TW200504154A - Cure resin, its manufacture and composition containing the cure resin - Google Patents

Cure resin, its manufacture and composition containing the cure resin

Info

Publication number
TW200504154A
TW200504154A TW093115747A TW93115747A TW200504154A TW 200504154 A TW200504154 A TW 200504154A TW 093115747 A TW093115747 A TW 093115747A TW 93115747 A TW93115747 A TW 93115747A TW 200504154 A TW200504154 A TW 200504154A
Authority
TW
Taiwan
Prior art keywords
cure resin
resin
cure
manufacture
composition containing
Prior art date
Application number
TW093115747A
Other languages
Chinese (zh)
Inventor
Shinichi Sato
Yukihiro Nomura
Jun Inui
Original Assignee
Konishi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konishi Co Ltd filed Critical Konishi Co Ltd
Publication of TW200504154A publication Critical patent/TW200504154A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/2805—Compounds having only one group containing active hydrogen
    • C08G18/288—Compounds containing at least one heteroatom other than oxygen or nitrogen
    • C08G18/289—Compounds containing at least one heteroatom other than oxygen or nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/42—Introducing metal atoms or metal-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon

Abstract

This invention is to provide a cure resin, which is a moisture-cure type cure resin having a silyl group on its end, and such cure resin can provide an excellent bonding property when the resin is used as adhering agent, sealant, paint and the like. The cure resin can be produced by directly bonding a hydrolytic group such as an alkyloxy, acetyloxy, oxime and the like, to silicon atom of silicon containing group, and at least comprising thiourethane bonding in molecule, and the main chain skeleton of the cure resin is a polyoxyalkylene polymer, (meth)acrylic acid ester polymer or hydrocarbon polymer.
TW093115747A 2003-06-03 2004-06-02 Cure resin, its manufacture and composition containing the cure resin TW200504154A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003157812 2003-06-03

Publications (1)

Publication Number Publication Date
TW200504154A true TW200504154A (en) 2005-02-01

Family

ID=33508405

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093115747A TW200504154A (en) 2003-06-03 2004-06-02 Cure resin, its manufacture and composition containing the cure resin

Country Status (3)

Country Link
JP (1) JPWO2004108774A1 (en)
TW (1) TW200504154A (en)
WO (1) WO2004108774A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385211B (en) * 2005-11-21 2013-02-11 Shinetsu Chemical Co Manufacturing method of semiconductor device by noflow
TWI673294B (en) * 2017-07-20 2019-10-01 長春人造樹脂廠股份有限公司 Resin composition, coating composition and article by using the same

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4578166B2 (en) * 2003-07-18 2010-11-10 コニシ株式会社 Curable resin composition and moisture curable adhesive composition containing the same
JP4685470B2 (en) * 2005-01-18 2011-05-18 コニシ株式会社 Method for producing curable resin composition
JP4847704B2 (en) * 2005-01-18 2011-12-28 コニシ株式会社 Curable resin composition
JP2006199725A (en) * 2005-01-18 2006-08-03 Konishi Co Ltd Curable resin composition
JP4847019B2 (en) * 2005-01-18 2011-12-28 コニシ株式会社 Room temperature moisture curable resin composition and room temperature moisture curable adhesive
US8143370B2 (en) * 2009-07-09 2012-03-27 Prc-Desoto International, Inc. One-part moisture curable sealant and method of making the same
JP2011178906A (en) * 2010-03-02 2011-09-15 Konishi Co Ltd Curable resin composition
CN103927939B (en) * 2012-01-25 2017-11-21 迪睿合电子材料有限公司 The manufacture method of image display device
US11760841B2 (en) 2018-12-21 2023-09-19 Dow Silicones Corporation Silicone-polycarbonate copolymer, sealants comprising same, and related methods
CA3122282A1 (en) 2018-12-21 2020-06-25 Dow Silicones Corporation Silicone-organic copolymer, sealants comprising same, and related methods
CN114437314B (en) * 2022-03-10 2024-01-23 韦尔通科技股份有限公司 Polythiol curing agent, single-component epoxy adhesive and preparation method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07108928B2 (en) * 1986-06-26 1995-11-22 鐘淵化学工業株式会社 Curable composition
JPH11322917A (en) * 1998-05-11 1999-11-26 Kazunori Kataoka Polyoxyethylene derivative having organic silylsulfide group on one terminal
JP2001072854A (en) * 1999-09-01 2001-03-21 Asahi Glass Co Ltd Room temperature setting composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385211B (en) * 2005-11-21 2013-02-11 Shinetsu Chemical Co Manufacturing method of semiconductor device by noflow
TWI673294B (en) * 2017-07-20 2019-10-01 長春人造樹脂廠股份有限公司 Resin composition, coating composition and article by using the same

Also Published As

Publication number Publication date
JPWO2004108774A1 (en) 2006-07-20
WO2004108774A1 (en) 2004-12-16

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