WO2008123053A1 - Positive photosensitive resin composition - Google Patents

Positive photosensitive resin composition Download PDF

Info

Publication number
WO2008123053A1
WO2008123053A1 PCT/JP2008/054932 JP2008054932W WO2008123053A1 WO 2008123053 A1 WO2008123053 A1 WO 2008123053A1 JP 2008054932 W JP2008054932 W JP 2008054932W WO 2008123053 A1 WO2008123053 A1 WO 2008123053A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
positive photosensitive
carbon atoms
octa
Prior art date
Application number
PCT/JP2008/054932
Other languages
French (fr)
Japanese (ja)
Inventor
Kazuto Miyoshi
Daichi Miyazaki
Masao Tomikawa
Original Assignee
Toray Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries, Inc. filed Critical Toray Industries, Inc.
Priority to JP2008520660A priority Critical patent/JP5212103B2/en
Publication of WO2008123053A1 publication Critical patent/WO2008123053A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Electroluminescent Light Sources (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Disclosed is a positive photosensitive resin composition which is excellent in chemical resistance after heat treatment and enables to form a pattern having a small taper angle. Specifically disclosed is a positive photosensitive resin composition containing (a) a polyamide acid and/or a polyamide acid ester having a structural unit represented by the general formula (1) below, (b) a quinonediazide compound and (c) a polyfunctional acrylate compound. (In the formula (1), R1 represents a tri- to octa-valent organic group having 2 or more carbon atoms; R2 represents a di- to octa-valent organic group having 2 or more carbon atoms; R3 and R4 may be the same or different and represent a hydrogen atom or a hydrocarbon group having 1-20 carbon atoms; p and q represent an integer of 0-4; r represents 1 or 2; and s represents an integer of 0-2. In this connection, p and q satisfy p + q > 0.)
PCT/JP2008/054932 2007-03-30 2008-03-18 Positive photosensitive resin composition WO2008123053A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008520660A JP5212103B2 (en) 2007-03-30 2008-03-18 Positive photosensitive resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-091097 2007-03-30
JP2007091097 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008123053A1 true WO2008123053A1 (en) 2008-10-16

Family

ID=39830554

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054932 WO2008123053A1 (en) 2007-03-30 2008-03-18 Positive photosensitive resin composition

Country Status (3)

Country Link
JP (1) JP5212103B2 (en)
TW (1) TWI416260B (en)
WO (1) WO2008123053A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009063980A (en) * 2006-11-15 2009-03-26 Asahi Kasei Corp Photosensitive resin composition and flexible printed wiring board using the same
JP2009062398A (en) * 2007-09-04 2009-03-26 Toray Ind Inc Diamine compound, heat-resistant resin precursor using it, and positive photosensitive resin composition
JP2010053323A (en) * 2008-08-29 2010-03-11 Chisso Corp Thermosetting composition, method for producing the same, and use of the same
JP2010085673A (en) * 2008-09-30 2010-04-15 Nissan Chem Ind Ltd Positive photosensitive resin composition including terminal functional group-containing polyimide
JP2010134422A (en) * 2008-10-28 2010-06-17 Jsr Corp Radiation-sensitive resin composition, interlayer insulation film and microlens, and method for producing them
JP2011090153A (en) * 2009-10-22 2011-05-06 Sony Corp Display device and method of manufacturing the same
JP2011180520A (en) * 2010-03-03 2011-09-15 Tokyo Ohka Kogyo Co Ltd Positive photosensitive resin composition and cured product thereof
JP2012133153A (en) * 2010-12-22 2012-07-12 Toray Ind Inc Photosensitive resin composition, cured film using the same, method for manufacturing semiconductor device, and semiconductor device
JP2013152476A (en) * 2008-05-29 2013-08-08 Asahi Kasei E-Materials Corp Photosensitive resin composition
WO2014097992A1 (en) * 2012-12-20 2014-06-26 東レ株式会社 Photosensitive resin composition, method for producing heat-resistant resin film and display device
WO2015118836A1 (en) * 2014-02-10 2015-08-13 日立化成デュポンマイクロシステムズ株式会社 Resin composition containing polyimide precursor, method for manufacturing cured film, and electronic component
JP2015179153A (en) * 2014-03-19 2015-10-08 東レ株式会社 photosensitive resin composition
JPWO2020183617A1 (en) * 2019-03-12 2020-09-17
CN114316263A (en) * 2022-01-17 2022-04-12 深圳职业技术学院 Cross-linked polyamic acid ester, method for producing same, polyimide composition containing same, and method for producing polyimide resin film

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101400186B1 (en) * 2010-12-31 2014-05-27 제일모직 주식회사 Positive photosensitive resin composition, photosensitive resin layer prepared by using the same, and semiconductor device including the photosensitive resin layer
KR102229661B1 (en) * 2013-10-21 2021-03-18 닛산 가가쿠 가부시키가이샤 Positive-type photosensitive resin composition

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002189290A (en) * 2000-09-29 2002-07-05 Nippon Zeon Co Ltd Radiation sensitive resin composition for forming insulating film and insulating film for organic electroluminescent element
JP2002328472A (en) * 2001-02-26 2002-11-15 Toray Ind Inc Positive photosensitive resin precursor composition, electronic parts using the same and display
JP2004326094A (en) * 2003-04-07 2004-11-18 Toray Ind Inc Photosensitive resin composition
JP2005159368A (en) * 2003-11-27 2005-06-16 Samsung Sdi Co Ltd Flat plate display device
WO2005068535A1 (en) * 2004-01-20 2005-07-28 Asahi Kasei Emd Corporation Resin and resin composition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002012761A (en) * 2000-04-28 2002-01-15 Toray Ind Inc Heat-resistant resin composition
JP4292765B2 (en) * 2002-08-22 2009-07-08 東レ株式会社 Positive photosensitive resin precursor composition, electronic component for semiconductor using the same, and display device for organic electroluminescent element
JP4514542B2 (en) * 2004-07-30 2010-07-28 旭化成イーマテリアルズ株式会社 Positive photosensitive resin composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002189290A (en) * 2000-09-29 2002-07-05 Nippon Zeon Co Ltd Radiation sensitive resin composition for forming insulating film and insulating film for organic electroluminescent element
JP2002328472A (en) * 2001-02-26 2002-11-15 Toray Ind Inc Positive photosensitive resin precursor composition, electronic parts using the same and display
JP2004326094A (en) * 2003-04-07 2004-11-18 Toray Ind Inc Photosensitive resin composition
JP2005159368A (en) * 2003-11-27 2005-06-16 Samsung Sdi Co Ltd Flat plate display device
WO2005068535A1 (en) * 2004-01-20 2005-07-28 Asahi Kasei Emd Corporation Resin and resin composition

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009063980A (en) * 2006-11-15 2009-03-26 Asahi Kasei Corp Photosensitive resin composition and flexible printed wiring board using the same
JP2009062398A (en) * 2007-09-04 2009-03-26 Toray Ind Inc Diamine compound, heat-resistant resin precursor using it, and positive photosensitive resin composition
JP2013152476A (en) * 2008-05-29 2013-08-08 Asahi Kasei E-Materials Corp Photosensitive resin composition
JP5260646B2 (en) * 2008-05-29 2013-08-14 旭化成イーマテリアルズ株式会社 Photosensitive resin composition
JP2010053323A (en) * 2008-08-29 2010-03-11 Chisso Corp Thermosetting composition, method for producing the same, and use of the same
JP2010085673A (en) * 2008-09-30 2010-04-15 Nissan Chem Ind Ltd Positive photosensitive resin composition including terminal functional group-containing polyimide
JP2010134422A (en) * 2008-10-28 2010-06-17 Jsr Corp Radiation-sensitive resin composition, interlayer insulation film and microlens, and method for producing them
TWI451194B (en) * 2008-10-28 2014-09-01 Jsr Corp Radiosensitive resin composition, interlayer insulation film, microlens and methods for manufacturing them
US8653532B2 (en) 2009-10-22 2014-02-18 Sony Corporation Display device and method for manufacturing display device
JP2011090153A (en) * 2009-10-22 2011-05-06 Sony Corp Display device and method of manufacturing the same
JP2011180520A (en) * 2010-03-03 2011-09-15 Tokyo Ohka Kogyo Co Ltd Positive photosensitive resin composition and cured product thereof
JP2012133153A (en) * 2010-12-22 2012-07-12 Toray Ind Inc Photosensitive resin composition, cured film using the same, method for manufacturing semiconductor device, and semiconductor device
WO2014097992A1 (en) * 2012-12-20 2014-06-26 東レ株式会社 Photosensitive resin composition, method for producing heat-resistant resin film and display device
CN110147031A (en) * 2012-12-20 2019-08-20 东丽株式会社 The manufacturing method and display device of photosensitive polymer combination, heat-resistant resin film
CN104854508A (en) * 2012-12-20 2015-08-19 东丽株式会社 Photosensitive resin composition, method for producing heat-resistant resin film and display device
US9897915B2 (en) 2012-12-20 2018-02-20 Toray Industries, Inc. Photosensitive resin composition, method for producing heat-resistant resin film and display device
JPWO2014097992A1 (en) * 2012-12-20 2017-01-12 東レ株式会社 Photosensitive resin composition, heat-resistant resin film manufacturing method, and display device
JPWO2015118836A1 (en) * 2014-02-10 2017-03-23 日立化成デュポンマイクロシステムズ株式会社 Resin composition containing polyimide precursor, method for producing cured film, and electronic component
WO2015118836A1 (en) * 2014-02-10 2015-08-13 日立化成デュポンマイクロシステムズ株式会社 Resin composition containing polyimide precursor, method for manufacturing cured film, and electronic component
JP2015179153A (en) * 2014-03-19 2015-10-08 東レ株式会社 photosensitive resin composition
JPWO2020183617A1 (en) * 2019-03-12 2020-09-17
WO2020183617A1 (en) * 2019-03-12 2020-09-17 日立化成株式会社 Photosensitive resin composition, patterned cured film and production method therefor, semiconductor element, and electronic device
JP7287453B2 (en) 2019-03-12 2023-06-06 株式会社レゾナック Photosensitive resin composition, pattern cured film and method for producing same, semiconductor element and electronic device
CN114316263A (en) * 2022-01-17 2022-04-12 深圳职业技术学院 Cross-linked polyamic acid ester, method for producing same, polyimide composition containing same, and method for producing polyimide resin film
CN114316263B (en) * 2022-01-17 2023-02-03 深圳职业技术学院 Cross-linked polyamic acid ester, method for producing same, polyimide composition containing same, and method for producing polyimide resin film

Also Published As

Publication number Publication date
JPWO2008123053A1 (en) 2010-07-15
TW200903163A (en) 2009-01-16
TWI416260B (en) 2013-11-21
JP5212103B2 (en) 2013-06-19

Similar Documents

Publication Publication Date Title
WO2008123053A1 (en) Positive photosensitive resin composition
WO2009028646A1 (en) Crosslinking agent, crosslinked polymer and their uses
TW200834240A (en) Positive photosensitive resin composition
WO2009034998A1 (en) Composition containing polymer having nitrogenous silyl group for forming resist underlayer film
ATE513837T1 (en) FLUORINE CONTAINING ACRYLIC CROSS REFERENCES
TW200736222A (en) Compound for electroluminescene element and producing method thereof
EP2105451A3 (en) Nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate
EP1752479A4 (en) Acrylic star polymer
WO2007140332A3 (en) Low odor, low volatility solvent for agricultural chemicals
EP1968131A4 (en) Material for organic electroluminescent device and organic electroluminescent device
WO2008126890A1 (en) Hydrazide compound and harmful arthropod-controlling agent containing the same
TW200705099A (en) Photosensitive resin composition and color filter using the same
WO2008081852A1 (en) Composition and light-emitting element comprising the composition
ATE465215T1 (en) RESIN COMPOSITION AND USE THEREOF
TW200641534A (en) Photosensitive resin composition
TW200602448A (en) Thermosetting adhesive or pressure-sensitive adhesive composition and thermosetting adhesive or pressure-sensitive adhesive tape or sheet
WO2008099709A1 (en) Positive-type photosensitive resin composition
TW200636390A (en) Photosensitive resin composition and color filter using the same
DE60316669D1 (en) Acid-degradable resin compositions containing ketene-dehyde-co-polymer
WO2009038038A1 (en) Acetylene compound, salt thereof, condensate thereof, and composition thereof
WO2008123507A1 (en) Positive photosensitive resin composition, cured film thereof, and display element
WO2009041550A1 (en) Adhesive set and bonding method using the same
WO2009075308A1 (en) Cyclic compound, photoresist base, photoresist composition, microfabrication process, and semiconductor device
WO2008117871A1 (en) Nitrogen-containing redox catalyst
WO2008126652A1 (en) Composition for external application to skin

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2008520660

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08722326

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08722326

Country of ref document: EP

Kind code of ref document: A1