JP2008251787A - Tool for carrying substrate, component packaging method, and component packaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tool for carrying a substrate that carries the substrate while preventing damage to the thinned substrate having a component packaging region at the edge, and to provide a component packaging method, and a component packaging apparatus. <P>SOLUTION: The tool for carrying a substrate comprises: a first plate member where the substrate is placed while a component packaging region arranged at the edge of the substrate is positioned outside the edge of the plate; a second plate member arranged so that the substrate is held between the second plate member itself and to the first plate member while the component packaging region is positioned outside the edge of the plate; and a fixing section for fixing the first and second plate members and holding the state where the substrate is sandwiched by respective plate members so that the state can be released. The tool for carrying a substrate holds the thinned substrate for conveyance. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate transport jig for transporting a substrate having a component mounting region at its edge, in particular, a thinned substrate, a component mounting method for the component mounting region of the substrate, and a component mounting apparatus.

  Conventionally, a substrate such as a liquid crystal display (LCD) substrate or a plasma display panel (PDP) substrate (hereinafter referred to as a “panel substrate”), a component such as an electronic component, a mechanical component, or an optical component, a flexible printed wiring substrate (FPC substrate). ), Or semiconductor package components such as COG (Chip On Glass) and TCP (Tape Carrier Package), etc. are mounted to manufacture display devices.

  A configuration of a component mounting line for such a panel substrate (for example, a liquid crystal display substrate) 1 is shown in FIG. As shown in FIG. 23, the component mounting line 500 includes an anisotropic conductive film (ACF) sheet 3 with respect to each terminal portion (component mounting region) 2 formed at the edge of two sides of the panel substrate 1. ACF adhering device 510 for performing the ACF adhering step for adhering the component, component temporary crimping device 520 for performing the component temporary crimping step for temporarily crimping the component 4 such as TCP via the ACF sheet in each terminal portion 2, and the long side The long-side main crimping device 530 for performing the long-side main crimping process for heating the component 4 temporarily crimped to the terminal section 2 and mounting it via the ACF sheet 3 while applying pressure, and the short-side terminal section 2 The short side main press-bonding device 540 for performing the short-side side main press-bonding step for performing the main press-bonding on the component 4 that has been temporarily press-bonded to the component 4 and the panel substrate 1 are held from the lower surface side, and each device is held. That can be transported sequentially And a conveying device 550. In the conventional component mounting line 500 having such a configuration, the panel substrate 1 is sequentially transported by the substrate transport device 550, and a predetermined process is performed in each device, whereby components for the respective terminal portions 2 of the panel substrate 1 are provided. 4 is implemented.

Japanese Patent Application Laid-Open No. 2001-228452

  Such a panel substrate 1, particularly a liquid crystal panel substrate, is used as a display device such as a portable information terminal such as a mobile phone or a PDA or a notebook personal computer (notebook PC). In order to meet the demand for weight reduction, the panel substrate is made thinner. In particular, the liquid crystal panel substrate has been reduced in thickness, for example, from about 1 mm to about 0.7 to 0.5 mm, and further research and development for realizing a thickness of 0.5 mm or less. Development is in progress.

  However, such a panel substrate 1 is mainly formed of a glass material, and such a thinning enables the panel substrate 1 to be handled during handling in an apparatus such as the component mounting line 500. There is a problem that the substrate 1 may be damaged.

  In particular, in a device such as the conventional component mounting line 500, it is necessary to securely hold the panel substrate 1 in order to carry and carry out the respective processes. Such holding means include vacuum suction and mechanical clamping. The following means are used. However, if the panel substrate 1 is significantly reduced in thickness, there is a problem that the panel substrate 1 is likely to be damaged by the stress applied to the panel substrate 1 by such holding means.

  Furthermore, in order to increase the productivity in the component mounting line 500, it is desired to increase the conveyance speed of the panel substrate 1. However, the increase in the conveyance speed also increases the stress load on the panel substrate 1, and the possibility of further damage. There is a problem of increasing the nature.

  Accordingly, an object of the present invention is to solve the above-described problem and to carry the substrate while preventing damage to a substrate having a component mounting region at its edge, particularly a thinned substrate. An object of the present invention is to provide a substrate carrying jig, a component mounting method for the component mounting region of the substrate, and a component mounting apparatus.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the first plate member on which the substrate is placed in a state where the component mounting region disposed at the edge of the substrate is positioned outside the plate end portion;
A second plate member disposed so as to sandwich the substrate between the first plate member in a state where the component mounting region is positioned outside the plate end;
A substrate transporting jig comprising: a fixing portion that fixes the first and second plate members to each other and releasably holds a state in which the substrate is sandwiched between the plate members. To do.

According to the second aspect of the present invention, the substrate has a square shape, and has the component mounting region at the edge of two sides adjacent to each other.
The first and second plate members hold the substrate in a state where at least the respective component mounting regions at the edge portions of the two sides are positioned outside the end portions. The board | substrate conveyance jig | tool as described in is provided.

  According to the third aspect of the present invention, the first aspect further includes a protective member formed of a material more flexible than the second plate member and the substrate on the contact surface of the second plate member with the substrate. Or the jig | tool for board | substrate conveyance as described in a 2nd aspect is provided.

  According to the fourth aspect of the present invention, the protective member of the second plate member is a heat insulating member that suppresses heat applied to the component mounting region from being transferred to a region other than the component mounting region. The board | substrate conveyance jig | tool as described in a 3rd aspect which has the function of is provided.

  According to the fifth aspect of the present invention, the second plate member exposes a part of the area other than the component mounting area on the board, and the board surface visually recognizing part that makes the part of the area visible. A jig for transporting a substrate according to any one of the first to fourth aspects is provided.

According to the sixth aspect of the present invention, in the component mounting method for mounting the component in the component mounting region disposed at the edge of the substrate,
The respective plate members and the substrate are integrated with each other in a state where the substrate is sandwiched and held by two plate members so that the component mounting region of the substrate is positioned outside the end portions of the respective plates. To position the component mounting area to the component mounting processing position,
Thereafter, a component mounting method is provided, wherein the component mounting process is performed on the component mounting region positioned outside the plate end portions of the two plate members.

  According to the seventh aspect of the present invention, the board is transported by placing the board having the component mounting area at the edges of two sides adjacent to each other in a square shape, and the components at least at the edges of the two sides. The component mounting method according to the sixth aspect, which is performed in a state where the mounting region is sandwiched and held between the two plate members so that the mounting region is positioned outside the respective plate end portions, is provided.

  According to an eighth aspect of the present invention, in the component mounting method according to the seventh aspect, the substrate is transported by holding the upper surface of the plate member and moving the held plate member. provide.

According to the ninth aspect of the present invention, a mounting head for mounting a component on a component mounting region disposed at an edge of the substrate;
The upper surface of the plate member can be released with respect to the substrate held between two plate members so that the component mounting area of the substrate is positioned outside the respective plate end portions. A substrate transfer device comprising: a plate holding unit to hold; and a holding unit moving device that moves the plate holding unit to move the substrate integrally with the two plate members;
The substrate transported by the substrate transport device is placed in a state sandwiched between the two plate members, and the component mounting area of the placed substrate is positioned with respect to the mounting head. There is provided a component mounting apparatus comprising a board positioning apparatus.

According to the tenth aspect of the present invention, the substrate is sandwiched and held by the two plate members so that the component mounting region disposed at the edge of the substrate is positioned outside the respective plate end portions. A substrate transfer preparation device to be in a state;
A substrate transfer device for integrally transferring the substrate sandwiched between the two plate members by the substrate transfer preparation device together with the two plate members;
A mounting head for mounting components on the component mounting region of the substrate;
The substrate transported by the substrate transport device is placed in a state sandwiched between the two plate members, and the component mounting area of the placed substrate is positioned with respect to the mounting head. There is provided a component mounting apparatus comprising a board positioning apparatus.

  According to the present invention, since the substrate is held in a state where the substrate is sandwiched between the first plate member and the second plate member in the substrate transport jig, the substrate whose thickness is reduced and the strength thereof is lowered is set to each plate. The substrate can be transported in a state where the strength is supplemented and the surface of the substrate is protected as described above. In addition, since the component mounting area formed on the edge of the board is positioned outside the plate end of each plate member, the board is held by the jig, so the component mounting process for the component mounting area is performed. Can be implemented. Therefore, it is possible to reliably protect the substrate so that the substrate is not damaged while the component mounting process can be performed on the thinned substrate.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

(First embodiment)
In describing the component mounting apparatus and the component mounting method according to the first embodiment of the present invention, first, the form of a substrate transporting jig used for transporting the panel substrate 1 handled in these component mounting apparatus and method; An outline of a mounting process performed on the panel substrate 1 using such a substrate transporting jig will be described with reference to FIGS. 1A, 1B, 1C, and 1D.

  First, as shown in FIG. 1A, a panel substrate 1 handled in the first embodiment is a panel substrate typified by a liquid crystal display (LCD) substrate, a plasma display panel (PDP) substrate, and the like. A terminal portion 2 in which a component mounting region R1 on which a component is mounted is arranged at the edge of two adjacent sides. In addition, such a panel substrate 1 generally has a rectangular shape, and each terminal portion 2 includes a long side terminal portion (terminal portion on the back side in FIG. 1A) and a short side terminal portion. (Terminal portion on the near side in the drawing in FIG. 1A). In addition, a plurality of terminal electrodes 2a are formed in each terminal portion 2, and each component is mounted and electrically connected to these terminal electrodes 2a. Further, the area inside the edge of the panel substrate 1 is a display area R2 on which images such as images and character information are displayed. Further, in the vicinity of the corner of the display region R2, for example, a barcode 1a is arranged as an example of an ID for identifying the panel substrate 1. The panel substrate 1 is mainly made of a glass material, and is thinned so that the thickness thereof is, for example, 0.5 mm or less.

  As shown in FIGS. 1A and 1B, a substrate transporting jig 10 for transporting while preventing damage to the panel substrate 1 having such a structure uses two plate members to attach the panel substrate 1 to the panel substrate 1. It has a structure that is sandwiched from above and below. Specifically, the substrate transport jig 10 is a first plate on which the panel substrate 1 is placed in a state where each terminal portion 2 of the panel substrate 1 is positioned outside the plate end portion 11a. In a state where the member 11 and each terminal portion 2 of the panel substrate 1 are positioned outside the plate end portion 12a, the first plate member 11 is disposed so as to sandwich the panel substrate 1 therebetween. An example of a fixing portion that fixes the first plate member 11 and the second plate member 12 to each other in a state where the panel substrate 1 is sandwiched between the two plate member 12 and the first plate member 11 and the second plate member 12. And a lock portion 13. The first plate member 11 and the second plate member 12 are preferably formed of, for example, a material having a thermal expansion coefficient that approximates the thermal expansion coefficient of the material constituting the panel substrate 1. Is formed. In addition, since the panel substrate 1 is placed on the first plate member 11, it is preferable that the placement surface of the first plate member 11 is formed with high accuracy so that the panel substrate 1 can be reliably contacted. .

Using the substrate transport jig 10 having such a configuration, the plate member 11 is sandwiched between the first plate member 11 and the second plate member 12, and each plate member 11 is locked by the lock portion 13. , 12 is fixed, that is, the state in which the panel substrate 1 is held by the substrate transfer jig 10 is shown in FIG. 1B. As shown in FIG. 1B, each terminal portion 2 (that is, component mounting region R1) on the panel substrate 1 is located outside the plate end portions 11a and 12a without being covered with the respective plate members 11 and 12. It is supposed to be in a state. On the other hand, the display region R <b> 2 on the panel substrate 1 is covered with the second plate member 12. In the second plate member 12, an opening is formed at a position corresponding to the barcode 1 a of the panel substrate 1, and this opening serves as a barcode viewing window 14 which is an example of a substrate surface viewing portion. In the state where the panel substrate 1 is held between the plate members 11 and 12, the bar coat 1a can be visually recognized. In the component mounting apparatus and method of the first embodiment, the thinned panel substrate 1 having such a characteristic that it is easily damaged is handled in a protected state using the substrate transporting jig 10, and the substrate is mounted. Component mounting processing is performed on each terminal portion 2 protruding (exposed) from the conveying jig 10.

  Specifically, in the component mounting method of the first embodiment, as shown in FIG. 1B, the panel substrate 1 held by the substrate transport jig 10 is integrated with the substrate transport jig 10. In the ACF attaching process, the ACF sheet 3 is attached to the terminal electrode 2a of each terminal portion 2 (see FIG. 1C), and then the ACF sheet 3 is attached in the component temporary pressing process and the main pressing process. For example, TCP4 is mounted as a component, that is, an outer lead bonding process is performed.

  Next, FIG. 2 is a schematic perspective view showing a configuration of a component mounting line 100 which is an example of a component mounting apparatus that performs such an outer lead bonding process.

  As shown in FIG. 2, the component mounting line 100 has an ACF adhering device 20 that performs an ACF adhering process on the panel substrate 1 held by the substrate carrying jig 10, and an ACF sheet 3. The component temporary crimping device 30 for performing the component temporary crimping process of the component such as TCP4 on the panel substrate 1 in a state of being attached and the TCP4 temporarily crimped to the terminal portion 2 on the long side of the panel substrate 1 The long side main crimping apparatus 40 for performing the long side main crimping process and the short side main crimping process for performing the final crimping and mounting of the TCP 4 temporarily crimped to the terminal portion 2 on the short side of the panel substrate 1 are performed. A short-side main pressure bonding device 50 and a substrate transfer device 60 for transferring the panel substrate 1 to each device are provided. The long side main crimping device 40 and the short side main crimping device 50 are separate devices. However, if the tact time on the component mounting line is sufficient, the length of the panel substrate can be increased with a single main crimping device. The main crimping step may be performed by switching between the side and the short side.

  The ACF adhering device 20 includes a pressure bonding unit 23 that cuts the tape-like ACF sheet 3 fed from the tape supply unit 21 to the tape collecting unit 22 into a predetermined length and affixes it to the terminal portion 2 of the panel substrate 1, The substrate that is transferred from the transfer device 60 while being held by the substrate transfer jig 10 and that positions the terminal portion 2 of the transferred panel substrate 1 and the crimping unit 23. A panel transfer stage 24, which is an example of a positioning device, is provided. The panel transfer stage 24 has a function of moving the placed panel substrate 1 in the X-axis direction or the Y-axis direction (XY movement function) and a plane including the X-axis direction and the Y-axis direction. And a function (lifting function) for raising and lowering the panel substrate 1 in the Z-axis direction. With such a function, the long side and the short side of the panel substrate 1 are provided. The terminal portion 2 can be aligned with the crimping unit 23. In FIG. 2, the X-axis direction and the Y-axis direction are substantially along the surface of the panel substrate 1, the transport direction of the panel substrate 1 is the X-axis direction, and the direction orthogonal to the X-axis direction is Y. It is an axial direction, and the illustrated vertical direction is the Z-axis direction.

  The component temporary crimping apparatus 30 is configured to connect a TCP supply cassette unit 31 that supplies a plurality of TCPs 4 accommodated in a cassette, and a TCP 4 supplied from the TCP supply cassette unit 31 to each terminal electrode via an ACF sheet 3. The temporary press-bonding head 32 for temporary press-bonding to 2a, the panel substrate 1 held by the substrate transporting jig 10, and the terminal portion 2 of the transferred panel base 1 and the temporary press-bonding head 32 are transferred. And a panel transfer stage 33 for performing positioning. The panel transfer stage 33 has an XY movement function, a θ rotation function, and an elevation function.

  The long-side main crimping device 40 heats the TCP 4 in a state of being temporarily crimped to the long-side terminal portion 2 of the panel substrate 1 via the ACF sheet 3, while heating the TCP 4 while pressing the TCP 4. A thermocompression bonding head 41 which is an example of a mounting head that performs the main pressure bonding, that is, thermocompression bonding (mounting), on the terminal electrode 2a, and a substrate for aligning the thermocompression bonding head 41 and the long side terminal portion 2 of the panel substrate 1. A panel transfer stage 43, which is an example of a positioning device, is provided. The main crimping operation by the thermocompression bonding head 41 is performed in a state where the terminal portion 2 of the panel substrate 1 is supported by the backup tool 42 from the lower surface side.

  The short-side main crimping apparatus 50 heats the TCP 4 in a state of being temporarily crimped to the short-side terminal portion 2 of the panel substrate 1 via the ACF sheet 3 while pressing the TCP 4, thereby A thermocompression bonding head 51 that performs final pressure bonding of the TCP 4 to the terminal electrode 2a, a panel transfer stage 53 that aligns the thermocompression bonding head 51 and the short side terminal portion 2 of the panel substrate 1, and a backup tool 52 are provided. Yes.

  As shown in the schematic side view of FIG. 3, the substrate transfer device 60 is a plate that holds the upper surface of the second plate member 12, which is a plate member on the upper surface side of the substrate transfer jig 10, so that it can be released by the vacuum suction means The holding unit 61, the elevating unit 62 that performs the elevating operation of the plate holding unit 61, and the plate holding unit 61 and the elevating unit 62 are moved along the X-axis direction in the figure to be held by the substrate transfer jig 10. And a moving unit 63 that transfers the panel substrate 1 in a state between the apparatuses. In the substrate transfer device 60 according to the first embodiment, the lifting unit 62 and the moving unit 63 constitute a holding unit moving device. In addition, the substrate transfer device 60 is individually disposed between the respective processes, that is, between the respective devices, and can perform transfer for transferring the jig 10 between the devices independently of each other. ing. In the first embodiment, the case where the plate holding unit 61 holds the plate member by the vacuum suction means will be described as an example, but instead of such a case, as shown in FIG. The plate member may be held by the plate holding portion 61A having a mechanical chuck means.

  In addition, the component mounting line 100 is provided with a control device 19 that performs overall control while associating operation control of each of the devices 20, 30, 40, 50, and 60 with each other's operation. The control device 19 sequentially controls the conveyance of the panel substrate 1 from the upstream device to the downstream device while performing individual operation control in each device, and the components for the plurality of panel substrates 1 are controlled. Mounting operation is performed. The control device 19 may have a control system configuration as one centralized control device. Alternatively, a control method may be employed in which each device is individually provided, and exchange control signals for the panel substrate 1 are exchanged between the devices.

  Next, a component mounting operation in the component mounting line 100 having such a configuration will be described. In addition, each operation | movement demonstrated below is controlled by the control apparatus 19, and is performed. In this description, FIG. 5 shows a schematic side view of the component mounting line 100, and FIG. 6 shows a schematic plan view thereof. FIG. 7 is a flowchart showing the procedure of the outer lead bonding process.

  First, in step S <b> 1 of the flowchart of FIG. 7, the panel substrate 1 held by the substrate transfer jig 10 is carried into the component mounting line 100. In this state, the panel substrate 1 is in a state where the terminal portion 2 is exposed from the respective plate end portions 11a and 12a, as shown in FIG. 1B. The carried-in panel substrate 1 is sucked and held on the upper surface of the second plate member 12 at, for example, four places by the plate holding unit 61 of the substrate transfer device 60, and in the holding state, the moving unit 63 moves in the X-axis direction in the figure. It is transported and placed on the panel transfer stage 24 of the ACF sticking device 20. When the lower surface of the first plate member 11 of the substrate transfer jig 10 is sucked and held by the panel transfer stage 24, the suction holding by the plate holding portion 61 of the substrate transfer device 60 is released.

  Next, the substrate transfer jig 10 held by the panel transfer stage 24 is moved in the XY direction so that the terminal 2 on the long side exposed from the jig 10 and the crimping unit 23 are aligned. After that, the crimping unit 23 is lowered and the ACF sheet 3 is attached to the long side terminal portion 2 (step S2: ACF attaching step). In this positioned state, the long side terminal portion 2 is supported by the backup tool 25 from the lower surface side. Thereafter, θ rotation by the panel transfer stage 24 is performed, and the short side terminal portion 2 exposed from the jig 10 and the crimping unit 23 are aligned, and the crimping unit 23 performs the ACF sheet 3. Is affixed to the terminal portion 2 on the short side. When the ACF attaching process is completed, the plate holding unit 61 of the substrate transfer device 60 holds the upper surface of the second plate member 12 by suction, and the suction holding by the panel transfer stage 24 is released, and the jig 10 transfers the substrate. Passed to device 60. Thereafter, the jig 10 is transported to the component temporary press-bonding device 30 by the substrate transport device 60.

  In the substrate temporary pressure bonding apparatus 30, the jig 10 conveyed by the substrate conveyance apparatus 60 is placed on the panel transfer stage 33 and delivered. On the other hand, in the temporary pressure bonding head 32, TCP 4 is supplied from the TCP supply cassette unit 31, and the TCP 4 is sucked and held by the temporary pressure bonding head 32. Thereafter, alignment of one terminal electrode 2a of the terminal portion 2 on the long side exposed from the jig 10 by the panel transfer stage 33 and the temporary pressure bonding head 32 is performed, and then the temporary pressure bonding head 32 is lowered. As a result, the TCP 4 is temporarily pressure-bonded to the terminal electrode 2 a via the ACF sheet 3. Similar operations are sequentially repeated, and the TCP 4 is temporarily bonded to each terminal electrode 2a (step S3: component temporary pressing process). When the TCP 4 temporary crimping to the long side terminal portion 2 is completed, the panel transfer stage 33 rotates the jig 10 and the short side terminal portion 2 and the temporary crimping head 32 are aligned. In other words, the TCP 4 is temporarily crimped to the terminal electrodes 2a of the terminal portion 2 on the short side. When the component temporary press-bonding process is completed, the plate holding unit 61 of the substrate transfer device 60 holds the upper surface of the second plate member 12 by suction, and the suction holding by the panel transfer stage 33 is released, and the jig 10 transfers the substrate. Passed to device 60. Thereafter, the jig 10 is transported to the long side main press-bonding device 40 by the substrate transport device 60.

  In the long side main crimping device 40, the jig 10 transported by the substrate transport device 60 is placed on the panel transfer stage 43 and delivered. Then, after the long side terminal portion 2 of the panel substrate 1 exposed from the jig by the panel transfer stage 43 is placed on the backup tool 42, the thermocompression bonding head 41 is lowered to temporarily Each TCP 4 in the attached state is heated while being pressed against each terminal electrode 2a through the ACF sheet 3, and the TCP 4 is mounted by thermocompression bonding (step S4: long-side main crimping step). The TCP 4 is pressed by the thermocompression bonding head 41 through a protective tape so that dirt or the like does not adhere to the pressing surface of the thermocompression bonding head 41. In addition, the ACF sheet 3 is thermally cured by applying heat to the ACF sheet 3 from the thermocompression bonding head 41, but the region other than the terminal portion 2 in the panel substrate 1 is formed by the substrate carrying jig 10. Since it is in a covered and protected state, heat radiated from the thermocompression bonding head 41 to a region other than the terminal portion 2 can be shielded, and it is possible to reliably prevent thermal damage from occurring. it can. When the long side main press-bonding step is completed, the plate holding unit 61 of the substrate transport device 60 holds the upper surface of the second plate member 12 by suction, and the suction holding by the panel transfer stage 43 is released. It is delivered to the substrate transfer device 60. Thereafter, the jig 10 is transported to the short-side main crimping device 50 by the substrate transport device 60.

  In the short side main crimping apparatus 50, the main crimping is performed on the short side terminal portion 2 exposed from the jig 10 in the same procedure as the procedure in the long side main crimping apparatus 40, and the TCP 4 Are mounted on each terminal electrode 2a via the ACF sheet 3 (step S5: short-side main press-bonding step). When the short side main press-bonding step is completed, the plate holding unit 61 of the substrate transport device 60 holds the upper surface of the second plate member 12 by suction, and the suction holding by the panel transfer stage 53 is released, and the jig 10 is moved. It is delivered to the substrate transfer device 60. Thereafter, the board substrate 1 held by the jig 10 is unloaded from the component mounting line 100 by the board transfer device 60 (step S6). In the component mounting line 100, the plurality of panel substrates 1 are sequentially conveyed by the substrate conveying device 60 while being held by the jig 10, and a predetermined process is performed in each device, whereby the outer leads A bonding process is performed.

  Thus, the following effects can be acquired by performing an outer lead bonding process in the state which pinched | interposed and hold | maintained the panel board | substrate 1 with the jig | tool 10 for board | substrate conveyance.

  First, the panel substrate 1 can be moved by sucking and holding the first plate member 11 and the second plate member 12 without directly sucking and holding the thinned panel substrate 1. The stress applied to the substrate 1 can be significantly reduced. In other words, the decrease in strength associated with the thinning of the panel substrate 1 can be compensated and protected by the respective plate members 11 and 12, and the damage of the thinned panel substrate 1 during movement and transportation can be prevented. Can do. In particular, in the substrate transfer device 60, since the upper surface of the jig 10 is sucked and held, transfer between each process can be realized, so that the transfer of the panel substrate 1 to the panel transfer stage in each device can be easily controlled. There is also an advantage that the apparatus configuration can be simplified.

  Further, even when the panel substrate 1 is sandwiched between the two plate members 11 and 12 as described above, the respective terminal portions 2 are positioned outside the plate end portions 11 a and 12 a of the plate members 11 and 12. Therefore, a predetermined process, that is, an ACF attaching process, a main crimping process, and the like can be performed on each terminal portion 2 without releasing the holding by the jig 10.

  Furthermore, since the display region R2 of the panel substrate 1 is covered with the second plate member 12, it is possible to reliably prevent foreign matter from attaching to the display region R2, or scratches.

  Further, in the main crimping step, heat for thermosetting the ACF sheet 3 is applied to the terminal portion 2 by the thermocompression bonding heads 41 and 51, but an area other than the terminal portion 2 of the panel substrate 1. Is covered with the plate members 11 and 12, it is possible to reduce the amount of heat applied to other regions and prevent thermal damage from occurring.

  Further, the first plate member 11 and the second plate member 12 constituting the substrate transporting jig 10 are made of, for example, a material (for example, aluminum) having a thermal expansion coefficient approximate to the thermal expansion coefficient of the material constituting the panel substrate 1. Even if heat is applied to the jig 10 or the terminal portion 2 of the panel substrate 1 during thermocompression bonding, the plate members 11 and 12 are applied to the panel substrate 1 even when heat is applied. Stress can be reduced.

  In the above description, the component mounting line 100 includes the ACF adhering device 20, the component temporary crimping device 30, and the main crimping devices 40 and 50. The substrate transport device 60 transports the panel substrate 1 between the devices. However, the first embodiment is not limited to such a configuration, and other configurations can be employed. For example, in the component mounting line 100, a jig holding device (substrate conveyance preparation device) that holds the panel substrate 1 between the substrate conveyance jigs 10 is provided upstream of the ACF adhering device 20 in the conveyance direction. It may be the case. Further, a jig holding release device for taking out the panel substrate 1 held between the substrate carrying jigs 10 from the jig 10 is provided on the downstream side of the short side main crimping apparatus 50 in the carrying direction. It may be the case.

(Second Embodiment)
Next, a schematic perspective view showing a configuration of a component mounting line 200 which is an example of a component mounting apparatus according to the second embodiment of the present invention is shown in FIG. Further, FIG. 9 shows a schematic side view showing the configuration of the board conveying device 260 provided in the component mounting line 200, FIG. 10 shows a schematic side view of the component mounting line 200, and FIG. 11 shows a schematic plan view thereof.

  As shown in FIGS. 8 to 11, in the component mounting line 200, the method for transporting the panel substrate 1 held by the substrate transporting jig 10 has a configuration different from that of the first embodiment. . Note that in the component mounting line 200 of the second embodiment, the same reference numerals are assigned to the devices, members, and the like having the same configurations as those of the component mounting line 100 of the first embodiment, and the description thereof is omitted.

  As shown in FIGS. 8 to 11, the board transfer device 260 included in the component mounting line 200 does not hold the board transfer jig 10 held by sandwiching the panel board 1 from the upper surface side. A plate holding arm 261 supported and held from the lower surface side, an arm elevating part (not shown) for raising and lowering the plate holding arm 261, and a moving part 263 for moving the plate holding arm 261 along the X-axis direction shown in the figure It has. In addition, the board | substrate conveyance apparatus 260 is provided separately between each apparatus, and each board | substrate conveyance apparatus 260 can convey the jig | tool 10 mutually independently.

  Next, a method for transporting the jig 10 between apparatuses by the substrate transport apparatus 260 will be specifically described. For example, a case where the jig 10 placed on the panel transfer stage 24 of the ACF adhering device 20 is conveyed to be transferred to the panel transfer stage 33 of the adjacent component temporary press-bonding device 30 is shown in FIG. 9 and the schematic diagram of FIG.

  First, as shown in FIG. 11, in the substrate transfer device 260 that transfers the jig 10 between the ACF adhering device 20 and the component temporary pressure bonding device 30, the plate holding arm 261 is attached to the ACF by the moving unit 263. It is moved to the jig delivery position in the apparatus 20. At this time, the panel transfer stage 24 is positioned at the retracted position so as not to interfere with the plate holding arm 261. Thereafter, the panel transfer stage 24 with the jig 10 placed thereon is moved in the Y-axis direction in the figure, and placed on the panel transfer stage 24 above the plate holding arm 261 as shown in FIG. The jig 10 in the state is placed. By releasing the suction and holding of the jig 10 by the panel mounting stage 24, the plate holding arm 261 is raised by the arm elevating unit, and the lower surface side of the jig 10 is sucked and held by the plate holding arm 261. The tool 10 is delivered.

  Thereafter, when the plate holding arm 261 holding the jig 10 is raised to a height position where interference with other members is prevented, the plate is moved horizontally in the X-axis direction by the moving unit 263, and the parts are temporarily crimped. The jig 10 is moved to the jig delivery position in the apparatus 30. On the other hand, in the component temporary crimping apparatus 30, the panel transfer stage 33 is moved below the jig delivery position, the plate holding arm 261 is lowered by the arm elevating part, and the jig 10 is moved to the panel transfer stage 33. The jig 10 is transferred to the component temporary press-bonding device 30 by being placed on and held by suction and releasing the suction and holding by the plate holding arm 261. In addition, the conveyance operation | movement between other apparatuses is also performed similarly to the conveyance operation of the jig | tool 10 between the ACF sticking apparatus 20 and the component temporary crimping apparatus 30 by such a board | substrate conveyance apparatus 260. FIG.

  According to the component mounting line 200 of the second embodiment, a transport mode that supports and holds a transport target object that is relatively often employed in the conventional component mounting line from the lower surface thereof is used for board transport. The present invention can be applied to a method for transporting the panel substrate 1 using the tool 10. Therefore, it is possible to realize the conveyance that can prevent the thinned panel substrate from being damaged while using the conventional conveyance form.

  In the above description, the component mounting line 200 has been described with the configuration in which the substrate transfer device 260 is provided between the devices. However, instead of such a case, the plate holding arm is replaced with the component mounting line 200. It is also possible to employ a configuration that circulates throughout. In addition, as such a circulation system, any configuration in which the upper side of the transport path of the panel substrate 1 is used as the reflux transport path or the lower side of the transport path is used as the reflux transport path is adopted. Can do.

(Third embodiment)
Next, FIGS. 12A to 12D are schematic views showing the configuration of the substrate carrying jig 110 according to the third embodiment of the present invention. In the substrate transport jig 110 of the third embodiment, members having the same configuration as those of the substrate transport jig 10 of the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIGS. 12A and 12B, in the substrate carrying jig 110, a protective member made of a flexible resin material or the like is formed on the lower surface side of the second plate 12 (that is, the side in contact with the panel substrate 1). The buffer member 115 as an example has a configuration different from that of the jig 10 of the first embodiment in that the buffer member 115 is disposed. Since the buffer member 115 is provided, the display region R2 of the panel substrate 1 is in direct contact with the plate member 12 even when the panel substrate 1 is held between the plate members 11 and 12. In addition, since the contact is made via the buffer member 115 formed of a relatively flexible material, the display region R2 can be reliably protected without being damaged. Further, since the panel substrate 1 is sandwiched between the plate members 11 and 12 using the elasticity of the buffer member 115, the panel substrate 1 having a certain thickness range can be held by the same jig 110. In addition, the panel substrate 1 can be held more reliably.

  In addition, as shown in FIG. 12E, by forming such a buffer member 115 from a heat insulating material such as resin, the amount of heat applied to the panel substrate 1 in the main crimping process is shielded by the heat insulating function of the buffer member 115. The thermal protection for the panel substrate 1 can be enhanced. From the viewpoint of such a heat insulating function, it is effective to dispose the buffer member 115A in the vicinity of the terminal portion 2 as shown in FIG. 12C. In addition, as shown in FIG. 12D, a sheet-like buffer member 115B can be disposed so as to cover the display region R2 of the panel substrate 1 in a wider range.

(Fourth embodiment)
Next, FIGS. 13A to 13C are schematic views showing the configuration of the substrate carrying jig 120 according to the fourth embodiment of the present invention. In the substrate transport jig 120 of the fourth embodiment, members having the same configurations as those of the substrate transport jigs 10 and 110 of the first embodiment and the third embodiment are denoted by the same reference numerals. The description is omitted.

  As shown in FIGS. 13A and 13B, the substrate transporting jig 120 is a display region that is an example of a substrate surface visually recognizing portion as an opening in the second plate member 112 at a position corresponding to the display region R <b> 2 of the panel substrate 1. Even in the state where the viewing window 126 is formed and the panel substrate 1 is held by the jig 120, the display region R2 can be viewed. By forming the display area viewing window 126 in this way, an inspection process for visually recognizing the display area R2 can be performed even when the panel substrate 1 is held by the jig 120.

  For example, in the mounting process for the panel substrate 1, as shown in the flowchart of FIG. 14, the panel terminal cleaning step S <b> 11 for cleaning each terminal portion 2 of the panel substrate 1 and the panel where the terminal portion 2 has been cleaned. The outer lead bonding step S12 for mounting the TCP 4 on the substrate 1, the PCB mounting step S13 for further mounting the PCB on the panel substrate 1 on which the TCP 4 is mounted, and finally the display area R2 of the panel substrate 1 is turned on. The panel lighting inspection step S14 for performing the inspection is performed. By providing the display area viewing window 126 as in the jig 120 of the fourth embodiment, the panel substrate 1 can be handled while being held by the jig 120 even in the panel lighting inspection step S14. The handleability can be improved while preventing the thinned panel substrate 1 from being damaged. In addition, it may replace with the case where such a display area visual recognition window 126 is formed as an opening part, and may be a case where a transparent member is arrange | positioned so that visual recognition from the outside is possible.

(Fifth embodiment)
Next, FIGS. 15A to 15D are schematic views showing the configuration of the substrate carrying jig 130 according to the fifth embodiment of the present invention. In addition, in the board | substrate conveyance jig | tool 130 of this 5th Embodiment, the same referential mark is attached | subjected to the member which has the same structure as the board | substrate conveyance jig | tool of said each embodiment, and the description is abbreviate | omitted.

  As shown in FIG. 15A, in the substrate transport jig 130, the suction holes for sucking and holding the panel substrate 1 placed on the surface of the first plate member 131 on which the panel substrate 1 is placed. 135 is formed. By forming such a suction hole 135, the panel substrate 1 can be held more reliably. In particular, after the panel substrate 1 placed on the first plate member 131 is securely attracted and held in a positioned state, the panel substrate 1 is sandwiched and held by the second plate member 132, so that the panel substrate 1 It is possible to reliably prevent the displacement of the holding position of the panel substrate 1 during the holding operation. Therefore, panel substrates 1 of various sizes can be reliably held by the same jig 130, and versatility of the jig 130 can be improved.

  Further, as shown in FIG. 15B, a configuration in which a plurality of cooling air passage grooves 136 are formed in the first plate member 131A and the cooling air blowing holes 137 are formed in the grooves 136 may be employed. By forming the cooling air passage groove 136 in this manner, the panel substrate 1 can be reliably cooled when heat is applied during the main press bonding, and the panel substrate 1 is prevented from being thermally damaged. Can be protected. Such a groove 136 may be formed in any direction along the direction orthogonal to the conveyance direction of the jig 130 (see FIG. 15B) or along the conveyance direction (see FIG. 15C). .

  Further, the vacuum pressure for realizing such suction holding and the cooling air for realizing the cooling of the panel substrate 1 are provided with an air supply connecting portion 138 in each device of the component mounting line, and a jig. By connecting the air supply connection portion 138 to the connection portion 139 of 130, it is possible to supply vacuum pressure and cooling air from the outside of the jig 130. In addition, in the component mounting line 100 of FIG. 2, such an air supply connection part 138 is illustrated.

(Sixth embodiment)
Next, FIGS. 16A to 16D are schematic views showing the configuration of the substrate carrying jig 140 according to the sixth embodiment of the present invention.

  As shown in FIGS. 16A to 16D, the substrate carrying jig 140 of the sixth embodiment is a hinge part that rotates in a state where the first plate member 141 and the second plate member 142 are engaged at one end thereof. 149 has an openable / closable structure. By adopting such an openable structure using the hinge portion 149, the operation of holding and releasing the panel substrate 1 can be simplified.

(Seventh embodiment)
Next, FIGS. 17A to 17D are schematic views showing the configuration of the substrate carrying jig 150 according to the seventh embodiment of the present invention.

  As shown in FIGS. 17A to 17D, the substrate transport jig 150 of the seventh embodiment is a jig for holding the panel substrate 101 including the terminal portions 102 on the three sides, and each plate member 151. , 152 can be held with the panel substrate 101 sandwiched in a state where the panel substrate 101 is disposed outside the plate end portions 151a, 152a so that the respective terminal portions 102 are positioned. Yes. Therefore, by using the substrate transport jig 150, it is possible to mount components while preventing damage to the panel substrate 101 in which components are mounted on the terminal portions 102 on the three sides.

(Eighth embodiment)
18A to 18D are schematic views showing the configuration of a substrate carrying jig 160 according to the eighth embodiment of the present invention.

  As shown in FIG. 18B, since the TCP 4 mounted on the terminal portion 2 of the panel substrate 1 is formed of a flexible film-like material, the TCP 4 is temporarily bonded or mounted. , Its end part hangs downward. The substrate transfer jig 160 according to the eighth embodiment prevents the TCP 4 from sagging.

  Specifically, as shown in FIGS. 18A and 18C, the substrate transfer jig 160 is provided on the outer peripheral end of the first plate member 1 with a sag prevention member 165 formed by a linear member (for example, a wire frame). It has. The sagging prevention member 165 is disposed so as to go around the outer periphery of each terminal portion 2 of the panel substrate 1 disposed outside the plate end portion 11 a of the first plate member 11. It has a function of supporting the vicinity of the outer end of the mounted TCP 4 from the lower side.

  By providing such a sag prevention member 165, as shown in FIG. 18C, the TCP 4 can be supported in a substantially horizontal state, and it is possible to prevent the occurrence of a temporary crimping failure due to the sag of the TCP 4 in advance. can do. Furthermore, as shown in FIG. 18D, the main pressure bonding by the thermocompression bonding head 41 or the like can be performed while the TCP 4 is kept in a substantially horizontal state, and reliable and highly accurate mounting can be performed.

  As shown in FIG. 18A, by providing a size adjusting unit 166 for adjusting the support position of the TCP 4 by the sag prevention member 165, it is possible to support various parts such as TCP. For example, as described in the flowchart of FIG. 14, in the panel substrate mounting process, after the outer lead bonding process S <b> 12 is performed, the ACF is applied to each TCP 4 mounted on the terminal portion 2 of the panel substrate 1. A PCB mounting step S13 for mounting the PCB 5 via the sheet 3 is performed. As shown in FIGS. 19A to 19C, the PCB 5 is formed by connecting the ACF sheet 3 so that the electrodes formed at the outer peripheral ends of the respective TCPs 4 mounted on the terminal portions 2 of the panel substrate 1 are connected to each other. Is to be implemented. However, as shown in FIG. 19B, since the TCP 4 is formed of a flexible material, if the PCB 5 is mounted as it is, the TCP 4 and the PCB 5 will hang down. Therefore, by using the sag prevention member 165 including the size adjusting unit 166 and adjusting the PCB 5 to be supported by the sag prevention member 165, the sag is prevented and the TCP 4 and the PCB 5 are supported in a substantially horizontal state. Can do. Here, the sagging prevention member 165 is adjusted and the TCP 4 and the PCB 5 are supported in a substantially horizontal state by one support portion. However, as shown in FIG. 19A, the sagging prevention member 165 is provided with another support portion 165A. Thus, the TCP 4 and the PCB 5 may be supported by separate support portions. By doing in this way, it is possible to prevent the TCP and PCB parts from hanging down more accurately in the PCB mounting process. Note that the PCB mounting process is similar to the outer lead bonding process, and as shown in the flowchart of FIG. The PCB is mounted by sequentially performing the long side main press-bonding step S23 and the short side main press-bonding step S24.

(Ninth embodiment)
Next, as a ninth embodiment of the present invention, a magazine for storing a plurality of the above-mentioned various forms of substrate carrying jigs in a lump and a storing form thereof will be described.

  First, as shown in FIGS. 21A and 21D, the jig 10 that holds the panel substrate 1 in a state before the component mounting line 100 or the like as shown in FIG. 21B is loaded is connected to both ends of the first plate member 11. A plurality of sheets can be stored in the carry-in magazine 170 in a state where the section is supported. Similarly, the jig 10 in which the outer lead bonding process as shown in FIG. 21C is performed and the TCP 4 is mounted is in a state where both ends of the first plate member 11 are supported as shown in FIG. 21E. Thus, a plurality of sheets can be stored in the carry-out magazine 171. Even when the panel substrate 1 is housed in the carry-in magazine 170 and the carry-out magazine 171 as described above, direct contact between the panel substrate 1 and the magazines 170, 171 is prevented and protected by the jig 10. Therefore, it is possible to improve handling in transporting the thinned panel substrate 1. In particular, by using such a magazine for conveyance between the respective processes as shown in the flowchart of FIG. 14, the panel substrate 1 having a reduced thickness can be conveyed more effectively.

  Further, as shown in FIG. 22A, a guard portion 167 is formed by projecting a part of the sag prevention member 165 included in the substrate transfer jig 160 of the eighth embodiment outward from the outer peripheral end position of the TCP 4. Thus, as shown in FIG. 22B, even if each jig 160 is housed in the carry-out magazine 171, it is possible to reliably prevent the TCP 4 from interfering with the inner wall of the magazine 171, and to reduce the thickness of the panel. The substrate 1 can be further reliably protected.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

The schematic exploded view of the jig for substrate conveyance of a 1st embodiment of the present invention. Schematic diagram of substrate transport jig according to the first embodiment (unprocessed state) Schematic diagram of substrate transport jig according to the first embodiment (ACF attached state) Schematic diagram of the substrate transport jig of the first embodiment (TCP mounting state) Schematic configuration diagram of the component mounting line of the first embodiment Schematic configuration diagram of a board transfer device provided in the component mounting line of the first embodiment The schematic block diagram which shows the modification of the board | substrate conveyance apparatus of 1st Embodiment. Schematic side view of the component mounting line in FIG. Schematic plan view of the component mounting line in FIG. Flow chart showing the procedure of the outer lead bonding process The schematic block diagram of the component mounting line of 2nd Embodiment of this invention Schematic configuration diagram of a board transfer device provided in the component mounting line of the second embodiment Schematic side view of the component mounting line in FIG. Schematic plan view of the component mounting line of FIG. The schematic block diagram of the jig | tool for board | substrate conveyance concerning 3rd Embodiment of this invention. Schematic exploded view of the jig of the third embodiment The schematic diagram of the buffer member concerning the modification of 3rd Embodiment The schematic diagram of the buffer member concerning the modification of 3rd Embodiment Schematic sectional view of the jig of the third embodiment The schematic exploded view of the jig | tool for board | substrate conveyance concerning 4th Embodiment of this invention Schematic configuration diagram of the jig of the fourth embodiment Schematic sectional view of the jig of the fourth embodiment Flow chart showing the procedure of panel board mounting process The schematic exploded view of the board | substrate conveyance jig concerning 5th Embodiment of this invention Schematic exploded view of a jig according to a modification of the fifth embodiment Schematic exploded view of a jig according to a modification of the fifth embodiment Schematic sectional view of the jig of the fifth embodiment Schematic configuration diagram of a substrate carrying jig according to a sixth embodiment of the present invention. Schematic exploded view of the jig of the sixth embodiment Schematic sectional view of the jig of the sixth embodiment (open state) Schematic sectional view of the jig of the sixth embodiment (closed state) Schematic configuration diagram of a substrate carrying jig according to a seventh embodiment of the present invention. Schematic exploded view of the jig of the seventh embodiment Schematic plan view of the jig of the seventh embodiment Schematic sectional view of the jig of the seventh embodiment Schematic configuration diagram of a substrate carrying jig according to an eighth embodiment of the present invention. Schematic side view of a jig according to a comparative example of the eighth embodiment Schematic side view of the jig of the eighth embodiment Schematic side view of the jig of the eighth embodiment Schematic configuration diagram of jig according to eighth embodiment (PCB mounting process) Schematic sectional view of a jig according to a comparative example of the eighth embodiment (PCB mounting process) Schematic sectional view of the jig of the eighth embodiment (PCB mounting process) Flow chart showing the procedure of PCB mounting process Schematic external view of a loading magazine according to the ninth embodiment of the present invention Schematic diagram of jig before TCP mounting stored in magazine of ninth embodiment Schematic diagram of the jig after TCP mounting stored in the magazine of the ninth embodiment Schematic diagram of the loading magazine of the ninth embodiment Schematic diagram of the magazine for carrying out of the ninth embodiment Schematic diagram of a jig provided with a guard part according to the ninth embodiment 22A is a schematic diagram showing a state where the jig of FIG. 22A is stored in a magazine. Schematic configuration diagram of a conventional component mounting line

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Panel substrate 1a Bar code 2 Terminal part 2a Terminal electrode 3 ACF sheet 4 TCP
5 PCB
DESCRIPTION OF SYMBOLS 10 Board | substrate conveyance jig | tool 11 1st plate member 11a Plate edge part 12 2nd plate member 12a Plate edge part 13 Locking part 14 Barcode recognition window 19 Control apparatus 20 ACF sticking apparatus 30 Component temporary crimping apparatus 40 Long side main crimping Device 50 Short side main crimping device 60 Substrate conveying device 100 Component mounting line R1 Component mounting region R2 Display region

Claims (10)

A first plate member on which the substrate is placed in a state in which a component mounting region disposed on an edge of the substrate is positioned outside the plate end;
A second plate member disposed so as to sandwich the substrate between the first plate member in a state where the component mounting region is positioned outside the plate end;
A substrate transporting jig, comprising: a fixing portion that fixes the first and second plate members to each other and releasably holds a state in which the substrate is sandwiched between the plate members. The substrate has a square shape, and has the component mounting region at the edges of two sides adjacent to each other,
The said 1st and 2nd plate member hold | maintains on both sides of the said board | substrate in the state which located each said component mounting area | region in the edge part of said 2 sides at the outer side from the edge part. The board | substrate conveyance jig of description.   The substrate transport jig according to claim 1, further comprising a protective member formed of a material more flexible than the second plate member and the substrate on a contact surface of the second plate member with the substrate. .   The said protection member of the said 2nd plate member has a function as a heat insulation member which suppresses that the heat added to the said component mounting area is transmitted to area | regions other than the said component mounting area. Substrate transfer jig.   The said 2nd plate member is provided with the board | substrate surface visual recognition part which exposes a part of area | regions other than the said component mounting area | region in the said board | substrate, and can visually recognize a part of said area | region. The board | substrate conveyance jig | tool as described in one. In a component mounting method for mounting a component in a component mounting area arranged at the edge of the board,
The respective plate members and the substrate are integrated with each other in a state where the substrate is sandwiched and held by two plate members so that the component mounting region of the substrate is positioned outside the end portions of the respective plates. To position the component mounting area to the component mounting processing position,
Thereafter, the component mounting process is performed on the component mounting region located outside the plate end portions of the two plate members.   The substrate is transported by using the substrate having the component mounting regions at the edges of two sides adjacent to each other in a square shape, and the component mounting regions at least at the edges of the two sides from the respective plate end portions. The component mounting method according to claim 6, wherein the component mounting method is performed in a state of being held between the two plate members so as to be positioned outside.   The component mounting method according to claim 7, wherein the transport of the substrate is performed by holding the upper surface of the plate member and moving the held plate member. A mounting head for mounting components in a component mounting area disposed at the edge of the substrate;
The upper surface of the plate member can be released with respect to the substrate held between two plate members so that the component mounting area of the substrate is positioned outside the respective plate end portions. A substrate transfer device comprising: a plate holding unit to hold; and a holding unit moving device that moves the plate holding unit to move the substrate integrally with the two plate members;
The substrate transported by the substrate transport device is placed in a state sandwiched between the two plate members, and the component mounting area of the placed substrate is positioned with respect to the mounting head. A component mounting apparatus, comprising: A board transport preparation device in which the board is sandwiched and held by two plate members so that the component mounting area arranged at the edge of the board is positioned outside the respective plate end parts;
A substrate transfer device for integrally transferring the substrate sandwiched between the two plate members by the substrate transfer preparation device together with the two plate members;
A mounting head for mounting components on the component mounting region of the substrate;
The substrate transported by the substrate transport device is placed in a state sandwiched between the two plate members, and the component mounting area of the placed substrate is positioned with respect to the mounting head. A component mounting apparatus, comprising:

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