SG179087A1 - Photosensitive resin composition and method for producing photosensitive resin film - Google Patents
Photosensitive resin composition and method for producing photosensitive resin filmInfo
- Publication number
- SG179087A1 SG179087A1 SG2012016986A SG2012016986A SG179087A1 SG 179087 A1 SG179087 A1 SG 179087A1 SG 2012016986 A SG2012016986 A SG 2012016986A SG 2012016986 A SG2012016986 A SG 2012016986A SG 179087 A1 SG179087 A1 SG 179087A1
- Authority
- SG
- Singapore
- Prior art keywords
- photosensitive resin
- resin composition
- inclusive
- weight
- resin film
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Materials For Photolithography (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009209042 | 2009-09-10 | ||
| PCT/JP2010/065293 WO2011030744A1 (ja) | 2009-09-10 | 2010-09-07 | 感光性樹脂組成物および感光性樹脂膜の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG179087A1 true SG179087A1 (en) | 2012-04-27 |
Family
ID=43732416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012016986A SG179087A1 (en) | 2009-09-10 | 2010-09-07 | Photosensitive resin composition and method for producing photosensitive resin film |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP4911248B2 (ja) |
| KR (1) | KR101227280B1 (ja) |
| CN (1) | CN102549497B (ja) |
| SG (1) | SG179087A1 (ja) |
| TW (1) | TWI461846B (ja) |
| WO (1) | WO2011030744A1 (ja) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011242676A (ja) * | 2010-05-20 | 2011-12-01 | Asahi Kasei E-Materials Corp | 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置 |
| JP5691731B2 (ja) * | 2011-03-28 | 2015-04-01 | 日立化成デュポンマイクロシステムズ株式会社 | ネガ型感光性樹脂組成物、パターン形成方法及び電子部品 |
| JP5637043B2 (ja) * | 2011-03-30 | 2014-12-10 | 日本ゼオン株式会社 | 感光性樹脂組成物 |
| SG2014013874A (en) * | 2011-08-18 | 2014-05-29 | Toray Industries | Polyamic acid resin composition, polyimide resin composition, polyimide oxazole resin composition, and flexible substrate containing same |
| CN110147031A (zh) * | 2012-12-20 | 2019-08-20 | 东丽株式会社 | 感光性树脂组合物、耐热性树脂膜的制造方法及显示装置 |
| JP6286834B2 (ja) * | 2013-02-22 | 2018-03-07 | 東レ株式会社 | 耐熱性樹脂組成物および耐熱性樹脂膜の製造方法 |
| CN103304812B (zh) * | 2013-06-06 | 2015-11-25 | 北京京东方光电科技有限公司 | 一种固化树脂、红色光阻剂、彩色滤光片及它们的制备方法、彩色显示器件 |
| CN103304810B (zh) * | 2013-06-06 | 2016-02-10 | 北京京东方光电科技有限公司 | 一种固化树脂、绿色光阻剂、彩色滤光片及它们的制备方法、彩色显示器件 |
| CN103319713B (zh) * | 2013-06-06 | 2015-11-25 | 北京京东方光电科技有限公司 | 一种固化树脂、黑色光阻剂、滤光片及它们的制备方法、显示器件 |
| KR101696963B1 (ko) * | 2013-09-30 | 2017-01-16 | 주식회사 엘지화학 | 감광성 수지 조성물 |
| JP6261285B2 (ja) * | 2013-10-31 | 2018-01-17 | 富士フイルム株式会社 | 積層体、有機半導体製造用キットおよび有機半導体製造用レジスト組成物 |
| KR101728820B1 (ko) | 2013-12-12 | 2017-04-20 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자 |
| JP6459191B2 (ja) * | 2014-03-19 | 2019-01-30 | 東レ株式会社 | 感光性樹脂組成物 |
| KR101612673B1 (ko) * | 2015-03-11 | 2016-04-14 | 동우 화인켐 주식회사 | 네가티브형 감광성 수지 조성물 |
| JP6658514B2 (ja) * | 2015-03-27 | 2020-03-04 | 東レ株式会社 | 薄膜トランジスタ用感光性樹脂組成物、硬化膜の製造方法、薄膜トランジスタの製造方法および液晶表示装置または有機電界発光表示装置の製造方法 |
| SG11201810262XA (en) * | 2016-06-15 | 2018-12-28 | Toray Industries | Photosensitive resin composition |
| CN109476951B (zh) | 2016-08-03 | 2022-07-29 | 日产化学株式会社 | 剥离层形成用组合物和剥离层 |
| KR102654926B1 (ko) * | 2016-08-10 | 2024-04-05 | 삼성디스플레이 주식회사 | 포토레지스트 조성물 및 이를 이용한 금속 패턴의 형성 방법 |
| WO2018043250A1 (ja) * | 2016-08-29 | 2018-03-08 | 東レ株式会社 | 感光性樹脂組成物、硬化膜、有機ｅｌ表示装置、半導体電子部品、半導体装置 |
| TWI600168B (zh) * | 2016-11-02 | 2017-09-21 | 律勝科技股份有限公司 | 薄膜電晶體的積層體結構 |
| US11274064B2 (en) * | 2017-10-20 | 2022-03-15 | Construction Research & Technology Gmbh | Set control composition for cementitious systems |
| KR101933940B1 (ko) * | 2018-01-31 | 2018-12-31 | 동우 화인켐 주식회사 | 착색 감광성 수지 조성물, 이를 이용하여 제조된 블랙 매트릭스 및/또는 컬럼 스페이서를 포함하는 컬러필터 및 컬러필터를 포함하는 화상표시장치 |
| KR20190101576A (ko) * | 2018-02-23 | 2019-09-02 | 동우 화인켐 주식회사 | 감광성 수지 조성물 및 이로부터 형성된 절연막 |
| JP7247655B2 (ja) * | 2018-03-30 | 2023-03-29 | 東レ株式会社 | 感光性樹脂組成物 |
| TWI700319B (zh) * | 2018-05-04 | 2020-08-01 | 新應材股份有限公司 | 正型光阻組成物及使用其之切割道形成方法 |
| CN112689800A (zh) * | 2018-09-11 | 2021-04-20 | 住友电木株式会社 | 永久膜形成用感光性树脂组合物、固化膜、电子装置、固化膜的制造方法和电子装置的制造方法 |
| JP7210999B2 (ja) * | 2018-10-22 | 2023-01-24 | 東レ株式会社 | 樹脂組成物、樹脂シート、硬化膜、硬化膜の製造方法、半導体装置および表示装置 |
| JP6974368B2 (ja) * | 2019-01-11 | 2021-12-01 | エセックス古河マグネットワイヤジャパン株式会社 | 絶縁塗料、及びこれを用いた絶縁電線の製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003043682A (ja) * | 2001-08-01 | 2003-02-13 | Jsr Corp | 感放射線性誘電率変化性組成物、誘電率変化法 |
| JP4333219B2 (ja) * | 2002-05-29 | 2009-09-16 | 東レ株式会社 | 感光性樹脂組成物および耐熱性樹脂膜の製造方法 |
| TWI288296B (en) * | 2002-05-29 | 2007-10-11 | Toray Industries | Optically sensitive resin composition and heat durable resin film |
| US7265182B2 (en) * | 2004-07-09 | 2007-09-04 | E. I. Du Pont De Nemours And Company | Polyamic acid cross-linked polymer and formable composition therefrom |
| JP2006309202A (ja) * | 2005-03-29 | 2006-11-09 | Toray Ind Inc | 感光性樹脂組成物およびそれを用いた半導体装置 |
| JP2008070480A (ja) * | 2006-09-12 | 2008-03-27 | Az Electronic Materials Kk | フォトレジスト用溶媒とそれを用いたスリットコーティング用フォトレジスト組成物 |
| JP4403174B2 (ja) * | 2006-12-25 | 2010-01-20 | Ａｚエレクトロニックマテリアルズ株式会社 | パターン形成方法およびそれに用いる感光性樹脂組成物 |
| KR101128207B1 (ko) * | 2007-04-24 | 2012-03-23 | 미쓰이 가가쿠 가부시키가이샤 | 감광성 수지 조성물, 드라이 필름 및 그것을 이용한 가공품 |
| JP5051371B2 (ja) * | 2007-11-26 | 2012-10-17 | Ｊｓｒ株式会社 | 感放射線性樹脂組成物、液晶表示素子のスペーサーおよび保護膜ならびに液晶表示素子 |
| EP2345933A4 (en) * | 2008-10-20 | 2013-01-23 | Sumitomo Bakelite Co | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING AND PROCESS FOR PRODUCING THROUGH ELECTRODE USING THE SAME |
-
2010
- 2010-09-07 SG SG2012016986A patent/SG179087A1/en unknown
- 2010-09-07 CN CN201080040527.7A patent/CN102549497B/zh active Active
- 2010-09-07 WO PCT/JP2010/065293 patent/WO2011030744A1/ja active Application Filing
- 2010-09-07 JP JP2010536263A patent/JP4911248B2/ja active Active
- 2010-09-07 KR KR1020127005046A patent/KR101227280B1/ko active IP Right Grant
- 2010-09-09 TW TW099130412A patent/TWI461846B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR101227280B1 (ko) | 2013-01-28 |
| JPWO2011030744A1 (ja) | 2013-02-07 |
| CN102549497A (zh) | 2012-07-04 |
| WO2011030744A1 (ja) | 2011-03-17 |
| TW201116930A (en) | 2011-05-16 |
| KR20120028406A (ko) | 2012-03-22 |
| TWI461846B (zh) | 2014-11-21 |
| CN102549497B (zh) | 2013-07-31 |
| JP4911248B2 (ja) | 2012-04-04 |
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