TW200428486A - Substrate treatment device - Google Patents

Substrate treatment device Download PDF

Info

Publication number
TW200428486A
TW200428486A TW093110254A TW93110254A TW200428486A TW 200428486 A TW200428486 A TW 200428486A TW 093110254 A TW093110254 A TW 093110254A TW 93110254 A TW93110254 A TW 93110254A TW 200428486 A TW200428486 A TW 200428486A
Authority
TW
Taiwan
Prior art keywords
substrate
conveying
nozzle
nozzles
supplied
Prior art date
Application number
TW093110254A
Other languages
English (en)
Chinese (zh)
Other versions
TWI335616B (https=
Inventor
Futoshi Shimai
Shigeru Kawata
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200428486A publication Critical patent/TW200428486A/zh
Application granted granted Critical
Publication of TWI335616B publication Critical patent/TWI335616B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Spray Control Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093110254A 2003-04-14 2004-04-13 Substrate treatment device TW200428486A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003108949A JP3995044B2 (ja) 2003-04-14 2003-04-14 基板処理装置

Publications (2)

Publication Number Publication Date
TW200428486A true TW200428486A (en) 2004-12-16
TWI335616B TWI335616B (https=) 2011-01-01

Family

ID=33470263

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093110254A TW200428486A (en) 2003-04-14 2004-04-13 Substrate treatment device

Country Status (3)

Country Link
JP (1) JP3995044B2 (https=)
KR (1) KR20040089561A (https=)
TW (1) TW200428486A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4849914B2 (ja) * 2006-03-13 2012-01-11 東京エレクトロン株式会社 基板処理装置、基板処理方法、コンピュータ読取可能な記憶媒体
JP4824723B2 (ja) * 2008-06-17 2011-11-30 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5303231B2 (ja) * 2008-09-30 2013-10-02 東京応化工業株式会社 塗布装置
CN108015024B (zh) * 2017-12-01 2021-03-05 浙江德尔威工程机械设备有限公司 一种玻璃清洗装置

Also Published As

Publication number Publication date
KR20040089561A (ko) 2004-10-21
TWI335616B (https=) 2011-01-01
JP2004313872A (ja) 2004-11-11
JP3995044B2 (ja) 2007-10-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees