KR20230146141A - Carrier tape for loading electron elements - Google Patents
Carrier tape for loading electron elements Download PDFInfo
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- KR20230146141A KR20230146141A KR1020220043895A KR20220043895A KR20230146141A KR 20230146141 A KR20230146141 A KR 20230146141A KR 1020220043895 A KR1020220043895 A KR 1020220043895A KR 20220043895 A KR20220043895 A KR 20220043895A KR 20230146141 A KR20230146141 A KR 20230146141A
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- South Korea
- Prior art keywords
- film
- adhesive layer
- carrier tape
- resistant
- electronic components
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- 239000013464 silicone adhesive Substances 0.000 claims abstract description 35
- 239000010410 layer Substances 0.000 claims abstract description 34
- 239000002131 composite material Substances 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 229920001721 polyimide Polymers 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000004642 Polyimide Substances 0.000 claims abstract description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 6
- 239000011112 polyethylene naphthalate Substances 0.000 claims abstract description 4
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 239000004744 fabric Substances 0.000 abstract description 12
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 7
- 230000003287 optical effect Effects 0.000 abstract description 5
- 230000003670 easy-to-clean Effects 0.000 abstract description 4
- 229920001123 polycyclohexylenedimethylene terephthalate Polymers 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 125000001153 fluoro group Chemical group F* 0.000 abstract 1
- 239000011247 coating layer Substances 0.000 description 5
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
본 발명은 전자부품(Electron elements) 실장용 캐리어 테이프에 관한 것으로서, 보다 구체적으로는 반투명하여 광학센서를 사용하는 공정에 적용이 가능하고, 고온에서도 점착성, 박리성 및 형태안정성이 우수하고, 표면이 편평하고, 점착제의 잔사가 없고, 표면 오염시 세척이 용이한 전자부품 실장용 캐리어 테이프에 관한 것이다.The present invention relates to a carrier tape for mounting electronic components. More specifically, it is translucent and can be applied to processes using optical sensors. It has excellent adhesion, peelability and shape stability even at high temperatures, and has a smooth surface. This relates to a carrier tape for mounting electronic components that is flat, has no adhesive residue, and is easy to clean when surface is contaminated.
전자부품 실장용 캐리어 테이프는 가요성 인쇄판 (Flexible Printed Circuits : 이하 "FPC" 라고 한다)상에 다이오드 등의 반도체 소자를 실장하는 SMT(Surface Mounting Technology)공정이나 FPC상에 실장된 반도체 소자를 납으로 용접하는 솔더링(Soldering)공정, 실리콘 시트에 점착되어 있는 마이크로 LED를 캐리어 테이프의 복합 실리콘 점착층으로 이송한 후 상기 마이크로 LED를 디스플레이 기재 상에 납으로 용접하는 솔더링(Solderling)공정 등에서 상기 FPC나 마이크로 LED 등의 전자부품을 임시로 점착하여 이송시키는 용도로 캐리어 플레이트(B) 상에 설치, 사용된다.Carrier tape for mounting electronic components is used in the SMT (Surface Mounting Technology) process of mounting semiconductor devices such as diodes on flexible printed circuits (hereinafter referred to as "FPC"), or by using lead to semiconductor devices mounted on an FPC. The FPC or micro It is installed and used on the carrier plate (B) to temporarily attach and transport electronic components such as LEDs.
따라서, 전자부품 실장용 캐리어 테이프는 FPC나 마이크로 LED 등의 전자부품을 전면을 반복적으로 부착, 고정할 수 있어야 함과 동시에 임시고정된 전자부품을 용이하게 탈착할 수 있어야 한다.Therefore, the carrier tape for mounting electronic components must be able to repeatedly attach and fix electronic components such as FPC or micro LED on the front surface, and at the same time, it must be able to easily detach temporarily fixed electronic components.
지금까지는 전자부품 실장용 캐리어 테이프로 폴리이미드 테이프를 주고 사용하였으나, 이 경우에는 반복사용이 불가능하여 매번 작업시 마다 캐리어 플레이트 상에 폴리이미드 테이프를 부착 및 제거해야 하므로 공정이 복잡해지고 제조비용도 상승하는 문제점이 있었다.Until now, polyimide tape has been used as a carrier tape for mounting electronic components, but in this case, repeated use is not possible and the polyimide tape must be attached and removed from the carrier plate for each operation, making the process complicated and increasing manufacturing costs. There was a problem.
또한, 폴리이미드 테이프를 사용하는 경우 점착제의 잔사로 인해 전자부품이 오염되고, 전자부품 전면을 편평하게 고정시키지 못해 인쇄 정밀도가 떨어지는 문제도 발생하였다.In addition, when polyimide tape was used, adhesive residue contaminated electronic components, and the front of the electronic component could not be fixed flat, causing problems with poor printing precision.
한편, 상기와 같은 문제점들을 해결하기 위하여 캐리어 플레이트 상에 실리콘 수지 등의 점착성 수지를 도포하여 사용하는 방법도 제안된 바 있으나, 상기 방법은 치수안정성이 낮아 전자부품 부착시 접힘 및 굴곡이 발생하고, 점착성 수지의 도포 두께 편차로 인해 전자부품의 고정성이 저하되고, 내열성이 낮아 공정중 도포층이 박리되거나 도포층에 주름이 발생되는 등의 문제점이 있었다.Meanwhile, in order to solve the above problems, a method of applying an adhesive resin such as silicone resin has been proposed on the carrier plate. However, this method has low dimensional stability and causes folding and bending when attaching electronic components. Due to variations in the application thickness of the adhesive resin, the fixation of electronic components was reduced, and due to low heat resistance, there were problems such as peeling of the coating layer or wrinkles in the coating layer during the process.
또 다른 종래의 전자부품 실장용 캐리어 테이프로서는 폴리에스테르 직물상에 망사를 라미네이팅 한 후, 그 위에 점착제를 도포하여 제조한 캐리어 테이프도 제안된 바 있으나, 상기의 경우에는 치수안정성이 낮고, 두께가 불균일한 문제점 등이 있었다.As another conventional carrier tape for mounting electronic components, a carrier tape manufactured by laminating mesh on a polyester fabric and then applying an adhesive thereon has been proposed. However, in this case, dimensional stability is low and the thickness is uneven. There was one problem.
또 다른 종래기술로서, 대한민국 등록특허 제10-0690357호에서는 불소계 수지가 함침된 유리섬유 직물, 탄소섬유 직물 및 방향족 폴리아미드 섬유 직물중에서 선택된 1종의 직물, 상기 직물의 일면에 코팅되어 있는 복합 실리콘 고무 코팅층 및 상기 직물의 나머지 일면에 코팅되어 있는 내열성 실리콘 점착제 코팅층으로 구성된 FPC 실장용 캐리어 테이프를 게재하고 있으나, 불소수지 함침 직물을 기재(Substrate)로 사용하기 때문에 상기 기재 양면 각각에 코팅되는 코팅층들을 균일한 두께로 코팅할 수 없어서 캐리어 테이프의 표면이 매끄럽지 못하고, 이물질이 많이 발생되고, 인장강도 등의 기계적 물성이 부족하고, 불투명하여 광학센서를 사용하는 공정에는 적용이 불가능한 문제가 있었다.As another prior art, Republic of Korea Patent No. 10-0690357 discloses a fabric selected from glass fiber fabric, carbon fiber fabric, and aromatic polyamide fiber fabric impregnated with fluorine resin, and a composite silicone coated on one side of the fabric. A carrier tape for FPC mounting consisting of a rubber coating layer and a heat-resistant silicone adhesive coating layer coated on the remaining side of the fabric is disclosed. However, since a fluororesin impregnated fabric is used as a substrate, the coating layers coated on each of both sides of the fabric are used. Because it could not be coated to a uniform thickness, the surface of the carrier tape was not smooth, a lot of foreign substances were generated, mechanical properties such as tensile strength were insufficient, and it was opaque, making it impossible to apply to processes using optical sensors.
본 발명의 과제는 고온에서도 점착성, 박리성 및 형태안정성이 우수하고, 표면이 편평하고, 점착제의 잔사가 없고, 표면 오염시 세척이 용이한 전자부품 실장용 캐리어 테이프를 제공하는 것이다.The object of the present invention is to provide a carrier tape for mounting electronic components that has excellent adhesion, peelability, and dimensional stability even at high temperatures, has a flat surface, has no adhesive residue, and is easy to clean when the surface is contaminated.
본 발명의 또 다른 과제는 기재(Substrate)로 종래의 불소수지 함침직물 대신에 고내열성 필름(2)을 사용하기 때문에 상기 기재 양면 각각에 코팅되는 복합 실리콘 점착층(2)과 내열성 실리콘 점착층(3)을 균일한 두께로 형성하여 코팅면을 매끄럽게할 수 있고, 이물질 발생을 최소화할 수 있고, 인장강도 등의 기계적 물성이 우수하고, 캐리어 테이프 자체가 반투명하기 때문에 광학센서를 사용하는 공정에도 적용 가능한 전자부품 실장용 캐리어 테이프를 제공하는 것이다.Another problem of the present invention is that since a high heat-resistant film (2) is used as a substrate instead of a conventional fluororesin impregnated fabric, a composite silicone adhesive layer (2) and a heat-resistant silicone adhesive layer (2) are coated on both sides of the substrate. 3) By forming it to a uniform thickness, the coating surface can be smoothed, the generation of foreign substances can be minimized, mechanical properties such as tensile strength are excellent, and the carrier tape itself is translucent, so it can also be applied to processes using optical sensors. The goal is to provide carrier tapes for mounting electronic components whenever possible.
이와 같은 과제들을 해결하기 위해서, 본 발명에서는 폴리이미드(Polyimide:PI) 필름, 폴리에틸렌나프탈레이트(Polyethylene naphthalate : PEN) 필름, 폴리에틸렌테레프탈레이트 필름 및 폴리싸이클로헥시렌 디메틸렌 테레프탈레이트(Poly-cyclohexylene dimethylene terephthalate : PCT) 필름 중에서 선택된 1종의 고내열성 필름(1) 일면에는 복합실리콘 점착층(2)을 코팅하고, 나머지 일면에는 내열성 실리콘 점착층(3)을 코팅하여 전자부품 실장용 캐리어 테이프를 제조한다.In order to solve these problems, in the present invention, polyimide (PI) film, polyethylene naphthalate (PEN) film, polyethylene terephthalate film, and polycyclohexylene dimethylene terephthalate (Poly-cyclohexylene dimethylene terephthalate) : A carrier tape for electronic component mounting is manufactured by coating one side of a high heat-resistant film (1) selected from PCT) films with a composite silicone adhesive layer (2), and coating the other side with a heat-resistant silicone adhesive layer (3). .
이때, 상기 복합 실리콘 점착층(2)은 1~5gf/25㎜, 5~15gf/25㎜, 15~25gf/25㎜, 25~35gf/25㎜, 35~45gf/25㎜ 및 110~150gf/25㎜ 중에서 선택된 1종의 점착력을 구비하도록 조절해 준다.At this time, the composite silicone adhesive layer (2) is 1~5gf/25mm, 5~15gf/25mm, 15~25gf/25mm, 25~35gf/25mm, 35~45gf/25mm, and 110~150gf/ Adjust to have one type of adhesive strength selected from 25mm.
본 발명은 기재(Substrate)로 종래의 불소수지 함침직물 대신에 고내열성 필름(2)을 사용하기 때문에 상기 기재 양면 각각에 코팅되는 복합 실리콘 점착층(2)과 내열성 실리콘 점착층(3)을 균일한 두께로 형성하여 코팅면을 매끄럽게할 수 있고, 이물질 발생을 최소화할 수 있고, 인장강도 등의 기계적 물성이 우수하고, 캐리어 테이프 자체가 반투명하기 때문에 광학센서를 사용하는 공정에도 적용할 수 있다.Since the present invention uses a highly heat-resistant film (2) as a substrate instead of a conventional fluororesin impregnated fabric, the composite silicone adhesive layer (2) and the heat-resistant silicone adhesive layer (3) coated on both sides of the substrate are uniformly distributed. By forming it to a single thickness, the coating surface can be smoothed, the generation of foreign substances can be minimized, mechanical properties such as tensile strength are excellent, and the carrier tape itself is translucent, so it can also be applied to processes using optical sensors.
본 발명은 고온에서도 점착성, 박리성 및 형태안정성이 우수하고, 표면이 편평하고, 점착제의 잔사가 없고, 표면 오염시 세척이 용이하다.The present invention has excellent adhesion, peelability, and shape stability even at high temperatures, has a flat surface, has no adhesive residue, and is easy to clean when the surface is contaminated.
그로 인해, 본 발명은 가요성 인쇄배선판(FPC)나 마이크로 LED와 같은 전자제품을 반복해서 용이하게 탈부착할 수 있고, 반복사용이 가능하여 사용 수명도 연장된다.Therefore, the present invention can easily attach and detach electronic products such as flexible printed circuit boards (FPC) or micro LEDs repeatedly, and can be used repeatedly, thereby extending the service life.
도 1 및 도 2는 본 발명의 단면 개략도.
도 3은 본 발명의 사용 상태를 나타내는 단면 개략도.1 and 2 are cross-sectional schematic diagrams of the present invention.
Figure 3 is a cross-sectional schematic diagram showing the use state of the present invention.
이하, 첨부한 도면등을 통하여 본 발명을 상세하게 설명한다.Hereinafter, the present invention will be described in detail through the attached drawings.
본 발명은 도 1과 같이 [ⅰ] 폴리이미드(Polyimide:PI) 필름, 폴리에틸렌나프탈레이트(Polyethylene naphthalate : PEN) 필름, 폴리에틸렌테레프탈레이트 필름 및 폴리싸이클로헥시렌 디메틸렌 테레프탈레이트(Poly-cyclohexylene dimethylene terephthalate : PCT) 필름 중에서 선택된 1종의 고내열성 필름(1); [ⅱ] 상기 고내열성 필름(1)의 일면에 코팅되어 있는 복합 실리콘 점착층(2); 및 [ⅲ] 상기 고내열성 필름(1)의 나머지 일면에 코팅되어 있는 내열성 실리콘 점착층(3)을 포함한다.As shown in Figure 1, the present invention [i] polyimide (PI) film, polyethylene naphthalate (PEN) film, polyethylene terephthalate film, and polycyclohexylene dimethylene terephthalate (Poly-cyclohexylene dimethylene terephthalate: One type of high heat resistance film (1) selected from PCT) films; [ii] a composite silicone adhesive layer (2) coated on one side of the high heat resistance film (1); and [iii] a heat-resistant silicone adhesive layer (3) coated on the remaining surface of the high heat-resistant film (1).
상기 복합 실리콘 점착층(2)은 폴리실록산계의 실리콘 폴리머와 점착물질인 폴리디메틸실록산계의 실리콘 폴리머를 포함한다.The composite silicone adhesive layer 2 includes a polysiloxane-based silicone polymer and a polydimethylsiloxane-based silicone polymer as an adhesive material.
상기 복합 실리콘 점착층(2)은 1~5gf/25㎜, 5~15gf/25㎜, 15~25gf/25㎜, 25~35gf/25㎜, 35~45gf/25㎜ 및 110~150gf/25㎜ 중에서 선택된 1종의 점착력을 구비한다.The composite silicone adhesive layer (2) is 1~5gf/25mm, 5~15gf/25mm, 15~25gf/25mm, 25~35gf/25mm, 35~45gf/25mm, and 110~150gf/25mm. It has one type of adhesive strength selected from among.
복합 실리콘 점착층(2)의 점착력 조절은 폴리실록산계의 실리콘 폴리머와 점착물질인 폴리디메틸실록산계의 실리콘 폴리머의 혼합 중량비율로 조절할 수 있다.The adhesion of the composite silicone adhesive layer 2 can be adjusted by the mixing weight ratio of the polysiloxane-based silicone polymer and the polydimethylsiloxane-based silicone polymer, which is an adhesive material.
예를들면, 10gf/25㎜의 점착력을 구현할 때는 폴리실록산계의 실리콘 폴리머와 상기 점착물질은 혼합 중량비율을 100:10으로 조절해 주고, 40gf/25㎜의 점착력을 구현할 때는 폴리실록산계의 실리콘 폴리머와 상기 점착물질은 혼합 중량비율을 100:40으로 조절해 준다.For example, when achieving an adhesive strength of 10gf/25mm, the mixed weight ratio of the polysiloxane-based silicone polymer and the adhesive material is adjusted to 100:10, and when achieving an adhesive strength of 40gf/25mm, the polysiloxane-based silicone polymer and the adhesive material are adjusted to 100:10. The mixing weight ratio of the adhesive material is adjusted to 100:40.
상기 고내열성 필름(1)의 두께는 0.025~0.0125㎜이고, 상기 복합 실리콘 고무 점착층(2)의 두께는 0.010~0.150㎜인 것이 바람직하다.The thickness of the high heat-resistant film 1 is preferably 0.025 to 0.0125 mm, and the thickness of the composite silicone rubber adhesive layer 2 is preferably 0.010 to 0.150 mm.
본 발명은 도 2와 같이 상기 복합 실리콘 점착층(2) 및 내열성 실리콘 점착층(3) 위에 보호용 필름(4,4')이 추가로 더 적층될 수도 있다.In the present invention, as shown in FIG. 2, a protective film (4, 4') may be additionally laminated on the composite silicone adhesive layer (2) and the heat-resistant silicone adhesive layer (3).
상기 보호용 필름(4.4')은 사용전에 점착층(2,3)들을 보호하는 역할을 하며, 사용시에는 상기 점착층(2,3)들로 분리된다.The protective film 4.4' serves to protect the adhesive layers 2 and 3 before use, and is separated into the adhesive layers 2 and 3 during use.
상기 보호용 필름(4,4')들은 폴리에틸렌테레프탈레이트 필름, 폴리프로필렌 필름 및 폴리이미드 필름 중에서 선택된 1종 등이다.The protective films 4 and 4' are selected from polyethylene terephthalate film, polypropylene film and polyimide film.
상기 내열성 실리콘 점착층은 260℃ 이상에서도 점착물성을 그대로 유지한다.The heat-resistant silicone adhesive layer maintains its adhesive properties even at temperatures above 260°C.
상기 내열성 실리콘 점착층(3)의 일면과 맞닿는 고내열성 필름의 일면은 에칭처리, 플라스마 처리 또는 코로나된 것이 바람직하다.It is preferable that one side of the high heat resistance film in contact with one side of the heat resistant silicone adhesive layer 3 is etched, plasma treated, or corona treated.
본 발명은 SMT 공정등에 사용시 도 3에 도시된 바와 같이 내열성 실리콘 점착층(3)은 캐리어 플레이트(B)와 점착되고, 복합 실리콘 점착층(2)에는 FPC(A) 또는 마이크로 LED 등의 전자부품이 점착된다.In the present invention, when used in an SMT process, etc., as shown in FIG. 3, the heat-resistant silicone adhesive layer (3) is adhered to the carrier plate (B), and the composite silicone adhesive layer (2) is attached to electronic components such as FPC (A) or micro LED. This sticks.
1 : 고내열성 필름
2 : 복합 실리콘 점착층
3 : 내열성 실리콘 점착층
4,4' : 보호용 필름
A : 본 발명의 캐리어 테이프
B : 캐리어 플레이트
C : FPC나 마이크로 LED 등의 전자부품1: High heat resistance film
2: Composite silicone adhesive layer
3: Heat-resistant silicone adhesive layer
4,4': protective film
A: Carrier tape of the present invention
B: Carrier plate
C: Electronic components such as FPC or micro LED
Claims (11)
[ⅱ] 상기 고내열성 필름(1)의 일면에 코팅되어 있는 복합 실리콘 점착층(2); 및
[ⅲ] 상기 고내열성 필름(1)의 나머지 일면에 코팅되어 있는 내열성 실리콘 점착층(3)을 포함하는 것을 특징으로 하는 전자부품 실장용 캐리어 테이프.[i] One type selected from polyimide (PI) film, polyethylene naphthalate (PEN) film, polyethylene terephthalate film, and poly-cyclohexylene dimethylene terephthalate (PCT) film of high heat resistance film (1);
[ii] a composite silicone adhesive layer (2) coated on one side of the high heat resistance film (1); and
[iii] A carrier tape for mounting electronic components, comprising a heat-resistant silicone adhesive layer (3) coated on the remaining surface of the high heat-resistant film (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220043895A KR20230146141A (en) | 2022-04-08 | 2022-04-08 | Carrier tape for loading electron elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220043895A KR20230146141A (en) | 2022-04-08 | 2022-04-08 | Carrier tape for loading electron elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230146141A true KR20230146141A (en) | 2023-10-19 |
Family
ID=88507760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020220043895A KR20230146141A (en) | 2022-04-08 | 2022-04-08 | Carrier tape for loading electron elements |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20230146141A (en) |
-
2022
- 2022-04-08 KR KR1020220043895A patent/KR20230146141A/en not_active Application Discontinuation
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