EP2757121A3 - Curable composition - Google Patents

Curable composition Download PDF

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Publication number
EP2757121A3
EP2757121A3 EP14001378.0A EP14001378A EP2757121A3 EP 2757121 A3 EP2757121 A3 EP 2757121A3 EP 14001378 A EP14001378 A EP 14001378A EP 2757121 A3 EP2757121 A3 EP 2757121A3
Authority
EP
European Patent Office
Prior art keywords
component
compound
curable composition
group
dimerdiol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14001378.0A
Other languages
German (de)
French (fr)
Other versions
EP2757121A2 (en
Inventor
Kazuhiko Ooga
Ritsuko Azuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of EP2757121A2 publication Critical patent/EP2757121A2/en
Publication of EP2757121A3 publication Critical patent/EP2757121A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C08G18/3203—Polyhydroxy compounds
    • C08G18/3212—Polyhydroxy compounds containing cycloaliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/71—Monoisocyanates or monoisothiocyanates
    • C08G18/718—Monoisocyanates or monoisothiocyanates containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8003—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
    • C08G18/8006—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32
    • C08G18/8009—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
    • C08G18/8012—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with diols
    • C08G18/8019—Masked aromatic polyisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
    • C08G18/8116—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/83—Chemically modified polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09D175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Paints Or Removers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Organic Insulating Materials (AREA)

Abstract

The present invention provides a curable composition comprising:
(component A) a compound having a structural unit derived from a dimerdiol and having, as an end group, a group represented by formula (1):
Figure imga0001
 wherein R1 represents H or CH3 and R2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end of the compound;
(component B) a non-silicon-containing monofunctional (meth)acryloyl group-containing compound;
(component C) a photopolymerization initiator; and
(component D) a silane coupling agent.
EP14001378.0A 2009-12-14 2010-12-06 Curable composition Withdrawn EP2757121A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009283328 2009-12-14
EP20100837530 EP2514781B1 (en) 2009-12-14 2010-12-06 Polymerizable compound and curable composition containing same

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
EP20100837530 Division EP2514781B1 (en) 2009-12-14 2010-12-06 Polymerizable compound and curable composition containing same
EP20100837530 Division-Into EP2514781B1 (en) 2009-12-14 2010-12-06 Polymerizable compound and curable composition containing same

Publications (2)

Publication Number Publication Date
EP2757121A2 EP2757121A2 (en) 2014-07-23
EP2757121A3 true EP2757121A3 (en) 2014-12-03

Family

ID=44167258

Family Applications (3)

Application Number Title Priority Date Filing Date
EP14001378.0A Withdrawn EP2757121A3 (en) 2009-12-14 2010-12-06 Curable composition
EP20100837530 Not-in-force EP2514781B1 (en) 2009-12-14 2010-12-06 Polymerizable compound and curable composition containing same
EP14001379.8A Withdrawn EP2757122A2 (en) 2009-12-14 2010-12-06 Photocurable moisture-proof insulating coating material for mounting circuit boards

Family Applications After (2)

Application Number Title Priority Date Filing Date
EP20100837530 Not-in-force EP2514781B1 (en) 2009-12-14 2010-12-06 Polymerizable compound and curable composition containing same
EP14001379.8A Withdrawn EP2757122A2 (en) 2009-12-14 2010-12-06 Photocurable moisture-proof insulating coating material for mounting circuit boards

Country Status (7)

Country Link
US (2) US20120232183A1 (en)
EP (3) EP2757121A3 (en)
JP (3) JP5769635B2 (en)
KR (2) KR101420202B1 (en)
CN (2) CN102652147B (en)
TW (2) TW201406802A (en)
WO (1) WO2011074503A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101420202B1 (en) * 2009-12-14 2014-07-17 쇼와 덴코 가부시키가이샤 Polymerizable compound and curable composition containing same
TWI510550B (en) * 2012-06-15 2015-12-01 Showa Denko Kk Polymerizable composition, polymer, optical adhesive sheet, image display device, and manufacturing method thereof
JP6072493B2 (en) * 2012-10-10 2017-02-01 株式会社カネカ Active energy ray-curable coating resin composition
JP6061728B2 (en) 2013-02-27 2017-01-18 株式会社オートネットワーク技術研究所 Radical and anion combined photo-curing material
WO2014188850A1 (en) * 2013-05-21 2014-11-27 昭和電工株式会社 Light-shielding moisture-proof insulating coating material, sealing/insulating treatment method using light-shielding moisture-proof insulating coating material, and electronic component which is sealed/insulated using light-shielding moisture-proof insulating coating material
CN105377911B (en) * 2013-07-25 2017-05-24 昭和电工株式会社 Composition, curable composition, production method therefor, and cured product
JP6539160B2 (en) * 2014-09-04 2019-07-03 積水化学工業株式会社 Sealant for liquid crystal display element and vertical conduction material
JP6529156B2 (en) * 2015-02-18 2019-06-12 昭和電工株式会社 Composition, method of producing composition and method of producing unsaturated compound
JP6610077B2 (en) * 2015-08-17 2019-11-27 日立化成株式会社 Optical three-dimensional modeling resin composition and method of manufacturing three-dimensional modeling
CN105860627A (en) * 2016-06-16 2016-08-17 马鞍山钢铁股份有限公司 Ultraviolet (UV) curing silicon steel insulating coating and preparation method thereof
JP6641497B2 (en) 2016-10-14 2020-02-05 旭化成株式会社 Isocyanate composition, method for producing isocyanate polymer, and isocyanate polymer
CN107353849A (en) * 2017-07-10 2017-11-17 苏州润德新材料有限公司 A kind of semiconductor special bonding agent
EP3842414B8 (en) 2018-08-20 2023-05-17 Resonac Corporation Composition, production method for composition, and production method for unsaturated compound
WO2020040050A1 (en) 2018-08-20 2020-02-27 昭和電工株式会社 Composition, production method for composition, and production method for unsaturated compound
US11661474B2 (en) 2018-08-20 2023-05-30 Showa Denko K.K. Composition, production method for composition, and production method for unsaturated compound
CN112469694A (en) 2018-08-20 2021-03-09 昭和电工株式会社 Composition, method for producing composition, and method for producing unsaturated compound
EP3894388A1 (en) * 2018-12-13 2021-10-20 Henkel IP & Holding GmbH (meth)acrylate-functionalized waxes and curable compositions made therewith

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0952167A1 (en) * 1996-06-17 1999-10-27 Kureha Kagaku Kogyo Kabushiki Kaisha Plastic lens material and process for preparing the same
WO2005107626A1 (en) * 2004-04-28 2005-11-17 The Regents Of The University Of Colorado Dimer acid-derived dimethacrylates and use in dental restorative compositions
JP2008291114A (en) * 2007-05-24 2008-12-04 Hitachi Chem Co Ltd Photosetting resin composition, photosetting and moistureproof insulating paint for mounted circuit board, electronic component and method for manufacturing the component

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0195819A (en) * 1987-10-09 1989-04-13 Hitachi Ltd Fully automatic pipe working system
JPH0749457B2 (en) * 1990-07-14 1995-05-31 荒川化学工業株式会社 Method for producing polyurethane acrylate and method for producing active energy ray-curable resin composition
JPH05202146A (en) * 1991-12-27 1993-08-10 I C I Japan Kk Photosetting resin composition
JPH1067835A (en) * 1996-06-17 1998-03-10 Kureha Chem Ind Co Ltd Plastic lens material and its production
JP3792302B2 (en) * 1996-07-22 2006-07-05 東洋モートン株式会社 Ionizing radiation curable adhesive composition
JPH1095640A (en) * 1996-09-19 1998-04-14 Takeda Chem Ind Ltd Photocurable type resin composition for coating optical fiber
JPH1095819A (en) * 1996-09-24 1998-04-14 Tanigawa Kaken:Kk Resin material
JPH10182779A (en) * 1996-12-24 1998-07-07 Dainippon Ink & Chem Inc Ultraviolet light curable type composition
JPH10251369A (en) 1997-03-14 1998-09-22 Ube Ind Ltd Production of polyurethane resin
JPH10273514A (en) 1997-03-31 1998-10-13 Ube Ind Ltd Production of polyurethane resin
JPH11142601A (en) * 1997-11-11 1999-05-28 Kureha Chem Ind Co Ltd Plastic lens and its production
JP2000007909A (en) 1998-06-19 2000-01-11 Sekisui Chem Co Ltd Urethane based aqueous composition
JP2001302946A (en) 2000-04-19 2001-10-31 Hitachi Chem Co Ltd Photocurable, moistureproof insulating coating and process for preparing moisture-resistant, insulated electronic component
US7189781B2 (en) * 2003-03-13 2007-03-13 H.B. Fuller Licensing & Finance Inc. Moisture curable, radiation curable sealant composition
JP5037780B2 (en) * 2003-05-23 2012-10-03 三菱化学株式会社 Active energy ray-curable composition and hard coat film
JP4587865B2 (en) 2004-04-22 2010-11-24 昭和電工株式会社 Photosensitive resin composition, cured product thereof, and method for producing printed wiring board using them
US20070123621A1 (en) * 2005-09-15 2007-05-31 Basf Corporation Coating compositions with silylated diols
JP5224640B2 (en) 2005-10-07 2013-07-03 昭和電工株式会社 Carboxyl group-containing polyurethane and thermosetting polyurethane resin composition
JP5265854B2 (en) * 2005-12-08 2013-08-14 昭和電工株式会社 Thermosetting resin composition, thermoplastic resin solution and film forming material, and cured products thereof
EP1849845A1 (en) * 2006-04-26 2007-10-31 Sika Technology AG Moisture-curable compositions comprising silane functional polymers and aminosilane adducts
JP2007314768A (en) 2006-04-27 2007-12-06 Hitachi Chem Co Ltd Photocurable resin composition and photocurable coating
JP5012235B2 (en) 2007-06-11 2012-08-29 日立化成工業株式会社 Photo-curable moisture-proof insulating coating, electronic component moisture-proof insulated using this photo-curable moisture-proof insulating coating, and manufacturing method thereof
JP2009190333A (en) * 2008-02-15 2009-08-27 Asahi Kasei E-Materials Corp Resin composition for laser carved original printing plate
JP5111158B2 (en) * 2008-02-28 2012-12-26 旭化成イーマテリアルズ株式会社 Polymer suitable for printing master and printing master
KR101420202B1 (en) * 2009-12-14 2014-07-17 쇼와 덴코 가부시키가이샤 Polymerizable compound and curable composition containing same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0952167A1 (en) * 1996-06-17 1999-10-27 Kureha Kagaku Kogyo Kabushiki Kaisha Plastic lens material and process for preparing the same
WO2005107626A1 (en) * 2004-04-28 2005-11-17 The Regents Of The University Of Colorado Dimer acid-derived dimethacrylates and use in dental restorative compositions
JP2008291114A (en) * 2007-05-24 2008-12-04 Hitachi Chem Co Ltd Photosetting resin composition, photosetting and moistureproof insulating paint for mounted circuit board, electronic component and method for manufacturing the component

Also Published As

Publication number Publication date
JP2015096608A (en) 2015-05-21
EP2757122A2 (en) 2014-07-23
EP2514781A4 (en) 2013-11-06
EP2757121A2 (en) 2014-07-23
US20120232183A1 (en) 2012-09-13
TW201406802A (en) 2014-02-16
CN102652147B (en) 2013-11-20
JP5832625B2 (en) 2015-12-16
EP2514781B1 (en) 2015-04-22
KR20130122807A (en) 2013-11-08
EP2514781A1 (en) 2012-10-24
TWI431023B (en) 2014-03-21
KR20120045024A (en) 2012-05-08
CN103396733A (en) 2013-11-20
JP5769635B2 (en) 2015-08-26
US20140309326A1 (en) 2014-10-16
JP2015091975A (en) 2015-05-14
CN102652147A (en) 2012-08-29
KR101420202B1 (en) 2014-07-17
KR101393467B1 (en) 2014-05-13
JPWO2011074503A1 (en) 2013-04-25
WO2011074503A1 (en) 2011-06-23
TW201136959A (en) 2011-11-01

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