MX2013003295A - Composicion epoxica resistente a vapor quimico. - Google Patents

Composicion epoxica resistente a vapor quimico.

Info

Publication number
MX2013003295A
MX2013003295A MX2013003295A MX2013003295A MX2013003295A MX 2013003295 A MX2013003295 A MX 2013003295A MX 2013003295 A MX2013003295 A MX 2013003295A MX 2013003295 A MX2013003295 A MX 2013003295A MX 2013003295 A MX2013003295 A MX 2013003295A
Authority
MX
Mexico
Prior art keywords
epoxy composition
chemical vapor
resistant epoxy
vapor resistant
meet
Prior art date
Application number
MX2013003295A
Other languages
English (en)
Inventor
Robert H Pauze
Boris Krivopal
Timothy P Walsh
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Publication of MX2013003295A publication Critical patent/MX2013003295A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C09D163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Una composición epóxica, curable, en dos partes útil para encapsular o sellar dispositivos eléctricos para su uso en ubicaciones peligrosas. Los productos de reacción de curado de la composición epóxica cumplen la mayoría o todos los requisitos de UL 674 y son útiles para aberturas de sellado en equipo eléctrico. El equipo sellado con las composiciones descritas puede cumplir los requisitos de UL 674.
MX2013003295A 2010-09-23 2011-09-19 Composicion epoxica resistente a vapor quimico. MX2013003295A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38569210P 2010-09-23 2010-09-23
PCT/US2011/052121 WO2012040094A2 (en) 2010-09-23 2011-09-19 Chemical vapor resistant epoxy composition

Publications (1)

Publication Number Publication Date
MX2013003295A true MX2013003295A (es) 2013-05-22

Family

ID=45874303

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013003295A MX2013003295A (es) 2010-09-23 2011-09-19 Composicion epoxica resistente a vapor quimico.

Country Status (6)

Country Link
US (3) US20130098676A1 (es)
EP (1) EP2619268A4 (es)
CN (1) CN103180384A (es)
CA (1) CA2806243C (es)
MX (1) MX2013003295A (es)
WO (1) WO2012040094A2 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2015003250A (es) * 2012-09-17 2015-06-10 3M Innovative Properties Co Composiciones de revestimiento de epoxi liquido, metodos y articulos.
US20170267893A1 (en) * 2016-03-18 2017-09-21 Warren Environmental, Inc. Bpa free sprayable epoxy resin
JP6447557B2 (ja) * 2016-03-24 2019-01-09 日亜化学工業株式会社 発光装置の製造方法
EP3336120A1 (de) * 2016-12-14 2018-06-20 Sika Technology AG Epoxidharz-klebstoff mit hoher druckfestigkeit
US20200172657A1 (en) 2017-05-16 2020-06-04 Jotun A/S Compositions
CN109065305B (zh) * 2018-06-28 2021-01-26 南京先正电子股份有限公司 一种带双温度保险压敏电阻器及其制备方法

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710651A (en) 1980-06-23 1982-01-20 Asahi Denka Kogyo Kk Coating material composition
DE3172709D1 (en) * 1980-07-23 1985-11-28 Ciba Geigy Ag Adducts from amines and di- and polyepoxides
JPS5863758A (ja) 1981-10-09 1983-04-15 Asahi Denka Kogyo Kk 被覆用組成物
JPS5869265A (ja) 1981-10-21 1983-04-25 Asahi Denka Kogyo Kk 塗料組成物
US4560732A (en) 1983-11-11 1985-12-24 Asahi Denka Kogyo K.K. Coating composition
US4724253A (en) * 1986-06-13 1988-02-09 The Dow Chemical Company Adducts of partially hydrolyzed epoxy resins and polyamines
US5034194A (en) * 1988-02-03 1991-07-23 Oregon State University Windowless flow cell and mixing chamber
AU615744B2 (en) 1988-05-12 1991-10-10 Minnesota Mining And Manufacturing Company Powdered epoxy resin compositions
US5202390A (en) 1988-07-28 1993-04-13 Ciba-Geigy Corporation Butadiene/polar comonomer copolymer and aromatic reactive end group-containing prepolymer
DE3827626A1 (de) 1988-08-10 1990-03-08 Teroson Gmbh Reaktiver schmelzklebstoff
US5218063A (en) 1991-06-26 1993-06-08 W. R. Grace & Co.-Conn. Epoxy adhesives and methods of using cured compositions therefrom
CA2112410C (en) 1991-06-26 2003-12-09 Norman E. Blank Reactive hot-melt adhesive
FR2679237B1 (fr) 1991-07-19 1994-07-22 Atochem Systeme d'amorcage pour la polymerisation anionique de monomeres (meth) acryliques.
CA2090092C (en) 1992-02-27 2000-01-11 Edwin Lee Mcinnis Higher modulus compositions incorporating particulate rubber
US5969053A (en) 1992-02-27 1999-10-19 Composite Particles, Inc. Higher modulus compositions incorporating particulate rubber
US5693714A (en) 1992-02-27 1997-12-02 Composite Particles, Inc. Higher modulus compositions incorporating particulate rubber
US5506283A (en) 1992-02-27 1996-04-09 Composite Particles, Inc. Higher modulus compositions incorporating particulate rubber
FR2735480B1 (fr) 1995-06-15 1997-07-18 Atochem Elf Sa Procede de polymerisation anionique en continu d'au moins un monomere (meth)acrylique pour l'obtention de polymeres a haut taux de solide
US20040181013A1 (en) 1998-10-06 2004-09-16 Henkel Teroson Gmbh Impact resistant epoxide resin compositions
DE19858921A1 (de) 1998-12-19 2000-06-21 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
US6437059B1 (en) * 1999-02-11 2002-08-20 Reichhold, Inc. Composition of epoxy, urethane polyacrylate and polyamine
US6286373B1 (en) * 1999-02-12 2001-09-11 Micro Motion, Inc. Coriolis flowmeter having an explosion proof housing
DE19960466A1 (de) * 1999-12-15 2001-09-20 Beiersdorf Ag Klebeband, insbesondere zum Maskieren einer KTL-Grundierung
US6884854B2 (en) 2000-04-10 2005-04-26 Henkel Kommanditgesellschaft Auf Aktien Composition of epoxy resin, low glass transition temperature copolymer, latent hardener and carboxy-terminated polyamide and/or polyamide
FR2809741B1 (fr) 2000-05-31 2002-08-16 Atofina Materiaux thermodurs a tenue au choc amelioree
WO2001098411A1 (fr) * 2000-06-21 2001-12-27 Mitsui Chemicals Inc. Materiau de scellement pour cellules d'affichage a cristaux liquides plastiques
US6451876B1 (en) * 2000-10-10 2002-09-17 Henkel Corporation Two component thermosettable compositions useful for producing structural reinforcing adhesives
TW507514B (en) * 2000-11-27 2002-10-21 Matsushita Electric Works Ltd Multilayer circuit board and method of manufacturing the same
US6911109B2 (en) * 2000-12-11 2005-06-28 Henkel Corporation Two-part, room temperature curable epoxy resin/ (meth)acrylate compositions and process for using same to bond substrates
DE10138127A1 (de) 2001-08-03 2003-02-27 Henkel Kgaa Bindemittelkomponente für Oberflächenbeschichtungsmittel mit verbesserten Hafteigenschaften
US6894659B2 (en) * 2002-01-28 2005-05-17 Daniel Industries, Inc. Solar panel and antenna mounted on an explosion-proof enclosure
US20030192643A1 (en) 2002-03-15 2003-10-16 Rainer Schoenfeld Epoxy adhesive having improved impact resistance
DE10300459A1 (de) * 2003-01-07 2004-07-22 Sgl Acotec Gmbh Elektrisch leitfähige Bodenbeschichtungen
CN100575440C (zh) 2003-07-07 2009-12-30 陶氏环球技术公司 粘合剂环氧组合物及其施用方法
TW200512268A (en) * 2003-07-18 2005-04-01 Konishi Co Ltd Curable resin composition and ambient temperature curable adhesive
JP4372532B2 (ja) * 2003-12-19 2009-11-25 株式会社Ａｄｅｋａ エポキシ樹脂組成物
US20050215730A1 (en) 2004-03-24 2005-09-29 Rainer Schoenfeld Polycarboxy-functionalized prepolymers
JP4620421B2 (ja) * 2004-10-05 2011-01-26 シャープ株式会社 光デバイスおよび光コネクタおよび電子機器
US7311972B2 (en) * 2004-10-14 2007-12-25 Yazaki Corporation Filled epoxy resin compositions
US20070172596A1 (en) * 2005-09-13 2007-07-26 Hartman Stuart J Epoxy sealer/healer for sealing and strengthening cracked concrete
WO2008069179A1 (ja) * 2006-12-04 2008-06-12 Panasonic Corporation 封止材料及びその封止材料を用いる実装方法
JP5366290B2 (ja) * 2007-01-31 2013-12-11 株式会社Ａｄｅｋａ 硬化性エポキシ樹脂組成物
CN103232588B (zh) * 2009-02-09 2017-09-26 3M创新有限公司 两组分液体垫片组合物
US9136195B2 (en) * 2009-07-17 2015-09-15 Tyco Electronics Corporation Oxygen barrier compositions and related methods

Also Published As

Publication number Publication date
EP2619268A4 (en) 2017-03-29
WO2012040094A2 (en) 2012-03-29
US20180362797A1 (en) 2018-12-20
CN103180384A (zh) 2013-06-26
US10087341B2 (en) 2018-10-02
US20160108279A1 (en) 2016-04-21
US20130098676A1 (en) 2013-04-25
EP2619268A2 (en) 2013-07-31
WO2012040094A3 (en) 2012-06-14
US10563085B2 (en) 2020-02-18
CA2806243A1 (en) 2012-03-29
CA2806243C (en) 2020-10-27

Similar Documents

Publication Publication Date Title
MX2013003295A (es) Composicion epoxica resistente a vapor quimico.
MY157541A (en) Elastomeric epoxy materials and the use thereof
WO2011126834A3 (en) Thioethers, methods for their preparation, and compositions including such thioethers
PH12015501834A1 (en) Sealing interface for a telecommunications enclosure
MX2012008190A (es) Dispositivo.
GB2492305A (en) Polymers of benzodithiophene and their use as organic semiconductors
MX2013005062A (es) Composiciones pesticidas y procesos relacionados a las mimas.
PH12015500108B1 (en) Liquid sealing material and electronic component using same
MX371065B (es) Composiciones adhesivas que contienen partículas de carbono grafénicas.
BR112013013989A2 (pt) montagem de vedação
MY175000A (en) Epoxy resin, epoxy resin composition and cured product
IN2014CN03129A (es)
MX2010002408A (es) Tapa para botella, ensamble de tapa y botella.
PH12017501555A1 (en) Mercaptoethylglycol uril compound and utilization thereof
MX2016007493A (es) Polibutadieno terminado en epoxi como depurador de oxigeno.
MY187028A (en) Sour gas resistant coating
CA2872575A1 (en) Compositions with a sulfur-containing polymer and graphenic carbon particles
IN2015DN02062A (es)
IN2014DN06782A (es)
WO2014066456A3 (en) Adduct curing agents
WO2014066450A3 (en) Weatherable coatings
WO2015065977A3 (en) Adhesion promoting adducts containing metal ligands, compositions thereof, and uses thereof
MX365413B (es) Anillo de sellado para el sellado con una lamina de un recipiente.
SG11201809392UA (en) Perfluoroelastomer composition and sealing material
MY156340A (en) Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same