SG179087A1 - Photosensitive resin composition and method for producing photosensitive resin film - Google Patents

Photosensitive resin composition and method for producing photosensitive resin film

Info

Publication number
SG179087A1
SG179087A1 SG2012016986A SG2012016986A SG179087A1 SG 179087 A1 SG179087 A1 SG 179087A1 SG 2012016986 A SG2012016986 A SG 2012016986A SG 2012016986 A SG2012016986 A SG 2012016986A SG 179087 A1 SG179087 A1 SG 179087A1
Authority
SG
Singapore
Prior art keywords
photosensitive resin
resin composition
inclusive
weight
resin film
Prior art date
Application number
SG2012016986A
Inventor
Kazuto Miyoshi
Masao Tomikawa
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of SG179087A1 publication Critical patent/SG179087A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Disclosed is a photosensitive resin composition which is suppressed in the formation of bubbles during drying under reduced pressure and capable of providing a photosensitive resin film that has excellent film thickness uniformity after drying.Specifically disclosed is a photosensitive resin composition which is characterized by containing (a) at least one resin selected from among polyimides, polybenzoxazoles, precursors of polyimides and precursors of polybenzoxazoles, (b) a sensitizer, (c) an organic solvent that has a boiling point at atmospheric pressure of 100-130˚C (inclusive), and (d) an organic solvent that has a boiling point at atmospheric pressure of not less than 150˚C and a viscosity at 20˚C of more than 1.1 mPa·s but less than 1.5 mPa·s. The photosensitive resin composition is also characterized in that the content of the component (c) is 40-90% by weight (inclusive) relative to the total weight of the organic solvents and the content of the component (d) is 10-60% by weight (inclusive) relative to the total weight of the organic solvents.
SG2012016986A 2009-09-10 2010-09-07 Photosensitive resin composition and method for producing photosensitive resin film SG179087A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009209042 2009-09-10
PCT/JP2010/065293 WO2011030744A1 (en) 2009-09-10 2010-09-07 Photosensitive resin composition and method for producing photosensitive resin film

Publications (1)

Publication Number Publication Date
SG179087A1 true SG179087A1 (en) 2012-04-27

Family

ID=43732416

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012016986A SG179087A1 (en) 2009-09-10 2010-09-07 Photosensitive resin composition and method for producing photosensitive resin film

Country Status (6)

Country Link
JP (1) JP4911248B2 (en)
KR (1) KR101227280B1 (en)
CN (1) CN102549497B (en)
SG (1) SG179087A1 (en)
TW (1) TWI461846B (en)
WO (1) WO2011030744A1 (en)

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JP2011242676A (en) * 2010-05-20 2011-12-01 Asahi Kasei E-Materials Corp Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor device
JP5691731B2 (en) * 2011-03-28 2015-04-01 日立化成デュポンマイクロシステムズ株式会社 Negative photosensitive resin composition, pattern forming method, and electronic component
JP5637043B2 (en) * 2011-03-30 2014-12-10 日本ゼオン株式会社 Photosensitive resin composition
WO2013024849A1 (en) * 2011-08-18 2013-02-21 東レ株式会社 Polyamic acid resin composition, polyimide resin composition, polyimide oxazole resin composition, and flexible substrate containing same
CN110147031A (en) * 2012-12-20 2019-08-20 东丽株式会社 The manufacturing method and display device of photosensitive polymer combination, heat-resistant resin film
JP6286834B2 (en) * 2013-02-22 2018-03-07 東レ株式会社 Heat resistant resin composition and method for producing heat resistant resin film
CN103304812B (en) * 2013-06-06 2015-11-25 北京京东方光电科技有限公司 A kind of cured resin, red light resist, colored filter and their preparation method, chromatic display
CN103304810B (en) * 2013-06-06 2016-02-10 北京京东方光电科技有限公司 A kind of cured resin, green light resist, colored filter and their preparation method, chromatic display
CN103319713B (en) * 2013-06-06 2015-11-25 北京京东方光电科技有限公司 A kind of cured resin, black light resist, spectral filter and their preparation method, display device
KR101696963B1 (en) * 2013-09-30 2017-01-16 주식회사 엘지화학 Photosensitive resin composition
JP6261285B2 (en) * 2013-10-31 2018-01-17 富士フイルム株式会社 Laminate, organic semiconductor manufacturing kit and organic semiconductor manufacturing resist composition
KR101728820B1 (en) 2013-12-12 2017-04-20 제일모직 주식회사 Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device
JP6459191B2 (en) * 2014-03-19 2019-01-30 東レ株式会社 Photosensitive resin composition
KR101612673B1 (en) * 2015-03-11 2016-04-14 동우 화인켐 주식회사 Negative-type photosensitive resin composition
US10199548B2 (en) * 2015-03-27 2019-02-05 Toray Industries, Inc. Photosensitive resin composition for thin film transistors, cured film, thin film transistor, liquid crystal display device or organic electroluminescent display device, method for producing cured film, method for manufacturing thin film transistor, and method for manufacturing liquid crystal display device or organic electroluminescent display device
SG11201810262XA (en) * 2016-06-15 2018-12-28 Toray Industries Photosensitive resin composition
WO2018025953A1 (en) 2016-08-03 2018-02-08 日産化学工業株式会社 Composition for forming release layer, and release layer
KR102654926B1 (en) * 2016-08-10 2024-04-05 삼성디스플레이 주식회사 Photoresist composition and method for forming a metal pattern using the same
WO2018043250A1 (en) * 2016-08-29 2018-03-08 東レ株式会社 Photosensitive resin composition, cured film, organic el display device, semiconductor electronic component and semiconductor device
TWI600168B (en) * 2016-11-02 2017-09-21 律勝科技股份有限公司 Laminate structure of thin film transistor
CN111247113B (en) * 2017-10-20 2022-06-10 建筑研究和技术有限公司 Setting control composition for bonding systems
KR101933940B1 (en) * 2018-01-31 2018-12-31 동우 화인켐 주식회사 Colored photosensitive resin composition, color filter comprising black matrix and/or column spacer produced using the same, and image display device including color filter
KR20190101576A (en) * 2018-02-23 2019-09-02 동우 화인켐 주식회사 Photosensitive resin composition and insulation layer formed from the same
JP7247655B2 (en) * 2018-03-30 2023-03-29 東レ株式会社 Photosensitive resin composition
TWI700319B (en) * 2018-05-04 2020-08-01 新應材股份有限公司 Positive photosensitive composition and wafer dicing method using the same
KR20210056394A (en) * 2018-09-11 2021-05-18 스미또모 베이크라이트 가부시키가이샤 Photosensitive resin composition for permanent film formation, cured film, electronic device, method for producing cured film, and method for producing electronic device
JP7210999B2 (en) * 2018-10-22 2023-01-24 東レ株式会社 Resin composition, resin sheet, cured film, method for producing cured film, semiconductor device, and display device
JP6974368B2 (en) * 2019-01-11 2021-12-01 エセックス古河マグネットワイヤジャパン株式会社 Insulation paint and manufacturing method of insulated wire using it

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
JP2003043682A (en) * 2001-08-01 2003-02-13 Jsr Corp Radiation sensitive composition with variable dielectric constant and method for varying dielectric constant
CN100480855C (en) * 2002-05-29 2009-04-22 东丽株式会社 Photosensitive resin composition and method for preparing heat-resistant resin film
JP4333219B2 (en) * 2002-05-29 2009-09-16 東レ株式会社 Photosensitive resin composition and method for producing heat-resistant resin film
WO2006010067A1 (en) * 2004-07-09 2006-01-26 E.I. Dupont De Nemours And Company Polyamic acid cross-linked polymers and formable compositions made therefrom
JP2006309202A (en) * 2005-03-29 2006-11-09 Toray Ind Inc Photosensitive resin composition and semiconductor device using the same
JP2008070480A (en) * 2006-09-12 2008-03-27 Az Electronic Materials Kk Photoresist solvent and photoresist composition for slit coating using it
JP4403174B2 (en) * 2006-12-25 2010-01-20 Ａｚエレクトロニックマテリアルズ株式会社 Pattern forming method and photosensitive resin composition used therefor
TWI421632B (en) * 2007-04-24 2014-01-01 Mitsui Chemicals Inc Photosensitive resin composition, dry film and fabricated article using the same
JP5051371B2 (en) * 2007-11-26 2012-10-17 Ｊｓｒ株式会社 Radiation-sensitive resin composition, spacer and protective film for liquid crystal display element, and liquid crystal display element
CN102187277B (en) * 2008-10-20 2014-07-09 住友电木株式会社 Positive photosensitive resin composition for spray coating and method for producing through electrode using same

Also Published As

Publication number Publication date
TW201116930A (en) 2011-05-16
TWI461846B (en) 2014-11-21
CN102549497B (en) 2013-07-31
JPWO2011030744A1 (en) 2013-02-07
WO2011030744A1 (en) 2011-03-17
JP4911248B2 (en) 2012-04-04
KR101227280B1 (en) 2013-01-28
CN102549497A (en) 2012-07-04
KR20120028406A (en) 2012-03-22

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