JP3995044B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP3995044B2
JP3995044B2 JP2003108949A JP2003108949A JP3995044B2 JP 3995044 B2 JP3995044 B2 JP 3995044B2 JP 2003108949 A JP2003108949 A JP 2003108949A JP 2003108949 A JP2003108949 A JP 2003108949A JP 3995044 B2 JP3995044 B2 JP 3995044B2
Authority
JP
Japan
Prior art keywords
substrate
nozzle
processing apparatus
roller
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003108949A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004313872A (ja
Inventor
太 島井
茂 河田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2003108949A priority Critical patent/JP3995044B2/ja
Priority to KR1020040024825A priority patent/KR20040089561A/ko
Priority to TW093110254A priority patent/TW200428486A/zh
Publication of JP2004313872A publication Critical patent/JP2004313872A/ja
Application granted granted Critical
Publication of JP3995044B2 publication Critical patent/JP3995044B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Spray Control Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2003108949A 2003-04-14 2003-04-14 基板処理装置 Expired - Fee Related JP3995044B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003108949A JP3995044B2 (ja) 2003-04-14 2003-04-14 基板処理装置
KR1020040024825A KR20040089561A (ko) 2003-04-14 2004-04-12 기판 처리장치
TW093110254A TW200428486A (en) 2003-04-14 2004-04-13 Substrate treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003108949A JP3995044B2 (ja) 2003-04-14 2003-04-14 基板処理装置

Publications (2)

Publication Number Publication Date
JP2004313872A JP2004313872A (ja) 2004-11-11
JP3995044B2 true JP3995044B2 (ja) 2007-10-24

Family

ID=33470263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003108949A Expired - Fee Related JP3995044B2 (ja) 2003-04-14 2003-04-14 基板処理装置

Country Status (3)

Country Link
JP (1) JP3995044B2 (https=)
KR (1) KR20040089561A (https=)
TW (1) TW200428486A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4849914B2 (ja) * 2006-03-13 2012-01-11 東京エレクトロン株式会社 基板処理装置、基板処理方法、コンピュータ読取可能な記憶媒体
JP4824723B2 (ja) * 2008-06-17 2011-11-30 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5303231B2 (ja) * 2008-09-30 2013-10-02 東京応化工業株式会社 塗布装置
CN108015024B (zh) * 2017-12-01 2021-03-05 浙江德尔威工程机械设备有限公司 一种玻璃清洗装置

Also Published As

Publication number Publication date
KR20040089561A (ko) 2004-10-21
TWI335616B (https=) 2011-01-01
TW200428486A (en) 2004-12-16
JP2004313872A (ja) 2004-11-11

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