KR20040089561A - 기판 처리장치 - Google Patents

기판 처리장치 Download PDF

Info

Publication number
KR20040089561A
KR20040089561A KR1020040024825A KR20040024825A KR20040089561A KR 20040089561 A KR20040089561 A KR 20040089561A KR 1020040024825 A KR1020040024825 A KR 1020040024825A KR 20040024825 A KR20040024825 A KR 20040024825A KR 20040089561 A KR20040089561 A KR 20040089561A
Authority
KR
South Korea
Prior art keywords
substrate
supply
processing apparatus
conveying
nozzles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020040024825A
Other languages
English (en)
Korean (ko)
Inventor
시마이후토시
가와타시게루
Original Assignee
도쿄 오카 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄 오카 고교 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20040089561A publication Critical patent/KR20040089561A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Spray Control Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020040024825A 2003-04-14 2004-04-12 기판 처리장치 Withdrawn KR20040089561A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00108949 2003-04-14
JP2003108949A JP3995044B2 (ja) 2003-04-14 2003-04-14 基板処理装置

Publications (1)

Publication Number Publication Date
KR20040089561A true KR20040089561A (ko) 2004-10-21

Family

ID=33470263

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040024825A Withdrawn KR20040089561A (ko) 2003-04-14 2004-04-12 기판 처리장치

Country Status (3)

Country Link
JP (1) JP3995044B2 (https=)
KR (1) KR20040089561A (https=)
TW (1) TW200428486A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4849914B2 (ja) * 2006-03-13 2012-01-11 東京エレクトロン株式会社 基板処理装置、基板処理方法、コンピュータ読取可能な記憶媒体
JP4824723B2 (ja) * 2008-06-17 2011-11-30 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5303231B2 (ja) * 2008-09-30 2013-10-02 東京応化工業株式会社 塗布装置
CN108015024B (zh) * 2017-12-01 2021-03-05 浙江德尔威工程机械设备有限公司 一种玻璃清洗装置

Also Published As

Publication number Publication date
TWI335616B (https=) 2011-01-01
TW200428486A (en) 2004-12-16
JP2004313872A (ja) 2004-11-11
JP3995044B2 (ja) 2007-10-24

Similar Documents

Publication Publication Date Title
KR100500170B1 (ko) 기판의 수평 및 상하 이송장치
US4938257A (en) Printed circuit cleaning apparatus
JP5841449B2 (ja) 拭き取りパッド及びこのパッドを用いたノズルメンテナンス装置並びに塗布処理装置
KR100671251B1 (ko) 기판 처리 장치
TWI343088B (https=)
KR20040089561A (ko) 기판 처리장치
EP0622125A1 (en) Fluid treatment apparatus
TW548697B (en) Substrate processing device
TWI254341B (en) An inclined liquid-draining device
JP4602567B2 (ja) 基板の洗浄装置
JP2004174308A (ja) 板材の洗浄設備
KR100899363B1 (ko) 기판의 경사조절장치
KR20110010064A (ko) 기판 반송 장치
JP3663277B2 (ja) 薄板ガラス基板洗浄方法および装置
US9862179B2 (en) Web transport system including scavenger blade
CN115889286A (zh) 端子清洗设备
JP4043410B2 (ja) インライン式現像処理装置
JPH1051106A (ja) 印刷配線板のエッチング装置
JPH0453023Y2 (https=)
JP2008296088A (ja) 洗浄装置、フラットパネルディスプレイの製造装置及びフラットパネルディスプレイ
US9689073B2 (en) Electroless plating system including bubble guide
KR20220106708A (ko) 기판 반송 장치, 현상 장치 및 현상 방법
JPH0377276B2 (https=)
CN201805637U (zh) 薄板处理制程的输送装置
JP4005462B2 (ja) 搬送式基板処理装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000