TW200604279A - Resin composition for radiating material and radiating material - Google Patents
Resin composition for radiating material and radiating materialInfo
- Publication number
- TW200604279A TW200604279A TW094108165A TW94108165A TW200604279A TW 200604279 A TW200604279 A TW 200604279A TW 094108165 A TW094108165 A TW 094108165A TW 94108165 A TW94108165 A TW 94108165A TW 200604279 A TW200604279 A TW 200604279A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- radiating material
- heat dissipating
- dissipating material
- compounding
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 5
- 239000011342 resin composition Substances 0.000 title abstract 3
- 238000013329 compounding Methods 0.000 abstract 1
- 239000011231 conductive filler Substances 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- 229920000058 polyacrylate Polymers 0.000 abstract 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 abstract 1
Classifications
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K5/00—Feeding devices for stock or game ; Feeding wagons; Feeding stacks
- A01K5/02—Automatic devices
- A01K5/0225—Gravity replenishment from a reserve, e.g. a hopper
- A01K5/0233—Gravity replenishment from a reserve, e.g. a hopper dispensing by dosing means actively operated by the animal
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K7/00—Watering equipment for stock or game
- A01K7/02—Automatic devices ; Medication dispensers
- A01K7/022—Pumps actuated by the drinking animal
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Environmental Sciences (AREA)
- Animal Husbandry (AREA)
- Biodiversity & Conservation Biology (AREA)
- Birds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
To provide a resin composition for a heat dissipating material, having excellent curability, adhesion, flexibility, thermal conductivity and durability, and to provide its cured product of the heat dissipating material (for example a heat dissipating sheet). The resin composition for the heat dissipating material is obtained by compounding (A) a (meth)acrylic polymer with (B) a thermally conductive filler, where (A) has a hydrolyzable silyl group and ≤ 10 DEG C glass transition point.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004087038A JP2005272599A (en) | 2004-03-24 | 2004-03-24 | Resin composition for heat dissipating material and heat dissipating material |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200604279A true TW200604279A (en) | 2006-02-01 |
TWI293082B TWI293082B (en) | 2008-02-01 |
Family
ID=35046061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094108165A TW200604279A (en) | 2004-03-24 | 2005-03-17 | Resin composition for radiating material and radiating material |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2005272599A (en) |
KR (1) | KR100715362B1 (en) |
CN (1) | CN100341937C (en) |
TW (1) | TW200604279A (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4853770B2 (en) * | 2006-02-23 | 2012-01-11 | 北川工業株式会社 | Flame retardant composite composition and flame retardant composite material |
JP5098009B2 (en) * | 2006-10-25 | 2012-12-12 | 北川工業株式会社 | Conductive heat conductive material |
JP5096782B2 (en) * | 2007-04-19 | 2012-12-12 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
KR100865771B1 (en) | 2007-12-31 | 2008-10-28 | 주식회사 리뷰텍 | Coating agent composition for heat sink |
JP5218375B2 (en) * | 2009-11-04 | 2013-06-26 | 横浜ゴム株式会社 | Thermally conductive composition |
JP5223149B2 (en) * | 2010-06-28 | 2013-06-26 | 北川工業株式会社 | Thermal conductivity material |
KR101270932B1 (en) | 2010-08-05 | 2013-06-11 | 한화케미칼 주식회사 | Highly Efficient Heat Radiant Paint Using Carbon Materials |
JP6145927B2 (en) | 2012-06-01 | 2017-06-14 | パナソニックIpマネジメント株式会社 | Lighting device and vehicle headlamp |
KR20150130367A (en) * | 2013-03-07 | 2015-11-23 | 스미또모 베이크라이트 가부시키가이샤 | Apparatus, composition for adhesive, and adhesive sheet |
KR101481804B1 (en) * | 2014-06-17 | 2015-01-26 | 부산대학교 산학협력단 | LED streetlamp using high heat-dissipating ceramic composite |
WO2017150748A1 (en) * | 2016-03-02 | 2017-09-08 | 주식회사 대신테크젠 | Composite composition having high thermal conductivity for use in automotive light housing and preparation method therefor |
EP3954719B1 (en) * | 2019-04-11 | 2023-07-26 | Denka Company Limited | Copolymer, dispersant, and resin composition |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8400149D0 (en) * | 1984-01-05 | 1984-02-08 | Bp Chem Int Ltd | Polymer composition |
JP2536092B2 (en) * | 1988-10-05 | 1996-09-18 | 日立電線株式会社 | Flame-retardant wire / cable |
JPH05230179A (en) * | 1992-02-20 | 1993-09-07 | Kansai Paint Co Ltd | Low-temperature curable resin composition |
JP4337991B2 (en) * | 1997-12-22 | 2009-09-30 | 日東電工株式会社 | Thermally conductive pressure-sensitive adhesive sheets and methods of fixing electronic components and heat radiating members using the same |
PL200670B1 (en) | 1998-12-28 | 2009-01-30 | Chugoku Marine Paints | Silylmethacrylate copolymers, methods of obtaining them, antifoulding painting compositions containing such copolymers, antifoulding films formed of such painting compositions, methods of preventing surface fouling using such painting compositions and und |
JP2001302936A (en) * | 2000-02-15 | 2001-10-31 | Sekisui Chem Co Ltd | Heat-conductive resin composition |
JP3608612B2 (en) * | 2001-03-21 | 2005-01-12 | 信越化学工業株式会社 | Electromagnetic wave absorbing heat conducting composition, heat softening electromagnetic wave absorbing heat radiation sheet, and heat radiation construction method |
JP2002363429A (en) * | 2001-06-07 | 2002-12-18 | Three Bond Co Ltd | Heat-conductive composition |
JP2002371192A (en) * | 2001-06-15 | 2002-12-26 | Hitachi Chem Co Ltd | Heat-radiating film and plate |
JP3975329B2 (en) | 2001-12-14 | 2007-09-12 | 信越化学工業株式会社 | MOUNTING CIRCUIT BOARD PROTECTION COATING AGENT, MOUNTING SURFACE PREVENTION METHOD, |
CN100447166C (en) * | 2002-04-25 | 2008-12-31 | 钟渊化学工业株式会社 | Process for producing (meth)acrylic polymer terminated by crosslinkable silyl group |
-
2004
- 2004-03-24 JP JP2004087038A patent/JP2005272599A/en active Pending
-
2005
- 2005-03-02 KR KR1020050017133A patent/KR100715362B1/en not_active IP Right Cessation
- 2005-03-17 TW TW094108165A patent/TW200604279A/en unknown
- 2005-03-22 CN CNB2005100560108A patent/CN100341937C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1673274A (en) | 2005-09-28 |
KR20060043304A (en) | 2006-05-15 |
KR100715362B1 (en) | 2007-05-07 |
CN100341937C (en) | 2007-10-10 |
JP2005272599A (en) | 2005-10-06 |
TWI293082B (en) | 2008-02-01 |
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