JP5888805B2 - 接着フィルム及びダイシング・ダイボンドフィルム - Google Patents
接着フィルム及びダイシング・ダイボンドフィルム Download PDFInfo
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- JP5888805B2 JP5888805B2 JP2011190865A JP2011190865A JP5888805B2 JP 5888805 B2 JP5888805 B2 JP 5888805B2 JP 2011190865 A JP2011190865 A JP 2011190865A JP 2011190865 A JP2011190865 A JP 2011190865A JP 5888805 B2 JP5888805 B2 JP 5888805B2
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- Prior art keywords
- adhesive
- adhesive film
- film
- resin
- thermosetting
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- 150000002923 oximes Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
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- 239000002904 solvent Substances 0.000 description 1
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- 238000004381 surface treatment Methods 0.000 description 1
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- BRKFQVAOMSWFDU-UHFFFAOYSA-M tetraphenylphosphanium;bromide Chemical compound [Br-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BRKFQVAOMSWFDU-UHFFFAOYSA-M 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
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- 239000002562 thickening agent Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QLAGHGSFXJZWKY-UHFFFAOYSA-N triphenylborane;triphenylphosphane Chemical compound C1=CC=CC=C1B(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QLAGHGSFXJZWKY-UHFFFAOYSA-N 0.000 description 1
- IUURMAINMLIZMX-UHFFFAOYSA-N tris(2-nonylphenyl)phosphane Chemical compound CCCCCCCCCC1=CC=CC=C1P(C=1C(=CC=CC=1)CCCCCCCCC)C1=CC=CC=C1CCCCCCCCC IUURMAINMLIZMX-UHFFFAOYSA-N 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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Description
接着フィルム3を構成する接着剤組成物は、カルボキシル基含有モノマーに由来する構成単位を含む熱可塑性成分と、エポキシ樹脂とを含む。
上記ダイシングフィルムとしては、例えば基材1上に粘着剤層2を積層したものが挙げられる。接着フィルム3は、粘着剤層2上に積層される。また図2に示すように、半導体ウェハ貼り付け部分3a(図1参照)にのみ接着フィルム3’を形成した構成であってもよい。
本実施の形態に係るダイシング・ダイボンドフィルム10、11は、例えばダイシングフィルム及び接着フィルムを別々に作製しておき、最後にこれらを貼り合わせることにより作成することができる。具体的には、以下のような手順に従って作製することができる。
次に、本実施の形態に係るダイシング・ダイボンドフィルム10を用いた半導体装置の製造方法について、以下に説明する。
上記被着体上に半導体素子を3次元実装する場合、半導体素子の回路が形成される面側には、バッファーコート膜が形成されている。当該バッファーコート膜としては、例えば窒化珪素膜やポリイミド樹脂等の耐熱樹脂からなるものが挙げられる。
表1に示したアクリル樹脂の組成で重合を行うことにより、熱可塑性成分として、重量平均分子量500,000程度のカルボキシル基含有モノマーに由来する構成単位を含むアクリル樹脂を得た。このアクリル樹脂100重量部に対して表1に示した割合でエポキシ樹脂A、エポキシ樹脂B、フェノール樹脂、シリカ、及び熱硬化触媒をメチルエチルケトンに溶解して濃度40重量%の接着剤組成物を調製した。
BA:アクリル酸ブチル
EA:アクリル酸エチル
AA:アクリル酸
AN:アクリロニトリル
エポキシ樹脂A:三菱化学株式会社製 JER 827
エポキシ樹脂B:三菱化学株式会社製 JER 1001
フェノール樹脂:明和化成株式会社製 MEHC−7800H
シリカ:アドマテックス株式会社製 SE−2050MC
熱硬化触媒:北興化学株式会社製 TPP−K
熱可塑性成分としてのアクリル樹脂の酸価の測定は、JIS K 0070の中和滴定法に準拠して行った。具体的には、まず、アクリル樹脂1gをメチルエチルケトン100mlと共に容積200mlの三角フラスコに加えた。その後、20分間の超音波溶解を行い、試料溶液をそれぞれ作製した。続いて、上記試料溶液に対し、滴定液として0.025mol/lの水酸化カリウム・エタノール溶液(指示薬:1%フェノールフタレイン溶液)を用いて、酸価の測定を行った。すなわち、各試料溶液にフェノールフタレイン溶液を数滴加え、水浴上で試料が完全に溶解するまで十分に振り混ぜ、さらに、水酸化カリウム・エタノール溶液で滴定を行い、指示薬のうすい紅色が30秒間続いたときを終点とした。
各実施例及び比較例で得られた接着フィルムを50℃で半導体チップ(5×5×0.5mm)にラミネーターで10mm/sec、圧力0.15MPaで貼り付けて積層体とし、この積層体をさらに50℃で半導体チップ(10×10×0.5mm)にラミ速度10mm/sec、圧力0.15MPaで貼り付けた。その後得られたサンプルに120℃で1時間の熱硬化を行い、これをボンドテスター(dagy4000)にてステージ温度175℃、ヘッド高さ100μm、速度0.5mm/secにおけるせん断接着力(MPa)を測定した。
各実施例及び比較例で得られた接着フィルムの熱硬化前の120℃における溶融粘度をレオメーター(HAAKE社製、RS−1)を用いて、パラレルプレート法により測定した。あらかじめ120℃に熱してあるプレートに試料0.1gを仕込み、測定開始から300秒後の値を溶融粘度とした。また、プレート間のギャップは0.1mmとした。この手順を接着フィルムの作製直後(接着フィルム作製から24時間以内)と作製から336時間後のサンプルに対して行い、それぞれの経過時間での粘度を測定した。作製直後の粘度を作製直後粘度A、336時間経過後の粘度を336時間後粘度Bとして、粘度比(粘度B/粘度A)を算出した。
各評価結果を表2に示す。
2 粘着剤層
3、13、21 接着フィルム
3a 接着フィルム
3a 部分
3b 部分
5 半導体チップ
6 被着体
7 ボンディングワイヤー
8 封止樹脂
9 スペーサ
10、11 ダイシング・ダイボンドフィルム
15 半導体チップ
Claims (6)
- カルボキシル基含有モノマーに由来する構成単位を含むアクリル樹脂と、エポキシ樹脂と、フェノール樹脂と、シリカフィラーとを含む接着剤組成物により構成されており、
前記アクリル樹脂の酸価が10〜80mgKOH/gであり、
前記アクリル樹脂100重量部に対し、前記エポキシ樹脂及びフェノール樹脂の混合量が10〜800重量部の範囲内であり、
上記アクリル樹脂におけるカルボキシル基含有モノマーに由来する構成単位の含有率が1.5mol%以上11mol%以下であり、
前記アクリル樹脂は、アクリル酸ブチルとアクリル酸エチルとアクリル酸とアクリロニトリルとの重合体であり、
前記フェノール樹脂は、下記化学式で表されるビフェニル型フェノールノボラック樹脂又はフェノールアラルキル樹脂である接着フィルム。
- 上記アクリル樹脂におけるカルボキシル基含有モノマーに由来する構成単位の含有率が2.5mol%以上9.5mol%以下である請求項1に記載の接着フィルム。
- シリコンウェハと貼り合わせた後に120℃で1時間熱硬化させた後の175℃における該シリコンウェハに対するせん断接着力が0.2MPa以上である請求項1又は2に記載の接着フィルム。
- 熱硬化前において、作製直後の120℃における粘度Aと、23℃で336時間保持した後の120℃における粘度Bとの比(粘度B/粘度A)が、0.8以上3.0以下である請求項1〜3のいずれか1項に記載の接着フィルム。
- 上記接着剤組成物が熱硬化触媒を含む請求項1〜4のいずれか1項に記載の接着フィルム。
- 基材及び該基材上に形成された粘着剤層を有するダイシングフィルムと、
上記粘着剤層上に積層された請求項1〜5のいずれか1項に記載の接着フィルムとを備えるダイシング・ダイボンドフィルム。
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