WO2018025953A1 - Composition for forming release layer, and release layer - Google Patents
Composition for forming release layer, and release layer Download PDFInfo
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- WO2018025953A1 WO2018025953A1 PCT/JP2017/028204 JP2017028204W WO2018025953A1 WO 2018025953 A1 WO2018025953 A1 WO 2018025953A1 JP 2017028204 W JP2017028204 W JP 2017028204W WO 2018025953 A1 WO2018025953 A1 WO 2018025953A1
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- Prior art keywords
- release layer
- resin substrate
- substrate
- composition
- aromatic group
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- HAYIPGIFANTODX-UHFFFAOYSA-N Cc(c(C(O)=O)c1)cc(C)c1C(O)=O Chemical compound Cc(c(C(O)=O)c1)cc(C)c1C(O)=O HAYIPGIFANTODX-UHFFFAOYSA-N 0.000 description 1
- FKUJGZJNDUGCFU-UHFFFAOYSA-N Cc(cc(C(O)=O)c(C)c1)c1C(O)=O Chemical compound Cc(cc(C(O)=O)c(C)c1)c1C(O)=O FKUJGZJNDUGCFU-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
- C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Definitions
- the present invention relates to a release layer forming composition and a release layer.
- the resin substrate used for the touch panel is a polyimide resin substrate, an acrylic resin substrate, a polyethylene terephthalate (PET) resin substrate, a cycloolefin resin substrate having transparency equivalent to that of glass, like a TFT display panel.
- PET polyethylene terephthalate
- a cycloolefin resin substrate having transparency equivalent to that of glass, like a TFT display panel.
- the direct method is mainly known as a method for producing a flexible display (Non-Patent Document 1).
- a direct method a prefabricated resin substrate is attached to a glass substrate through an adhesive layer, and a pixel circuit including a TFT and an organic EL are directly formed on the substrate, or a resin substrate is formed on the glass substrate. And a pixel circuit including a TFT and an organic EL are directly formed on the substrate.
- a resin substrate on which a pixel circuit or the like is formed on a glass substrate is peeled off by various methods to be described later to be used for manufacturing a target electronic device such as a display panel.
- Patent Documents 1, 2, and 3 an amorphous silicon thin film layer is formed on a glass substrate, a plastic substrate is formed on the thin film layer, and then laser irradiation is performed from the glass substrate side to crystallize amorphous silicon.
- a method of peeling a plastic substrate from a glass substrate by hydrogen gas generated along with the crystallization is disclosed.
- Patent Document 4 a layer to be peeled (described as “transfer target layer” in Patent Document 4) is attached to a plastic film by using the techniques disclosed in Patent Documents 1 to 3, and a liquid crystal display device is formed. A method of completion is disclosed.
- a current glass substrate is used as a substrate (hereinafter referred to as a glass substrate), and a release layer is formed on the glass substrate using a polymer such as a cyclic olefin copolymer.
- a heat-resistant resin film such as a polyimide film
- ITO transparent electrodes, TFTs, etc. are formed and sealed on the film by a vacuum process, and finally the glass substrate is peeled off.
- the manufacturing process to remove is employ
- a slit coating method using a slit coater or the like is generally advantageous.
- the slit coating method is a coating method using a slit nozzle, and since it does not need to rotate the substrate like the conventional spin coating method, it is widely adopted from the viewpoint of reducing the amount of resin composition used and process safety. Yes.
- speeding up of the coating process is desired from the viewpoint of improving productivity.
- Patent Documents 6 and 7 disclose compositions using so-called low-viscosity solvents such as propylene glycol monomethyl ether acetate and propylene glycol monomethyl ether as photoresist compositions suitable for the slit coating method.
- a resin or a precursor thereof
- a slit coating method should be adopted for forming the release layer. It was difficult.
- JP 10-125929 A Japanese Patent Laid-Open No. 10-125931 International Publication No. 2005/050754 JP-A-10-125930 JP 2010-1111853 A International Publication No. 2011/030744 JP 2008-70480 A
- the present invention has been made in view of the above circumstances, is soluble in so-called low-viscosity solvents such as propylene glycol monomethyl ether, can be easily applied to a slit coating method, and flexible electronics formed thereon
- a release layer forming composition that provides a release layer that can be peeled without damaging a resin substrate of a device, particularly a film substrate formed of polyimide resin, acrylic resin, cycloolefin polymer resin, or the like.
- the present inventors have found that a polyamic acid having a specific structure can be easily dissolved in a low-viscosity solvent, and the polyamic acid and an organic solvent.
- the composition containing the resin substrate has excellent adhesion to a substrate such as a glass substrate, and moderate adhesion to a resin substrate used for flexible electronic devices, particularly a resin substrate having a light transmittance of 80% or more at a wavelength of 400 nm;
- the present invention was completed by finding that a release layer having an appropriate release property can be provided.
- a release layer forming composition comprising a polyamic acid represented by the following formula (1) and an organic solvent.
- X represents an aromatic group represented by the following formula (2a) or (2b)
- Y represents a divalent aromatic group having a fluorine atom
- Z represents the formula (2a )
- X is an aromatic group represented by the formula (2b)
- m represents a natural number.
- the aromatic group represented by the above formula (2a) is an aromatic group represented by the following formula (7a) or (8a), and the above Z, independently of each other,
- the aromatic group represented by the above formula (2b) is an aromatic group represented by the following formula (7b) or (8b), and the above Z, independently of each other,
- the organic solvent is at least one selected from those having structures represented by the following formulas (S1) to (S7): Composition.
- the release layer forming composition of the present invention By using the release layer forming composition of the present invention, it is possible to obtain a release layer having excellent adhesion to the substrate, moderate adhesion to the resin substrate, and moderate release with good reproducibility.
- the polyamic acid used in the present invention is excellent in solubility in a low-viscosity solvent, it is possible to easily prepare a composition that can be applied to a slit coating method by using a low-viscosity solvent. It becomes easy to apply uniformly.
- the resin substrate is separated from the substrate together with the circuit without damaging the resin substrate formed on the substrate or the circuit provided on the substrate. Is possible. Therefore, the composition for forming a release layer of the present invention can contribute to speeding up the production process of a flexible electronic device including a resin substrate, improving the yield, and the like.
- composition for forming a release layer of the present invention includes a polyamic acid represented by the following formula (1) and an organic solvent.
- the release layer is a layer provided immediately above a substrate (such as a glass substrate) on which a resin substrate is formed.
- a substrate such as a glass substrate
- the resin substrate is fixed between the base and the resin substrate of the flexible electronic device formed of polyimide resin, acrylic resin, or the like in a predetermined process.
- a release layer provided so that the resin substrate can be easily peeled from the substrate after an electronic circuit or the like is formed on the resin substrate.
- X is an aromatic group represented by the following formula (2a) or (2b)
- Y is a divalent aromatic group having a fluorine atom
- Z is a formula in which X is a formula In the case of (2a), independently of each other, an aromatic group represented by the following formula (3a) or (4a), and in the case where X is the formula (2b), independently of each other, the following formula (3b) ) Or (4b), and m represents a natural number.
- the aromatic group represented by the formula (2a) is preferably an aromatic group represented by the following formula (7a) or (8a), and the aromatic group represented by the formula (2b) is An aromatic group represented by the following formula (7b) or (8b) is preferable.
- the aromatic group represented by the above formula (3a) or (4a) is preferably an aromatic group represented by the following formula (9a) or (10a), and the above formula (3b) or (
- the aromatic group represented by 4b) is preferably an aromatic group represented by the following formula (9b) or (10b).
- Y is preferably an aromatic group having a fluorine atom and containing 1 to 5 benzene rings, more preferably an aromatic group selected from the following formula (5), and an aromatic group selected from the following formula (6). Groups are more preferred.
- M may be a natural number, but is preferably a natural number of 100 or less, more preferably a natural number of 2 to 100.
- the polyamic acid represented by the above formula (1) is obtained by reacting a predetermined tetracarboxylic dianhydride component with a diamine component.
- a tetracarboxylic dianhydride component benzenetetracarboxylic dianhydride or biphenyltetracarboxylic dianhydride is used.
- the diamine component as long as it has a fluorine atom, any of an alicyclic chain, an alicyclic ring, an aromatic group, and an aromatic alicyclic group may be used.
- the polyamic acid obtained by reacting the benzenetetracarboxylic dianhydride or biphenyltetracarboxylic dianhydride with the diamine component containing the aromatic diamine is more preferable.
- the benzenetetracarboxylic dianhydride component, the biphenyltetracarboxylic dianhydride component, and the diamine component that can be used for the synthesis of the polyamic acid having the structure represented by the above formula (1) will be described in detail.
- the benzenetetracarboxylic dianhydride is not particularly limited as long as it has two dicarboxylic anhydride sites in the molecule and has a benzene ring. Specific examples thereof include pyromellitic dianhydride and benzene-1,2,3,4-tetracarboxylic dianhydride. In the present invention, pyromellitic dianhydride is preferable. These may be used individually by 1 type, or may be used in combination of 2 or more type.
- the biphenyltetracarboxylic dianhydride is not particularly limited as long as it has two dicarboxylic anhydride sites in the molecule and has a biphenyl group. Specific examples thereof include 2,2 ′, 3,3′-biphenyltetracarboxylic dianhydride, 2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4 Examples include '-biphenyltetracarboxylic dianhydride. In the present invention, 3,3', 4,4'-biphenyltetracarboxylic dianhydride is preferable. These may be used individually by 1 type, or may be used in combination of 2 or more type.
- the aromatic diamine is not particularly limited as long as it has two amino groups having a fluorine atom and directly bonded to the aromatic ring in the molecule.
- An aromatic diamine containing 1 to 2, particularly 1 to 2, and further 2 is preferred.
- what has a fluoroalkyl group or a perfluoroalkyl group is more preferable, and a perfluoroalkyl group is still more preferable.
- the perfluoroalkyl group include a trifluoromethyl group, a pentafluoroethyl group, an n-heptafluoropropyl group, and an i-heptafluoropropyl group.
- aromatic diamine examples include 5-trifluoromethylbenzene-1,3-diamine, 5-trifluoromethylbenzene-1,2-diamine, 2,2′-bis (trifluoromethyl) -4, Examples thereof include, but are not limited to, 4′-diaminobiphenyl and 3,3′-bis (trifluoromethyl) biphenyl-4,4′-diamine. Of these, 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl can be preferably used in the present invention. These may be used individually by 1 type, or may be used in combination of 2 or more type.
- the charging ratio of the diamine component and the tetracarboxylic dianhydride component is appropriately determined in consideration of the target molecular weight and molecular weight distribution, the kind of the diamine and tetracarboxylic dianhydride, etc.
- the molar ratio of the tetracarboxylic dianhydride component is preferably 1.05 to 2.5 mol, more preferably 1.07 to 1.5 mol, relative to 1 mol of the diamine component, and 1.1 to 1.5 mol. 1.3 mol is even more preferred.
- the polyamic acid contained in the composition for forming a release layer of the present invention can be obtained.
- the organic solvent used in the synthesis of the polyamic acid is not particularly limited as long as it does not adversely affect the reaction.
- Specific examples thereof include m-cresol, 2-pyrrolidone, N-methyl-2-pyrrolidone, N— Ethyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, 3-methoxy-N, N-dimethylpropylamide, 3-ethoxy-N, N-dimethylpropyl Amides, 3-propoxy-N, N-dimethylpropylamide, 3-isopropoxy-N, N-dimethylpropylamide, 3-butoxy-N, N-dimethylpropylamide, 3-sec-butoxy-N, N-dimethyl Propylamide, 3-tert-butoxy-N, N-dimethylpropylamide, ⁇ -butyrolacto , Propylene glycol monomethyl ether and propylene glyco
- the reaction temperature during the synthesis of the polyamic acid may be appropriately set in the range from the melting point to the boiling point of the solvent to be used, and is usually about 0 to 100 ° C. However, it prevents imidization of the resulting polyamic acid in the solution. From the viewpoint of maintaining a high content of polyamic acid units, the temperature can be preferably about 0 to 70 ° C, more preferably about 0 to 60 ° C, and still more preferably about 0 to 50 ° C.
- the reaction time depends on the reaction temperature and the reactivity of the raw material, it cannot be defined unconditionally, but is usually about 1 to 100 hours.
- the weight average molecular weight of the polyamic acid thus obtained is usually about 5,000 to 500,000. From the viewpoint of improving the function of the resulting film as a release layer, preferably 10,000 to 200,000. About 000, more preferably about 10,000 to 150,000.
- a weight average molecular weight is a polystyrene conversion value by a gel permeation chromatography (GPC) measurement.
- n1 and m2 represent the number of repeating units, and the sum of m1 and m2 is the same as m above.
- n1 and m2 represent the number of repeating units, and the sum of m1 and m2 is the same as m above.
- the release layer forming composition of the present invention contains an organic solvent.
- the organic solvent those similar to the specific examples of the reaction solvent of the above reaction can be used. However, since the polyamic acid of the present invention is well dissolved and a highly uniform composition can be easily prepared, amides, An organic solvent selected from the group consisting of alcohols, esters, ethers, and ketones is preferable, and at least one type having a structure represented by the following formulas (S1) to (S7) is particularly preferable.
- R 1 to R 8 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, preferably 1 to 5 carbon atoms.
- R 9 and R 10 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, preferably 1 to 5 carbon atoms, or an acyl group having 1 to 10 carbon atoms, preferably 1 to 5 carbon atoms.
- b represents a natural number, preferably a natural number of 1 to 5, more preferably a natural number of 1 to 3.
- n represents a natural number, but is preferably a natural number of 1 to 5, more preferably a natural number of 1 to 3.
- alkyl group having 1 to 10 carbon atoms may be linear, branched or cyclic, and include methyl, ethyl, n-propyl, isopropyl, cyclopropyl, n-butyl, isobutyl, s-butyl, t-butyl, n-pentyl, 1-methyl-n-butyl, 2-methyl-n-butyl, 3-methyl-n-butyl, 1,1-dimethyl-n-propyl, 1,2-dimethyl-n- Propyl, 2,2-dimethyl-n-propyl, 1-ethyl-n-propyl, cyclopentyl, n-hexyl, 1-methyl-n-pentyl, 2-methyl-n-pentyl, 3-methyl-n-pentyl, 4-methyl-n-pentyl, 1,1-dimethyl-n-butyl, 1,2-dimethyl-n-butyl, 1,3-di
- acyl group having 1 to 10 carbon atoms include formyl group, acetyl group, propionyl group, butyryl group, isobutyryl group, valeryl group, isovaleryl group, hexanoyl group, isohexanoyl group, heptanoyl group, isoheptanoyl group, octanoyl group Group, isooctanoyl group, nonanoyl group, isononanoyl group, decanoyl group, isodecanoyl group, benzoyl group and the like.
- organic solvent represented by the above formulas (S1) to (S7) include the following.
- Formula (S1) 3-methoxy-N, N-dimethylpropylamide, 3-ethoxy-N, N-dimethylpropylamide, 3-propoxy-N, N-dimethylpropylamide, 3-isopropoxy-N, N- Dimethylpropylamide, 3-butoxy-N, N-dimethylpropylamide, 3-sec-butoxy-N, N-dimethylpropylamide, 3-tert-butoxy-N, N-dimethylpropylamide
- Formula (S2) 2- Pyrrolidone, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone formula (S3): N, N-dimethylformamide, N, N-dimethylacetamide, N, N-dimethylpropylamide, N, N-dimethylbutane
- N-methyl-2-pyrrolidone, butyl cellosolve, propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate are preferred, propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate are more preferred, and propylene glycol monomethyl ether is preferred. Further preferred.
- These organic solvents may be used alone or in combination of two or more.
- the organic solvent when a so-called low-viscosity solvent such as propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate is used as the organic solvent, it is possible to obtain a low-viscosity release layer-forming composition that can be suitably applied to slit coating. it can.
- the proportion of the low-viscosity solvent in the entire solvent is preferably 60% by mass or more, more preferably 70% by mass or more, and 80% by mass or more. Is most preferred.
- the solvent alone does not dissolve the polyamic acid, it can be used for preparing the composition as long as the polyamic acid does not precipitate.
- Especially low surfaces such as ethyl carbitol, butyl carbitol, ethyl carbitol acetate, 1-phenoxy-2-propanol, propylene glycol monoacetate, propylene glycol diacetate, dipropylene glycol, 2- (2-ethoxypropoxy) propanol
- a solvent having tension can be mixed appropriately. Thereby, it is known that the coating film uniformity is improved at the time of application to the substrate, and it can be suitably used in the present invention.
- the composition for forming a release layer of the present invention can be prepared by a usual method.
- the preparation method the reaction solution containing the target polyamic acid obtained by the method described above is filtered, and the concentration of the obtained filtrate is adjusted to a predetermined concentration using the organic solvent described above. Good.
- the concentration of the polyamic acid in the composition for forming a release layer of the present invention is appropriately set in consideration of the thickness of the release layer to be produced, the viscosity of the composition, etc., but is usually about 1 to 30% by mass, preferably It is about 1 to 20% by mass. By setting such a concentration, a release layer having a thickness of about 0.05 to 5 ⁇ m can be obtained with good reproducibility.
- Concentration of polyamic acid adjusts the amount of diamine component, tetracarboxylic dianhydride component and aromatic monoamine used as the raw material for polyamic acid. Etc. can be adjusted.
- the viscosity of the composition for forming a release layer of the present invention is appropriately set in consideration of the thickness of the release layer to be produced, etc., but a film having a thickness of about 0.05 to 5 ⁇ m is particularly reproducible. When it is intended to obtain well, it is usually about 10 to 10,000 mPa ⁇ s at 25 ° C., preferably about 20 to 5,000 mPa ⁇ s. Further, when the composition for forming a release layer of the present invention is used in a slit coating method, the viscosity is preferably about 2 to 100 mPa ⁇ s, and preferably about 2 to 25 mPa ⁇ s from the viewpoint of productivity.
- the viscosity can be measured using a commercially available liquid viscosity measurement viscometer, for example, with reference to the procedure described in JIS K7117-2 at a temperature of the composition of 25 ° C. .
- a conical plate type (cone plate type) rotational viscometer is used as the viscometer, and preferably the composition temperature is 25 ° C. using 1 ° 34 ′ ⁇ R24 as a standard cone rotor. It can be measured under the condition of ° C.
- An example of such a rotational viscometer is TVE-25L manufactured by Toki Sangyo Co., Ltd.
- composition for forming a release layer of the present invention may contain a crosslinking agent or the like in order to improve the film strength, for example, in addition to the polyamic acid and the organic solvent.
- the release layer When such a release layer of the present invention is formed on a substrate, the release layer may be formed on a part of the substrate surface or on the entire surface.
- a mode of forming a release layer on a part of the substrate surface a mode in which the release layer is formed only in a predetermined range on the substrate surface, a release layer in a pattern such as a dot pattern or a line and space pattern on the entire substrate surface.
- substrate means what is used for manufacture of a flexible electronic device etc. by which the composition for peeling layer formation of this invention is applied to the surface.
- the substrate examples include glass, plastic (polycarbonate, polymethacrylate, polystyrene, polyester, polyolefin, epoxy, melamine, triacetyl cellulose, ABS, AS, norbornene resin, etc.), metal (silicon wafer, etc.), Examples include wood, paper, and slate.
- plastic polycarbonate, polymethacrylate, polystyrene, polyester, polyolefin, epoxy, melamine, triacetyl cellulose, ABS, AS, norbornene resin, etc.
- metal silicon wafer, etc.
- Examples include wood, paper, and slate.
- a glass substrate since the release layer has sufficient adhesion, a glass substrate can be preferably used.
- the substrate surface may be composed of a single material or may be composed of two or more materials.
- the substrate surface is composed of two or more materials
- a material in a pattern such as a dot pattern or a line and space pattern is present in other materials.
- the method for applying the release layer-forming composition of the present invention to the substrate is not particularly limited, and examples thereof include cast coating, spin coating, slit coating, blade coating, dip coating, and roll coating.
- Method bar coating method, die coating method, ink jet method, printing method (such as relief printing, intaglio printing, planographic printing, and screen printing).
- the heating temperature for imidization is usually appropriately determined within the range of 50 to 550 ° C., but is preferably more than 150 ° C. to 510 ° C. By setting the heating temperature in this way, it is possible to sufficiently advance the imidization reaction while preventing the obtained film from being weakened.
- the heating time varies depending on the heating temperature, and cannot be generally defined, but is usually 5 minutes to 5 hours.
- the imidization rate may be in the range of 50 to 100%.
- the heating temperature is gradually increased as it is, and finally from 150 ° C. to 510 ° C. for 30 minutes to 4 hours.
- the method of heating is mentioned. In particular, it is preferable that heating is performed at 50 to 150 ° C. for 5 minutes to 2 hours, followed by heating at 150 to 350 ° C. for 5 minutes to 2 hours, and finally heating at 350 to 450 ° C. for 30 minutes to 4 hours.
- Examples of the appliance used for heating include a hot plate and an oven.
- the heating atmosphere may be under air or under an inert gas, and may be under normal pressure or under reduced pressure.
- the thickness of the release layer is usually about 0.01 to 50 ⁇ m, and preferably about 0.05 to 20 ⁇ m from the viewpoint of productivity.
- desired thickness is implement
- the release layer described above has excellent adhesion to a substrate, particularly a glass substrate, moderate adhesion to a resin substrate, and moderate release. Therefore, the release layer of the present invention peels the resin substrate from the substrate together with the circuit formed on the resin substrate without damaging the resin substrate of the device in the manufacturing process of the flexible electronic device. Therefore, it can be suitably used.
- a release layer is formed on a glass substrate by the method described above.
- a resin solution for forming a resin substrate is applied on the release layer, and this coating film is heated to form a resin substrate fixed to the glass substrate via the release layer of the present invention.
- the substrate is formed with a larger area than the area of the release layer so as to cover the entire release layer.
- the resin substrate examples include a substrate made of a polyimide resin, an acrylic resin, or a cycloolefin polymer resin typical as a resin substrate of a flexible electronic device, and a resin solution for forming it includes a polyimide solution, a polyamic acid solution, Examples thereof include an acrylic polymer solution and a cycloolefin polymer solution.
- the method for forming the resin substrate may follow a conventional method.
- a resin substrate with high transparency a resin substrate formed of an acrylic resin or a cycloolefin polymer resin can be exemplified, and in particular, a substrate having a light transmittance of 80% or more at a wavelength of 400 nm is preferable.
- a desired circuit is formed on the resin substrate fixed to the base via the release layer of the present invention, and then the resin substrate is cut along the release layer, for example. It peels from a peeling layer, and a resin substrate and a base
- the LLO method is characterized in that light having a specific wavelength, for example, light having a wavelength of 308 nm, is irradiated from the surface opposite to the surface on which a circuit or the like is formed from the glass substrate side. The irradiated light passes through the glass substrate, and only the polymer (polyimide resin) in the vicinity of the glass substrate absorbs this light and evaporates (sublimates). As a result, it is possible to selectively peel the resin substrate from the glass substrate without affecting the circuit or the like provided on the resin substrate, which determines the performance of the display.
- the composition for forming a release layer according to the present invention has a feature of sufficiently absorbing light having a specific wavelength (for example, 308 nm) that enables application of the LLO method, and can therefore be used as a sacrificial layer for the LLO method. Therefore, when a desired circuit is formed on a resin substrate fixed to a glass substrate through a release layer formed by using the composition according to the present invention, and then an LLO method is performed to irradiate a light beam of 308 nm. Only the release layer absorbs this light and evaporates (sublimates). Thereby, the release layer is sacrificed (acts as a sacrifice layer), and the resin substrate can be selectively peeled from the glass substrate.
- a specific wavelength for example, 308 nm
- Mw weight average molecular weight
- Mw molecular weight distribution of a polymer
- GPC apparatus manufactured by JASCO Corporation (column: KD801 and KD805 manufactured by Shodex; eluent: Dimethylformamide / LiBr.H 2 O (29.6 mM) / H 3 PO 4 (29.6 mM) / THF (0.1% by mass); Flow rate: 1.0 mL / min; Column temperature: 40 ° C .; Mw: Standard (Polystyrene equivalent value).
- resin substrate forming composition A resin substrate forming composition was prepared by the following method.
- Resin substrate forming composition F5 > 0.6 g of VESTAGON B 1530 and 11.8 g of PGMEA were added to 10 g of the reaction solution obtained in Synthesis Example S3, and the mixture was stirred at 23 ° C. for 24 hours to prepare a resin substrate forming composition F5.
- ⁇ Preparation Example 7 Resin substrate forming composition F7> To an eggplant flask containing 100 g of carbon tetrachloride, 10 g of ZEONOR (registered trademark) 1060R (manufactured by Nippon Zeon Co., Ltd., cycloolefin polymer resin) was added. This solution was dissolved by stirring for 24 hours under a nitrogen atmosphere to prepare a resin substrate forming composition F7.
- ZEONOR registered trademark
- 1060R manufactured by Nippon Zeon Co., Ltd., cycloolefin polymer resin
- composition for forming release layer [Example 1-1] BCS and NMP were added to the reaction solution obtained in Synthesis Example L1, and diluted such that the polymer concentration was 5% by mass and BCS was 20% by mass to obtain a release layer forming composition.
- Example 1-2 The reaction solution obtained in Synthesis Example L2 was directly used as the release layer forming composition.
- Example 1-3 BCS and NMP were added to the reaction solution obtained in Synthesis Example L3, and diluted such that the polymer concentration was 5% by mass and BCS was 20% by mass to obtain a release layer forming composition.
- Example 1-4 The reaction solution obtained in Synthesis Example L4 was used as the release layer forming composition as it was.
- Example 2-1 Production of release layer and resin substrate [Example 2-1] Using a spin coater (condition: about 3,000 rpm for about 30 seconds), the release layer forming composition L1 obtained in Example 1-1 was applied to a 100 mm ⁇ 100 mm glass substrate (hereinafter the same). It was applied on top.
- the obtained coating film was heated at 80 ° C. for 10 minutes using a hot plate, and then heated at 300 ° C. for 30 minutes using an oven, and the heating temperature was raised to 400 ° C. (10 ° C./min. And then heated at 400 ° C. for 30 minutes to form a release layer having a thickness of about 0.1 ⁇ m on the glass substrate, thereby obtaining a glass substrate with a release layer.
- the film-coated substrate was not removed from the oven but heated in the oven.
- the composition F1 for resin substrate formation was apply
- the obtained coating film was heated at 80 ° C. for 30 minutes using a hot plate, and then heated at 140 ° C. for 30 minutes using an oven, and the heating temperature was raised to 210 ° C. (2 ° C./min.
- a resin substrate having a thickness of about 20 ⁇ m was formed to obtain a glass substrate with a resin substrate and a release layer. During the temperature increase, the film-coated substrate was not removed from the oven but heated in the oven.
- Example 2-2 A release layer and a resin substrate were produced in the same manner as in Example 2-1, except that the resin substrate forming composition F2 was used instead of the resin substrate forming composition F1 used in Example 2-1. Then, a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
- Example 2-3 The same procedure as in Example 2-1 except that the release layer forming composition L2 obtained in Example 1-2 was used instead of the release layer forming composition L1 obtained in Example 1-1.
- a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
- Example 2-4 The release layer forming composition L2 obtained in Example 1-2 was used as the release layer forming composition, and the resin substrate forming composition F2 used in Example 2-2 was used as the resin substrate forming composition.
- Example 2-4 The release layer forming composition L2 obtained in Example 1-2 was used as the release layer forming composition, and the resin substrate forming composition F2 used in Example 2-2 was used as the resin substrate forming composition.
- Example 2-4 was used to prepare a release layer and a resin substrate in the same manner as in Example 2-1, and a glass substrate with a release layer and a glass substrate with a resin substrate and a release layer were obtained.
- Example 2-5 The release layer forming composition L1 obtained in Example 1-1 was used as the release layer forming composition, and the resin substrate forming composition F4 was used as the resin substrate forming composition.
- a release layer and a resin substrate were prepared in the same manner as in Example 1 to obtain a glass substrate with a release layer and a glass substrate with a resin substrate / release layer.
- Example 2-6 The release layer forming composition L1 obtained in Example 1-1 was used as the release layer forming composition, and the resin substrate forming composition F5 was used as the resin substrate forming composition.
- a release layer and a resin substrate were prepared in the same manner as in Example 1 to obtain a glass substrate with a release layer and a glass substrate with a resin substrate / release layer.
- Example 2-7 The release layer forming composition L2 obtained in Example 1-2 was used as the release layer forming composition, and the resin substrate forming composition F5 was used as the resin substrate forming composition.
- a release layer and a resin substrate were prepared in the same manner as in Example 1 to obtain a glass substrate with a release layer and a glass substrate with a resin substrate / release layer.
- Example 2-8 Using the release layer forming composition L1 obtained in Example 1-1, a release layer was formed in the same manner as in Example 2-1, to obtain a glass substrate with a release layer. Immediately thereafter, using a spin coater (condition: about 15 seconds at 200 rpm), the resin substrate forming composition F6 was applied on the release layer (resin thin film) on the glass substrate. The obtained coating film was heated at 80 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 30 minutes using a hot plate to form a resin substrate having a thickness of about 3 ⁇ m on the release layer. A glass substrate with a resin substrate and a release layer was obtained. Thereafter, the light transmittance was measured using an ultraviolet-visible spectrophotometer (UV-2600 manufactured by Shimadzu Corporation). As a result, the resin substrate showed a transmittance of 80% or more at 400 nm.
- UV-2600 ultraviolet-visible spectrophotometer
- Example 2-8 was the same as Example 2-8 except that the release layer forming composition L2 obtained in Example 1-2 was used instead of the release layer forming composition L1 obtained in Example 1-1.
- a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
- Example 2-10 Using the release layer forming composition L1 obtained in Example 1-1, a release layer was formed in the same manner as in Example 2-1, to obtain a glass substrate with a release layer. Immediately thereafter, using a spin coater (condition: about 15 seconds at 200 rpm), the resin substrate forming composition F7 was applied on the release layer (resin thin film) on the glass substrate. The obtained coating film was heated at 80 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 30 minutes using a hot plate to form a resin substrate having a thickness of about 3 ⁇ m on the release layer. A glass substrate with a resin substrate and a release layer was obtained. Thereafter, the light transmittance was measured using an ultraviolet-visible spectrophotometer (UV-2600 manufactured by Shimadzu Corporation). As a result, the resin substrate showed a transmittance of 80% or more at 400 nm.
- UV-2600 ultraviolet-visible spectrophotometer
- Example 2-10 was the same as Example 2-10 except that the release layer forming composition L2 obtained in Example 1-2 was used instead of the release layer forming composition L1 obtained in Example 1-1.
- a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
- Example 2-12 Using a spin coater (conditions: about 3,000 rpm for about 30 seconds), the release layer forming composition L3 obtained in Example 1-3 was used as a glass substrate of 100 mm ⁇ 100 mm glass substrate (hereinafter the same) It was applied on top.
- the obtained coating film was heated at 80 ° C. for 10 minutes using a hot plate, and then heated at 300 ° C. for 30 minutes using an oven, and the heating temperature was raised to 400 ° C. (10 ° C./min. And then heated at 400 ° C. for 30 minutes to form a release layer having a thickness of about 0.1 ⁇ m on the glass substrate, thereby obtaining a glass substrate with a release layer.
- the film-coated substrate was not removed from the oven but heated in the oven.
- composition F3 for resin substrate formation was apply
- the obtained coating film was heated at 80 ° C. for 30 minutes using a hot plate, and then heated at 230 ° C. for 30 minutes using an oven to form an acrylic substrate having a thickness of about 3 ⁇ m on the release layer. .
- the film-coated substrate was not removed from the oven but heated in the oven.
- Example 2-13 A release layer and a resin substrate were prepared in the same manner as in Example 2-12, except that the resin substrate forming composition F4 was used instead of the resin substrate forming composition F3 used in Example 2-12. Then, a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
- Example 2-14 A release layer and a resin substrate were prepared in the same manner as in Example 2-12, except that the resin substrate forming composition F5 was used instead of the resin substrate forming composition F3 used in Example 2-12. Then, a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
- Example 2-15 The same procedure as in Example 2-12 except that the release layer forming composition L4 obtained in Example 1-4 was used instead of the release layer forming composition L3 obtained in Example 1-3.
- a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
- Example 2-16 The release layer forming composition L4 obtained in Example 1-4 was used as the release layer forming composition, and the resin substrate forming composition F5 used in Example 2-14 was used as the resin substrate forming composition.
- the release layer forming composition L4 obtained in Example 1-4 was used as the release layer forming composition
- the resin substrate forming composition F5 used in Example 2-14 was used as the resin substrate forming composition.
- Example 2-17 Using the release layer forming composition L3 obtained in Example 1-3, a release layer was formed in the same manner as in Example 2-12 to obtain a glass substrate with a release layer. Immediately thereafter, using a spin coater (condition: about 15 seconds at 200 rpm), the resin substrate forming composition F6 was applied on the release layer (resin thin film) on the glass substrate. The obtained coating film was heated at 80 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 30 minutes using a hot plate to form a resin substrate having a thickness of about 3 ⁇ m on the release layer. A glass substrate with a resin substrate and a release layer was obtained. Thereafter, the light transmittance was measured using an ultraviolet-visible spectrophotometer (UV-2600 manufactured by Shimadzu Corporation). As a result, the resin substrate showed a transmittance of 80% or more at 400 nm.
- UV-2600 ultraviolet-visible spectrophotometer
- Example 2-17 was the same as Example 2-17 except that the release layer forming composition L4 obtained in Example 1-4 was used instead of the release layer forming composition L3 obtained in Example 1-3.
- a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
- Example 2-19 Using the release layer forming composition L3 obtained in Example 1-3, a release layer was formed in the same manner as in Example 2-12 to obtain a glass substrate with a release layer. Immediately thereafter, using a spin coater (condition: about 15 seconds at 200 rpm), the resin substrate forming composition F7 was applied on the release layer (resin thin film) on the glass substrate. The obtained coating film was heated at 80 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 30 minutes using a hot plate to form a resin substrate having a thickness of about 3 ⁇ m on the release layer. A glass substrate with a resin substrate and a release layer was obtained. Thereafter, the light transmittance was measured using an ultraviolet-visible spectrophotometer (UV-2600 manufactured by Shimadzu Corporation). As a result, the resin substrate showed a transmittance of 80% or more at 400 nm.
- UV-2600 ultraviolet-visible spectrophotometer
- Example 2-20 The same procedure as in Example 2-19 except that the release layer forming composition L4 obtained in Example 1-4 was used instead of the release layer forming composition L3 obtained in Example 1-3.
- a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
- Example 2-5 The same procedure as in Example 2-12 except that the release layer forming composition HL1 obtained in Comparative Example 1-1 was used instead of the release layer forming composition L3 obtained in Example 1-3.
- a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained. Combinations of the release layer and the resin substrate are as shown in Table 2.
- a resin substrate / glass substrate with a release layer was cut into a 25 mm ⁇ 50 mm width rectangle so as to penetrate to the back surface of the resin substrate with a cutter knife to produce a strip. Further, after a cellophane tape (Nichiban CT-24) is put on the produced strip, autograph AG-500N (manufactured by Shimadzu Corporation) is used, at 90 degrees with respect to the surface of the substrate, that is, , Peeled in the vertical direction, peel strength was measured, 100% peel (all peel), and peel strength of less than 0.1 N / 25 mm was taken as AAA.
- Tables 1 and 2 The above results are shown in Tables 1 and 2.
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Abstract
Description
特に、新世代ディスプレイでは、軽量なフレキシブルプラスチック基板(以下、樹脂基板と表記する)を用いたアクティブマトリクス型フルカラーTFTディスプレイパネルの開発が求められている。この新世代ディスプレイに関する技術は、フレキシブルディスプレイや、フレキシブルスマートフォン、ミラーディスプレイ等の様々な分野への転用が期待されている。 In recent years, electronic devices have been required to have a function of being able to bend in addition to the characteristics of thinning and lightening. For this reason, it is required to use a lightweight flexible plastic substrate in place of the conventional glass substrate that is fragile and cannot be bent.
In particular, in the new generation display, development of an active matrix type full color TFT display panel using a lightweight flexible plastic substrate (hereinafter referred to as a resin substrate) is required. This new generation display technology is expected to be diverted to various fields such as flexible displays, flexible smartphones, and mirror displays.
しかも、被剥離層が大面積である場合には、レーザー処理に長時間を要するため、デバイス作製の生産性を上げることが難しい。 However, in the methods disclosed in Patent Documents 1 to 4, particularly the method disclosed in Patent Document 4, it is essential to use a highly light-transmitting substrate in order to transmit laser light, and the substrate passes through the substrate. In addition, it is necessary to irradiate laser light with a relatively large energy sufficient to release hydrogen contained in amorphous silicon, and the layer to be peeled may be damaged by the laser light irradiation. There is a problem.
In addition, when the layer to be peeled has a large area, it takes a long time for the laser treatment, and it is difficult to increase the productivity of device fabrication.
[1]下記式(1)で表されるポリアミック酸と有機溶媒とを含むことを特徴とする剥離層形成用組成物。
[5]上記Xにおいて、上記式(2b)で表される芳香族基が、下記式(7b)又は(8b)で表される芳香族基であり、上記Zが、互いに独立して、下記式(9b)又は式(10b)で表される芳香族基である[1]~[3]のいずれかに記載の剥離層形成用組成物。
[6]上記有機溶媒が、下記式(S1)~(S7)で表される構造を有するものから選ばれる少なくとも1種である[1]~[5]のいずれかに記載の剥離層形成用組成物。
[7]上記有機溶媒が、プロピレングリコールモノメチルエーテル又はプロピレングリコールモノメチルエーテルアセテートである[6]記載の剥離層形成用組成物。
[8][1]~[7]のいずれかに記載の剥離層形成用組成物を用いて形成される剥離層。
[9][8]記載の剥離層を用いる樹脂基板の製造方法。
[10]上記樹脂基板が、ポリイミド樹脂基板又は波長400nmの光透過率が80%以上である樹脂基板である[9]記載の製造方法。 Therefore, the present invention provides the following release layer forming composition and release layer.
[1] A release layer forming composition comprising a polyamic acid represented by the following formula (1) and an organic solvent.
[5] In the above X, the aromatic group represented by the above formula (2b) is an aromatic group represented by the following formula (7b) or (8b), and the above Z, independently of each other, The composition for forming a release layer according to any one of [1] to [3], which is an aromatic group represented by formula (9b) or formula (10b).
[6] For forming a release layer according to any one of [1] to [5], wherein the organic solvent is at least one selected from those having structures represented by the following formulas (S1) to (S7): Composition.
[7] The composition for forming a release layer according to [6], wherein the organic solvent is propylene glycol monomethyl ether or propylene glycol monomethyl ether acetate.
[8] A release layer formed using the release layer forming composition according to any one of [1] to [7].
[9] A method for producing a resin substrate using the release layer according to [8].
[10] The manufacturing method according to [9], wherein the resin substrate is a polyimide resin substrate or a resin substrate having a light transmittance of 80% or more at a wavelength of 400 nm.
本発明の剥離層形成用組成物は、下記式(1)で表されるポリアミック酸と、有機溶媒とを含むものである。 Hereinafter, the present invention will be described in more detail.
The composition for forming a release layer of the present invention includes a polyamic acid represented by the following formula (1) and an organic solvent.
上記テトラカルボン酸二無水物成分としては、ベンゼンテトラカルボン酸二無水物又はビフェニルテトラカルボン酸二無水物を使用する。上記ジアミン成分としては、フッ素原子を有するものであれば、脂鎖、脂環、芳香族、芳香脂環族のいずれでもよいが、本発明では、特に低粘度溶媒に対する溶解性を向上させると共に、得られる膜の剥離層としての機能を向上させる観点から、上記ベンゼンテトラカルボン酸二無水物又はビフェニルテトラカルボン酸二無水物と、上記芳香族ジアミンを含むジアミン成分とを反応させて得られるポリアミック酸が好ましく、上記テトラカルボン酸二無水物と芳香族ジアミンとを反応させて得られる全芳香族ポリアミック酸がより好ましい。
以下、上記式(1)で表される構造を有するポリアミック酸の合成に使用できるベンゼンテトラカルボン酸二無水物成分、ビフェニルテトラカルボン酸二無水物及びジアミン成分について詳述する。 The polyamic acid represented by the above formula (1) is obtained by reacting a predetermined tetracarboxylic dianhydride component with a diamine component.
As the tetracarboxylic dianhydride component, benzenetetracarboxylic dianhydride or biphenyltetracarboxylic dianhydride is used. As the diamine component, as long as it has a fluorine atom, any of an alicyclic chain, an alicyclic ring, an aromatic group, and an aromatic alicyclic group may be used. From the viewpoint of improving the function of the resulting film as a release layer, the polyamic acid obtained by reacting the benzenetetracarboxylic dianhydride or biphenyltetracarboxylic dianhydride with the diamine component containing the aromatic diamine. The wholly aromatic polyamic acid obtained by reacting the tetracarboxylic dianhydride with an aromatic diamine is more preferable.
Hereinafter, the benzenetetracarboxylic dianhydride component, the biphenyltetracarboxylic dianhydride component, and the diamine component that can be used for the synthesis of the polyamic acid having the structure represented by the above formula (1) will be described in detail.
(式中、m1及びm2は繰り返し単位の数を表し、m1とm2の合計は上記mと同じである。)
(In the formula, m1 and m2 represent the number of repeating units, and the sum of m1 and m2 is the same as m above.)
(式中、m1及びm2は繰り返し単位の数を表し、m1とm2の合計は上記mと同じである。)
(In the formula, m1 and m2 represent the number of repeating units, and the sum of m1 and m2 is the same as m above.)
式(S1):3-メトキシ-N,N-ジメチルプロピルアミド、3-エトキシ-N,N-ジメチルプロピルアミド、3-プロポキシ-N,N-ジメチルプロピルアミド、3-イソプロポキシ-N,N-ジメチルプロピルアミド、3-ブトキシ-N,N-ジメチルプロピルアミド、3-sec-ブトキシ-N,N-ジメチルプロピルアミド、3-tert-ブトキシ-N,N-ジメチルプロピルアミド
式(S2):2-ピロリドン、N-メチル-2-ピロリドン、N-エチル-2-ピロリドン
式(S3):N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド、N,N-ジメチルプロピルアミド、N,N-ジメチルブタンアミド
式(S4):γ-ブチロラクトン
式(S5):シクロペンタノン、シクロヘキサノン、シクロヘプタノン
式(S6):乳酸メチル、乳酸エチル、乳酸n-プロピル、乳酸n-ブチル、乳酸イソアミル、2-ヒドロキシイソ酪酸メチル、2-ヒドロキシイソ酪酸エチル、2-ヒドロキシイソ酪酸プロピル、2-ヒドロキシイソ酪酸ブチル
式(S7):エチルセロソルブ、ブチルセロソルブ、エチレングリコール、1-メトキシ-2-プロパノール、1-エトキシ-2-プロパノール、1-ブトキシ-2-プロパノール、プロピレングリコールモノメチルエーテル、プロピレングリコール-1-モノメチルエーテル-2-アセテート、プロピレングリコール-1-モノエチルエーテル-2-アセテート Specific examples of the organic solvent represented by the above formulas (S1) to (S7) include the following.
Formula (S1): 3-methoxy-N, N-dimethylpropylamide, 3-ethoxy-N, N-dimethylpropylamide, 3-propoxy-N, N-dimethylpropylamide, 3-isopropoxy-N, N- Dimethylpropylamide, 3-butoxy-N, N-dimethylpropylamide, 3-sec-butoxy-N, N-dimethylpropylamide, 3-tert-butoxy-N, N-dimethylpropylamide Formula (S2): 2- Pyrrolidone, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone formula (S3): N, N-dimethylformamide, N, N-dimethylacetamide, N, N-dimethylpropylamide, N, N-dimethylbutane Amide formula (S4): γ-butyrolactone formula (S5): cyclopentanone, cyclohexanone, cycloheptanone (S6): Methyl lactate, ethyl lactate, n-propyl lactate, n-butyl lactate, isoamyl lactate, methyl 2-hydroxyisobutyrate, ethyl 2-hydroxyisobutyrate, propyl 2-hydroxyisobutyrate, butyl 2-hydroxyisobutyrate Formula (S7): Ethyl cellosolve, butyl cellosolve, ethylene glycol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, 1-butoxy-2-propanol, propylene glycol monomethyl ether, propylene glycol-1-monomethyl ether 2-acetate, propylene glycol-1-monoethyl ether-2-acetate
本発明の剥離層形成用組成物を用いて、上述の方法によって、ガラス基体上に剥離層を形成する。この剥離層の上に、樹脂基板を形成するための樹脂溶液を塗布し、この塗膜を加熱することで、本発明の剥離層を介して、ガラス基体に固定された樹脂基板を形成する。この際、剥離層を全て覆うようにして、剥離層の面積と比較して大きい面積で、基板を形成する。樹脂基板としては、フレキシブル電子デバイスの樹脂基板として代表的なポリイミド樹脂やアクリル樹脂、シクロオレフィンポリマー樹脂からなる基板が挙げられ、それを形成するための樹脂溶液としては、ポリイミド溶液、ポリアミック酸溶液、アクリルポリマー溶液及びシクロオレフィンポリマー溶液等が挙げられる。当該樹脂基板の形成方法は、常法に従えばよい。また、透明性が高い樹脂基板としては、アクリル樹脂やシクロオレフィンポリマー樹脂で形成される樹脂基板を例示することができ、特に波長400nmの光透過率が80%以上であるものが好ましい。 Hereinafter, an example of the manufacturing method of the flexible electronic device using the peeling layer of this invention is demonstrated.
Using the composition for forming a release layer of the present invention, a release layer is formed on a glass substrate by the method described above. A resin solution for forming a resin substrate is applied on the release layer, and this coating film is heated to form a resin substrate fixed to the glass substrate via the release layer of the present invention. At this time, the substrate is formed with a larger area than the area of the release layer so as to cover the entire release layer. Examples of the resin substrate include a substrate made of a polyimide resin, an acrylic resin, or a cycloolefin polymer resin typical as a resin substrate of a flexible electronic device, and a resin solution for forming it includes a polyimide solution, a polyamic acid solution, Examples thereof include an acrylic polymer solution and a cycloolefin polymer solution. The method for forming the resin substrate may follow a conventional method. Moreover, as a resin substrate with high transparency, a resin substrate formed of an acrylic resin or a cycloolefin polymer resin can be exemplified, and in particular, a substrate having a light transmittance of 80% or more at a wavelength of 400 nm is preferable.
[1]化合物の略語
p-PDA:p-フェニレンジアミン
TPDA:4,4''-ジアミノ-p-ターフェニル
TFMB:2,2’-ビス(トリフルオロメチル)ベンジジン
BPDA:3,3’,4,4’-ビフェニルテトラカルボン酸二無水物
PMDA:ピロメリット酸二無水物
DMCBDA:1,3-ジメチルシクロブタン酸二無水物
CBDA:シクロブタン酸二無水物
MMA:メタクリル酸メチル
MAA:メタクリル酸
HEMA:メタクリル酸2-ヒドロキシエチル
AIBN:アゾビスイソブチロニトリル
CHMI:シクロヘキシルマレイミド
エポリード GT-401:ブタンテトラカルボン酸、テトラ(3,4-エポキシシクロヘキシルメチル)、修飾ε-カプロラクトン、(株)ダイセル製
セロキサイド 2021P:3’,4’-エポキシシクロヘキシルメチル 3,4-エポキシシクロヘキサンカルボキシレート、(株)ダイセル製
VESTAGON B 1530:エボニックジャパン(株)製
NMP:N-メチル-2-ピロリドン
BCS:ブチルセロソルブ
PGME:プロピレングリコールモノメチルエーテル
PGMEA:プロピレングリコールモノメチルエーテルアセテート EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated further in detail, this invention is not limited to these Examples.
[1] Abbreviations of compounds p-PDA: p-phenylenediamine TPDA: 4,4 ″ -diamino-p-terphenyl TFMB: 2,2′-bis (trifluoromethyl) benzidine BPDA: 3, 3 ′, 4 , 4'-biphenyltetracarboxylic dianhydride PMDA: pyromellitic dianhydride DMCBDA: 1,3-dimethylcyclobutanoic dianhydride CBDA: cyclobutanoic dianhydride MMA: methyl methacrylate MAA: methacrylic acid HEMA: methacryl Acid 2-hydroxyethyl AIBN: azobisisobutyronitrile CHMI: cyclohexylmaleimide epoxide GT-401: butanetetracarboxylic acid, tetra (3,4-epoxycyclohexylmethyl), modified ε-caprolactone, celoxide manufactured by Daicel Corporation 2021P: 3 ′, 4′-epoxy Chlohexylmethyl 3,4-epoxycyclohexanecarboxylate, VESTAGON B 1530, manufactured by Daicel Corporation NMP: N-methyl-2-pyrrolidone BCS: Butyl cellosolve PGME: Propylene glycol monomethyl ether PGMEA: Propylene glycol monomethyl Ether acetate
ポリマーの重量平均分子量(以下Mwと略す)及び分子量分布の測定は、日本分光(株)製GPC装置(カラム:Shodex製 KD801及びKD805;溶離液:ジメチルホルムアミド/LiBr・H2O(29.6mM)/H3PO4(29.6mM)/THF(0.1質量%);流量:1.0mL/分;カラム温度:40℃;Mw:標準ポリスチレン換算値)を用いて行った。 [2] Measuring method of weight average molecular weight and molecular weight distribution The weight average molecular weight (hereinafter abbreviated as Mw) and molecular weight distribution of a polymer are measured by GPC apparatus manufactured by JASCO Corporation (column: KD801 and KD805 manufactured by Shodex; eluent: Dimethylformamide / LiBr.H 2 O (29.6 mM) / H 3 PO 4 (29.6 mM) / THF (0.1% by mass); Flow rate: 1.0 mL / min; Column temperature: 40 ° C .; Mw: Standard (Polystyrene equivalent value).
以下の方法によって、実施例及び比較例で使用する各種ポリマーを合成した。
なお、得られたポリマー含有反応液からポリマーを単離せず、後述の通りに、反応液を希釈することで、樹脂基板形成用組成物又は剥離層形成用組成物を調製した。 [3] Polymer synthesis Various polymers used in Examples and Comparative Examples were synthesized by the following method.
In addition, the polymer was not isolated from the obtained polymer containing reaction liquid, but the resin substrate formation composition or the peeling layer formation composition was prepared by diluting a reaction liquid as mentioned later.
p-PDA3.218g(30mmol)をNMP88.2gに溶解させた。得られた溶液にBPDA8.581g(29mmol)を加え、窒素雰囲気下、23℃で24時間反応させた。得られたポリマーのMwは107,300、分子量分布は4.6であった。 <Synthesis Example S1 Synthesis of Polyamic Acid (S1)>
3.218 g (30 mmol) of p-PDA was dissolved in 88.2 g of NMP. To the obtained solution, 8.581 g (29 mmol) of BPDA was added and reacted at 23 ° C. for 24 hours under a nitrogen atmosphere. Mw of the obtained polymer was 107,300 and molecular weight distribution was 4.6.
p-PDA20.261g(0.1875mol)とTPDA12.206g(0.0469mol)をNMP617.4gに溶解し、15℃に冷却後、PMDA50.112g(0.2298mol)を添加し、窒素雰囲気下、50℃で48時間反応させた。得られたポリマーのMwは82,100、分子量分布は2.7であった。 <Synthesis Example S2 Synthesis of Polyamic Acid (S2)>
20.261 g (0.1875 mol) of p-PDA and 12.206 g (0.0469 mol) of TPDA were dissolved in 617.4 g of NMP, cooled to 15 ° C., 50.112 g (0.2298 mol) of PMDA was added, and the mixture was added under nitrogen atmosphere. The reaction was carried out at 0 ° C. for 48 hours. Mw of the obtained polymer was 82,100, and molecular weight distribution was 2.7.
MMA7.20g(0.0719mol)、HEMA7.20g(0.0553mol)、CHMI10.8g(0.0603mol)、MAA4.32g(0.0502mol)、AIBN2.46g(0.0150mol)をPGMEA46.9gに溶解し、60~100℃にて20時間反応させることによりアクリル重合体溶液(固形分濃度40質量%)を得た。得られたアクリル重合体のMnは3,800、Mwは7,300であった。 <Synthesis Example S3 Synthesis of Acrylic Polymer (S3)>
MMA 7.20 g (0.0719 mol), HEMA 7.20 g (0.0553 mol), CHMI 10.8 g (0.0603 mol), MAA 4.32 g (0.0502 mol), AIBN 2.46 g (0.0150 mol) were dissolved in PGMEA 46.9 g. Then, an acrylic polymer solution (solid content concentration 40% by mass) was obtained by reacting at 60 to 100 ° C. for 20 hours. Mn of the obtained acrylic polymer was 3,800, and Mw was 7,300.
TFMB2.73g(8.53mmol)をNMP38.5gに溶解させた。得られた溶液に、PMDA2.06g(9.47mmol)を加え、窒素雰囲気下、23℃で24時間反応させた。得られたポリマーのMwは17,100、分子量分布1.7であった。得られたポリマー溶液1gをPGME10gに添加した結果、特に析出は見られなかった。 <Synthesis Example L1 Synthesis of polyamic acid (L1)>
2.73 g (8.53 mmol) of TFMB was dissolved in 38.5 g of NMP. To the obtained solution, 2.06 g (9.47 mmol) of PMDA was added and reacted at 23 ° C. for 24 hours under a nitrogen atmosphere. Mw of the obtained polymer was 17,100 and molecular weight distribution was 1.7. As a result of adding 1 g of the obtained polymer solution to 10 g of PGME, no precipitation was observed.
TFMB2.73g(8.53mmol)をPGME40gに溶解させた。得られた溶液に、PMDA2.06g(9.47mmol)を加え、窒素雰囲気下、23℃で24時間反応させた。得られたポリマーのMwは20,100、分子量分布1.8であった。 <Synthesis Example L2 Synthesis of polyamic acid (L2)>
2.73 g (8.53 mmol) of TFMB was dissolved in 40 g of PGME. To the obtained solution, 2.06 g (9.47 mmol) of PMDA was added and reacted at 23 ° C. for 24 hours under a nitrogen atmosphere. Mw of the obtained polymer was 20,100 and molecular weight distribution was 1.8.
TFMB23.7g(74.2mmol)をNMP352gに溶解させた。得られた溶液に、BPDA24.2g(82.5mmol)を加え、窒素雰囲気下、23℃で24時間反応させた。得られたポリマーのMwは16,500、分子量分布1.7であった。得られたポリマー溶液1gをPGME10gに添加した結果、特に析出は見られなかった。 <Synthesis Example L3 Synthesis of polyamic acid (L3)>
23.7 g (74.2 mmol) of TFMB was dissolved in 352 g of NMP. To the obtained solution, 24.2 g (82.5 mmol) of BPDA was added and reacted at 23 ° C. for 24 hours under a nitrogen atmosphere. The obtained polymer had Mw of 16,500 and a molecular weight distribution of 1.7. As a result of adding 1 g of the obtained polymer solution to 10 g of PGME, no precipitation was observed.
TFMB9.89g(30.9mmol)をPGME380gに溶解させた。得られた溶液に、BPDA10.0g(34.3mmol)を加え、窒素雰囲気下、50℃で72時間反応させた。得られたポリマーのMwは14,700、分子量分布1.7であった。 <Synthesis Example L4 Synthesis of polyamic acid (L4)>
9.89 g (30.9 mmol) of TFMB was dissolved in 380 g of PGME. To the resulting solution, 10.0 g (34.3 mmol) of BPDA was added and reacted at 50 ° C. for 72 hours under a nitrogen atmosphere. Mw of the obtained polymer was 14,700 and molecular weight distribution was 1.7.
p-PDA3.90g(3.60mmol)をNMP35.2gに溶解させた。得られた溶液に、DMCBDA9.27g(4.00mmol)を加え、窒素雰囲気下、23℃で24時間反応させた。得られたポリマーのMwは45,000、分子量分布3.9であった。得られたポリマー溶液1gをPGME10gに添加した結果、ポリアミック酸が析出した。 <Synthesis of Comparative Synthesis Example HL1 Polyamic Acid (HL1)>
3.90 g (3.60 mmol) of p-PDA was dissolved in 35.2 g of NMP. To the resulting solution, 9.27 g (4.00 mmol) of DMCBDA was added and reacted at 23 ° C. for 24 hours under a nitrogen atmosphere. Mw of the obtained polymer was 45,000 and molecular weight distribution was 3.9. As a result of adding 1 g of the obtained polymer solution to 10 g of PGME, polyamic acid was precipitated.
TFMB2.86g(8.91mmol)をNMP35.2gに溶解させた。得られた溶液に、CBDA1.94g(9.91mmol)を加え、窒素雰囲気下、23℃で24時間反応させた。得られたポリマーのMwは69,200、分子量分布2.2であった。得られたポリマー溶液1gをPGME10gに添加した結果、特に析出は見られなかった。 <Synthesis of Comparative Synthesis Example HL2 Polyamic Acid (HL2)>
2.86 g (8.91 mmol) of TFMB was dissolved in 35.2 g of NMP. CBDA 1.94 g (9.91 mmol) was added to the resulting solution, and the mixture was reacted at 23 ° C. for 24 hours under a nitrogen atmosphere. Mw of the obtained polymer was 69,200 and molecular weight distribution 2.2. As a result of adding 1 g of the obtained polymer solution to 10 g of PGME, no precipitation was observed.
以下の方法によって、樹脂基板形成用組成物を調製した。 [4] Preparation of resin substrate forming composition A resin substrate forming composition was prepared by the following method.
合成例S1で得られた反応液をそのまま樹脂基板形成用組成物F1として用いた。 <Preparation Example 1 Resin substrate forming composition F1>
The reaction solution obtained in Synthesis Example S1 was directly used as the resin substrate forming composition F1.
合成例S2で得られた反応液をそのまま樹脂基板形成用組成物F2として用いた。 <Preparation Example 2 Resin substrate forming composition F2>
The reaction solution obtained in Synthesis Example S2 was used as it is as the resin substrate forming composition F2.
合成例S3得られた反応液10gにエポリードGT-401 0.60gとPGMEA11.8gを添加し、23℃で24時間撹拌して、樹脂基板形成用組成物F3を調製した。 <Preparation Example 3 Composition F3 for Resin Substrate Formation>
Synthesis Example S3 To 10 g of the obtained reaction solution, 0.60 g of Eporide GT-401 and 11.8 g of PGMEA were added and stirred at 23 ° C. for 24 hours to prepare a resin substrate forming composition F3.
合成例S3で得られた反応液10gにセロキサイド 2021P 0.80gとPGMEA11.8gを添加し、23℃で24時間撹拌して、樹脂基板形成用組成物F4を調製した。 <Preparation Example 4 Resin Substrate Forming Composition F4>
To 10 g of the reaction solution obtained in Synthesis Example S3, 0.80 g of Celoxide 2021P and 11.8 g of PGMEA were added and stirred at 23 ° C. for 24 hours to prepare a resin substrate forming composition F4.
合成例S3で得られた反応液10gにVESTAGON B 1530 0.60gとPGMEA11.8gを添加し、23℃で24時間撹拌して、樹脂基板形成用組成物F5を調製した。 <Preparation Example 5 Resin substrate forming composition F5>
0.6 g of VESTAGON B 1530 and 11.8 g of PGMEA were added to 10 g of the reaction solution obtained in Synthesis Example S3, and the mixture was stirred at 23 ° C. for 24 hours to prepare a resin substrate forming composition F5.
四塩化炭素100gを入れたナスフラスコに、ゼオノア(登録商標)1020R(日本ゼオン(株)製、シクロオレフィンポリマー樹脂)10g及びGT-401 3gを添加した。この溶液を、窒素雰囲気下、24時間攪拌して溶解し、樹脂基板形成用組成物F6を調製した。 <Preparation Example 6 Resin substrate forming composition F6>
To an eggplant flask containing 100 g of carbon tetrachloride, 10 g of ZEONOR (registered trademark) 1020R (manufactured by Nippon Zeon Co., Ltd., cycloolefin polymer resin) and 3 g of GT-401 were added. This solution was dissolved by stirring for 24 hours in a nitrogen atmosphere to prepare a resin substrate forming composition F6.
四塩化炭素100gを入れたナスフラスコに、ゼオノア(登録商標)1060R(日本ゼオン(株)製、シクロオレフィンポリマー樹脂)10gを添加した。この溶液を、窒素雰囲気下、24時間攪拌して溶解し、樹脂基板形成用組成物F7を調製した。 <Preparation Example 7: Resin substrate forming composition F7>
To an eggplant flask containing 100 g of carbon tetrachloride, 10 g of ZEONOR (registered trademark) 1060R (manufactured by Nippon Zeon Co., Ltd., cycloolefin polymer resin) was added. This solution was dissolved by stirring for 24 hours under a nitrogen atmosphere to prepare a resin substrate forming composition F7.
[実施例1-1]
合成例L1で得られた反応液に、BCSとNMPを加え、ポリマー濃度が5質量%、BCSが20質量%となるように希釈し、剥離層形成用組成物を得た。 [5] Preparation of composition for forming release layer [Example 1-1]
BCS and NMP were added to the reaction solution obtained in Synthesis Example L1, and diluted such that the polymer concentration was 5% by mass and BCS was 20% by mass to obtain a release layer forming composition.
合成例L2で得られた反応溶液をそのまま剥離層形成用組成物とした。 [Example 1-2]
The reaction solution obtained in Synthesis Example L2 was directly used as the release layer forming composition.
合成例L3で得られた反応液に、BCSとNMPを加え、ポリマー濃度が5質量%、BCSが20質量%となるように希釈し、剥離層形成用組成物を得た。 [Example 1-3]
BCS and NMP were added to the reaction solution obtained in Synthesis Example L3, and diluted such that the polymer concentration was 5% by mass and BCS was 20% by mass to obtain a release layer forming composition.
合成例L4で得られた反応溶液をそのまま剥離層形成用組成物とした。 [Example 1-4]
The reaction solution obtained in Synthesis Example L4 was used as the release layer forming composition as it was.
比較合成例HL1で得られた反応液に、BCSとNMPを加え、ポリマー濃度が5質量%、BCSが20質量%となるように希釈し、剥離層形成用組成物を得た。 [Comparative Example 1-1]
BCS and NMP were added to the reaction solution obtained in Comparative Synthesis Example HL1, and diluted such that the polymer concentration was 5% by mass and BCS was 20% by mass to obtain a release layer forming composition.
比較合成例HL2で得られた反応液に、BCSとNMPを加え、ポリマー濃度が5質量%、BCSが20質量%となるように希釈し、剥離層形成用組成物を得た。 [Comparative Example 1-2]
BCS and NMP were added to the reaction solution obtained in Comparative Synthesis Example HL2, and diluted such that the polymer concentration was 5% by mass and BCS was 20% by mass to obtain a release layer forming composition.
[実施例2-1]
スピンコータ(条件:回転数3,000rpmで約30秒)を用いて、実施例1-1で得られた剥離層形成用組成物L1を、ガラス基体としての100mm×100mmガラス基板(以下同様)の上に塗布した。
そして、得られた塗膜を、ホットプレートを用いて80℃で10分間加熱し、その後、オーブンを用いて、300℃で30分間加熱し、加熱温度を400℃まで昇温(10℃/分)し、更に400℃で30分間加熱し、ガラス基板上に厚さ約0.1μmの剥離層を形成し、剥離層付きガラス基板を得た。なお、昇温の間、膜付き基板をオーブンから取り出すことはせず、オーブン内で加熱した。 [6] Production of release layer and resin substrate [Example 2-1]
Using a spin coater (condition: about 3,000 rpm for about 30 seconds), the release layer forming composition L1 obtained in Example 1-1 was applied to a 100 mm × 100 mm glass substrate (hereinafter the same). It was applied on top.
The obtained coating film was heated at 80 ° C. for 10 minutes using a hot plate, and then heated at 300 ° C. for 30 minutes using an oven, and the heating temperature was raised to 400 ° C. (10 ° C./min. And then heated at 400 ° C. for 30 minutes to form a release layer having a thickness of about 0.1 μm on the glass substrate, thereby obtaining a glass substrate with a release layer. During the temperature increase, the film-coated substrate was not removed from the oven but heated in the oven.
実施例2-1で用いた樹脂基板形成用組成物F1の代わりに、樹脂基板形成用組成物F2を用いた以外は、実施例2-1と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-2]
A release layer and a resin substrate were produced in the same manner as in Example 2-1, except that the resin substrate forming composition F2 was used instead of the resin substrate forming composition F1 used in Example 2-1. Then, a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
実施例1-1で得られた剥離層形成用組成物L1の代わりに、実施例1-2で得られた剥離層形成用組成物L2を用いた以外は、実施例2-1と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-3]
The same procedure as in Example 2-1 except that the release layer forming composition L2 obtained in Example 1-2 was used instead of the release layer forming composition L1 obtained in Example 1-1. By the method, a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
剥離層形成用組成物として、実施例1-2で得られた剥離層形成用組成物L2を用い、樹脂基板形成用組成物として、実施例2-2で用いた樹脂基板形成用組成物F2を用いて、実施例2-1と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-4]
The release layer forming composition L2 obtained in Example 1-2 was used as the release layer forming composition, and the resin substrate forming composition F2 used in Example 2-2 was used as the resin substrate forming composition. Was used to prepare a release layer and a resin substrate in the same manner as in Example 2-1, and a glass substrate with a release layer and a glass substrate with a resin substrate and a release layer were obtained.
剥離層形成用組成物として、実施例1-1で得られた剥離層形成用組成物L1を用い、樹脂基板形成用組成物として、樹脂基板形成用組成物F4を用いて、実施例2-1と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-5]
The release layer forming composition L1 obtained in Example 1-1 was used as the release layer forming composition, and the resin substrate forming composition F4 was used as the resin substrate forming composition. A release layer and a resin substrate were prepared in the same manner as in Example 1 to obtain a glass substrate with a release layer and a glass substrate with a resin substrate / release layer.
剥離層形成用組成物として、実施例1-1で得られた剥離層形成用組成物L1を用い、樹脂基板形成用組成物として、樹脂基板形成用組成物F5を用いて、実施例2-1と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-6]
The release layer forming composition L1 obtained in Example 1-1 was used as the release layer forming composition, and the resin substrate forming composition F5 was used as the resin substrate forming composition. A release layer and a resin substrate were prepared in the same manner as in Example 1 to obtain a glass substrate with a release layer and a glass substrate with a resin substrate / release layer.
剥離層形成用組成物として、実施例1-2で得られた剥離層形成用組成物L2を用い、樹脂基板形成用組成物として、樹脂基板形成用組成物F5を用いて、実施例2-1と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-7]
The release layer forming composition L2 obtained in Example 1-2 was used as the release layer forming composition, and the resin substrate forming composition F5 was used as the resin substrate forming composition. A release layer and a resin substrate were prepared in the same manner as in Example 1 to obtain a glass substrate with a release layer and a glass substrate with a resin substrate / release layer.
実施例1-1で得られた剥離層形成用組成物L1を用いて、実施例2-1と同様の方法で剥離層を形成し、剥離層付きガラス基板を得た。
その後、すぐにスピンコータ(条件:回転数200rpmで約15秒)を用いて、前記ガラス基板上の剥離層(樹脂薄膜)の上に樹脂基板形成用組成物F6を塗布した。得られた塗膜を、ホットプレートを用いて80℃で2分間加熱し、その後、ホットプレートを用いて230℃で30分間加熱し、剥離層上に厚さ約3μmの樹脂基板を形成し、樹脂基板・剥離層付きガラス基板を得た。その後、紫外可視分光光度計((株)島津製作所製UV-2600)を用いて光透過率を測定した結果、樹脂基板は、400nmで80%以上の透過率を示した。 [Example 2-8]
Using the release layer forming composition L1 obtained in Example 1-1, a release layer was formed in the same manner as in Example 2-1, to obtain a glass substrate with a release layer.
Immediately thereafter, using a spin coater (condition: about 15 seconds at 200 rpm), the resin substrate forming composition F6 was applied on the release layer (resin thin film) on the glass substrate. The obtained coating film was heated at 80 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 30 minutes using a hot plate to form a resin substrate having a thickness of about 3 μm on the release layer. A glass substrate with a resin substrate and a release layer was obtained. Thereafter, the light transmittance was measured using an ultraviolet-visible spectrophotometer (UV-2600 manufactured by Shimadzu Corporation). As a result, the resin substrate showed a transmittance of 80% or more at 400 nm.
実施例1-1で得られた剥離層形成用組成物L1の代わりに、実施例1-2で得られた剥離層形成用組成物L2を用いた以外は、実施例2-8と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-9]
Example 2-8 was the same as Example 2-8 except that the release layer forming composition L2 obtained in Example 1-2 was used instead of the release layer forming composition L1 obtained in Example 1-1. By the method, a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
実施例1-1で得られた剥離層形成用組成物L1を用いて、実施例2-1と同様の方法で剥離層を形成し、剥離層付きガラス基板を得た。
その後、すぐにスピンコータ(条件:回転数200rpmで約15秒)を用いて、前記ガラス基板上の剥離層(樹脂薄膜)の上に樹脂基板形成用組成物F7を塗布した。得られた塗膜を、ホットプレートを用いて80℃で2分間加熱し、その後、ホットプレートを用いて230℃で30分間加熱し、剥離層上に厚さ約3μmの樹脂基板を形成し、樹脂基板・剥離層付きガラス基板を得た。その後、紫外可視分光光度計((株)島津製作所製UV-2600)を用いて光透過率を測定した結果、樹脂基板は、400nmで80%以上の透過率を示した。 [Example 2-10]
Using the release layer forming composition L1 obtained in Example 1-1, a release layer was formed in the same manner as in Example 2-1, to obtain a glass substrate with a release layer.
Immediately thereafter, using a spin coater (condition: about 15 seconds at 200 rpm), the resin substrate forming composition F7 was applied on the release layer (resin thin film) on the glass substrate. The obtained coating film was heated at 80 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 30 minutes using a hot plate to form a resin substrate having a thickness of about 3 μm on the release layer. A glass substrate with a resin substrate and a release layer was obtained. Thereafter, the light transmittance was measured using an ultraviolet-visible spectrophotometer (UV-2600 manufactured by Shimadzu Corporation). As a result, the resin substrate showed a transmittance of 80% or more at 400 nm.
実施例1-1で得られた剥離層形成用組成物L1の代わりに、実施例1-2で得られた剥離層形成用組成物L2を用いた以外は、実施例2-10と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-11]
Example 2-10 was the same as Example 2-10 except that the release layer forming composition L2 obtained in Example 1-2 was used instead of the release layer forming composition L1 obtained in Example 1-1. By the method, a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
実施例1-1で得られた剥離層形成用組成物の代わりに、比較例1-1~1-2で得られた剥離層形成用組成物を用いた以外は、上記実施例と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。剥離層と樹脂基板の組み合わせは表1に示した通りである。 [Comparative Examples 2-1 to 2-4]
The same composition as in the above example except that the composition for forming a release layer obtained in Comparative Examples 1-1 to 1-2 was used instead of the composition for forming a release layer obtained in Example 1-1. By the method, a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained. The combination of the release layer and the resin substrate is as shown in Table 1.
スピンコーター(条件:回転数3,000rpmで約30秒)を用いて、実施例1-3で得られた剥離層形成用組成物L3を、ガラス基体としての100mm×100mmガラス基板(以下同様)の上に塗布した。
そして、得られた塗膜を、ホットプレートを用いて80℃で10分間加熱し、その後、オーブンを用いて、300℃で30分間加熱し、加熱温度を400℃まで昇温(10℃/分)し、更に400℃で30分間加熱し、ガラス基板上に厚さ約0.1μmの剥離層を形成し、剥離層付きガラス基板を得た。なお、昇温の間、膜付き基板をオーブンから取り出すことはせず、オーブン内で加熱した。 [Example 2-12]
Using a spin coater (conditions: about 3,000 rpm for about 30 seconds), the release layer forming composition L3 obtained in Example 1-3 was used as a glass substrate of 100 mm × 100 mm glass substrate (hereinafter the same) It was applied on top.
The obtained coating film was heated at 80 ° C. for 10 minutes using a hot plate, and then heated at 300 ° C. for 30 minutes using an oven, and the heating temperature was raised to 400 ° C. (10 ° C./min. And then heated at 400 ° C. for 30 minutes to form a release layer having a thickness of about 0.1 μm on the glass substrate, thereby obtaining a glass substrate with a release layer. During the temperature increase, the film-coated substrate was not removed from the oven but heated in the oven.
実施例2-12で用いた樹脂基板形成用組成物F3の代わりに、樹脂基板形成用組成物F4を用いた以外は、実施例2-12と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-13]
A release layer and a resin substrate were prepared in the same manner as in Example 2-12, except that the resin substrate forming composition F4 was used instead of the resin substrate forming composition F3 used in Example 2-12. Then, a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
実施例2-12で用いた樹脂基板形成用組成物F3の代わりに、樹脂基板形成用組成物F5を用いた以外は、実施例2-12と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-14]
A release layer and a resin substrate were prepared in the same manner as in Example 2-12, except that the resin substrate forming composition F5 was used instead of the resin substrate forming composition F3 used in Example 2-12. Then, a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
実施例1-3で得られた剥離層形成用組成物L3の代わりに、実施例1-4で得られた剥離層形成用組成物L4を用いた以外は、実施例2-12と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-15]
The same procedure as in Example 2-12 except that the release layer forming composition L4 obtained in Example 1-4 was used instead of the release layer forming composition L3 obtained in Example 1-3. By the method, a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
剥離層形成用組成物として、実施例1-4で得られた剥離層形成用組成物L4を用い、樹脂基板形成用組成物として、実施例2-14で用いた樹脂基板形成用組成物F5を用いて、実施例2-12と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-16]
The release layer forming composition L4 obtained in Example 1-4 was used as the release layer forming composition, and the resin substrate forming composition F5 used in Example 2-14 was used as the resin substrate forming composition. Was used to prepare a release layer and a resin substrate in the same manner as in Example 2-12, and a glass substrate with a release layer and a glass substrate with a resin substrate and a release layer were obtained.
実施例1-3で得られた剥離層形成用組成物L3を用いて、実施例2-12と同様の方法で剥離層を形成し、剥離層付きガラス基板を得た。
その後、すぐにスピンコータ(条件:回転数200rpmで約15秒)を用いて、前記ガラス基板上の剥離層(樹脂薄膜)の上に樹脂基板形成用組成物F6を塗布した。得られた塗膜を、ホットプレートを用いて80℃で2分間加熱し、その後、ホットプレートを用いて230℃で30分間加熱し、剥離層上に厚さ約3μmの樹脂基板を形成し、樹脂基板・剥離層付きガラス基板を得た。その後、紫外可視分光光度計((株)島津製作所製UV-2600)を用いて光透過率を測定した結果、樹脂基板は、400nmで80%以上の透過率を示した。 [Example 2-17]
Using the release layer forming composition L3 obtained in Example 1-3, a release layer was formed in the same manner as in Example 2-12 to obtain a glass substrate with a release layer.
Immediately thereafter, using a spin coater (condition: about 15 seconds at 200 rpm), the resin substrate forming composition F6 was applied on the release layer (resin thin film) on the glass substrate. The obtained coating film was heated at 80 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 30 minutes using a hot plate to form a resin substrate having a thickness of about 3 μm on the release layer. A glass substrate with a resin substrate and a release layer was obtained. Thereafter, the light transmittance was measured using an ultraviolet-visible spectrophotometer (UV-2600 manufactured by Shimadzu Corporation). As a result, the resin substrate showed a transmittance of 80% or more at 400 nm.
実施例1-3で得られた剥離層形成用組成物L3の代わりに、実施例1-4で得られた剥離層形成用組成物L4を用いた以外は、実施例2-17と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-18]
Example 2-17 was the same as Example 2-17 except that the release layer forming composition L4 obtained in Example 1-4 was used instead of the release layer forming composition L3 obtained in Example 1-3. By the method, a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
実施例1-3で得られた剥離層形成用組成物L3を用いて、実施例2-12と同様の方法で剥離層を形成し、剥離層付きガラス基板を得た。
その後、すぐにスピンコータ(条件:回転数200rpmで約15秒)を用いて、前記ガラス基板上の剥離層(樹脂薄膜)の上に樹脂基板形成用組成物F7を塗布した。得られた塗膜を、ホットプレートを用いて80℃で2分間加熱し、その後、ホットプレートを用いて230℃で30分間加熱し、剥離層上に厚さ約3μmの樹脂基板を形成し、樹脂基板・剥離層付きガラス基板を得た。その後、紫外可視分光光度計((株)島津製作所製UV-2600)を用いて光透過率を測定した結果、樹脂基板は、400nmで80%以上の透過率を示した。 [Example 2-19]
Using the release layer forming composition L3 obtained in Example 1-3, a release layer was formed in the same manner as in Example 2-12 to obtain a glass substrate with a release layer.
Immediately thereafter, using a spin coater (condition: about 15 seconds at 200 rpm), the resin substrate forming composition F7 was applied on the release layer (resin thin film) on the glass substrate. The obtained coating film was heated at 80 ° C. for 2 minutes using a hot plate, and then heated at 230 ° C. for 30 minutes using a hot plate to form a resin substrate having a thickness of about 3 μm on the release layer. A glass substrate with a resin substrate and a release layer was obtained. Thereafter, the light transmittance was measured using an ultraviolet-visible spectrophotometer (UV-2600 manufactured by Shimadzu Corporation). As a result, the resin substrate showed a transmittance of 80% or more at 400 nm.
実施例1-3で得られた剥離層形成用組成物L3の代わりに、実施例1-4で得られた剥離層形成用組成物L4を用いた以外は、実施例2-19と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Example 2-20]
The same procedure as in Example 2-19 except that the release layer forming composition L4 obtained in Example 1-4 was used instead of the release layer forming composition L3 obtained in Example 1-3. By the method, a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained.
実施例1-3で得られた剥離層形成用組成物L3の代わりに、比較例1-1で得られた剥離層形成用組成物HL1を用いた以外は、実施例2-12と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。剥離層と樹脂基板の組み合わせは表2に示した通りである。 [Comparative Example 2-5]
The same procedure as in Example 2-12 except that the release layer forming composition HL1 obtained in Comparative Example 1-1 was used instead of the release layer forming composition L3 obtained in Example 1-3. By the method, a release layer and a resin substrate were prepared, and a glass substrate with a release layer and a glass substrate with a resin substrate / release layer were obtained. Combinations of the release layer and the resin substrate are as shown in Table 2.
剥離層形成用組成物として、比較例1-2で得られた剥離層形成用組成物HL2を用い、樹脂基板形成用組成物として、実施例2-13で用いた樹脂基板形成用組成物F4を用いて、実施例2-12と同様の方法で、剥離層及び樹脂基板を作製し、剥離層付きガラス基板及び樹脂基板・剥離層付きガラス基板を得た。 [Comparative Example 2-6]
The release layer forming composition HL2 obtained in Comparative Example 1-2 was used as the release layer forming composition, and the resin substrate forming composition F4 used in Example 2-13 was used as the resin substrate forming composition. Was used to prepare a release layer and a resin substrate in the same manner as in Example 2-12, and a glass substrate with a release layer and a glass substrate with a resin substrate and a release layer were obtained.
得られた実施例2-1~2-20、比較例2-1~2-6で作製した剥離層付きガラス基板の剥離層上にNMPとPGMEをピペットを用いて0.1ml滴下した。1分後、該剥離層を純水で洗浄した後、溶剤を滴下した部分の剥離層の状態を目視で観察して、剥離層の溶剤耐性を評価した。判定基準は以下の通りである。結果を表1及び表2に示す。
<判定基準>
○:特に液滴の跡も見られず、溶解がみられない。
△:液滴の跡がみられるが、残膜がみられる。
×:溶解している。
剥離層が、滴下した溶媒に溶解しないことは、剥離層上に樹脂基板を形成した際に、樹脂基板形成用組成物に含まれる有機溶剤に溶解しないことを意味し、ガラス基板から樹脂基板を損傷することなく剥離できることを意味する。 [7] Evaluation of solvent resistance of release layer Pipette NMP and PGME onto release layer of glass substrate with release layer prepared in Examples 2-1 to 2-20 and Comparative Examples 2-1 to 2-6. Was added dropwise in 0.1 ml. After 1 minute, the release layer was washed with pure water, and then the state of the release layer where the solvent was dropped was visually observed to evaluate the solvent resistance of the release layer. Judgment criteria are as follows. The results are shown in Tables 1 and 2.
<Criteria>
○: In particular, no traces of droplets are observed, and no dissolution is observed.
(Triangle | delta): Although the trace of a droplet is seen, a residual film is seen.
X: Dissolved.
The fact that the release layer does not dissolve in the dropped solvent means that when the resin substrate is formed on the release layer, it does not dissolve in the organic solvent contained in the resin substrate forming composition. It means that it can be peeled without being damaged.
上記実施例2-1~2-20及び比較例2-1~2-6で得られた樹脂基板・剥離層付きガラス基板について、剥離層とガラス基板との剥離性を、下記手法にて確認した。なお、下記の試験は、同一のガラス基板で行った。 [8] Evaluation of peelability With respect to the resin substrates / glass substrates with release layers obtained in Examples 2-1 to 2-20 and Comparative Examples 2-1 to 2-6, the peelability between the release layer and the glass substrate. Was confirmed by the following method. In addition, the following test was done with the same glass substrate.
実施例2-1~2-20及び比較例2-1~2-6で得られた剥離層付きガラス基板上の剥離層をクロスカット(縦横1mm間隔、以下同様)し、100マスカットを行った。すなわち、このクロスカットにより、1mm四方のマス目を100個形成した。
そして、この100マスカット部分に粘着テープを張り付けて、そのテープを剥がし、以下の基準(5B~0B,B,A,AA)に基づき、剥離の程度を評価した。
更に、全て剥離した基板のうち、実施例2-5~2-20で作製した樹脂基板・剥離層付きガラス基板を用いて、剥離力評価試験を実施した。試験方法は、樹脂基板・剥離層付きガラス基板の樹脂基板を25mm×50mm幅の長方形に、カッターナイフにて樹脂基板の背面まで貫通するように切り込みを入れ、短冊を作製した。更に、作製した短冊上に、セロハンテープ(ニチバンCT-24)をはった後、オートグラフAG-500N((株)島津製作所製)を用いて、基板の面に対して90度で、すなわち、垂直方向に剥離し、剥離力を測定し、100%剥離(すべて剥離)で、なおかつ剥離力が0.1N/25mm未満のものをAAAとした。
以上の結果を表1及び表2に示す。
<判定基準>
5B:0%剥離(剥離なし)
4B:5%未満の剥離
3B:5~15%未満の剥離
2B:15~35%未満の剥離
1B:35~65%未満の剥離
0B:65%~80%未満の剥離
B:80%~95%未満の剥離
A:95%~100%未満の剥離
AA:100%剥離(すべて剥離)
AAA:100%剥離で剥離力が0.1N/25mm未満 <Evaluation of peelability between release layer and glass substrate>
The release layers on the glass substrates with release layers obtained in Examples 2-1 to 2-20 and Comparative Examples 2-1 to 2-6 were cross-cut (1 mm in length and width, the same applies hereinafter), and 100 mass cuts were performed. . That is, 100 crosses of 1 mm square were formed by this cross cut.
Then, an adhesive tape was attached to the 100 muscat portion, the tape was peeled off, and the degree of peeling was evaluated based on the following criteria (5B to 0B, B, A, AA).
Further, among all the peeled substrates, a peeling force evaluation test was carried out using the resin substrate / glass substrate with the peeling layer produced in Examples 2-5 to 2-20. In the test method, a resin substrate / glass substrate with a release layer was cut into a 25 mm × 50 mm width rectangle so as to penetrate to the back surface of the resin substrate with a cutter knife to produce a strip. Further, after a cellophane tape (Nichiban CT-24) is put on the produced strip, autograph AG-500N (manufactured by Shimadzu Corporation) is used, at 90 degrees with respect to the surface of the substrate, that is, , Peeled in the vertical direction, peel strength was measured, 100% peel (all peel), and peel strength of less than 0.1 N / 25 mm was taken as AAA.
The above results are shown in Tables 1 and 2.
<Criteria>
5B: 0% peeling (no peeling)
4B: Less than 5% peeling 3B: Less than 5-15% peeling 2B: 15-35% peeling 1B: 35-65% peeling 0B: 65% -80% peeling B: 80% -95 % Peeling A: 95% to less than 100% peeling AA: 100% peeling (all peeling)
AAA: 100% peel and peel strength less than 0.1 N / 25 mm
実施例2-1~2-20及び比較例2-1~2-6で得られた樹脂基板・剥離層付きガラス基板について、上記の剥離性評価と同様の手順でその剥離性を評価した。結果を表1及び表2に示す。 <Evaluation of peelability between release layer and resin substrate>
For the resin substrates and glass substrates with release layers obtained in Examples 2-1 to 2-20 and Comparative Examples 2-1 to 2-6, the peelability was evaluated in the same procedure as the above-described peelability evaluation. The results are shown in Tables 1 and 2.
一方、比較例2-1~2-6の剥離層は、ガラス基板との密着性に優れるが、樹脂基板との剥離性に劣っていることが確認された。 As shown in Table 1 and Table 2, it was confirmed that the release layers of Examples 2-1 to 2-20 were excellent in adhesion to the glass substrate and easily peeled off from the resin film. Moreover, it was also confirmed from the result of the solubility test that it does not dissolve in the organic solvent contained in the resin substrate forming composition.
On the other hand, it was confirmed that the release layers of Comparative Examples 2-1 to 2-6 were excellent in adhesion to the glass substrate but inferior to the resin substrate.
Claims (10)
- 下記式(1)で表されるポリアミック酸と有機溶媒とを含むことを特徴とする剥離層形成用組成物。
- 上記Xにおいて、上記式(2a)で表される芳香族基が、下記式(7a)又は(8a)で表される芳香族基であり、上記Zが、互いに独立して、下記式(9a)又は式(10a)で表される芳香族基である請求項1~3のいずれか1項記載の剥離層形成用組成物。
- 上記Xにおいて、上記式(2b)で表される芳香族基が、下記式(7b)又は(8b)で表される芳香族基であり、上記Zが、互いに独立して、下記式(9b)又は式(10b)で表される芳香族基である請求項1~3のいずれか1項記載の剥離層形成用組成物。
- 上記有機溶媒が、下記式(S1)~(S7)で表される構造を有するものから選ばれる少なくとも1種である請求項1~5のいずれか1項記載の剥離層形成用組成物。
- 上記有機溶媒が、プロピレングリコールモノメチルエーテル又はプロピレングリコールモノメチルエーテルアセテートである請求項6記載の剥離層形成用組成物。 The composition for forming a release layer according to claim 6, wherein the organic solvent is propylene glycol monomethyl ether or propylene glycol monomethyl ether acetate.
- 請求項1~7のいずれか1項記載の剥離層形成用組成物を用いて形成される剥離層。 A release layer formed using the release layer forming composition according to any one of claims 1 to 7.
- 請求項8記載の剥離層を用いる樹脂基板の製造方法。 A method for producing a resin substrate using the release layer according to claim 8.
- 上記樹脂基板が、ポリイミド樹脂基板又は波長400nmの光透過率が80%以上である樹脂基板である請求項9記載の製造方法。 10. The manufacturing method according to claim 9, wherein the resin substrate is a polyimide resin substrate or a resin substrate having a light transmittance of 80% or more at a wavelength of 400 nm.
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KR1020237003164A KR20230020011A (en) | 2016-08-03 | 2017-08-03 | Composition for forming release layer, and release layer |
JP2018531972A JP7063266B2 (en) | 2016-08-03 | 2017-08-03 | A composition for forming a release layer and a release layer |
KR1020197004731A KR20190037265A (en) | 2016-08-03 | 2017-08-03 | The composition for forming a peel layer and the peel layer |
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KR20230020011A (en) | 2023-02-09 |
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CN109476951B (en) | 2022-07-29 |
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