WO2009041550A1 - Adhesive set and bonding method using the same - Google Patents

Adhesive set and bonding method using the same Download PDF

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Publication number
WO2009041550A1
WO2009041550A1 PCT/JP2008/067379 JP2008067379W WO2009041550A1 WO 2009041550 A1 WO2009041550 A1 WO 2009041550A1 JP 2008067379 W JP2008067379 W JP 2008067379W WO 2009041550 A1 WO2009041550 A1 WO 2009041550A1
Authority
WO
WIPO (PCT)
Prior art keywords
polymer
liquid
adhesive set
carbon atoms
alkyl group
Prior art date
Application number
PCT/JP2008/067379
Other languages
French (fr)
Japanese (ja)
Inventor
Hiromu Nagae
Mikio Murakami
Original Assignee
Sharp Chemical Ind. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Chemical Ind. Co., Ltd. filed Critical Sharp Chemical Ind. Co., Ltd.
Priority to CN200880109669.7A priority Critical patent/CN101815770B/en
Publication of WO2009041550A1 publication Critical patent/WO2009041550A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)

Abstract

Disclosed is an adhesive set composed of a liquid A containing a first polymer having an alkyldialkoxysilyl group represented by the general formula (I) below at an end of a molecule, and a liquid B containing a second polymer having a trialkoxysilyl group represented by the general formula (II) below at an end of a molecule. This adhesive set is used by mixing the liquid A and the liquid B at such a ratio that the second polymer is not less than 0.07 part by weight relative to 100 parts by weight of the first polymer. -SiR2(OR1)2 (I) (In the formula (I), R1 represents an alkyl group having 1-6 carbon atoms, and R2 represents an optionally substituted alkyl group having 1-20 carbon atoms.) -Si(OR3)3 (II) (In the formula (II), R3 represents an alkyl group having 1-6 carbon atoms.)
PCT/JP2008/067379 2007-09-28 2008-09-26 Adhesive set and bonding method using the same WO2009041550A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200880109669.7A CN101815770B (en) 2007-09-28 2008-09-26 Adhesive set and bonding method using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007254614A JP5178116B2 (en) 2007-09-28 2007-09-28 Adhesive set and bonding method using the same
JP2007-254614 2007-09-28

Publications (1)

Publication Number Publication Date
WO2009041550A1 true WO2009041550A1 (en) 2009-04-02

Family

ID=40511430

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067379 WO2009041550A1 (en) 2007-09-28 2008-09-26 Adhesive set and bonding method using the same

Country Status (3)

Country Link
JP (1) JP5178116B2 (en)
CN (1) CN101815770B (en)
WO (1) WO2009041550A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222485A (en) * 2009-03-24 2010-10-07 Sharp Kagaku Kogyo Kk Adhesion method
JP2020083974A (en) * 2018-11-21 2020-06-04 積水フーラー株式会社 Curable composition
JP2022516216A (en) * 2018-10-31 2022-02-25 ダウ シリコーンズ コーポレーション glue
WO2023127443A1 (en) * 2021-12-27 2023-07-06 株式会社カネカ Curable composition and cured product thereof

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5599670B2 (en) * 2010-07-27 2014-10-01 シャープ化学工業株式会社 Masking material and masking method using the same
CN102140268B (en) * 2011-05-17 2013-04-10 欧美龙（南通）重防腐涂料有限公司 Ship ballast tank anticorrosion solventless epoxy coating modifying additive and modified epoxy coating
CN104409549B (en) * 2014-11-18 2017-05-10 苏州福斯特光伏材料有限公司 High-efficiency black solar cell backplane and preparation method thereof
CN109796927B (en) * 2019-01-25 2021-10-19 杭州福斯特应用材料股份有限公司 Quick-curing silicone structural adhesive and application thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10245484A (en) * 1997-03-03 1998-09-14 Konishi Kk Silicone-based resin composition
JPH10251552A (en) * 1997-03-07 1998-09-22 Konishi Kk Silicone resin composition
WO1998047939A1 (en) * 1997-04-21 1998-10-29 Asahi Glass Company Ltd. Room temperature setting compositions
JP2001200230A (en) * 2000-01-21 2001-07-24 Konishi Co Ltd Silicone-based contact adhesive
JP2002069289A (en) * 2000-08-31 2002-03-08 Konishi Co Ltd Curable resin composition
WO2007094275A1 (en) * 2006-02-16 2007-08-23 Kaneka Corporation Curable composition

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1233771C (en) * 2003-04-29 2005-12-28 中国印钞造币总公司 Adhesive compound

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10245484A (en) * 1997-03-03 1998-09-14 Konishi Kk Silicone-based resin composition
JPH10251552A (en) * 1997-03-07 1998-09-22 Konishi Kk Silicone resin composition
WO1998047939A1 (en) * 1997-04-21 1998-10-29 Asahi Glass Company Ltd. Room temperature setting compositions
JP2001200230A (en) * 2000-01-21 2001-07-24 Konishi Co Ltd Silicone-based contact adhesive
JP2002069289A (en) * 2000-08-31 2002-03-08 Konishi Co Ltd Curable resin composition
WO2007094275A1 (en) * 2006-02-16 2007-08-23 Kaneka Corporation Curable composition

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222485A (en) * 2009-03-24 2010-10-07 Sharp Kagaku Kogyo Kk Adhesion method
JP2022516216A (en) * 2018-10-31 2022-02-25 ダウ シリコーンズ コーポレーション glue
JP7446291B2 (en) 2018-10-31 2024-03-08 ダウ シリコーンズ コーポレーション glue
JP2020083974A (en) * 2018-11-21 2020-06-04 積水フーラー株式会社 Curable composition
JP7325077B2 (en) 2018-11-21 2023-08-14 積水フーラー株式会社 Curable composition
WO2023127443A1 (en) * 2021-12-27 2023-07-06 株式会社カネカ Curable composition and cured product thereof

Also Published As

Publication number Publication date
JP2009084386A (en) 2009-04-23
CN101815770B (en) 2013-03-27
JP5178116B2 (en) 2013-04-10
CN101815770A (en) 2010-08-25

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