SG87829A1 - Semiconductor integrated circuit apparatus - Google Patents

Semiconductor integrated circuit apparatus

Info

Publication number
SG87829A1
SG87829A1 SG9904392A SG1999004392A SG87829A1 SG 87829 A1 SG87829 A1 SG 87829A1 SG 9904392 A SG9904392 A SG 9904392A SG 1999004392 A SG1999004392 A SG 1999004392A SG 87829 A1 SG87829 A1 SG 87829A1
Authority
SG
Singapore
Prior art keywords
integrated circuit
semiconductor integrated
circuit apparatus
semiconductor
integrated
Prior art date
Application number
SG9904392A
Other languages
English (en)
Inventor
Mizuno Hiroyuki
Ishibashi Koichiro
Narita Susumu
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of SG87829A1 publication Critical patent/SG87829A1/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0008—Arrangements for reducing power consumption
    • H03K19/0016—Arrangements for reducing power consumption by using a control or a clock signal, e.g. in order to apply power supply
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133331—Cover glasses

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computing Systems (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Dram (AREA)
  • Control Of Electrical Variables (AREA)
  • Logic Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
SG9904392A 1998-09-09 1999-09-08 Semiconductor integrated circuit apparatus SG87829A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25484498 1998-09-09
JP10891699 1999-04-16

Publications (1)

Publication Number Publication Date
SG87829A1 true SG87829A1 (en) 2002-04-16

Family

ID=26448739

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200104041A SG125053A1 (en) 1998-09-09 1999-09-08 Semiconductor integrated circuit apparatus
SG9904392A SG87829A1 (en) 1998-09-09 1999-09-08 Semiconductor integrated circuit apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG200104041A SG125053A1 (en) 1998-09-09 1999-09-08 Semiconductor integrated circuit apparatus

Country Status (8)

Country Link
US (3) US6380798B1 (zh)
EP (1) EP0986177B1 (zh)
KR (2) KR100679548B1 (zh)
CN (2) CN1172373C (zh)
DE (1) DE69943120D1 (zh)
MY (1) MY130260A (zh)
SG (2) SG125053A1 (zh)
TW (1) TW453032B (zh)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4109340B2 (ja) * 1997-12-26 2008-07-02 株式会社ルネサステクノロジ 半導体集積回路装置
TW453032B (en) * 1998-09-09 2001-09-01 Hitachi Ltd Semiconductor integrated circuit apparatus
US6611918B1 (en) * 1999-12-21 2003-08-26 Intel Corporation Method and apparatus for changing bias levels to reduce CMOS leakage of a real time clock when switching to a battery mode of operation
JP3609003B2 (ja) * 2000-05-02 2005-01-12 シャープ株式会社 Ｃｍｏｓ半導体集積回路
US7247932B1 (en) * 2000-05-19 2007-07-24 Megica Corporation Chip package with capacitor
JP2002064150A (ja) * 2000-06-05 2002-02-28 Mitsubishi Electric Corp 半導体装置
US6967522B2 (en) * 2001-04-17 2005-11-22 Massachusetts Institute Of Technology Adaptive power supply and substrate control for ultra low power digital processors using triple well control
US6518826B2 (en) 2001-06-28 2003-02-11 Intel Corporation Method and apparatus for dynamic leakage control
US6483375B1 (en) 2001-06-28 2002-11-19 Intel Corporation Low power operation mechanism and method
JP2003031681A (ja) * 2001-07-16 2003-01-31 Matsushita Electric Ind Co Ltd 半導体集積回路
US6552596B2 (en) * 2001-08-10 2003-04-22 Micron Technology, Inc. Current saving mode for input buffers
US6982500B2 (en) * 2002-03-11 2006-01-03 Intel Corporation Power-down scheme for an on-die voltage differentiator design
JP4401621B2 (ja) * 2002-05-07 2010-01-20 株式会社日立製作所 半導体集積回路装置
US6753719B2 (en) * 2002-08-26 2004-06-22 Motorola, Inc. System and circuit for controlling well biasing and method thereof
JP2004227710A (ja) * 2003-01-24 2004-08-12 Renesas Technology Corp 半導体記憶装置
US6812758B2 (en) * 2003-02-12 2004-11-02 Sun Microsystems, Inc. Negative bias temperature instability correction technique for delay locked loop and phase locked loop bias generators
US7219324B1 (en) * 2003-06-02 2007-05-15 Virage Logic Corporation Various methods and apparatuses to route multiple power rails to a cell
US7250807B1 (en) * 2003-06-05 2007-07-31 National Semiconductor Corporation Threshold scaling circuit that minimizes leakage current
JP4321678B2 (ja) * 2003-08-20 2009-08-26 パナソニック株式会社 半導体集積回路
JP2005166698A (ja) * 2003-11-28 2005-06-23 Matsushita Electric Ind Co Ltd 半導体集積回路
JP4744807B2 (ja) * 2004-01-06 2011-08-10 パナソニック株式会社 半導体集積回路装置
US20050225376A1 (en) * 2004-04-08 2005-10-13 Ati Technologies, Inc. Adaptive supply voltage body bias apparatus and method thereof
US7279926B2 (en) * 2004-05-27 2007-10-09 Qualcomm Incoporated Headswitch and footswitch circuitry for power management
WO2005125012A1 (en) * 2004-06-15 2005-12-29 Koninklijke Philips Electronics N.V. Adaptive control of power supply for integrated circuits
DE102004058612A1 (de) * 2004-12-04 2006-06-08 Infineon Technologies Ag Spannungsversorgungsschaltung, insbesondere für eine DRAM-Speicherschaltung sowie ein Verfahren zum Steuern einer Versorgungsquelle
US20060132218A1 (en) * 2004-12-20 2006-06-22 Tschanz James W Body biasing methods and circuits
JP2006217540A (ja) * 2005-02-07 2006-08-17 Fujitsu Ltd 半導体集積回路および半導体集積回路の制御方法
US7345524B2 (en) * 2005-03-01 2008-03-18 Taiwan Semiconductor Manufacturing Company Integrated circuit with low power consumption and high operation speed
US7011980B1 (en) * 2005-05-09 2006-03-14 International Business Machines Corporation Method and structures for measuring gate tunneling leakage parameters of field effect transistors
US7141998B1 (en) * 2005-05-19 2006-11-28 International Business Machines Corporation Method and apparatus for burn-in optimization
JP4764086B2 (ja) * 2005-07-27 2011-08-31 パナソニック株式会社 半導体集積回路装置
WO2007015442A1 (ja) * 2005-08-02 2007-02-08 Matsushita Electric Industrial Co., Ltd. 半導体集積回路
US7397072B2 (en) * 2005-12-01 2008-07-08 Board Of Regents, The University Of Texas System Structure for and method of using a four terminal hybrid silicon/organic field effect sensor device
US20070139098A1 (en) * 2005-12-15 2007-06-21 P.A. Semi, Inc. Wearout compensation mechanism using back bias technique
KR100735756B1 (ko) 2006-01-02 2007-07-06 삼성전자주식회사 반도체 집적 회로
US7366036B2 (en) * 2006-01-13 2008-04-29 International Business Machines Corporation Memory device with control circuit for regulating power supply voltage
JP4762754B2 (ja) * 2006-02-17 2011-08-31 富士通セミコンダクター株式会社 半導体装置および電子装置
KR100744131B1 (ko) * 2006-02-21 2007-08-01 삼성전자주식회사 냉온에서 동작 속도가 향상되는 메모리 집적회로 장치
US7330049B2 (en) * 2006-03-06 2008-02-12 Altera Corporation Adjustable transistor body bias generation circuitry with latch-up prevention
US7355437B2 (en) * 2006-03-06 2008-04-08 Altera Corporation Latch-up prevention circuitry for integrated circuits with transistor body biasing
TWI318344B (en) * 2006-05-10 2009-12-11 Realtek Semiconductor Corp Substrate biasing apparatus
US7429870B2 (en) * 2006-06-21 2008-09-30 Element Cxi, Llc Resilient integrated circuit architecture
US7408830B2 (en) * 2006-11-07 2008-08-05 Taiwan Semiconductor Manufacturing Co. Dynamic power supplies for semiconductor devices
US7989849B2 (en) * 2006-11-15 2011-08-02 Synopsys, Inc. Apparatuses and methods for efficient power rail structures for cell libraries
JP4237221B2 (ja) * 2006-11-20 2009-03-11 エルピーダメモリ株式会社 半導体装置
US9608604B2 (en) * 2006-12-14 2017-03-28 Taiwan Semiconductor Manufacturing Co., Ltd. Voltage level shifter with single well voltage
US20090033409A1 (en) * 2007-08-02 2009-02-05 Fsp Technology Inc. Bias correction device
US7874298B2 (en) * 2007-12-13 2011-01-25 Dina Suzanne Malick Unit and method for decorating nails
US8013617B2 (en) * 2008-03-10 2011-09-06 Ngk Spark Plug Co., Ltd. Test method and apparatus for spark plug ceramic insulator
TWI405297B (zh) * 2008-09-25 2013-08-11 Via Tech Inc 微處理器、積體電路以及晶片雜訊減少方法
US7978001B2 (en) * 2008-09-25 2011-07-12 Via Technologies, Inc. Microprocessor with selective substrate biasing for clock-gated functional blocks
US7812662B2 (en) * 2008-10-07 2010-10-12 Via Technologies, Inc. System and method for adjusting supply voltage levels to reduce sub-threshold leakage
JP2012059328A (ja) * 2010-09-10 2012-03-22 Renesas Electronics Corp テスト回路及びそれを備えた半導体集積回路
US20120206188A1 (en) * 2011-02-14 2012-08-16 California Institute Of Technology Systems and methods for dynamic mosfet body biasing for low power, fast response vlsi applications
US9110643B2 (en) * 2012-06-11 2015-08-18 Arm Limited Leakage current reduction in an integrated circuit
US8787096B1 (en) * 2013-01-16 2014-07-22 Qualcomm Incorporated N-well switching circuit
US9112495B1 (en) * 2013-03-15 2015-08-18 Mie Fujitsu Semiconductor Limited Integrated circuit device body bias circuits and methods
KR102095856B1 (ko) * 2013-04-15 2020-04-01 삼성전자주식회사 반도체 메모리 장치 및 그것의 바디 바이어스 방법
JP6287025B2 (ja) * 2013-10-09 2018-03-07 セイコーエプソン株式会社 発光装置及び電子機器
JP2015075623A (ja) * 2013-10-09 2015-04-20 セイコーエプソン株式会社 発光装置、電子機器、及び発光装置の設計方法
WO2016007501A1 (en) 2014-07-08 2016-01-14 Chaologix, Inc. Continuously charged isolated supply network for secure logic applications
JP2016126359A (ja) * 2014-12-26 2016-07-11 日立オートモティブシステムズ株式会社 電子装置
KR20170044411A (ko) * 2015-10-15 2017-04-25 에스케이하이닉스 주식회사 반도체장치
US10469085B2 (en) * 2016-04-25 2019-11-05 Microchip Technology Incorporated Seamless switching control for low power battery backup system
US10386897B2 (en) * 2016-07-14 2019-08-20 John V. Rivera, Jr. Smart device cooling system
EP3343769B1 (en) * 2016-12-27 2019-02-06 GN Hearing A/S Integrated circuit comprising adjustable back biasing of one or more logic circuit regions
DE102017109264B3 (de) * 2017-04-28 2018-08-23 Infineon Technologies Ag Leistungshalbleiterbauelemente und ein Verfahren zum Bilden eines Leistungshalbleiterbauelements
KR20190054812A (ko) 2017-11-14 2019-05-22 삼성전자주식회사 메모리 장치의 구동 방법 및 이를 수행하는 메모리 장치
CN108776296A (zh) * 2018-06-26 2018-11-09 北京中电华大电子设计有限责任公司 一种用电流差值来判断iddq测试的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557231A (en) * 1992-03-30 1996-09-17 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with improved substrate bias voltage generating circuit

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920010633A (ko) * 1990-11-30 1992-06-26 김광호 반도체 메모리 장치의 기준전압 발생회로
JP3184265B2 (ja) * 1991-10-17 2001-07-09 株式会社日立製作所 半導体集積回路装置およびその制御方法
JP2939086B2 (ja) * 1992-03-30 1999-08-25 三菱電機株式会社 半導体装置
US5461338A (en) * 1992-04-17 1995-10-24 Nec Corporation Semiconductor integrated circuit incorporated with substrate bias control circuit
KR0169157B1 (ko) * 1993-11-29 1999-02-01 기다오까 다까시 반도체 회로 및 mos-dram
JPH07254685A (ja) * 1994-03-16 1995-10-03 Toshiba Corp 半導体記憶装置
JPH0973784A (ja) * 1995-09-07 1997-03-18 Nec Corp 半導体装置及びその制御回路
US5721495A (en) * 1995-10-24 1998-02-24 Unisys Corporation Circuit for measuring quiescent current
KR970029758A (ko) * 1995-11-09 1997-06-26 리 패치 저전압 cmos 회로용 누설 전류 제어 시스템 및 그 방법
KR100223770B1 (ko) * 1996-06-29 1999-10-15 김영환 반도체 장치의 문턱전압 제어회로
US5742177A (en) * 1996-09-27 1998-04-21 Intel Corporation Method for testing a semiconductor device by measuring quiescent currents (IDDQ) at two different temperatures
CN1190225A (zh) * 1997-02-05 1998-08-12 林光泽 鉴别纸制钞票的装置和方法
JPH10229165A (ja) * 1997-02-17 1998-08-25 Ricoh Co Ltd 半導体集積回路装置
JP3814385B2 (ja) * 1997-10-14 2006-08-30 株式会社ルネサステクノロジ 半導体集積回路装置
JP4109340B2 (ja) * 1997-12-26 2008-07-02 株式会社ルネサステクノロジ 半導体集積回路装置
US6239609B1 (en) * 1998-02-11 2001-05-29 Lsi Logic Corporation Reduced voltage quiescent current test methodology for integrated circuits
TW453032B (en) * 1998-09-09 2001-09-01 Hitachi Ltd Semiconductor integrated circuit apparatus
US6664801B1 (en) * 2001-05-21 2003-12-16 Lsi Logic Corporation IDDQ test methodology based on the sensitivity of fault current to power supply variations

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557231A (en) * 1992-03-30 1996-09-17 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with improved substrate bias voltage generating circuit

Also Published As

Publication number Publication date
CN1172373C (zh) 2004-10-20
CN100508153C (zh) 2009-07-01
CN1253379A (zh) 2000-05-17
KR20060022296A (ko) 2006-03-09
US20040012397A1 (en) 2004-01-22
US6946865B2 (en) 2005-09-20
TW453032B (en) 2001-09-01
US6380798B1 (en) 2002-04-30
DE69943120D1 (de) 2011-02-24
KR100679548B1 (ko) 2007-02-07
KR20000022921A (ko) 2000-04-25
EP0986177B1 (en) 2011-01-12
KR100712091B1 (ko) 2007-05-02
MY130260A (en) 2007-06-29
EP0986177A2 (en) 2000-03-15
SG125053A1 (en) 2006-09-29
US6630857B2 (en) 2003-10-07
US20020044007A1 (en) 2002-04-18
CN1519906A (zh) 2004-08-11
EP0986177A3 (en) 2000-09-27

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