SG43928A1 - Single in-line memory module - Google Patents

Single in-line memory module

Info

Publication number
SG43928A1
SG43928A1 SG1996005845A SG1996005845A SG43928A1 SG 43928 A1 SG43928 A1 SG 43928A1 SG 1996005845 A SG1996005845 A SG 1996005845A SG 1996005845 A SG1996005845 A SG 1996005845A SG 43928 A1 SG43928 A1 SG 43928A1
Authority
SG
Singapore
Prior art keywords
memory module
line memory
line
module
memory
Prior art date
Application number
SG1996005845A
Other languages
English (en)
Inventor
Andreas Bechtolsheim
Edward Frank
James Testa
Shawn Storm
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Publication of SG43928A1 publication Critical patent/SG43928A1/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09645Patterning on via walls; Plural lands around one hole
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1572Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00Electrical connectors
    • Y10S439/951PCB having detailed leading edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dram (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Credit Cards Or The Like (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • Memory System (AREA)
SG1996005845A 1992-05-19 1993-04-28 Single in-line memory module SG43928A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/886,413 US5270964A (en) 1992-05-19 1992-05-19 Single in-line memory module

Publications (1)

Publication Number Publication Date
SG43928A1 true SG43928A1 (en) 1997-11-14

Family

ID=25389005

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996005845A SG43928A1 (en) 1992-05-19 1993-04-28 Single in-line memory module

Country Status (6)

Country Link
US (5) US5270964A (fr)
EP (4) EP0926681A3 (fr)
JP (1) JPH06348588A (fr)
KR (1) KR100235222B1 (fr)
DE (1) DE69326189T2 (fr)
SG (1) SG43928A1 (fr)

Families Citing this family (166)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270964A (en) * 1992-05-19 1993-12-14 Sun Microsystems, Inc. Single in-line memory module
US5446860A (en) * 1993-01-11 1995-08-29 Hewlett-Packard Company Apparatus for determining a computer memory configuration of memory modules using presence detect bits shifted serially into a configuration register
US5375084A (en) * 1993-11-08 1994-12-20 International Business Machines Corporation Selectable interface between memory controller and memory simms
JP3077866B2 (ja) * 1993-11-18 2000-08-21 日本電気株式会社 メモリモジュール
US5502621A (en) * 1994-03-31 1996-03-26 Hewlett-Packard Company Mirrored pin assignment for two sided multi-chip layout
GB9410208D0 (en) * 1994-05-21 1994-07-06 Simpson Gareth D Memory module
DE4423567C2 (de) * 1994-07-05 1998-09-03 Siemens Ag Modulkarte
US5513135A (en) * 1994-12-02 1996-04-30 International Business Machines Corporation Synchronous memory packaged in single/dual in-line memory module and method of fabrication
US5577236A (en) * 1994-12-30 1996-11-19 International Business Machines Corporation Memory controller for reading data from synchronous RAM
KR0144035B1 (ko) * 1995-03-07 1998-08-17 김주용 전전자 교환기내 상위 제어계의 d-램 모듈 접속방법
US5686730A (en) * 1995-05-15 1997-11-11 Silicon Graphics, Inc. Dimm pair with data memory and state memory
IN188196B (fr) * 1995-05-15 2002-08-31 Silicon Graphics Inc
AU1051697A (en) * 1995-11-13 1997-06-05 Intel Corporation A dual-in-line universal serial bus connector
US5745914A (en) * 1996-02-09 1998-04-28 International Business Machines Corporation Technique for converting system signals from one address configuration to a different address configuration
US5661677A (en) 1996-05-15 1997-08-26 Micron Electronics, Inc. Circuit and method for on-board programming of PRD Serial EEPROMS
US5802395A (en) * 1996-07-08 1998-09-01 International Business Machines Corporation High density memory modules with improved data bus performance
US5815426A (en) * 1996-08-13 1998-09-29 Nexcom Technology, Inc. Adapter for interfacing an insertable/removable digital memory apparatus to a host data part
US5877975A (en) * 1996-08-13 1999-03-02 Nexcom Technology, Inc. Insertable/removable digital memory apparatus and methods of operation thereof
US5831890A (en) * 1996-12-16 1998-11-03 Sun Microsystems, Inc. Single in-line memory module having on-board regulation circuits
EP0880142B1 (fr) * 1997-05-20 2011-04-27 Bull S.A. Mémoire dynamique à accès aléatoire à configuration variable pour système de traitement de données et support d'expansion correspondant pour une configuration bloc de mémoire entrelacée
US6286062B1 (en) * 1997-07-01 2001-09-04 Micron Technology, Inc. Pipelined packet-oriented memory system having a unidirectional command and address bus and a bidirectional data bus
US6067594A (en) 1997-09-26 2000-05-23 Rambus, Inc. High frequency bus system
US6108228A (en) * 1997-12-02 2000-08-22 Micron Technology, Inc. Quad in-line memory module
US6349051B1 (en) 1998-01-29 2002-02-19 Micron Technology, Inc. High speed data bus
US6721860B2 (en) * 1998-01-29 2004-04-13 Micron Technology, Inc. Method for bus capacitance reduction
US6108730A (en) 1998-02-27 2000-08-22 International Business Machines Corporation Memory card adapter insertable into a motherboard memory card socket comprising a memory card receiving socket having the same configuration as the motherboard memory card socket
US6142830A (en) * 1998-03-06 2000-11-07 Siemens Aktiengesellschaft Signaling improvement using extended transmission lines on high speed DIMMS
US5870325A (en) * 1998-04-14 1999-02-09 Silicon Graphics, Inc. Memory system with multiple addressing and control busses
US5953243A (en) * 1998-09-30 1999-09-14 International Business Machines Corporation Memory module identification
US6347394B1 (en) * 1998-11-04 2002-02-12 Micron Technology, Inc. Buffering circuit embedded in an integrated circuit device module used for buffering clocks and other input signals
KR100355223B1 (ko) * 1999-01-07 2002-10-09 삼성전자 주식회사 멀티 인라인 메모리 모듈 및 그와 결합되는 전자 부품 소켓
US6324071B2 (en) 1999-01-14 2001-11-27 Micron Technology, Inc. Stacked printed circuit board memory module
US6327690B1 (en) 1999-02-04 2001-12-04 Intel Corporation Integrated reed-solomon error correction code encoder and syndrome generator
US6115278A (en) 1999-02-09 2000-09-05 Silicon Graphics, Inc. Memory system with switching for data isolation
US6338144B2 (en) 1999-02-19 2002-01-08 Sun Microsystems, Inc. Computer system providing low skew clock signals to a synchronous memory unit
US6315614B1 (en) 1999-04-16 2001-11-13 Sun Microsystems, Inc. Memory module with offset notches for improved insertion and stability and memory module connector
US6414868B1 (en) 1999-06-07 2002-07-02 Sun Microsystems, Inc. Memory expansion module including multiple memory banks and a bank control circuit
US6574746B1 (en) 1999-07-02 2003-06-03 Sun Microsystems, Inc. System and method for improving multi-bit error protection in computer memory systems
US6408356B1 (en) 1999-11-16 2002-06-18 International Business Machines Corporation Apparatus and method for modifying signals from a CPU to a memory card
US6683372B1 (en) * 1999-11-18 2004-01-27 Sun Microsystems, Inc. Memory expansion module with stacked memory packages and a serial storage unit
US6288898B1 (en) 1999-12-20 2001-09-11 Dell Usa, L.P. Apparatus for mounting and cooling a system components in a computer
TW523658B (en) * 2000-04-29 2003-03-11 Samsung Electronics Co Ltd Memory modules having conductors at edges thereof and configured to conduct signals to and from the memory modules via the respective edges
US6791555B1 (en) 2000-06-23 2004-09-14 Micron Technology, Inc. Apparatus and method for distributed memory control in a graphics processing system
GB2366468B (en) * 2000-08-25 2005-03-02 Hewlett Packard Co Improvements relating to document transmission techniques I
GB2366469B (en) * 2000-08-25 2005-02-23 Hewlett Packard Co Improvements relating to document transmission techniques II
GB2366470B (en) * 2000-08-25 2005-07-20 Hewlett Packard Co Improvements relating to document transmission techniques iv
TW528948B (en) * 2000-09-14 2003-04-21 Intel Corp Memory module having buffer for isolating stacked memory devices
US6487102B1 (en) 2000-09-18 2002-11-26 Intel Corporation Memory module having buffer for isolating stacked memory devices
US6658530B1 (en) * 2000-10-12 2003-12-02 Sun Microsystems, Inc. High-performance memory module
US6725314B1 (en) 2001-03-30 2004-04-20 Sun Microsystems, Inc. Multi-bank memory subsystem employing an arrangement of multiple memory modules
US6721185B2 (en) 2001-05-01 2004-04-13 Sun Microsystems, Inc. Memory module having balanced data I/O contacts pads
US6714433B2 (en) 2001-06-15 2004-03-30 Sun Microsystems, Inc. Memory module with equal driver loading
US6843421B2 (en) 2001-08-13 2005-01-18 Matrix Semiconductor, Inc. Molded memory module and method of making the module absent a substrate support
US6674644B2 (en) 2001-11-01 2004-01-06 Sun Microsystems, Inc. Module and connector having multiple contact rows
US20030101312A1 (en) * 2001-11-26 2003-05-29 Doan Trung T. Machine state storage apparatus and method
US6731011B2 (en) 2002-02-19 2004-05-04 Matrix Semiconductor, Inc. Memory module having interconnected and stacked integrated circuits
US6771536B2 (en) 2002-02-27 2004-08-03 Sandisk Corporation Operating techniques for reducing program and read disturbs of a non-volatile memory
US6751113B2 (en) * 2002-03-07 2004-06-15 Netlist, Inc. Arrangement of integrated circuits in a memory module
US7076408B1 (en) * 2002-04-03 2006-07-11 Yazaki North America Method for ensuring consistent protocol in the location of circuits and connectors having multiple circuit-receiving cavities
US7133972B2 (en) 2002-06-07 2006-11-07 Micron Technology, Inc. Memory hub with internal cache and/or memory access prediction
US7200024B2 (en) 2002-08-02 2007-04-03 Micron Technology, Inc. System and method for optically interconnecting memory devices
US7117316B2 (en) 2002-08-05 2006-10-03 Micron Technology, Inc. Memory hub and access method having internal row caching
US7254331B2 (en) 2002-08-09 2007-08-07 Micron Technology, Inc. System and method for multiple bit optical data transmission in memory systems
US7149874B2 (en) 2002-08-16 2006-12-12 Micron Technology, Inc. Memory hub bypass circuit and method
US6820181B2 (en) 2002-08-29 2004-11-16 Micron Technology, Inc. Method and system for controlling memory accesses to memory modules having a memory hub architecture
US7836252B2 (en) 2002-08-29 2010-11-16 Micron Technology, Inc. System and method for optimizing interconnections of memory devices in a multichip module
US7102907B2 (en) 2002-09-09 2006-09-05 Micron Technology, Inc. Wavelength division multiplexed memory module, memory system and method
KR100505641B1 (ko) * 2002-09-10 2005-08-03 삼성전자주식회사 메모리 모듈 및 이를 구비하는 메모리 시스템
US6996686B2 (en) * 2002-12-23 2006-02-07 Sun Microsystems, Inc. Memory subsystem including memory modules having multiple banks
US6812555B2 (en) * 2003-03-10 2004-11-02 Everstone Industry Corp. Memory card substrate with alternating contacts
US6982892B2 (en) * 2003-05-08 2006-01-03 Micron Technology, Inc. Apparatus and methods for a physical layout of simultaneously sub-accessible memory modules
US6947304B1 (en) 2003-05-12 2005-09-20 Pericon Semiconductor Corp. DDR memory modules with input buffers driving split traces with trace-impedance matching at trace junctions
US7245145B2 (en) 2003-06-11 2007-07-17 Micron Technology, Inc. Memory module and method having improved signal routing topology
US7120727B2 (en) 2003-06-19 2006-10-10 Micron Technology, Inc. Reconfigurable memory module and method
US7428644B2 (en) 2003-06-20 2008-09-23 Micron Technology, Inc. System and method for selective memory module power management
US7260685B2 (en) 2003-06-20 2007-08-21 Micron Technology, Inc. Memory hub and access method having internal prefetch buffers
US7107415B2 (en) 2003-06-20 2006-09-12 Micron Technology, Inc. Posted write buffers and methods of posting write requests in memory modules
KR100568537B1 (ko) 2003-06-24 2006-04-07 삼성전자주식회사 버퍼드 메모리 모듈
US7389364B2 (en) 2003-07-22 2008-06-17 Micron Technology, Inc. Apparatus and method for direct memory access in a hub-based memory system
ATE498219T1 (de) * 2003-07-28 2011-02-15 Sandisk Secure Content Solutions Inc Elektrischer verbinder
WO2005015564A1 (fr) * 2003-08-06 2005-02-17 Netlist, Inc. Modules memoire en ligne non normalises comprenant plus de deux rangees de memoire par module et plusieurs dispositifs de detection de la presence en serie permettant de simuler plusieurs modules
US7210059B2 (en) 2003-08-19 2007-04-24 Micron Technology, Inc. System and method for on-board diagnostics of memory modules
US7133991B2 (en) 2003-08-20 2006-11-07 Micron Technology, Inc. Method and system for capturing and bypassing memory transactions in a hub-based memory system
US7136958B2 (en) 2003-08-28 2006-11-14 Micron Technology, Inc. Multiple processor system and method including multiple memory hub modules
US20050050237A1 (en) * 2003-08-28 2005-03-03 Jeddeloh Joseph M. Memory module and method having on-board data search capabilities and processor-based system using such memory modules
US7310752B2 (en) 2003-09-12 2007-12-18 Micron Technology, Inc. System and method for on-board timing margin testing of memory modules
US7194593B2 (en) 2003-09-18 2007-03-20 Micron Technology, Inc. Memory hub with integrated non-volatile memory
US7120743B2 (en) 2003-10-20 2006-10-10 Micron Technology, Inc. Arbitration system and method for memory responses in a hub-based memory system
US7177211B2 (en) * 2003-11-13 2007-02-13 Intel Corporation Memory channel test fixture and method
US7330992B2 (en) 2003-12-29 2008-02-12 Micron Technology, Inc. System and method for read synchronization of memory modules
US8250295B2 (en) 2004-01-05 2012-08-21 Smart Modular Technologies, Inc. Multi-rank memory module that emulates a memory module having a different number of ranks
US20050018495A1 (en) * 2004-01-29 2005-01-27 Netlist, Inc. Arrangement of integrated circuits in a memory module
US7188219B2 (en) 2004-01-30 2007-03-06 Micron Technology, Inc. Buffer control system and method for a memory system having outstanding read and write request buffers
US7788451B2 (en) 2004-02-05 2010-08-31 Micron Technology, Inc. Apparatus and method for data bypass for a bi-directional data bus in a hub-based memory sub-system
US7412574B2 (en) 2004-02-05 2008-08-12 Micron Technology, Inc. System and method for arbitration of memory responses in a hub-based memory system
US7181584B2 (en) * 2004-02-05 2007-02-20 Micron Technology, Inc. Dynamic command and/or address mirroring system and method for memory modules
US7289386B2 (en) 2004-03-05 2007-10-30 Netlist, Inc. Memory module decoder
US7916574B1 (en) 2004-03-05 2011-03-29 Netlist, Inc. Circuit providing load isolation and memory domain translation for memory module
US7366864B2 (en) 2004-03-08 2008-04-29 Micron Technology, Inc. Memory hub architecture having programmable lane widths
US7257683B2 (en) 2004-03-24 2007-08-14 Micron Technology, Inc. Memory arbitration system and method having an arbitration packet protocol
US7120723B2 (en) 2004-03-25 2006-10-10 Micron Technology, Inc. System and method for memory hub-based expansion bus
US7447240B2 (en) 2004-03-29 2008-11-04 Micron Technology, Inc. Method and system for synchronizing communications links in a hub-based memory system
US7213082B2 (en) 2004-03-29 2007-05-01 Micron Technology, Inc. Memory hub and method for providing memory sequencing hints
US6980042B2 (en) 2004-04-05 2005-12-27 Micron Technology, Inc. Delay line synchronizer apparatus and method
US7590797B2 (en) 2004-04-08 2009-09-15 Micron Technology, Inc. System and method for optimizing interconnections of components in a multichip memory module
US7162567B2 (en) 2004-05-14 2007-01-09 Micron Technology, Inc. Memory hub and method for memory sequencing
US7222213B2 (en) 2004-05-17 2007-05-22 Micron Technology, Inc. System and method for communicating the synchronization status of memory modules during initialization of the memory modules
US7363419B2 (en) 2004-05-28 2008-04-22 Micron Technology, Inc. Method and system for terminating write commands in a hub-based memory system
US7310748B2 (en) 2004-06-04 2007-12-18 Micron Technology, Inc. Memory hub tester interface and method for use thereof
US7519788B2 (en) 2004-06-04 2009-04-14 Micron Technology, Inc. System and method for an asynchronous data buffer having buffer write and read pointers
US7289332B2 (en) * 2004-06-16 2007-10-30 Liberty University Mirror image electrical packages and system for using same
US7539800B2 (en) * 2004-07-30 2009-05-26 International Business Machines Corporation System, method and storage medium for providing segment level sparing
US7389375B2 (en) 2004-07-30 2008-06-17 International Business Machines Corporation System, method and storage medium for a multi-mode memory buffer device
US7296129B2 (en) 2004-07-30 2007-11-13 International Business Machines Corporation System, method and storage medium for providing a serialized memory interface with a bus repeater
US7224595B2 (en) * 2004-07-30 2007-05-29 International Business Machines Corporation 276-Pin buffered memory module with enhanced fault tolerance
US7392331B2 (en) 2004-08-31 2008-06-24 Micron Technology, Inc. System and method for transmitting data packets in a computer system having a memory hub architecture
KR100585158B1 (ko) 2004-09-13 2006-05-30 삼성전자주식회사 Ecc 메모리 모듈
US7353437B2 (en) * 2004-10-29 2008-04-01 Micron Technology, Inc. System and method for testing a memory for a memory failure exhibited by a failing memory
US7277988B2 (en) * 2004-10-29 2007-10-02 International Business Machines Corporation System, method and storage medium for providing data caching and data compression in a memory subsystem
US7441060B2 (en) 2004-10-29 2008-10-21 International Business Machines Corporation System, method and storage medium for providing a service interface to a memory system
US7299313B2 (en) 2004-10-29 2007-11-20 International Business Machines Corporation System, method and storage medium for a memory subsystem command interface
US7305574B2 (en) 2004-10-29 2007-12-04 International Business Machines Corporation System, method and storage medium for bus calibration in a memory subsystem
US7331010B2 (en) 2004-10-29 2008-02-12 International Business Machines Corporation System, method and storage medium for providing fault detection and correction in a memory subsystem
US7356737B2 (en) 2004-10-29 2008-04-08 International Business Machines Corporation System, method and storage medium for testing a memory module
US7395476B2 (en) 2004-10-29 2008-07-01 International Business Machines Corporation System, method and storage medium for providing a high speed test interface to a memory subsystem
US7512762B2 (en) 2004-10-29 2009-03-31 International Business Machines Corporation System, method and storage medium for a memory subsystem with positional read data latency
US7172465B2 (en) * 2005-02-22 2007-02-06 Micron Technology, Inc. Edge connector including internal layer contact, printed circuit board and electronic module incorporating same
US7478307B1 (en) 2005-05-19 2009-01-13 Sun Microsystems, Inc. Method for improving un-correctable errors in a computer system
US7464225B2 (en) 2005-09-26 2008-12-09 Rambus Inc. Memory module including a plurality of integrated circuit memory devices and a plurality of buffer devices in a matrix topology
US7562271B2 (en) 2005-09-26 2009-07-14 Rambus Inc. Memory system topologies including a buffer device and an integrated circuit memory device
US11328764B2 (en) 2005-09-26 2022-05-10 Rambus Inc. Memory system topologies including a memory die stack
DE102005051497B3 (de) * 2005-10-26 2006-12-07 Infineon Technologies Ag Speichermodul mit einer elektronischen Leiterplatte und einer Mehrzahl von gleichartigen Halbleiterchips
US7478259B2 (en) 2005-10-31 2009-01-13 International Business Machines Corporation System, method and storage medium for deriving clocks in a memory system
US7685392B2 (en) 2005-11-28 2010-03-23 International Business Machines Corporation Providing indeterminate read data latency in a memory system
JP4945125B2 (ja) * 2005-12-21 2012-06-06 ラピスセミコンダクタ株式会社 メモリ制御装置
US7636813B2 (en) * 2006-05-22 2009-12-22 International Business Machines Corporation Systems and methods for providing remote pre-fetch buffers
US7594055B2 (en) 2006-05-24 2009-09-22 International Business Machines Corporation Systems and methods for providing distributed technology independent memory controllers
US7640386B2 (en) 2006-05-24 2009-12-29 International Business Machines Corporation Systems and methods for providing memory modules with multiple hub devices
US7584336B2 (en) * 2006-06-08 2009-09-01 International Business Machines Corporation Systems and methods for providing data modification operations in memory subsystems
US7493439B2 (en) 2006-08-01 2009-02-17 International Business Machines Corporation Systems and methods for providing performance monitoring in a memory system
US7669086B2 (en) 2006-08-02 2010-02-23 International Business Machines Corporation Systems and methods for providing collision detection in a memory system
US7581073B2 (en) * 2006-08-09 2009-08-25 International Business Machines Corporation Systems and methods for providing distributed autonomous power management in a memory system
US7587559B2 (en) 2006-08-10 2009-09-08 International Business Machines Corporation Systems and methods for memory module power management
US7539842B2 (en) 2006-08-15 2009-05-26 International Business Machines Corporation Computer memory system for selecting memory buses according to physical memory organization information stored in virtual address translation tables
US7490217B2 (en) 2006-08-15 2009-02-10 International Business Machines Corporation Design structure for selecting memory busses according to physical memory organization information stored in virtual address translation tables
US7870459B2 (en) 2006-10-23 2011-01-11 International Business Machines Corporation High density high reliability memory module with power gating and a fault tolerant address and command bus
US7477522B2 (en) * 2006-10-23 2009-01-13 International Business Machines Corporation High density high reliability memory module with a fault tolerant address and command bus
US7721140B2 (en) 2007-01-02 2010-05-18 International Business Machines Corporation Systems and methods for improving serviceability of a memory system
KR100834826B1 (ko) * 2007-01-25 2008-06-03 삼성전자주식회사 취급손상을 줄인 집적회로 모듈의 구조 및 모듈의 종단저항 배치방법
US7606988B2 (en) 2007-01-29 2009-10-20 International Business Machines Corporation Systems and methods for providing a dynamic memory bank page policy
US7603526B2 (en) 2007-01-29 2009-10-13 International Business Machines Corporation Systems and methods for providing dynamic memory pre-fetch
KR101013900B1 (ko) * 2007-12-17 2011-02-14 기아자동차주식회사 차량의 통합조작스위치
US8516185B2 (en) 2009-07-16 2013-08-20 Netlist, Inc. System and method utilizing distributed byte-wise buffers on a memory module
US8154901B1 (en) 2008-04-14 2012-04-10 Netlist, Inc. Circuit providing load isolation and noise reduction
KR20100030126A (ko) 2008-09-09 2010-03-18 삼성전자주식회사 메모리 장치 및 그를 포함하는 전자 장치
US9128632B2 (en) 2009-07-16 2015-09-08 Netlist, Inc. Memory module with distributed data buffers and method of operation
JP2011049216A (ja) * 2009-08-25 2011-03-10 Elpida Memory Inc 回路基板及びこれを備える半導体装置、メモリモジュール、メモリシステム、並びに、回路基板の製造方法
US9142926B2 (en) * 2010-07-19 2015-09-22 Chou Hsien Tsai Electrical connector for bidirectional plug insertion
KR101796116B1 (ko) 2010-10-20 2017-11-10 삼성전자 주식회사 반도체 장치, 이를 포함하는 메모리 모듈, 메모리 시스템 및 그 동작방법
WO2012061633A2 (fr) 2010-11-03 2012-05-10 Netlist, Inc. Procédé et appareil pour optimiser la charge d'un pilote dans un ensemble de mémoires
CN104871654B (zh) * 2012-12-18 2018-04-06 日本电气株式会社 电子基板及其接头连接的结构
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US20140268621A1 (en) * 2013-03-15 2014-09-18 Wintec Industries, Inc. Edge Mounting for Printed Circuit
US8992247B2 (en) * 2013-03-15 2015-03-31 Ortronics, Inc. Multi-surface contact plug assemblies, systems and methods
CN105706064B (zh) 2013-07-27 2019-08-27 奈特力斯股份有限公司 具有本地分别同步的内存模块
WO2018119987A1 (fr) * 2016-12-30 2018-07-05 Intel Corporation Modules de mémoire à double ligne et connecteurs pour une performance de système accrue

Family Cites Families (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3161859A (en) * 1961-01-12 1964-12-15 Rca Corp Modular memory structures
US3508209A (en) * 1966-03-31 1970-04-21 Ibm Monolithic integrated memory array structure including fabrication and package therefor
US3680038A (en) * 1970-04-28 1972-07-25 Teradyne Inc Electrical connector with vibration resistance
US3671917A (en) * 1970-05-20 1972-06-20 Ammon & Champion Co Inc Printed circuit board connector
US3701078A (en) * 1971-02-04 1972-10-24 Amp Inc Bussing connector
JPS5544429B2 (fr) * 1973-05-11 1980-11-12
US3982807A (en) * 1975-03-27 1976-09-28 International Telephone And Telegraph Corporation Zero force printed circuit board connector
US4077694A (en) * 1975-06-24 1978-03-07 Amp Incorporated Circuit board connector
US4164751A (en) * 1976-11-10 1979-08-14 Texas Instruments Incorporated High capacity dynamic ram cell
US4084874A (en) * 1977-06-27 1978-04-18 Gte Automatic Electric Laboratories Incorporated Low insertion force connector
US4163289A (en) * 1978-05-01 1979-07-31 Texas Instruments Incorporated Sixteen bit microcomputer memory boards for use with eight bit standard connector bus
JPS5567993A (en) * 1978-11-14 1980-05-22 Fujitsu Ltd Semiconductor memory unit
US4426689A (en) * 1979-03-12 1984-01-17 International Business Machines Corporation Vertical semiconductor integrated circuit chip packaging
EP0020116B1 (fr) * 1979-05-24 1984-03-14 Fujitsu Limited Dispositif semiconducteur du type "MASTERSLICE" et procédé de fabrication
DE2948159C2 (de) * 1979-11-29 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Integrierter Speicherbaustein mit wählbaren Betriebsfunktionen
US4253719A (en) * 1980-01-28 1981-03-03 Methode Electronics, Inc. Electrical edge connector
US4426773A (en) * 1981-05-15 1984-01-24 General Electric Ceramics, Inc. Array of electronic packaging substrates
US4428635A (en) * 1982-02-24 1984-01-31 Amp Incorporated One piece zif connector
JPS58159360A (ja) * 1982-03-17 1983-09-21 Fujitsu Ltd 半導体装置
US4548456A (en) * 1982-12-21 1985-10-22 Burroughs Corporation Printed circuit board edge connectors
JPS59144155A (ja) * 1983-02-08 1984-08-18 Nec Corp 集積回路パツケ−ジ
US4727513A (en) * 1983-09-02 1988-02-23 Wang Laboratories, Inc. Signal in-line memory module
US4656605A (en) * 1983-09-02 1987-04-07 Wang Laboratories, Inc. Single in-line memory module
US4651416A (en) * 1983-10-31 1987-03-24 Depaul Albert D Printed circuits
US4842538A (en) * 1983-11-23 1989-06-27 Burndy Corporation Low insertion force circuit board connector assembly
US4781612A (en) * 1983-12-14 1988-11-01 Amp Incorporated Socket for single in-line memory module
US4558912A (en) * 1983-12-14 1985-12-17 Amp Incorporated Edge connector for chip carrier
KR890004820B1 (ko) * 1984-03-28 1989-11-27 인터내셔널 비지네스 머신즈 코포레이션 배저장밀도의 메모리 모듈 및 보드와 그 형성방법
US4724531A (en) * 1984-07-18 1988-02-09 Hughes Aircraft Company Gate array with bidirectional symmetry
US4777590A (en) * 1984-10-29 1988-10-11 Pictorial, Inc. Portable computer
US4604743A (en) * 1984-11-21 1986-08-05 North American Philips Corporation Bus structure for an image processor
NL8500587A (nl) * 1985-03-01 1986-10-01 Du Pont Nederland Kaartleeshouder.
US4850892A (en) * 1985-12-16 1989-07-25 Wang Laboratories, Inc. Connecting apparatus for electrically connecting memory modules to a printed circuit board
JPS62155546A (ja) * 1985-12-27 1987-07-10 Toshiba Corp メモリ−モジユ−ル
JPS62192086A (ja) * 1986-02-18 1987-08-22 Matsushita Electronics Corp 半導体記憶装置
US4695111A (en) * 1986-04-10 1987-09-22 Amp Incorporated Zero insertion force connector having wiping action
JPS62260244A (ja) * 1986-05-06 1987-11-12 Nintendo Co Ltd メモリカ−トリツジ
US4700998A (en) * 1986-08-19 1987-10-20 Northern Telecom Limited Multiple contact connector having a low insertion force
US4740868A (en) * 1986-08-22 1988-04-26 Motorola Inc. Rail bonded multi-chip leadframe, method and package
JPS63239675A (ja) * 1986-11-27 1988-10-05 Toshiba Corp 半導体記憶装置
US4756694A (en) * 1986-12-19 1988-07-12 Amp Incorporated Dual row connector for low profile package
JPS63197083A (ja) * 1987-02-12 1988-08-15 Mitsubishi Electric Corp 記憶素子モジユ−ル
GB2203591A (en) * 1987-04-14 1988-10-19 Plessey Co Plc Semiconductor hybrid device
JPS63296292A (ja) * 1987-05-27 1988-12-02 Mitsubishi Electric Corp 半導体装置
US4771366A (en) * 1987-07-06 1988-09-13 International Business Machines Corporation Ceramic card assembly having enhanced power distribution and cooling
JPS6480032A (en) * 1987-09-21 1989-03-24 Hitachi Maxell Semiconductor device and manufacture thereof
JP2507476B2 (ja) * 1987-09-28 1996-06-12 株式会社東芝 半導体集積回路装置
JPH01175180A (ja) * 1987-12-28 1989-07-11 Yamaichi Electric Mfg Co Ltd 配線基板用コネクタ
JP2509969B2 (ja) * 1988-02-26 1996-06-26 株式会社日立製作所 電子装置
US4891789A (en) * 1988-03-03 1990-01-02 Bull Hn Information Systems, Inc. Surface mounted multilayer memory printed circuit board
US4850891A (en) * 1988-04-04 1989-07-25 Augat Inc. Memory module socket
JP2645068B2 (ja) * 1988-04-08 1997-08-25 株式会社東芝 メモリモジュール
US5307309A (en) * 1988-05-31 1994-04-26 Micron Technology, Inc. Memory module having on-chip surge capacitors
US4882700A (en) * 1988-06-08 1989-11-21 Micron Technology, Inc. Switched memory module
JP2865170B2 (ja) * 1988-07-06 1999-03-08 三菱電機株式会社 電子回路装置
US5138434A (en) * 1991-01-22 1992-08-11 Micron Technology, Inc. Packaging for semiconductor logic devices
US4992850A (en) * 1989-02-15 1991-02-12 Micron Technology, Inc. Directly bonded simm module
GB8823239D0 (en) 1988-10-04 1988-11-09 Gems Of Cambridge Ltd Improved data processing
JPH02186636A (ja) * 1989-01-12 1990-07-20 Seiko Epson Corp 集積回路装置の配線法
US4879631A (en) * 1989-01-18 1989-11-07 Micron Technology, Inc. Short-resistant decoupling capacitor system for semiconductor circuits
EP0382948B1 (fr) * 1989-02-14 2003-10-08 Koninklijke Philips Electronics N.V. Assemblage de bornes d'alimentation pour un circuit intégré
US4992849A (en) * 1989-02-15 1991-02-12 Micron Technology, Inc. Directly bonded board multiple integrated circuit module
JPH02246099A (ja) * 1989-03-20 1990-10-01 Hitachi Ltd 大規模半導体集積回路装置とその欠陥救済法
US5043792A (en) * 1989-04-17 1991-08-27 Nec Corporation Integrated circuit having wiring strips for propagating in-phase signals
JPH02287646A (ja) * 1989-04-27 1990-11-27 Toshiba Corp メモリ拡張方式
US5051994A (en) * 1989-04-28 1991-09-24 International Business Machines Corporation Computer memory module
AU628547B2 (en) * 1989-05-19 1992-09-17 Compaq Computer Corporation Modular computer memory circuit board
US4973270A (en) * 1989-06-02 1990-11-27 Amp Incorporated Circuit panel socket with cloverleaf contact
US4946403A (en) * 1989-08-24 1990-08-07 Amp Incorporated Low insertion force circuit panel socket
US5162979A (en) * 1989-10-23 1992-11-10 International Business Machines Corp. Personal computer processor card interconnect system
US5089993B1 (en) * 1989-09-29 1998-12-01 Texas Instruments Inc Memory module arranged for data and parity bits
US4990107A (en) * 1989-11-17 1991-02-05 Amp Incorporated Integrated circuit module connector assembly
US5191404A (en) * 1989-12-20 1993-03-02 Digital Equipment Corporation High density memory array packaging
CA2031865C (fr) * 1989-12-20 1993-07-20 Andrew L. Wu Encapsulation a grande densite de reseaux de memoire
US5157635A (en) * 1989-12-27 1992-10-20 International Business Machines Corporation Input signal redriver for semiconductor modules
DE69120306T2 (de) * 1990-01-31 1996-10-24 Hewlett Packard Co Systemspeicherinitialisierung mit Anwesenheitserkennungskodierung
US4990097A (en) * 1990-02-21 1991-02-05 Amp Incorporated Electrical connector with module extraction apparatus
JPH03248896A (ja) * 1990-02-28 1991-11-06 Hitachi Ltd Icカード
JPH03262055A (ja) * 1990-03-12 1991-11-21 Toshiba Corp 主記憶装置増設用記憶装置
US5026297A (en) * 1990-06-28 1991-06-25 Molex Incorporated Electrical socket assembly for single in-line circuit package
US5161995A (en) * 1990-07-16 1992-11-10 Molex Incorporated Metal latch for SIMM socket
US5094624A (en) * 1990-12-18 1992-03-10 Molex Incorporated Metal latch for SIMM socket
US5082459A (en) * 1990-08-23 1992-01-21 Amp Incorporated Dual readout simm socket
JPH04130763A (ja) * 1990-09-21 1992-05-01 Toshiba Corp 薄型メモリモジュール
JP2568748B2 (ja) * 1990-10-30 1997-01-08 三菱電機株式会社 半導体装置
US5112242A (en) * 1990-11-20 1992-05-12 Foxconn International, Inc. Durable latch for memory module board
US5169333A (en) * 1991-09-27 1992-12-08 Yang Lee Su Lan Durable latch with mounting peg of memory module socket
JP3082323B2 (ja) * 1991-07-30 2000-08-28 ソニー株式会社 メモリモジュール
US5252857A (en) * 1991-08-05 1993-10-12 International Business Machines Corporation Stacked DCA memory chips
US5145396A (en) * 1991-11-13 1992-09-08 Amphenol Corporation Combo SIMM connector
US5260892A (en) * 1991-11-21 1993-11-09 Sun Microsystems, Inc. High speed electrical signal interconnect structure
US5200917A (en) * 1991-11-27 1993-04-06 Micron Technology, Inc. Stacked printed circuit board device
US5167517A (en) * 1991-12-05 1992-12-01 Long Frank T Ejecting SIMM socket
US5319591A (en) * 1991-12-26 1994-06-07 Oki Electric Industry Co., Ltd. Memory module
US5162970A (en) * 1992-01-27 1992-11-10 American Technical Ceramics Corporation Miniature monolithic ceramic coupler for electronic circuits
US5192220A (en) * 1992-01-31 1993-03-09 Amp Inc. Dual readout extended socket
US5164916A (en) * 1992-03-31 1992-11-17 Digital Equipment Corporation High-density double-sided multi-string memory module with resistor for insertion detection
US5265218A (en) * 1992-05-19 1993-11-23 Sun Microsystems, Inc. Bus architecture for integrated data and video memory
US5270964A (en) * 1992-05-19 1993-12-14 Sun Microsystems, Inc. Single in-line memory module
US5263870A (en) * 1992-12-16 1993-11-23 The Whitaker Corporation Dual read-out SIMM socket for high electrical speed applications
US5272664A (en) * 1993-04-21 1993-12-21 Silicon Graphics, Inc. High memory capacity DRAM SIMM
US5358887A (en) * 1993-11-26 1994-10-25 United Microelectronics Corporation Ulsi mask ROM structure and method of manufacture

Also Published As

Publication number Publication date
EP0926681A2 (fr) 1999-06-30
JPH06348588A (ja) 1994-12-22
DE69326189D1 (de) 1999-10-07
EP0571092A2 (fr) 1993-11-24
US5383148A (en) 1995-01-17
US5270964A (en) 1993-12-14
US5532954A (en) 1996-07-02
US5973951A (en) 1999-10-26
EP0571092B1 (fr) 1999-09-01
EP0813204A3 (fr) 1999-09-29
US5465229A (en) 1995-11-07
EP0813205A2 (fr) 1997-12-17
DE69326189T2 (de) 2000-01-05
KR100235222B1 (ko) 1999-12-15
EP0813204A2 (fr) 1997-12-17
EP0926681A3 (fr) 2000-11-22
EP0813205A3 (fr) 1999-09-29
EP0571092A3 (fr) 1994-01-12

Similar Documents

Publication Publication Date Title
SG43928A1 (en) Single in-line memory module
GB2246219B (en) Single in-line dram memory module
EP0591009A3 (en) Semiconductor memory
GB2264578A8 (en) Nonvolatilte semiconductor memory
EP0555659A3 (en) Multi-chip module
GB2261768B (en) Transistor module
EP0460853A3 (en) Memory system
SG44560A1 (en) Integrated circuit memory
KR0132636B1 (en) Memory device
GB9226382D0 (en) Memory device
GB9315126D0 (en) Opto-electronic memory systems
GB2240415B (en) Memory systems
GB9015578D0 (en) Fermentorbioreactor module
GB2264577B (en) Cache memory system
GB9315125D0 (en) Opto-electronic memory system
GB2283128B (en) Memory device
GB2268657B (en) Video memory
EP0591752A3 (en) Multiport memory
EP0544247A3 (en) Memory architecture
CZ21995A3 (en) Chip module
GB8418183D0 (en) Single in-line memory module
TW309157U (en) Single in-line memory module
GB2283120B (en) Memory circuit
GB9309167D0 (en) Memory system
ZA944631B (en) Termination module