

SUMMARY OF THE INVENTION The present invention has been accomplished in view of the above problems, and it is an object of the present invention to provide a protective tape which protects a substrate passing through a solder reflow process and can maintain a good special condition that does not increase the adhesive force by heat during a solder reflow process, And to provide the above-mentioned objects.

The protective tape of the present invention is a protective tape attached to a substrate passing through a solder reflow process and protecting at least a part of the substrate, an adhesive layer adhered on the substrate; A metal layer; And a resin layer, wherein at least the metal layer and the resin layer are provided on the adhesive layer.

According to the above configuration, the metal layer of the protective tape for protecting at least a part of the substrate can reflect and radiate heat to the outside during the solder reflow process. As described above, since heat can be prevented from being transmitted to the adhesive layer adhered to the substrate by the metal layer, temperature rise of the adhesive layer can be alleviated. As a result, after the solder reflow process, it is difficult to peel off from the substrate or after the peeling, no residue is formed, and deterioration of workability can be prevented. Further, even if the protective tape is warped, the influence of the warp on the metal layer due to the elasticity of the resin layer provided on the protective tape can be mitigated. Therefore, when the protective tape is peeled from the substrate, the metal layer can be prevented from being torn by the resin layer.

In the protective tape of the present invention, the resin layer and the metal layer may be provided on the adhesive layer in the order of the resin layer and the metal layer.

According to the above configuration, even when the resin layer and the metal layer are provided in this order on the pressure-sensitive adhesive layer, the heat can be prevented from being transmitted to the pressure-sensitive adhesive layer adhered on the substrate by the metal layer. It is possible to mitigate the influence on the metal layer.

Further, in the protective tape of the present invention, the resin layer and the metal layer may be provided on the adhesive layer in this order of the metal layer and the resin layer.

According to the above configuration, even when the metal layer and the resin layer are provided in this order on the pressure-sensitive adhesive layer, the heat can be prevented from being transmitted to the pressure-sensitive adhesive layer adhered to the substrate by the metal layer. It is possible to mitigate the influence on the metal layer.

Further, in the protective tape of the present invention, the thickness of the metal layer may be 6 탆 to 30 탆.

According to the above configuration, since the thickness of the metal layer is preferable, the heat can be effectively reflected and radiated easily. Further, the thickness of the metal layer can prevent the protective tape from becoming too hard and difficult to peel off, or a large amount of material is required, and the cost can be prevented from rising.

Further, in the protective tape of the present invention, the metal layer may be formed of aluminum.

According to the above configuration, since the metal layer is formed of a preferable material, heat can be more effectively reflected and radiated to the outside. As a result, the temperature rise of the pressure-sensitive adhesive layer can be further mitigated, the protective tape can be easily peeled off during peeling work, and the working efficiency can be improved.

In addition, in the protective tape of the present invention, the temperature of the substrate during the solder reflow process may be at most 270 캜.

According to the above configuration, the protective tape can be applied even when the temperature of the substrate reaches 270 캜 at the solder reflow step.

Further, in the protective tape of the present invention, the solder reflow process may use infrared rays as a heat source.

According to the above configuration, heat during the solder reflow process using infrared rays as a heat source can be reflected and radiated to the outside by the metal layer. Thus, a protective tape can be applied to a solder reflow process using an infrared ray as a heat source.

According to the protective tape of the present invention, since the metal layer makes it difficult to transfer heat to the adhesive layer adhered on the substrate, the temperature rise of the adhesive layer can be alleviated. This makes it difficult to peel off the substrate after the solder reflow process or to remove residues after peeling, thereby preventing deterioration of workability. In addition, it is possible to prevent the metal layer from being torn when the protective tape is peeled from the substrate by the resin layer.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an explanatory view showing an outer appearance and a cross-sectional view of a protective tape according to this embodiment. Fig.
2 is an explanatory view showing a state in which the protective tape according to the present embodiment is attached to a substrate.
3 is an explanatory view showing a solder reflow process according to the present embodiment.
Fig. 4 is an explanatory diagram showing the results of the peeling test using the protective tape of Example 1 and Comparative Example 1 according to the present embodiment. Fig.
5 is an explanatory diagram showing the results of peeling test using the protective tapes of Examples 2 to 4 and Comparative Example 2 according to the present embodiment.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

(Protective tape)

An outline of the protective tape 1 according to this embodiment will be described with reference to Figs. 1 and 2. Fig. The protective tape 1 according to the present embodiment is a protective tape which is attached to a substrate 30 passing through a solder reflow process and protects at least a part of the substrate 30, 11); A metal layer 14; And a resin layer 13. The adhesive layer 11 is provided with at least a metal layer 14 and a resin layer 13. [ 1 and 2, the resin layer 13 and the metal layer 14 are provided on the adhesive layer 11 in the order of the resin layer 13 and the metal layer 14 . The resin layer 13 and the metal layer 14 may be provided on the adhesive layer 11 in the order of the metal layer 14 and the resin layer 13 in this order. Here, the temperature of the substrate 30 in the solder reflow process according to the present embodiment reaches a maximum of 270 占 폚.

As shown in Fig. 1, the protective tape 1 is formed by winding a long tape in the form of a roll like a conventional tape and storing it in a desired size by using the back of a worker when using it. The cut protective tape 1 is adhered to the surface of the substrate 30 on which the adhesive layer 11 is intended to be protected.

The protective tape 1 is formed by sequentially laminating an adhesive layer 11, a resin layer 13 and a metal layer 14 from the side where the protective tape 1 is adhered to the substrate 30. [ In addition, the metal layer 14 is attached on the resin layer 13 through the adhesive layer 12. The metal layer 14 located on the outermost layer of the protective tape 1 reflects the heat 70 in the solder reflow process and can heat the heat 70a applied to the metal layer 14 to the outside have. Therefore, the protective tape 1 can prevent the heat from being transmitted to the adhesive layer 11 located on the lower surface of the metal layer 14. In addition, even when the adhesive layer 11, the metal layer 14, and the resin layer 13 are sequentially stacked from the side where the protective tape 1 is adhered to the substrate 30, , The heat 70 transmitted through the resin layer 13 can be reflected and the heat 70a applied can be dissipated to the outside.

(How to use protective tape)

Specifically, a method of using the protective tape 1 will be described with reference to FIG. The substrate 30 according to the present embodiment uses what is called a flexible printed circuit board (FPC). This substrate 30 is disposed on a support plate 20 used in the solder reflow process of FIG. 3 to be described later. On the substrate 30, connection portions 35a and 35b to which the electronic component 40 and the like are connected are provided. In the case of Fig. 2, the electronic part 40 is connected to the connection part 35a through the solder 45, and the protection tape 1 is attached to the connection part 35b. The protective tape 1 attached to the substrate 30 is attached to the surface of the support plate 20 at the same time and the substrate 30 is fixed to the support plate 20 by the protective tape 1. [ As described above, since the protective tape 1 is attached to the connection portion 35b to which the electronic component 40 is not connected, the solder 45 is melted in the solder reflow process, It is prevented from sticking to the image. In addition, the protective tape 1 is not limited to the connection portion 35b of the substrate 30, but can be appropriately attached to a portion of the substrate 30 to be protected.

Here, as described above, the flexible printed circuit board such as the board 30 according to the present embodiment often bends frequently during operation. The protective tape 1 for protecting the substrate 30 may also be warped. Further, since the protection tape 1 is bent even when the protective tape 1 is detached from the substrate 30, it is also considered to cope with the thermal countermeasures due to the solder reflow process and also to have flexibility and strength that do not tear even when bent The material and thickness of each constitution of the protective tape 1 are set.

Each constitution of the protective tape 1 according to the present embodiment will be described.

(Metal layer)

First, the metal layer 14 of the protective tape 1 will be described. The metal layer 14 is attached to the resin layer 13 to be described later via the adhesive layer 12 and disposed on the outermost layer of the protective tape 1 and serves to reflect or dissipate heat during the solder reflow process do. The thickness of the metal layer 14 is preferably 6 mu m to 30 mu m. This is because if the thickness of the metal layer 14 is thinner than 6 탆, it tends to be easily torn or difficult to dissipate in the peeling operation. On the other hand, if the thickness of the metal layer 14 is larger than 30 mu m, the protective tape 1 becomes too hard due to its thickness, so that it becomes difficult to peel off or a large amount of material is required. The metal layer 14 may be a metal plating such as aluminum, silver, or copper, or may be a metal foil. Among them, it is preferable to use aluminum for the metal layer 14 because of the characteristic of easily radiating heat while reflecting heat during the solder reflow process.

According to this configuration, the heat can be more effectively reflected and radiated to the outside, so that the temperature rise of the adhesive layer 11 can be relaxed, the protective tape can be easily peeled off during peeling work, have.

Further, since the thickness of the metal layer 14 is preferable, it is easy to effectively reflect and dissipate heat. Also, the thickness of the metal layer 14 can prevent the protective tape 1 from becoming too hard and difficult to peel off, or requiring a large amount of material, thereby preventing the cost from rising.

(Adhesive layer)

The adhesive layer 12 is interposed between the metal layer 14 and the resin layer 13 and serves to adhere the metal layer 14 on the resin layer 13. The adhesive layer 12 is formed of a polyurethane-based adhesive or a polyester-based adhesive, and has a thickness of 1 to 6 탆.

(Resin layer)

Next, the resin layer 13 of the protective tape 1 will be described. The resin layer 13 is provided on the adhesive layer 11 to be described later together with the metal layer 14 adhered by the adhesive layer 12. 1, the resin layer 13 is sandwiched between the metal layer 14 and the adhesive layer 11 and faces the metal layer 14 through the adhesive layer 12. Further, the resin layer 13 prevents the metal layer 14 from being torn when the protective tape 1 is peeled off.

The resin layer 13 is formed of a resin such as polyethylene terephthalate (PET), polyimide (PI), or epoxy. Among them, it is preferable to use polyethylene terephthalate in view of preventing tearing of the metal layer 14 during peeling of the protective tape 1 and cost-saving. The thickness of the resin layer 13 is 6 탆 to 50 탆. This is because if the thickness of the resin layer 13 is thinner than 6 mu m, it is difficult to mitigate the influence of the metal layer 14 on the warpage. On the other hand, if the thickness of the resin layer 13 is greater than 50 탆, the protective tape 1 becomes too hard to be peeled off due to its thickness, or a large amount of material is required and the cost is increased. In addition, the polyethylene terephthalate used for the resin layer 13 is discolored to yellow at a temperature of about 180 캜, starts to be thermally deformed, and starts to contract at a temperature of about 240 캜. Therefore, the metal layer 14 according to the present embodiment reflects and dissipates heat so that the temperature of the resin layer 13 does not reach 180 deg. C at which the temperature starts to change.

1, the resin layer 13 is sandwiched between the metal layer 14 and the adhesive layer 11 but may be provided on the surface of the metal layer 14 (the outermost layer of the protective tape 1) have. In this case, the metal layer 14 serves to mitigate the influence of the bending of the metal layer 14 and to protect the metal layer 14 from acid chemicals.

According to the structure of the resin layer 13 as described above, even if the protective tape 1 is warped, the influence of the warp due to the elasticity of the resin layer 13 on the metal layer 14 can be alleviated. Therefore, it is possible to prevent the metal layer 14 from being torn by the resin layer 13 when the protective tape 1 is peeled from the substrate 30.

(Adhesive layer)

Next, the adhesive layer 11 of the protective tape 1 will be described. The adhesive layer 11 is disposed on the side facing the substrate 30 and laminated on the resin layer 13 laminated on the metal layer 14 and attached to the substrate 30. The adhesive layer 11 is formed of a resin such as acrylic, rubber, silicone, or urethane. Among them, the adhesive layer 11 is preferably formed using an acrylic resin in consideration of the transparency and the stability of the adhesive force. Further, the thickness of the adhesive layer 11 is 5 占 퐉 to 20 占 퐉. This is because if the thickness of the adhesive layer 11 is less than 5 탆, it is difficult to adhere to the substrate 30, and if it is thicker than 20 탆, residues tends to be formed when the protective tape 1 is peeled off. Further, in the case of the pressure-sensitive adhesive layer 11 formed of an acrylic resin, deterioration starts when heat of 250 占 폚 or more is applied, so that the temperature of the heat applied to the pressure-sensitive adhesive layer 11 must be at least 250 占 폚.

(Board)

Next, the substrate 30 to which the protective tape 1 having the above-described structure is attached will be described. The substrate 30 according to the present embodiment is a flexible printed circuit board (FPC). The substrate 30 is provided with a plurality of wiring patterns, such as signal wiring patterns and ground wiring patterns, which are not shown, on a base member formed of polyimide, and its surface is covered with an insulating layer or the like. The substrate 30 having such a configuration is provided with a connecting portion 35a and a connecting portion 35b and the connecting terminal disposed on the connecting portion 35a and the connecting terminal disposed on the electronic component 40 are soldered by the solder 45 So that both are electrically connected. In addition, the substrate 30 formed of polyimide can withstand temperatures of 300 ° C or more. 2, the protective tape 1 is attached to the connection portion 35b to which the electronic component 40 of the substrate 30 is not connected, and the solder 45 scattered in the solder reflow process It is prevented from sticking to the substrate 30. In addition, in the present embodiment, the flexible printed circuit board (FPC) is used as the substrate 30, but other types of substrates may also be used.

(Solder reflow process)

Next, the solder reflow process according to the present embodiment will be described with reference to FIG. First, the solder reflow apparatus 50 used in the solder reflow process will be described. The solder reflow apparatus 50 includes a base portion 51; A conveyor belt 52; And a heating furnace section (55). The base portion 51 has an elongated case and serves as a base of the solder reflow apparatus 50. The conveyor belts 52 are provided on the base portion 51 and are provided with a plurality of rollers 53 arranged in parallel in the same direction at a constant distance to cover the upper and lower surfaces of the rollers 53 A belt is constituted. The rollers 53 are cylindrical in cross section and cause the belts of the conveyor belts 52 to move in the left and right directions as the rollers 53 rotate about the center of the circle. The heating furnace portion 55 has a total length of 2 m and an infrared ray irradiating portion 56 is provided therein so that the infrared ray can be irradiated toward the upper portion of the conveyor belt 52. Further, the infrared ray irradiating portions 56 are provided at regular intervals between the conveyor belts 52. Thereby, infrared rays can be irradiated from the infrared ray irradiating section 56 to the substrate 30 passing on the conveyor belt 52. [

Here, before the solder reflow process, a plurality of substrates 30 are arranged on the support plate 20, and the protective tape 1 is attached to the connection portion 35b to which the electronic component 40 is not connected. At this time, the protective tape 1 is simultaneously attached to the support plate 20 so as to fix the substrate 30 to the support plate 20. The protective tape 1 is attached so that the adhesive layer 11 of the protective tape 1 comes into contact with the substrate 30. Then, a solder cream is applied to the connecting portion 35a of the substrate 30, and the electronic component 40 is placed thereon to prepare solder reflow.

Next, as shown in Fig. 3 (a), the support plate 20 on which the substrates 30 prepared as described above are arranged is placed on the conveyor belt 52. [ As the rollers 53 of the conveyor belt 52 rotate, the conveyor belt 52 moves in the right direction in the figure, and the support plate 20 on which the boards 30 are arranged is also moved. The substrate 30 moved to the right by the conveyor belt 52 reaches the lower position of the heating furnace portion 55 as shown in Fig. 3 (b) 56 are irradiated with infrared light. At this time, the substrate 30 moving below the heating furnace portion 55 moves within the heating furnace portion 55 having a total length of 2 m for 3 minutes. During the movement, the temperature on the substrate 30 gradually rises from the initial position of the heating furnace portion 55, and as soon as the temperature reaches the maximum 270 DEG C and moves to the last position of the heating furnace portion 55 The temperature is gradually lowered. The solder 45 applied to the connecting portion 35a is fused by the heat at this temperature (270 DEG C) and the connecting portions disposed in the connecting portion 35a and the electronic component 40 are bonded by the solder 45, And is electrically connected. 3 (b), the heat applied to the protective tape 1 is transferred to the low temperature portion on the support plate 20 by the metal layer 14. As described above, the temperature of the adhesive layer 11 of the protective tape 1 is set such that at least the adhesive layer 11 starts to deteriorate because the infrared rays are reflected to the outside by the metal layer 14 and heat generated by the infrared rays is radiated Lt; RTI ID = 0.0 > 250 C. < / RTI > In Fig. 3, the solder reflow process according to the present embodiment uses infrared rays as a heat source, but the present invention is not limited thereto. For example, a process of soldering by blowing hot air is also possible. Any means can be used as long as the metal layer 14 of the protective tape 1 can reflect and radiate heat.

As described above, the metal layer 14 of the protective tape 1 protecting at least a part of the substrate 30 can heat and heat the solder reflow process to the outside. As described above, since heat can be prevented from being transmitted to the adhesive layer 11 attached to the substrate 30 by the metal layer 14, the temperature rise of the adhesive layer 11 can be alleviated. This makes it difficult to peel off the substrate 30 after the solder reflow process, and does not cause residue after peeling, thereby preventing deterioration of workability.

In addition, heat during the solder reflow process using infrared rays as a heat source can be reflected and radiated to the outside by the metal layer 14. [ As described above, the protective tape 1 can also be applied to a solder reflow process using an infrared ray as a heat source.

Also, in the solder reflow process, the protective tape 1 according to the present embodiment can be applied even when the temperature of the substrate 30 reaches a maximum of 270 占 폚.

(Example 1 and Comparative Example 1)

Next, the present invention will be described in detail with reference to Example 1 and Comparative Example 1 of the protective tape 1 according to the present embodiment.

The protective tape 1 according to the present embodiment shown in Fig. 1 is used as the first embodiment and is composed of the metal layer 14, the resin layer 13, and the adhesive layer 11. Specifically, the metal layer 14 is formed of an aluminum (Al) foil and has a thickness of 9 mu m. The resin layer 13 is formed of polyethylene terephthalate (PET) and has a thickness of 12 占 퐉. The adhesive layer 11 is formed of acrylic resin and has a thickness of 10 mu m. On the other hand, as a comparative example, the experiment was first conducted by using the resin layer 13 made of polyethylene terephthalate (PET) and the adhesive layer 11 made of acrylic resin without using the metal layer 14, The tape was shrunk and could not be measured. Therefore, as Comparative Example 1, a resin layer 13 made of an epoxy resin and an adhesive layer 11 made of an acrylic resin were used.

Next, as the evaluation method, a peeling test was conducted using the adhesive tape / pressure-sensitive adhesive sheet test method prescribed in JIS Z 0237. Specifically, the protective tape 1 cut into 10 mm width and 100 mm length was attached to a test plate made of stainless steel, and the tensile strength at the time of peeling the protective tape 1 from the test plate in the 180 ° direction was measured using a tensile tester Respectively.

The above peeling test was carried out before and after the solder reflow process shown in Fig. That is, the peeling test was performed after the solder reflow step, the solder reflow step, and the solder reflow step were performed three times. In addition, in each of the test samples of Example 1 and Comparative Example 1, four samples were prepared and the respective tensile strengths were measured. The results are shown in Fig.

According to the test results shown in Fig. 4, the measured value before the solder reflow process was the same as the average value of the tensile force of Example 1 and Comparative Example 1, and there was no difference. Next, when the solder reflow process was performed once and then the test was carried out, the average value of the tensile force of Example 1 was 0.30 N and the average value of the tensile force of Comparative Example 1 was 0.61 N, and there was a difference in tensile force between both. When the solder reflow process was carried out three times and then the test was carried out, the average value of the tensile force in Comparative Example 1 was 1.04 N, while the average value of the tensile force in Example 1 was 0.33 N, . In Example 1, after the solder reflow process was completed once, the tensile force was 1.1 times, and after the solder reflow process was completed 3 times, the solder reflow process tended to be 1.22 times. In Comparative Example 1, It was found that the tensile strength increased 2.25 times after the spinning and 3.85 times after the solder reflow process was finished 3 times. This is because, in the case of the comparative example 1, since the metal layer 14 is not provided, heat is not reflected and the heat is not radiated, thereby increasing the temperature of the adhesive layer 11 on the lower surface. That is, the temperature of the adhesive layer 11 rises to 250 ° C or higher at which the adhesive layer 11 begins to deteriorate due to the heat of the solder reflow process, and the material of the adhesive layer 11 is decomposed to increase the adhesive strength. As a result, the tensile force at the time of detaching from the test plate 60 seems to increase. On the other hand, in the case of Example 1, since the outermost layer is the metal layer 14, the heat is reflected and radiated by the metal layer 14 and heat is not sufficiently transferred to the adhesive layer 11 so that the temperature of the adhesive layer 11 is 250 Lt; 0 > C or more. Therefore, the adhesive force of the adhesive layer 11 remains unchanged for the first time, and the tensile force at the time of detaching the protective tape 1 from the substrate 30 does not change so much. Therefore, when the adhesive tape 11 is detached from the test plate 60, There is no residue. As described above, in Example 1, comprehensive evaluation of 'O' was obtained in all the test samples and 'X' in the comparative test was obtained.

(Comparative Example 2 to Examples 2 to 4)

Next, the present invention will be described in detail with reference to Examples 2 to 4 and Comparative Example 2 of the protective tape 1 according to the present embodiment.

Examples 2 and 3 and Comparative Example 2 all have the same structure as the protective tape 1 according to the present embodiment, but differ only in the thickness of the metal layer 14. Specifically, the thickness of the metal layer 14 of Example 2 is 6 占 퐉, the thickness of the metal layer 14 of Example 3 is 9 占 퐉, and the thickness of the metal layer 14 of Comparative Example 2 is 0.1 占 퐉. Other thicknesses are the same as those in the first embodiment shown in Fig. In Example 4, a metal layer 14 having a thickness of 9 占 퐉 is provided on the adhesive layer 11 and a resin layer 13 made of polyimide (PI) having a thickness of 12 占 퐉 is laminated on the metal layer 14 . In the case of Embodiment 4, the resin layer 13 made of polyimide (PI) prevents the metal layer 14 from being torn when the protective tape 1 is peeled from the substrate. Further, since the resin layer 13 made of polyimide (PI) is located on the outermost layer of the protective tape 1, the metal layer 14 can be protected from acidic chemicals or the like.

After the solder reflow process was performed, the solder reflow process was performed once, and the solder reflow process was performed three times, the peeling test was conducted using each of Examples 2 to 4 and Comparative Example 2 having the above- did. Further, the protective tapes of Examples 2 to 4 and Comparative Example 2 were put into a hot-air dryer having different temperatures for 3 minutes, and then peeling test was carried out. In the hot-air dryer test, the test was conducted at a temperature of 200 ° C for 3 minutes and the test was conducted at a temperature of 270 ° C for 3 minutes. The results are shown in Fig.

According to the test results shown in Fig. 5, the measured values before the solder reflow process were 0.38 N for Example 2, 0.45 N for Example 3, 0.32 N for Example 4, and 0.17 N for Comparative Example 2. Next, when the solder reflow process was completed once and then the test was carried out, Example 2 was 0.43 N, Example 3 was 0.51 N, Example 4 was 0.39 N, and Comparative Example 2 was 0.52 N. In addition, when the solder reflow process was completed three times and then the test was carried out, Example 2 was 0.49 N, Example 3 was 0.55 N, Example 4 was 0.36 N, and Comparative Example 2 was 0.62 N. As described above, there was no difference in the tensile force between the metal layer 14 and the resin layer 13 on the metal layer 14 even when the solder reflow step was performed three times.

In the hot-air dryer test in which the temperature was 200 占 폚 for 3 minutes, Example 2 was 0.44 N, Example 3 was 0.48 N, Example 4 was 0.35 N, and Comparative Example 2 was 0.34 N. However, in the test of a hot-air dryer in which the temperature was 270 ° C for 3 minutes, 0.41N in Example 2, 0.38N in Example 3, and 0.37N in Example 4 were obtained. In a hot air drier heated at 200 ° C for 3 minutes In contrast, in the case of Comparative Example 2, the protective tape was shrunk and measurement was impossible. This is because, in the case of Comparative Example 2, the thickness of the metal layer 14 is thin, so that the metal layer 14 can not withstand the hot air dryer test at a temperature of 270 캜. From these results, even when the thickness of the metal layer 14 is at least 6 占 퐉, even after the solder reflow step is performed three times, even when the metal layer 14 is put in a hot air drier heated at a temperature of 270 占 폚 for 3 minutes, Was not improved much.

According to the test using the embodiment and the comparative example, the heat during the solder reflow process can be reflected and discharged to the outside by the metal layer 14 of the protective tape 1. Since the metal layer 14 can prevent the heat from being transmitted to the adhesive layer 11 attached on the substrate 30, the temperature rise of the adhesive layer 11 can be alleviated. This makes it difficult to peel off the substrate 30 after the solder reflow process, and does not cause residue after peeling, thereby preventing deterioration of workability.

If the thickness of the metal layer 14 is 6 占 퐉 or more, the thickness of the metal layer 14 becomes adequate, and the heat is easily reflected and released easily.

Also, in the solder reflow process, the protective tape 1 according to the present embodiment can be applied even when the temperature of the substrate 30 reaches a maximum of 270 占 폚.

Although the embodiments of the present invention have been described above, the present invention is not limited to the specific embodiments. The functions and effects described in the embodiments of the present invention are listed as the most appropriate actions and effects arising from the present invention, and the actions and effects according to the present invention are not limited to those described in the embodiments of the present invention.

The present invention can be applied to a protective tape for protecting a substrate passing through a solder reflow process.

1: Protective tape
11: Adhesive layer
13: Resin layer
14: metal layer
70: heat

Claims (7)

A protective tape attached to a substrate past a solder reflow process to protect at least a portion of the substrate,
An adhesive layer adhered on the substrate; A metal layer; Resin layer; / RTI >
Wherein at least the metal layer and the resin layer are provided on the adhesive layer,
Wherein the resin layer and the metal layer are provided on the adhesive layer in the order of the resin layer and the metal layer,
The thickness of the adhesive layer is 5 탆 to 20 탆,
The thickness of the metal layer is 6 탆 to 30 탆,
The thickness of the resin layer is preferably from 6 [mu] m to 50 [
Wherein the protective tape comprises a protective tape. The method according to claim 1,
Wherein the adhesive layer is formed of an acrylic resin. 3. The method according to claim 1 or 2,
Wherein the metal layer is formed of aluminum. 3. The method according to claim 1 or 2,
Wherein the temperature of the substrate during the solder reflow process is at most 270 ° C. 3. The method according to claim 1 or 2,
Wherein the solder reflow process uses infrared rays as a heat source. delete delete

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