JPWO2020183617A1 - - Google Patents

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Publication number
JPWO2020183617A1
JPWO2020183617A1 JP2021504683A JP2021504683A JPWO2020183617A1 JP WO2020183617 A1 JPWO2020183617 A1 JP WO2020183617A1 JP 2021504683 A JP2021504683 A JP 2021504683A JP 2021504683 A JP2021504683 A JP 2021504683A JP WO2020183617 A1 JPWO2020183617 A1 JP WO2020183617A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021504683A
Other languages
Japanese (ja)
Other versions
JP7287453B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2020183617A1 publication Critical patent/JPWO2020183617A1/ja
Application granted granted Critical
Publication of JP7287453B2 publication Critical patent/JP7287453B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
JP2021504683A 2019-03-12 2019-03-12 Photosensitive resin composition, pattern cured film and method for producing same, semiconductor element and electronic device Active JP7287453B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/010057 WO2020183617A1 (en) 2019-03-12 2019-03-12 Photosensitive resin composition, patterned cured film and production method therefor, semiconductor element, and electronic device

Publications (2)

Publication Number Publication Date
JPWO2020183617A1 true JPWO2020183617A1 (en) 2020-09-17
JP7287453B2 JP7287453B2 (en) 2023-06-06

Family

ID=72427406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021504683A Active JP7287453B2 (en) 2019-03-12 2019-03-12 Photosensitive resin composition, pattern cured film and method for producing same, semiconductor element and electronic device

Country Status (2)

Country Link
JP (1) JP7287453B2 (en)
WO (1) WO2020183617A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008123053A1 (en) * 2007-03-30 2008-10-16 Toray Industries, Inc. Positive photosensitive resin composition
WO2009145153A1 (en) * 2008-05-29 2009-12-03 旭化成イーマテリアルズ株式会社 Photosensitive resin composition
JP2011013644A (en) * 2009-07-06 2011-01-20 Asahi Kasei E-Materials Corp Photosensitive resin composition
JP2017187752A (en) * 2016-03-31 2017-10-12 東京応化工業株式会社 Composition for forming interlayer insulating film, interlayer insulating film, method for forming interlayer insulating film pattern, and device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4380178B2 (en) * 2002-03-28 2009-12-09 日立化成デュポンマイクロシステムズ株式会社 Positive photosensitive resin composition, pattern manufacturing method, and electronic component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008123053A1 (en) * 2007-03-30 2008-10-16 Toray Industries, Inc. Positive photosensitive resin composition
WO2009145153A1 (en) * 2008-05-29 2009-12-03 旭化成イーマテリアルズ株式会社 Photosensitive resin composition
JP2011013644A (en) * 2009-07-06 2011-01-20 Asahi Kasei E-Materials Corp Photosensitive resin composition
JP2017187752A (en) * 2016-03-31 2017-10-12 東京応化工業株式会社 Composition for forming interlayer insulating film, interlayer insulating film, method for forming interlayer insulating film pattern, and device

Also Published As

Publication number Publication date
WO2020183617A1 (en) 2020-09-17
JP7287453B2 (en) 2023-06-06

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