TW200512268A - Curable resin composition and ambient temperature curable adhesive - Google Patents
Curable resin composition and ambient temperature curable adhesiveInfo
- Publication number
- TW200512268A TW200512268A TW093121264A TW93121264A TW200512268A TW 200512268 A TW200512268 A TW 200512268A TW 093121264 A TW093121264 A TW 093121264A TW 93121264 A TW93121264 A TW 93121264A TW 200512268 A TW200512268 A TW 200512268A
- Authority
- TW
- Taiwan
- Prior art keywords
- bond
- curable resin
- group
- substituted
- ambient temperature
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4833—Polyethers containing oxyethylene units
- C08G18/4837—Polyethers containing oxyethylene units and other oxyalkylene units
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
- C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
- C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
- C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003277042 | 2003-07-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200512268A true TW200512268A (en) | 2005-04-01 |
Family
ID=34074623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093121264A TW200512268A (en) | 2003-07-18 | 2004-07-16 | Curable resin composition and ambient temperature curable adhesive |
Country Status (6)
Country | Link |
---|---|
US (2) | US7576167B2 (zh) |
EP (1) | EP1652891B1 (zh) |
KR (1) | KR100720816B1 (zh) |
CN (1) | CN100590149C (zh) |
TW (1) | TW200512268A (zh) |
WO (1) | WO2005007751A1 (zh) |
Cited By (5)
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TWI401281B (zh) * | 2005-12-07 | 2013-07-11 | Osaka Gas Co Ltd | 聚矽烷及含有聚矽烷之樹脂組成物 |
TWI454499B (zh) * | 2005-12-28 | 2014-10-01 | Mitsubishi Gas Chemical Co | Epoxy resin hardener and epoxy resin composition |
TWI627306B (zh) * | 2016-09-13 | 2018-06-21 | Rohm And Haas Electronic Materials Llc | 用於選擇性金屬化的屏蔽塗層 |
TWI632252B (zh) * | 2016-09-13 | 2018-08-11 | Rohm And Haas Electronic Materials Llc | 用於選擇性金屬化的屏蔽塗層 |
TWI634233B (zh) * | 2016-09-13 | 2018-09-01 | 羅門哈斯電子材料有限公司 | 用於選擇性金屬化的屏蔽塗層 |
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US8759435B2 (en) * | 2005-04-15 | 2014-06-24 | Kaneka Corporation | Curable composition and cured article excellent in transparency |
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US20090286015A1 (en) * | 2005-07-28 | 2009-11-19 | Akakawa Chemical Industries, Ltd | Curable resin composition, cured product thereof, and various articles derived from those |
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JP3030020B1 (ja) | 1998-12-10 | 2000-04-10 | コニシ株式会社 | ウレタン系樹脂及びその製造方法 |
JP4108863B2 (ja) | 1999-03-31 | 2008-06-25 | 株式会社東芝 | マルチメディア情報通信システム |
EP1298169A4 (en) * | 2000-06-28 | 2006-07-12 | Three Bond Co Ltd | CALCULATING COMPOSITION |
US7135518B2 (en) | 2001-09-27 | 2006-11-14 | Sekisui Chemical Co., Ltd. | Curable compositions, sealing material, and adhesive |
JP4103668B2 (ja) | 2003-04-17 | 2008-06-18 | セイコーエプソン株式会社 | 印刷装置、印刷方法、プログラム及び印刷システム |
-
2004
- 2004-07-16 KR KR1020067001243A patent/KR100720816B1/ko active IP Right Grant
- 2004-07-16 TW TW093121264A patent/TW200512268A/zh unknown
- 2004-07-16 US US10/564,843 patent/US7576167B2/en not_active Expired - Fee Related
- 2004-07-16 WO PCT/JP2004/010549 patent/WO2005007751A1/ja active Application Filing
- 2004-07-16 EP EP04747912A patent/EP1652891B1/en not_active Revoked
- 2004-07-16 CN CN200480020619A patent/CN100590149C/zh active Active
-
2009
- 2009-06-30 US US12/494,540 patent/US8110645B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI401281B (zh) * | 2005-12-07 | 2013-07-11 | Osaka Gas Co Ltd | 聚矽烷及含有聚矽烷之樹脂組成物 |
TWI454499B (zh) * | 2005-12-28 | 2014-10-01 | Mitsubishi Gas Chemical Co | Epoxy resin hardener and epoxy resin composition |
TWI627306B (zh) * | 2016-09-13 | 2018-06-21 | Rohm And Haas Electronic Materials Llc | 用於選擇性金屬化的屏蔽塗層 |
TWI632252B (zh) * | 2016-09-13 | 2018-08-11 | Rohm And Haas Electronic Materials Llc | 用於選擇性金屬化的屏蔽塗層 |
TWI634233B (zh) * | 2016-09-13 | 2018-09-01 | 羅門哈斯電子材料有限公司 | 用於選擇性金屬化的屏蔽塗層 |
Also Published As
Publication number | Publication date |
---|---|
US20090264602A1 (en) | 2009-10-22 |
EP1652891A4 (en) | 2009-01-14 |
CN100590149C (zh) | 2010-02-17 |
WO2005007751A1 (ja) | 2005-01-27 |
EP1652891B1 (en) | 2012-06-13 |
US8110645B2 (en) | 2012-02-07 |
KR20060041248A (ko) | 2006-05-11 |
CN1823139A (zh) | 2006-08-23 |
KR100720816B1 (ko) | 2007-05-21 |
US7576167B2 (en) | 2009-08-18 |
EP1652891A1 (en) | 2006-05-03 |
US20060189736A1 (en) | 2006-08-24 |
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