JP6551294B2 - 硬化性ポリウレタン系樹脂組成物を用いた電装部品 - Google Patents
硬化性ポリウレタン系樹脂組成物を用いた電装部品 Download PDFInfo
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/36—Hydroxylated esters of higher fatty acids
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
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- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
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- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
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- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyurethanes Or Polyureas (AREA)
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- Organic Insulating Materials (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
上記硬化性ポリウレタン系樹脂組成物は、ヒマシ油系ポリオールと、ポリイソシアネートと、エポキシ基含有アクリルポリマーとを含有する、硬化性ポリウレタン系樹脂組成物を用いた電装部品にある。
以下に、硬化性ポリウレタン系樹脂組成物を用いた電装部品の実施形態1を、図面に基づいて説明する。図1に一例を示すように、電装部品1は、例えば、車載用の電子制御ユニット(すなわち、ECU)であり、硬化性ポリウレタン系樹脂組成物は、電装部品1用の封止材2として用いられる。電装部品1は、樹脂製のケース11と、ケース11内に収容される基板4と、基板4に実装される各種電子部品3とを有している。封止材2は、硬化性ポリウレタン系樹脂組成物がケース11内に注入されて硬化した硬化物からなり、電子部品3を含む基板4の全体を被覆している。電子部品3としては、例えば、基板4の表面(すなわち、図中の上面)に複数のセラミックコンデンサ31、32が、裏面(すなわち、図中の下面)にはエンジン制御用のICチップ33が搭載される。
以下のようにして、硬化性ポリウレタン系樹脂組成物を調製し、硬化させて硬化物を作製した。また、得られた硬化物に対し、高温又は高温高湿条件下において熱耐久試験を行って、試験前後の物性の変化を調べた。
まず、ポリウレタン(A)の原料として、ヒマシ油系ポリオール(a1)である市販のヒマシ油ポリオール(a1−1)と、ポリイソシアネート(a2)である市販の変性MDI(a2−1)を用意した。ヒマシ油ポリオール(a1−1)としては、伊藤製油社製の「URIC H1824」(すなわち、官能基数:2.3、水酸基価:66、酸価:4.0以下)を用い、変性MDI(a2−1)としては、住化コベストロウレタン社製の「SBU0632」を用いた。また、エポキシ基含有アクリルポリマー(B)である市販のエポキシ基含有アクリルポリマー(B−1)を用意した。エポキシ基含有アクリルポリマー(B−1)としては、東亜合成社製の「UG4010」(すなわち、平均分子量:2900、エポキシ基含有量:1.4ミリ当量/g、粘度:3700mPa・s/25℃、Tg:−57℃)を用いた。
100質量部のヒマシ油ポリオール(a1−1)に対して、添加されるエポキシ基含有アクリルポリマー(B−1)を30質量部とした以外は、実施例1と同様の方法で硬化性ポリウレタン系樹脂組成物を得た(すなわち、実施例2)。また、エポキシ基含有アクリルポリマー(B)として、市販のエポキシ基含有アクリルポリマー(B−2)80質量部を用い、それ以外は、実施例1と同様の方法で硬化性ポリウレタン系樹脂組成物を得た(すなわち、実施例3)。エポキシ基含有アクリルポリマー(B−2)は、東亜合成社製の「UG4000」(すなわち、平均分子量:3000、エポキシ基含有量:0.7ミリ当量/g、粘度:3000mPa・s/25℃、Tg:−61℃)とした。
100質量部のヒマシ油ポリオール(a1−1)に対して、エポキシ基含有アクリルポリマー(B)に代えて、市販のビスフェノールA型エポキシ樹脂(すなわち、DER331J、ダウ・ケミカル社製)30質量部を用い、それ以外は、実施例1と同様の方法で硬化性ポリウレタン系樹脂組成物を得た(すなわち、比較例1)。また、100質量部のヒマシ油ポリオール(a1−1)に対して当量比の変性MDI(a2−1)のみを配合し、エポキシ基含有アクリルポリマー(B)を含有しない硬化性ポリウレタン系樹脂組成物を得た(すなわち、比較例2)。
11 ケース
2 封止材
3 電子部品
31、32 セラミックコンデンサ
33 ICチップ
4 基板
51〜53 導電層
Claims (5)
- 硬化性ポリウレタン系樹脂組成物の硬化物からなる封止材(2)にて、電子部品(3)が被覆されている、電装部品(1)であって、
上記硬化性ポリウレタン系樹脂組成物は、ヒマシ油系ポリオールと、ポリイソシアネートと、エポキシ基含有アクリルポリマーとを含有する、硬化性ポリウレタン系樹脂組成物を用いた電装部品。 - 上記ヒマシ油系ポリオール100質量部に対する、上記エポキシ基含有アクリルポリマーの含有量が10質量部〜80質量部である、請求項1に記載の硬化性ポリウレタン系樹脂組成物を用いた電装部品。
- 上記エポキシ基含有アクリルポリマーは、平均分子量が10000以下である、請求項1又は2に記載の硬化性ポリウレタン系樹脂組成物を用いた電装部品。
- 上記エポキシ基含有アクリルポリマーは、単位質量当たりのエポキシ基含有量が、0.5ミリ当量/g〜1.7ミリ当量/gである、請求項1〜3のいずれか1項に記載の硬化性ポリウレタン系樹脂組成物を用いた電装部品。
- 上記エポキシ基含有アクリルポリマーは、上記ヒマシ油系ポリオール100質量部当たりのエポキシ基含有量が、5ミリ当量〜136ミリ当量である、請求項4に記載の硬化性ポリウレタン系樹脂組成物を用いた電装部品。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016088314A JP6551294B2 (ja) | 2016-04-26 | 2016-04-26 | 硬化性ポリウレタン系樹脂組成物を用いた電装部品 |
| PCT/JP2017/015505 WO2017188050A1 (ja) | 2016-04-26 | 2017-04-17 | 硬化性ポリウレタン系樹脂組成物及びそれを用いた電装部品 |
| DE112017002179.0T DE112017002179B4 (de) | 2016-04-26 | 2017-04-17 | Elektrische Vorrichtung, welche eine härtbare Harzzusammensetzung vom Polyurethantyp nutzt |
| US16/096,435 US10717867B2 (en) | 2016-04-26 | 2017-04-17 | Curable polyurethane type resin composition and electrical device using the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016088314A JP6551294B2 (ja) | 2016-04-26 | 2016-04-26 | 硬化性ポリウレタン系樹脂組成物を用いた電装部品 |
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| Publication Number | Publication Date |
|---|---|
| JP2017197628A JP2017197628A (ja) | 2017-11-02 |
| JP2017197628A5 JP2017197628A5 (ja) | 2018-08-02 |
| JP6551294B2 true JP6551294B2 (ja) | 2019-07-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2016088314A Expired - Fee Related JP6551294B2 (ja) | 2016-04-26 | 2016-04-26 | 硬化性ポリウレタン系樹脂組成物を用いた電装部品 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10717867B2 (ja) |
| JP (1) | JP6551294B2 (ja) |
| DE (1) | DE112017002179B4 (ja) |
| WO (1) | WO2017188050A1 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6935734B2 (ja) * | 2017-11-28 | 2021-09-15 | 株式会社デンソー | 硬化性樹脂組成物およびこれを用いた電装部品 |
| JP6919528B2 (ja) * | 2017-11-28 | 2021-08-18 | 株式会社デンソー | 硬化性樹脂組成物およびこれを用いた電装部品 |
| US11840598B2 (en) | 2019-08-27 | 2023-12-12 | Mitsubishi Gas Chemical Company, Inc. | Urethane resin |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2791438B2 (ja) * | 1988-09-09 | 1998-08-27 | 関西ペイント株式会社 | 樹脂組成物及びその硬化方法 |
| US5314983A (en) * | 1992-11-09 | 1994-05-24 | Enichem S.P.A. | Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides |
| JP3432566B2 (ja) | 1994-02-10 | 2003-08-04 | 協和醗酵工業株式会社 | エステルの加水分解抑制方法、加水分解抑制剤およびエステル組成物 |
| US5698623A (en) * | 1994-04-28 | 1997-12-16 | Jacobs; Richard L. | Resin precursors having thixotropic properties and fillers stabilized against settling |
| JP2001131472A (ja) * | 1999-11-01 | 2001-05-15 | Kansai Paint Co Ltd | カチオン電着塗料用樹脂組成物 |
| TW200512268A (en) * | 2003-07-18 | 2005-04-01 | Konishi Co Ltd | Curable resin composition and ambient temperature curable adhesive |
| CN101977949A (zh) * | 2008-03-28 | 2011-02-16 | 巴斯夫公司 | 用于塑料扎带的聚合物组合物 |
| DE102009008949A1 (de) | 2009-02-13 | 2010-08-19 | Bayer Materialscience Ag | Wässrige Beschichtungssysteme auf Basis physikalisch trocknender Urethanacrylate |
| CN102300925B (zh) * | 2009-03-23 | 2014-06-18 | 施敏打硬株式会社 | 固化性组合物 |
| DE102010009896A1 (de) | 2010-03-02 | 2011-09-08 | Bayer Materialscience Ag | Wässrige Polyurethandispersionen |
| US20130131222A1 (en) * | 2010-03-12 | 2013-05-23 | Synthezyme Llc | Polyurethane polymers comprising copolyester polyols having repeat units derived from biobased hydroxyfatty acids |
| JP5667791B2 (ja) | 2010-06-15 | 2015-02-12 | 富士フイルム株式会社 | インク及びインクジェット記録方法 |
| US9832902B2 (en) * | 2013-05-31 | 2017-11-28 | Elantas Pdg, Inc. | Formulated resin compositions for flood coating electronic circuit assemblies |
| WO2015013064A1 (en) * | 2013-07-22 | 2015-01-29 | Basf Se | A coating system |
| CN103992728A (zh) * | 2014-04-17 | 2014-08-20 | 京东方科技集团股份有限公司 | 导电材料及配制方法、彩色滤光片及制备方法、显示装置 |
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- 2016-04-26 JP JP2016088314A patent/JP6551294B2/ja not_active Expired - Fee Related
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2017
- 2017-04-17 DE DE112017002179.0T patent/DE112017002179B4/de active Active
- 2017-04-17 US US16/096,435 patent/US10717867B2/en active Active
- 2017-04-17 WO PCT/JP2017/015505 patent/WO2017188050A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017188050A1 (ja) | 2017-11-02 |
| US10717867B2 (en) | 2020-07-21 |
| US20190144668A1 (en) | 2019-05-16 |
| JP2017197628A (ja) | 2017-11-02 |
| DE112017002179T5 (de) | 2019-01-03 |
| DE112017002179B4 (de) | 2022-12-22 |
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