SG66317A1 - Process for producing semiconductor substrate - Google Patents

Process for producing semiconductor substrate

Info

Publication number
SG66317A1
SG66317A1 SG1996010249A SG1996010249A SG66317A1 SG 66317 A1 SG66317 A1 SG 66317A1 SG 1996010249 A SG1996010249 A SG 1996010249A SG 1996010249 A SG1996010249 A SG 1996010249A SG 66317 A1 SG66317 A1 SG 66317A1
Authority
SG
Singapore
Prior art keywords
semiconductor substrate
producing semiconductor
producing
substrate
semiconductor
Prior art date
Application number
SG1996010249A
Other languages
English (en)
Inventor
Kenji Yamagata
Kiyokumi Sakaguchi
Nobuhiko Sato
Takao Yonehara
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG66317A1 publication Critical patent/SG66317A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76256—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques using silicon etch back techniques, e.g. BESOI, ELTRAN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/0203—Making porous regions on the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76243—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using silicon implanted buried insulating layers, e.g. oxide layers, i.e. SIMOX techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Weting (AREA)
  • Pressure Sensors (AREA)
SG1996010249A 1995-07-13 1996-07-13 Process for producing semiconductor substrate SG66317A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17718995 1995-07-13

Publications (1)

Publication Number Publication Date
SG66317A1 true SG66317A1 (en) 1999-07-20

Family

ID=16026741

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996010249A SG66317A1 (en) 1995-07-13 1996-07-13 Process for producing semiconductor substrate

Country Status (9)

Country Link
US (1) US6103598A (de)
EP (1) EP0753886B1 (de)
KR (1) KR100249456B1 (de)
CN (1) CN1058354C (de)
DE (1) DE69619602T2 (de)
ES (1) ES2171616T3 (de)
MY (1) MY113920A (de)
SG (1) SG66317A1 (de)
TW (1) TW317645B (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7148119B1 (en) 1994-03-10 2006-12-12 Canon Kabushiki Kaisha Process for production of semiconductor substrate
US20030087503A1 (en) * 1994-03-10 2003-05-08 Canon Kabushiki Kaisha Process for production of semiconductor substrate
JP3293736B2 (ja) * 1996-02-28 2002-06-17 キヤノン株式会社 半導体基板の作製方法および貼り合わせ基体
KR970052020A (ko) * 1995-12-30 1997-07-29 김주용 에스 오 아이 기판 제조방법
KR100304161B1 (ko) 1996-12-18 2001-11-30 미다라이 후지오 반도체부재의제조방법
SG71094A1 (en) * 1997-03-26 2000-03-21 Canon Kk Thin film formation using laser beam heating to separate layers
JP3847935B2 (ja) * 1998-01-09 2006-11-22 キヤノン株式会社 多孔質領域の除去方法及び半導体基体の製造方法
JP3218564B2 (ja) * 1998-01-14 2001-10-15 キヤノン株式会社 多孔質領域の除去方法及び半導体基体の製造方法
US6376285B1 (en) * 1998-05-28 2002-04-23 Texas Instruments Incorporated Annealed porous silicon with epitaxial layer for SOI
US20020106874A1 (en) * 1998-07-03 2002-08-08 Masaaki Iwane Crystal growth process, semiconductor device, and its production process
JP2000173976A (ja) * 1998-12-02 2000-06-23 Mitsubishi Electric Corp 半導体装置の製造方法
JP2000223682A (ja) * 1999-02-02 2000-08-11 Canon Inc 基体の処理方法及び半導体基板の製造方法
US6410436B2 (en) * 1999-03-26 2002-06-25 Canon Kabushiki Kaisha Method of cleaning porous body, and process for producing porous body, non-porous film or bonded substrate
US8507361B2 (en) * 2000-11-27 2013-08-13 Soitec Fabrication of substrates with a useful layer of monocrystalline semiconductor material
US6699770B2 (en) * 2001-03-01 2004-03-02 John Tarje Torvik Method of making a hybride substrate having a thin silicon carbide membrane layer
DE10128719A1 (de) * 2001-06-13 2002-12-19 Muehlbauer Ernst Gmbh & Co Kg Zahnärztlicher Abformlöffel
US7535100B2 (en) * 2002-07-12 2009-05-19 The United States Of America As Represented By The Secretary Of The Navy Wafer bonding of thinned electronic materials and circuits to high performance substrates
JP2004103600A (ja) * 2002-09-04 2004-04-02 Canon Inc 基板及びその製造方法
EP1396883A3 (de) * 2002-09-04 2005-11-30 Canon Kabushiki Kaisha Substrat und Herstellungsverfahren dafür
JP2004103855A (ja) * 2002-09-10 2004-04-02 Canon Inc 基板及びその製造方法
JP2004103946A (ja) * 2002-09-11 2004-04-02 Canon Inc 基板及びその製造方法
DE60310026D1 (de) * 2003-01-24 2007-01-11 St Microelectronics Srl Pipeline Analog-Digital-Wandler mit Korrektion von Verstärkungsfehlern zwischen den Stufen
US7198974B2 (en) * 2003-03-05 2007-04-03 Micron Technology, Inc. Micro-mechanically strained semiconductor film
US7220656B2 (en) * 2003-04-29 2007-05-22 Micron Technology, Inc. Strained semiconductor by wafer bonding with misorientation
US7115480B2 (en) * 2003-05-07 2006-10-03 Micron Technology, Inc. Micromechanical strained semiconductor by wafer bonding
US7662701B2 (en) 2003-05-21 2010-02-16 Micron Technology, Inc. Gettering of silicon on insulator using relaxed silicon germanium epitaxial proximity layers
US7273788B2 (en) 2003-05-21 2007-09-25 Micron Technology, Inc. Ultra-thin semiconductors bonded on glass substrates
US7008854B2 (en) * 2003-05-21 2006-03-07 Micron Technology, Inc. Silicon oxycarbide substrates for bonded silicon on insulator
US7439158B2 (en) 2003-07-21 2008-10-21 Micron Technology, Inc. Strained semiconductor by full wafer bonding
US7153753B2 (en) 2003-08-05 2006-12-26 Micron Technology, Inc. Strained Si/SiGe/SOI islands and processes of making same
US20050132332A1 (en) * 2003-12-12 2005-06-16 Abhay Sathe Multi-location coordinated test apparatus
US7354863B2 (en) * 2004-03-19 2008-04-08 Micron Technology, Inc. Methods of selectively removing silicon
US7544584B2 (en) 2006-02-16 2009-06-09 Micron Technology, Inc. Localized compressive strained semiconductor
EP1926132A1 (de) * 2006-11-23 2008-05-28 S.O.I.Tec Silicon on Insulator Technologies Chromfreie Ätzlösung für Si-Substrate und SiGe-substrate, Verfahren zum Präparieren von Defekten diese Ätzlösung verwendend und Verfahren zum Behnadeln von Si-Substraten und SiGe-Substraten
CN100440489C (zh) * 2006-11-28 2008-12-03 北京大学 一种多孔硅片及其制备方法
RU2461090C1 (ru) * 2010-12-23 2012-09-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Кабардино-Балкарский государственный университет им. Х.М. Бербекова" (КБГУ) Способ изготовления полупроводниковой структуры
CN102169552A (zh) * 2011-01-28 2011-08-31 上海集成电路研发中心有限公司 射频识别标签及其制造方法
US20190131454A1 (en) * 2017-11-01 2019-05-02 Qualcomm Incorporated Semiconductor device with strained silicon layers on porous silicon
TWI683351B (zh) * 2017-12-14 2020-01-21 新唐科技股份有限公司 半導體裝置及其形成方法
WO2020245423A1 (en) * 2019-06-06 2020-12-10 Iqe Plc Tunable stress compensation in layered structures

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2660064B2 (ja) * 1988-10-02 1997-10-08 キヤノン株式会社 結晶物品及びその形成方法
US5190613A (en) * 1988-10-02 1993-03-02 Canon Kabushiki Kaisha Method for forming crystals
US5290712A (en) * 1989-03-31 1994-03-01 Canon Kabushiki Kaisha Process for forming crystalline semiconductor film
JPH03215391A (ja) * 1989-06-26 1991-09-20 Canon Inc 結晶の成長方法
US5278092A (en) * 1989-08-07 1994-01-11 Canon Kabushiki Kaisha Method of forming crystal semiconductor film
US5278093A (en) * 1989-09-23 1994-01-11 Canon Kabushiki Kaisha Method for forming semiconductor thin film
JP2695488B2 (ja) * 1989-10-09 1997-12-24 キヤノン株式会社 結晶の成長方法
US5363793A (en) * 1990-04-06 1994-11-15 Canon Kabushiki Kaisha Method for forming crystals
ATE259098T1 (de) * 1990-08-03 2004-02-15 Canon Kk Verfahren zur herstellung eines soi-substrats
JP2608351B2 (ja) * 1990-08-03 1997-05-07 キヤノン株式会社 半導体部材及び半導体部材の製造方法
US5403751A (en) * 1990-11-29 1995-04-04 Canon Kabushiki Kaisha Process for producing a thin silicon solar cell
US5403771A (en) * 1990-12-26 1995-04-04 Canon Kabushiki Kaisha Process for producing a solar cell by means of epitaxial growth process
JP3347354B2 (ja) * 1991-02-15 2002-11-20 キヤノン株式会社 エッチング方法および半導体基材の作製方法
SG93197A1 (en) * 1991-02-15 2002-12-17 Canon Kk Etching solution for etching porous silicon, etching method using the etching solution and method of preparing semiconductor member using the etching solution
TW211621B (de) * 1991-07-31 1993-08-21 Canon Kk
EP1043768B1 (de) * 1992-01-30 2004-09-08 Canon Kabushiki Kaisha Herstellungsverfahren für Halbleitersubstrate
JP3261685B2 (ja) * 1992-01-31 2002-03-04 キヤノン株式会社 半導体素子基体及びその作製方法

Also Published As

Publication number Publication date
CN1058354C (zh) 2000-11-08
TW317645B (de) 1997-10-11
DE69619602D1 (de) 2002-04-11
EP0753886A1 (de) 1997-01-15
DE69619602T2 (de) 2002-08-08
US6103598A (en) 2000-08-15
EP0753886B1 (de) 2002-03-06
ES2171616T3 (es) 2002-09-16
CN1149758A (zh) 1997-05-14
KR100249456B1 (ko) 2000-03-15
MY113920A (en) 2002-06-29

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