SG65092A1 - Substrate processing apparatus substrate support apparatus substrate processing method and substrate fabrication method - Google Patents

Substrate processing apparatus substrate support apparatus substrate processing method and substrate fabrication method

Info

Publication number
SG65092A1
SG65092A1 SG1998003112A SG1998003112A SG65092A1 SG 65092 A1 SG65092 A1 SG 65092A1 SG 1998003112 A SG1998003112 A SG 1998003112A SG 1998003112 A SG1998003112 A SG 1998003112A SG 65092 A1 SG65092 A1 SG 65092A1
Authority
SG
Singapore
Prior art keywords
substrate
substrate processing
support apparatus
fabrication method
processing apparatus
Prior art date
Application number
SG1998003112A
Other languages
English (en)
Inventor
Toru Takisawa
Takao Yonehara
Kenji Yamagata
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG65092A1 publication Critical patent/SG65092A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
SG1998003112A 1997-08-27 1998-08-17 Substrate processing apparatus substrate support apparatus substrate processing method and substrate fabrication method SG65092A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9231132A JPH1174164A (ja) 1997-08-27 1997-08-27 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法

Publications (1)

Publication Number Publication Date
SG65092A1 true SG65092A1 (en) 1999-05-25

Family

ID=16918791

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998003112A SG65092A1 (en) 1997-08-27 1998-08-17 Substrate processing apparatus substrate support apparatus substrate processing method and substrate fabrication method

Country Status (8)

Country Link
US (2) US6451670B1 (ja)
EP (1) EP0899778A3 (ja)
JP (1) JPH1174164A (ja)
KR (1) KR100396014B1 (ja)
CN (1) CN1209644A (ja)
AU (1) AU732569B2 (ja)
SG (1) SG65092A1 (ja)
TW (1) TW480617B (ja)

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CN109075037B (zh) * 2016-02-16 2023-11-07 Ev 集团 E·索尔纳有限责任公司 用于接合衬底的方法与设备
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Also Published As

Publication number Publication date
US6706618B2 (en) 2004-03-16
EP0899778A3 (en) 2001-03-21
EP0899778A2 (en) 1999-03-03
AU8190298A (en) 1999-03-11
TW480617B (en) 2002-03-21
CN1209644A (zh) 1999-03-03
KR19990023901A (ko) 1999-03-25
KR100396014B1 (ko) 2003-10-17
US6451670B1 (en) 2002-09-17
US20020034859A1 (en) 2002-03-21
JPH1174164A (ja) 1999-03-16
US20020182038A1 (en) 2002-12-05
AU732569B2 (en) 2001-04-26

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