CN103180384A - 耐化学蒸气的环氧树脂组合物 - Google Patents
耐化学蒸气的环氧树脂组合物 Download PDFInfo
- Publication number
- CN103180384A CN103180384A CN2011800381633A CN201180038163A CN103180384A CN 103180384 A CN103180384 A CN 103180384A CN 2011800381633 A CN2011800381633 A CN 2011800381633A CN 201180038163 A CN201180038163 A CN 201180038163A CN 103180384 A CN103180384 A CN 103180384A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- component
- composition
- epoxide
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
K | M | Q | T | U | V | |
暴露于冰醋酸蒸气后的保留% | 70.4 | 74.6 | 55.8 | 68.6 | 66 | 67.2 |
暴露于丙酮蒸气后的保留% | 78.6 | 82.3 | 61.3 | 76.8 | 72.5 | 77.4 |
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US38569210P | 2010-09-23 | 2010-09-23 | |
US61/385,692 | 2010-09-23 | ||
PCT/US2011/052121 WO2012040094A2 (en) | 2010-09-23 | 2011-09-19 | Chemical vapor resistant epoxy composition |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103180384A true CN103180384A (zh) | 2013-06-26 |
Family
ID=45874303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011800381633A Pending CN103180384A (zh) | 2010-09-23 | 2011-09-19 | 耐化学蒸气的环氧树脂组合物 |
Country Status (6)
Country | Link |
---|---|
US (3) | US20130098676A1 (zh) |
EP (1) | EP2619268A4 (zh) |
CN (1) | CN103180384A (zh) |
CA (1) | CA2806243C (zh) |
MX (1) | MX2013003295A (zh) |
WO (1) | WO2012040094A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109065305A (zh) * | 2018-06-28 | 2018-12-21 | 南京先正电子股份有限公司 | 一种带双温度保险压敏电阻器及其制备方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MX2015003250A (es) * | 2012-09-17 | 2015-06-10 | 3M Innovative Properties Co | Composiciones de revestimiento de epoxi liquido, metodos y articulos. |
US20170267893A1 (en) * | 2016-03-18 | 2017-09-21 | Warren Environmental, Inc. | Bpa free sprayable epoxy resin |
JP6447557B2 (ja) * | 2016-03-24 | 2019-01-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
EP3336120A1 (de) * | 2016-12-14 | 2018-06-20 | Sika Technology AG | Epoxidharz-klebstoff mit hoher druckfestigkeit |
US20200172657A1 (en) | 2017-05-16 | 2020-06-04 | Jotun A/S | Compositions |
Citations (6)
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CN1356863A (zh) * | 2000-11-27 | 2002-07-03 | 松下电工株式会社 | 多层电路板及其制造方法 |
US6451876B1 (en) * | 2000-10-10 | 2002-09-17 | Henkel Corporation | Two component thermosettable compositions useful for producing structural reinforcing adhesives |
CN1388818A (zh) * | 2000-06-21 | 2003-01-01 | 三井化学株式会社 | 塑性液晶显示元件用密封剂组合物 |
CN1763946A (zh) * | 2004-10-05 | 2006-04-26 | 夏普株式会社 | 光学器件、光学连接器、电子器件及电子仪器 |
JP2008184598A (ja) * | 2007-01-31 | 2008-08-14 | Adeka Corp | 硬化性エポキシ樹脂組成物 |
JP4372532B2 (ja) * | 2003-12-19 | 2009-11-25 | 株式会社Adeka | エポキシ樹脂組成物 |
Family Cites Families (38)
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JPS5710651A (en) | 1980-06-23 | 1982-01-20 | Asahi Denka Kogyo Kk | Coating material composition |
DE3172709D1 (en) * | 1980-07-23 | 1985-11-28 | Ciba Geigy Ag | Adducts from amines and di- and polyepoxides |
JPS5863758A (ja) | 1981-10-09 | 1983-04-15 | Asahi Denka Kogyo Kk | 被覆用組成物 |
JPS5869265A (ja) | 1981-10-21 | 1983-04-25 | Asahi Denka Kogyo Kk | 塗料組成物 |
US4560732A (en) | 1983-11-11 | 1985-12-24 | Asahi Denka Kogyo K.K. | Coating composition |
US4724253A (en) * | 1986-06-13 | 1988-02-09 | The Dow Chemical Company | Adducts of partially hydrolyzed epoxy resins and polyamines |
US5034194A (en) * | 1988-02-03 | 1991-07-23 | Oregon State University | Windowless flow cell and mixing chamber |
AU615744B2 (en) | 1988-05-12 | 1991-10-10 | Minnesota Mining And Manufacturing Company | Powdered epoxy resin compositions |
US5202390A (en) | 1988-07-28 | 1993-04-13 | Ciba-Geigy Corporation | Butadiene/polar comonomer copolymer and aromatic reactive end group-containing prepolymer |
DE3827626A1 (de) | 1988-08-10 | 1990-03-08 | Teroson Gmbh | Reaktiver schmelzklebstoff |
US5218063A (en) | 1991-06-26 | 1993-06-08 | W. R. Grace & Co.-Conn. | Epoxy adhesives and methods of using cured compositions therefrom |
CA2112410C (en) | 1991-06-26 | 2003-12-09 | Norman E. Blank | Reactive hot-melt adhesive |
FR2679237B1 (fr) | 1991-07-19 | 1994-07-22 | Atochem | Systeme d'amorcage pour la polymerisation anionique de monomeres (meth) acryliques. |
CA2090092C (en) | 1992-02-27 | 2000-01-11 | Edwin Lee Mcinnis | Higher modulus compositions incorporating particulate rubber |
US5969053A (en) | 1992-02-27 | 1999-10-19 | Composite Particles, Inc. | Higher modulus compositions incorporating particulate rubber |
US5693714A (en) | 1992-02-27 | 1997-12-02 | Composite Particles, Inc. | Higher modulus compositions incorporating particulate rubber |
US5506283A (en) | 1992-02-27 | 1996-04-09 | Composite Particles, Inc. | Higher modulus compositions incorporating particulate rubber |
FR2735480B1 (fr) | 1995-06-15 | 1997-07-18 | Atochem Elf Sa | Procede de polymerisation anionique en continu d'au moins un monomere (meth)acrylique pour l'obtention de polymeres a haut taux de solide |
US20040181013A1 (en) | 1998-10-06 | 2004-09-16 | Henkel Teroson Gmbh | Impact resistant epoxide resin compositions |
DE19858921A1 (de) | 1998-12-19 | 2000-06-21 | Henkel Teroson Gmbh | Schlagfeste Epoxidharz-Zusammensetzungen |
US6437059B1 (en) * | 1999-02-11 | 2002-08-20 | Reichhold, Inc. | Composition of epoxy, urethane polyacrylate and polyamine |
US6286373B1 (en) * | 1999-02-12 | 2001-09-11 | Micro Motion, Inc. | Coriolis flowmeter having an explosion proof housing |
DE19960466A1 (de) * | 1999-12-15 | 2001-09-20 | Beiersdorf Ag | Klebeband, insbesondere zum Maskieren einer KTL-Grundierung |
US6884854B2 (en) | 2000-04-10 | 2005-04-26 | Henkel Kommanditgesellschaft Auf Aktien | Composition of epoxy resin, low glass transition temperature copolymer, latent hardener and carboxy-terminated polyamide and/or polyamide |
FR2809741B1 (fr) | 2000-05-31 | 2002-08-16 | Atofina | Materiaux thermodurs a tenue au choc amelioree |
US6911109B2 (en) * | 2000-12-11 | 2005-06-28 | Henkel Corporation | Two-part, room temperature curable epoxy resin/ (meth)acrylate compositions and process for using same to bond substrates |
DE10138127A1 (de) | 2001-08-03 | 2003-02-27 | Henkel Kgaa | Bindemittelkomponente für Oberflächenbeschichtungsmittel mit verbesserten Hafteigenschaften |
US6894659B2 (en) * | 2002-01-28 | 2005-05-17 | Daniel Industries, Inc. | Solar panel and antenna mounted on an explosion-proof enclosure |
US20030192643A1 (en) | 2002-03-15 | 2003-10-16 | Rainer Schoenfeld | Epoxy adhesive having improved impact resistance |
DE10300459A1 (de) * | 2003-01-07 | 2004-07-22 | Sgl Acotec Gmbh | Elektrisch leitfähige Bodenbeschichtungen |
CN100575440C (zh) | 2003-07-07 | 2009-12-30 | 陶氏环球技术公司 | 粘合剂环氧组合物及其施用方法 |
TW200512268A (en) * | 2003-07-18 | 2005-04-01 | Konishi Co Ltd | Curable resin composition and ambient temperature curable adhesive |
US20050215730A1 (en) | 2004-03-24 | 2005-09-29 | Rainer Schoenfeld | Polycarboxy-functionalized prepolymers |
US7311972B2 (en) * | 2004-10-14 | 2007-12-25 | Yazaki Corporation | Filled epoxy resin compositions |
US20070172596A1 (en) * | 2005-09-13 | 2007-07-26 | Hartman Stuart J | Epoxy sealer/healer for sealing and strengthening cracked concrete |
WO2008069179A1 (ja) * | 2006-12-04 | 2008-06-12 | Panasonic Corporation | 封止材料及びその封止材料を用いる実装方法 |
CN103232588B (zh) * | 2009-02-09 | 2017-09-26 | 3M创新有限公司 | 两组分液体垫片组合物 |
US9136195B2 (en) * | 2009-07-17 | 2015-09-15 | Tyco Electronics Corporation | Oxygen barrier compositions and related methods |
-
2011
- 2011-09-19 CN CN2011800381633A patent/CN103180384A/zh active Pending
- 2011-09-19 CA CA2806243A patent/CA2806243C/en active Active
- 2011-09-19 WO PCT/US2011/052121 patent/WO2012040094A2/en active Application Filing
- 2011-09-19 MX MX2013003295A patent/MX2013003295A/es unknown
- 2011-09-19 EP EP11827293.9A patent/EP2619268A4/en not_active Withdrawn
-
2012
- 2012-12-13 US US13/713,164 patent/US20130098676A1/en not_active Abandoned
-
2015
- 2015-12-14 US US14/967,999 patent/US10087341B2/en active Active
-
2018
- 2018-08-27 US US16/113,145 patent/US10563085B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1388818A (zh) * | 2000-06-21 | 2003-01-01 | 三井化学株式会社 | 塑性液晶显示元件用密封剂组合物 |
US6451876B1 (en) * | 2000-10-10 | 2002-09-17 | Henkel Corporation | Two component thermosettable compositions useful for producing structural reinforcing adhesives |
CN1356863A (zh) * | 2000-11-27 | 2002-07-03 | 松下电工株式会社 | 多层电路板及其制造方法 |
JP4372532B2 (ja) * | 2003-12-19 | 2009-11-25 | 株式会社Adeka | エポキシ樹脂組成物 |
CN1763946A (zh) * | 2004-10-05 | 2006-04-26 | 夏普株式会社 | 光学器件、光学连接器、电子器件及电子仪器 |
JP2008184598A (ja) * | 2007-01-31 | 2008-08-14 | Adeka Corp | 硬化性エポキシ樹脂組成物 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109065305A (zh) * | 2018-06-28 | 2018-12-21 | 南京先正电子股份有限公司 | 一种带双温度保险压敏电阻器及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2619268A4 (en) | 2017-03-29 |
WO2012040094A2 (en) | 2012-03-29 |
US20180362797A1 (en) | 2018-12-20 |
MX2013003295A (es) | 2013-05-22 |
US10087341B2 (en) | 2018-10-02 |
US20160108279A1 (en) | 2016-04-21 |
US20130098676A1 (en) | 2013-04-25 |
EP2619268A2 (en) | 2013-07-31 |
WO2012040094A3 (en) | 2012-06-14 |
US10563085B2 (en) | 2020-02-18 |
CA2806243A1 (en) | 2012-03-29 |
CA2806243C (en) | 2020-10-27 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: HENKEL US IP LLC Free format text: FORMER OWNER: HENKEL CORP. Effective date: 20141119 Owner name: HENKEL CORP. Free format text: FORMER OWNER: HENKEL US IP LLC Effective date: 20141119 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20141119 Address after: Dusseldorf Applicant after: HENKEL IP & HOLDING GmbH Address before: American Connecticut Applicant before: Henkel American Intellectual Property LLC Effective date of registration: 20141119 Address after: American Connecticut Applicant after: Henkel American Intellectual Property LLC Address before: American Connecticut Applicant before: Henkel Corp. |
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RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130626 |
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RJ01 | Rejection of invention patent application after publication |