WO2008133265A1 - Curable composition - Google Patents

Curable composition Download PDF

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Publication number
WO2008133265A1
WO2008133265A1 PCT/JP2008/057828 JP2008057828W WO2008133265A1 WO 2008133265 A1 WO2008133265 A1 WO 2008133265A1 JP 2008057828 W JP2008057828 W JP 2008057828W WO 2008133265 A1 WO2008133265 A1 WO 2008133265A1
Authority
WO
WIPO (PCT)
Prior art keywords
curable composition
base material
silane coupling
hydrolyzable silyl
hydrolysis rate
Prior art date
Application number
PCT/JP2008/057828
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshihiro Ikari
Toshihiko Okamoto
Original Assignee
Kaneka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corporation filed Critical Kaneka Corporation
Priority to JP2009511881A priority Critical patent/JP5508000B2/en
Publication of WO2008133265A1 publication Critical patent/WO2008133265A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
  • Silicon Polymers (AREA)

Abstract

Disclosed is a two-component or multi-component curable composition characterized by having good workability, particularly long working life without deteriorating good adhesion to general-purpose bases. Specifically disclosed is a curable composition obtained by mixing a base material (I) containing a polyether polymer (A) having a crosslinkable hydrolyzable silyl group with a curing agent (II) containing a silanol condensation catalyst (B) and a silane coupling agent (C). This curable composition is characterized in that the base material (I) contains an equivalent or excessive molar amount of water with respect to the hydrolyzable silyl group, and the hydrolysis rate of the silane coupling agent (C) in the curing agent (II) is lower than the hydrolysis rate of a primary amine compound having a trimethyoxysilyl group.
PCT/JP2008/057828 2007-04-24 2008-04-23 Curable composition WO2008133265A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009511881A JP5508000B2 (en) 2007-04-24 2008-04-23 Curable composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007114801 2007-04-24
JP2007-114801 2007-04-24

Publications (1)

Publication Number Publication Date
WO2008133265A1 true WO2008133265A1 (en) 2008-11-06

Family

ID=39925714

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057828 WO2008133265A1 (en) 2007-04-24 2008-04-23 Curable composition

Country Status (2)

Country Link
JP (1) JP5508000B2 (en)
WO (1) WO2008133265A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010248307A (en) * 2009-04-13 2010-11-04 Aica Kogyo Co Ltd Two-pack curable joint composition
JP2012246347A (en) * 2011-05-25 2012-12-13 Yokohama Rubber Co Ltd:The Curable composition
JP2014005696A (en) * 2012-06-26 2014-01-16 Kaneka Corp Curable composition for concrete reinforcement impregnation
EP2840087A1 (en) 2013-08-23 2015-02-25 Evonik Degussa GmbH Compounds containing semi-organic silicon groups with guanidine groups
JP2015164986A (en) * 2014-03-03 2015-09-17 セメダイン株式会社 sealant composition
JP2015183037A (en) * 2014-03-20 2015-10-22 セメダイン株式会社 sealing method
NL2017639B1 (en) * 2016-10-19 2018-04-26 Strongbond B V Two component adhesive with improved open time
CN110256994A (en) * 2019-07-12 2019-09-20 山西省建筑科学研究院有限公司 Assembled architecture high adhesiveness silane modified polyether seal glue and preparation method thereof
JP2021507023A (en) * 2017-12-14 2021-02-22 ボスティク エス．アー． Adhesive multi-component composition and its use

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07316538A (en) * 1994-05-26 1995-12-05 Sharp Kagaku Kogyo Kk Composition for sealing material
JP2003342547A (en) * 2002-05-24 2003-12-03 Sekisui Chem Co Ltd Room temperature curable adhesive composition
WO2006075482A1 (en) * 2005-01-11 2006-07-20 Kaneka Corporation Curable composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07316538A (en) * 1994-05-26 1995-12-05 Sharp Kagaku Kogyo Kk Composition for sealing material
JP2003342547A (en) * 2002-05-24 2003-12-03 Sekisui Chem Co Ltd Room temperature curable adhesive composition
WO2006075482A1 (en) * 2005-01-11 2006-07-20 Kaneka Corporation Curable composition

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010248307A (en) * 2009-04-13 2010-11-04 Aica Kogyo Co Ltd Two-pack curable joint composition
JP2012246347A (en) * 2011-05-25 2012-12-13 Yokohama Rubber Co Ltd:The Curable composition
JP2014005696A (en) * 2012-06-26 2014-01-16 Kaneka Corp Curable composition for concrete reinforcement impregnation
US9353225B2 (en) 2013-08-23 2016-05-31 Evonik Degussa Gmbh Compounds having guanidine groups and containing semi-organic silicon groups
EP2840087A1 (en) 2013-08-23 2015-02-25 Evonik Degussa GmbH Compounds containing semi-organic silicon groups with guanidine groups
DE102013216787A1 (en) 2013-08-23 2015-02-26 Evonik Degussa Gmbh Guanidinruppen containing semi-organic silicon group-containing compounds
JP2015164986A (en) * 2014-03-03 2015-09-17 セメダイン株式会社 sealant composition
JP2015183037A (en) * 2014-03-20 2015-10-22 セメダイン株式会社 sealing method
NL2017639B1 (en) * 2016-10-19 2018-04-26 Strongbond B V Two component adhesive with improved open time
WO2018074925A1 (en) 2016-10-19 2018-04-26 Strongbond B.V. Two component adhesive with improved open time
JP2021507023A (en) * 2017-12-14 2021-02-22 ボスティク エス．アー． Adhesive multi-component composition and its use
US11708511B2 (en) 2017-12-14 2023-07-25 Bostik Sa Adhesive multicomponent composition and uses thereof
JP7418329B2 (en) 2017-12-14 2024-01-19 ボスティク エス アー Adhesive multicomponent composition and its use
CN110256994A (en) * 2019-07-12 2019-09-20 山西省建筑科学研究院有限公司 Assembled architecture high adhesiveness silane modified polyether seal glue and preparation method thereof
CN110256994B (en) * 2019-07-12 2022-01-04 山西省建筑科学研究院有限公司 High-adhesion silane modified polyether sealant for prefabricated building and preparation method thereof

Also Published As

Publication number Publication date
JPWO2008133265A1 (en) 2010-07-29
JP5508000B2 (en) 2014-05-28

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