TW200509395A - High performance FET devices and methods thereof - Google Patents

High performance FET devices and methods thereof

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Publication number
TW200509395A
TW200509395A TW093112010A TW93112010A TW200509395A TW 200509395 A TW200509395 A TW 200509395A TW 093112010 A TW093112010 A TW 093112010A TW 93112010 A TW93112010 A TW 93112010A TW 200509395 A TW200509395 A TW 200509395A
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TW
Taiwan
Prior art keywords
insulator
methods
fet devices
high performance
layer
Prior art date
Application number
TW093112010A
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English (en)
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TWI279914B (en
Inventor
Jack Oon Chu
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Ibm
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Publication of TW200509395A publication Critical patent/TW200509395A/zh
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Publication of TWI279914B publication Critical patent/TWI279914B/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/785Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • H01L21/28017Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/2807Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being Si or Ge or C and their alloys except Si
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    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • H01L29/7787Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
TW093112010A 2003-05-01 2004-04-29 High performance FET devices and methods thereof TWI279914B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/427,233 US6909186B2 (en) 2003-05-01 2003-05-01 High performance FET devices and methods therefor

Publications (2)

Publication Number Publication Date
TW200509395A true TW200509395A (en) 2005-03-01
TWI279914B TWI279914B (en) 2007-04-21

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US (6) US6909186B2 (zh)
JP (2) JP2004336048A (zh)
TW (1) TWI279914B (zh)

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US6982474B2 (en) 2002-06-25 2006-01-03 Amberwave Systems Corporation Reacted conductive gate electrodes
KR100474850B1 (ko) * 2002-11-15 2005-03-11 삼성전자주식회사 수직 채널을 가지는 비휘발성 sonos 메모리 및 그 제조방법
US6909186B2 (en) * 2003-05-01 2005-06-21 International Business Machines Corporation High performance FET devices and methods therefor
US7199011B2 (en) * 2003-07-16 2007-04-03 Texas Instruments Incorporated Method to reduce transistor gate to source/drain overlap capacitance by incorporation of carbon
US7355253B2 (en) * 2003-08-22 2008-04-08 International Business Machines Corporation Strained-channel Fin field effect transistor (FET) with a uniform channel thickness and separate gates
US7198995B2 (en) * 2003-12-12 2007-04-03 International Business Machines Corporation Strained finFETs and method of manufacture
US7224007B1 (en) * 2004-01-12 2007-05-29 Advanced Micro Devices, Inc. Multi-channel transistor with tunable hot carrier effect
US7105391B2 (en) * 2004-03-04 2006-09-12 International Business Machines Corporation Planar pedestal multi gate device
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