SG11201810262XA - Photosensitive resin composition - Google Patents
Photosensitive resin compositionInfo
- Publication number
- SG11201810262XA SG11201810262XA SG11201810262XA SG11201810262XA SG11201810262XA SG 11201810262X A SG11201810262X A SG 11201810262XA SG 11201810262X A SG11201810262X A SG 11201810262XA SG 11201810262X A SG11201810262X A SG 11201810262XA SG 11201810262X A SG11201810262X A SG 11201810262XA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- photosensitive resin
- photosensitive
- composition
- resin
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016118522 | 2016-06-15 | ||
| PCT/JP2017/021094 WO2017217293A1 (en) | 2016-06-15 | 2017-06-07 | Photosensitive resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201810262XA true SG11201810262XA (en) | 2018-12-28 |
Family
ID=60664107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201810262XA SG11201810262XA (en) | 2016-06-15 | 2017-06-07 | Photosensitive resin composition |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPWO2017217293A1 (en) |
| KR (1) | KR102364136B1 (en) |
| CN (1) | CN109313387B (en) |
| SG (1) | SG11201810262XA (en) |
| TW (1) | TWI726112B (en) |
| WO (1) | WO2017217293A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7180459B2 (en) * | 2018-03-26 | 2022-11-30 | 東レ株式会社 | Method for producing alkali-soluble resin solution |
| JP2019172975A (en) * | 2018-03-26 | 2019-10-10 | 東レ株式会社 | Resin composition, resin sheet and cured film |
| JP7094150B2 (en) * | 2018-05-31 | 2022-07-01 | 太陽ホールディングス株式会社 | Photosensitive resin compositions, dry films, cured products, and electronic components |
| CN113614173B (en) * | 2019-05-16 | 2023-09-29 | 株式会社力森诺科 | Polyamide-imide resin composition and process for producing polyamide-imide resin |
| KR20220143710A (en) * | 2020-02-20 | 2022-10-25 | 스미또모 베이크라이트 가부시키가이샤 | Method for producing a photosensitive resin composition |
| CN117304225B (en) * | 2023-09-12 | 2024-03-29 | 波米科技有限公司 | Alkynyl-containing compound, positive photosensitive resin composition, and preparation methods and applications thereof |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3968884B2 (en) * | 1998-05-01 | 2007-08-29 | 日本メクトロン株式会社 | Photosensitive composition |
| JP3931484B2 (en) * | 1999-06-03 | 2007-06-13 | 住友化学株式会社 | Positive photoresist composition |
| JP4677687B2 (en) | 2001-06-21 | 2011-04-27 | 東レ株式会社 | Positive photosensitive resin precursor composition |
| KR100548625B1 (en) * | 2003-03-24 | 2006-01-31 | 주식회사 엘지화학 | High heat resistant transparent polyimide precursor and photosensitive resin composition using same |
| JP4955263B2 (en) * | 2004-12-15 | 2012-06-20 | イビデン株式会社 | Printed wiring board |
| JP5061435B2 (en) | 2005-08-01 | 2012-10-31 | 東レ株式会社 | Heat-resistant resin precursor composition and semiconductor device using the same |
| JP5241280B2 (en) | 2007-04-06 | 2013-07-17 | 旭化成イーマテリアルズ株式会社 | Positive photosensitive resin composition |
| JP2009084435A (en) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | Photosensitive resin composition, method for producing photo spacer, substrates for liquid crystal display device, liquid crystal display element, and liquid crystal display device |
| TWI399391B (en) * | 2007-10-26 | 2013-06-21 | Asahi Chemical Ind | A polyimide precursor and a photosensitive resin composition containing a polyimide precursor |
| JP2009235311A (en) * | 2008-03-28 | 2009-10-15 | Toray Ind Inc | Polyimide resin and heat-resistant resin composition using the same |
| US8530119B2 (en) * | 2009-05-20 | 2013-09-10 | Sumitomo Bakelite Co., Ltd. | Positive photosensitive resin composition, cured film, protective film, interlayer insulating film, and semiconductor device and display element using the same |
| SG179087A1 (en) * | 2009-09-10 | 2012-04-27 | Toray Industries | Photosensitive resin composition and method for producing photosensitive resin film |
| KR101333704B1 (en) * | 2009-12-29 | 2013-11-27 | 제일모직주식회사 | Positive type photosensitive resin composition |
| CN102713756B (en) * | 2010-01-22 | 2014-10-15 | 日立化成杜邦微系统股份有限公司 | Light-sensitive polymer composition, method for producing pattern, and electronic component |
| JP2012069734A (en) * | 2010-09-24 | 2012-04-05 | Toshiba Corp | Manufacturing method of semiconductor device |
| JP5548604B2 (en) * | 2010-12-21 | 2014-07-16 | 富士フイルム株式会社 | Photosensitive resin composition |
| US9331295B2 (en) * | 2011-12-20 | 2016-05-03 | Seiko Epson Corporation | Film-forming ink, film-forming method, method of manufacturing light emitting element, light emitting element, light emitting device, and electronic apparatus |
| WO2014115233A1 (en) | 2013-01-28 | 2014-07-31 | 日立化成デュポンマイクロシステムズ株式会社 | Resin composition, method for manufacturing pattern cured film, and semiconductor element |
| JPWO2015087830A1 (en) * | 2013-12-11 | 2017-03-16 | 富士フイルム株式会社 | Photosensitive resin composition, method for producing cured film, cured film, liquid crystal display device, and organic EL display device |
| WO2015137281A1 (en) * | 2014-03-14 | 2015-09-17 | 東レ株式会社 | Photosensitive resin composition |
| JP6447242B2 (en) | 2014-05-15 | 2019-01-09 | Jsr株式会社 | Radiation-sensitive resin composition, insulating film, method for producing the same, and organic EL device |
| WO2016047483A1 (en) * | 2014-09-26 | 2016-03-31 | 東レ株式会社 | Organic el display device |
-
2017
- 2017-06-07 CN CN201780036074.2A patent/CN109313387B/en active Active
- 2017-06-07 KR KR1020187037217A patent/KR102364136B1/en active IP Right Grant
- 2017-06-07 WO PCT/JP2017/021094 patent/WO2017217293A1/en active Application Filing
- 2017-06-07 JP JP2017531637A patent/JPWO2017217293A1/en active Pending
- 2017-06-07 SG SG11201810262XA patent/SG11201810262XA/en unknown
- 2017-06-09 TW TW106119168A patent/TWI726112B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI726112B (en) | 2021-05-01 |
| CN109313387A (en) | 2019-02-05 |
| WO2017217293A1 (en) | 2017-12-21 |
| TW201833662A (en) | 2018-09-16 |
| KR102364136B1 (en) | 2022-02-18 |
| CN109313387B (en) | 2021-11-26 |
| KR20190017807A (en) | 2019-02-20 |
| JPWO2017217293A1 (en) | 2019-04-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11201707976RA (en) | Photosensitive colored resin composition | |
| EP3632941C0 (en) | Resin composition | |
| TWI800019B (en) | resin composition | |
| SG11201701691PA (en) | Resin and photosensitive resin composition | |
| SG11201901693YA (en) | Resin composition | |
| SG11201802512WA (en) | Resin and photosensitive resin composition | |
| ZA201704978B (en) | Epoxy resin composition | |
| SG10202009208UA (en) | Photosensitive siloxane composition | |
| SG11201701852VA (en) | Thermosetting resin composition | |
| EP3492501A4 (en) | Resin composition | |
| SG11202003707SA (en) | Resin composition | |
| SG11201810262XA (en) | Photosensitive resin composition | |
| SG11201807874YA (en) | Photosensitive resin composition | |
| EP3438992A4 (en) | Resin composition | |
| IL261641B (en) | Thermoplastic composition | |
| SG11201707712TA (en) | Photosensitive resin composition | |
| TWI799393B (en) | resin composition | |
| EP3225647A4 (en) | Resin and photosensitive resin composition | |
| EP3560993A4 (en) | Resin composition | |
| SG11201704956UA (en) | Photosensitive resin composition and adhesives composition | |
| EP3564321A4 (en) | Resin composition | |
| EP3453744A4 (en) | Resin composition | |
| EP3324237A4 (en) | Photosensitive resin composition | |
| SG11201710797QA (en) | Photocurable resin composition | |
| EP3097453A4 (en) | Photosensitive resin composition |