KR101696963B1 - Photosensitive resin composition - Google Patents

Abstract

A slit coating method is used to prevent defects such as stains in a photosensitive resin film and foreign matter by dry cohesion of slit nozzles when a photosensitive resin film is formed, The present invention relates to a photosensitive resin composition capable of forming a photosensitive resin film having a pattern forming property, wherein the photosensitive resin composition is a binder resin containing at least one compound selected from the group consisting of polyimide, polybenzoxazole and a precursor thereof, A resin, a photoactive compound, and a mixed solvent of organic solvents according to (a) to (c) below:
(a) 10 to 50% by weight of a first organic solvent having a boiling point of less than 115 to 160 캜,
(b) 30 to 70 wt.% of a second organic solvent having a boiling point of less than 160 to 190 DEG C, a viscosity at 25 DEG C of 1.1 mPa s or more and less than 1.5 mPa s, and
(c) 5 to 20% by weight of a third organic solvent having a boiling point of 190 to 220 캜 and a viscosity at 25 캜 of 1.5 to 4.0 m · Ps.

Description

[0001] PHOTOSENSITIVE RESIN COMPOSITION [0002]

Disclosure of the Invention The present invention provides a method for preventing occurrence of defects such as stains in a photosensitive resin film and formation of foreign matter by dry cohesion of slit nozzles when a photosensitive resin film of a display device is formed using a slit coating method, To a photosensitive resin composition capable of producing a photosensitive resin film having excellent pattern formability.

Generally, a photosensitive resin means a polymer compound in which chemical changes in the molecular structure occur within a short period of time by light irradiation, and physical properties such as solubility, coloration, and curing are changed with respect to a specific solvent. Since the characteristics of such a photosensitive resin enable fine precision processing, reduce energy and raw materials as compared with a thermal reaction process, and enable quick and reliable work, photosensitive resins are used in advanced printing fields, And various precision electronic and information industries such as semiconductor and display.

Generally, a positive-working photosensitive resin composition includes a binder resin, a photoactive compound and a solvent. The double binder resin forms the skeleton of the coating film, determines the basic physical properties, and is designed to have an appropriate solubility for the developer. In addition, the photoactive compound binds to the binder resin to lower the solubility of the developer in the unexposed area and increase the solubility in the exposed area, thereby facilitating pattern formation by light.

Such a photosensitive resin composition is mainly used for forming an insulating film of a display-use organic EL element or a flattening film of a TFT substrate. In these applications, the slit coating method is mainly used because the substrate size is very large as compared with the semiconductor application.

The slit coating method is widely used because it is a coating method using a slit nozzle, there is no need to rotate the substrate to which the photosensitive resin composition is applied, the amount of the resin composition used is small, and the process safety is superior as compared with the conventional spin coating method . However, since the photosensitive resin coating film discharged from the slit nozzle during the slit coating contains a large amount of solvent, the solvent is firstly removed through rapid drying under reduced pressure after the coating, and then the solvent is firstly removed by a secondary heating Drying is common. However, in the vacuum drying step after the slit coating, the pattern shape defect easily occurs due to the difference in the solvent evaporation speed between the coating film surface and the inside, and in the heating and drying process, there is a problem .

Japanese Patent Application Laid-Open No. 2004-0051651 (published Feb. 19, 2004)

SUMMARY OF THE INVENTION An object of the present invention is to prevent occurrence of defects such as stains in a photosensitive resin film and occurrence of foreign matter by dry cohesion of slit nozzles when a photosensitive resin film of a display device is formed using a slit coating method, And to provide a photosensitive resin composition capable of forming a photosensitive resin film having an excellent pattern forming property by increasing the speed.

Another object of the present invention is to provide a photosensitive resin film produced by the photosensitive resin composition and having excellent pattern forming property and a method for producing the same.

It is still another object of the present invention to provide a display device including the photosensitive resin film formed by the photosensitive resin composition as a partition wall to show improved performance and reliability.

The photosensitive resin composition according to one aspect of the present invention comprises a binder resin, a photoactive compound, and a solvent, wherein the binder resin is at least one compound selected from the group consisting of polyimide, polybenzoxazole, and a precursor thereof (A) a first organic solvent having a boiling point of less than 115 to less than 160 占 폚 in an amount of from 10 to 50% by weight, (b) having a boiling point of less than 160 to 190 占 폚, a viscosity at 25 占 폚 of not less than 1.1 mPa.s (C) 5 to 20% by weight of a third organic solvent having a boiling point of 190 to 220 占 폚 and a viscosity at 25 占 폚 of 1.5 to 4.0 mPa 占 퐏, .

In the above-mentioned photosensitive resin composition, the first organic solvent may be selected from the group consisting of propylene glycol monomethyl ether acetate, monobutyl acetate, propylene glycol monomethyl ether, ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol diethyl ether, butyl acetate, ethylene glycol methyl ether acetate, isoamyl acetate, 2-methoxy ethyl acetate, methoxy propionate, ethyl butyrate, propyl butyrate, methyl 2- Ether, cyclopentanone, 2-hexanone, 3-hexanone, 5-methyl-2-hexanone, 4-heptanone, and mixtures thereof.

The second organic solvent may be selected from the group consisting of diethylene glycol dimethyl ether, dipropylene glycol dimethyl ether, butyl cellosolve, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, and mixtures thereof. have.

The third organic solvent may be selected from the group consisting of gamma-butyrolactone, dimethyltriglycol, N-methylpyrrolidone (NMP), and mixtures thereof.

In the photosensitive resin composition, the binder resin may have a weight average molecular weight of 1,000 to 50,000 g / mol.

In the photosensitive resin composition, the photoactive compound may be at least one selected from the group consisting of o-quinonediazide derivatives, 1,2-naphthoquinonediazide derivatives, allyldiazonium salts, diallyl iodonium salts, triallyl sulfonium salts, Benzyl ester, p-nitrobenzyl ester, trihalomethyl group-substituted s-triazine derivative, imidosulfonate derivative, compounds of the following formulas (1a) to (1i), condensation compounds of at least one compound It may be selected from the following groups:

Wherein e is an integer of 1 to 1000 in the repeating unit, and

및

로 이루어진 군에서 선택되는 하나이다.D each independently represent a hydrogen atom,

And

≪ / RTI >

The photosensitive resin composition may have a viscosity of 3 to 6 mPa · s.

A method of manufacturing a photosensitive resin film according to another aspect of the present invention includes the steps of forming a coating film by applying the above-mentioned photosensitive resin composition to a substrate by a slit coating method, and drying the coating film.

In the above-described method for producing a photosensitive resin film, the drying step may be carried out by sequential execution of drying under reduced pressure, followed by heating and drying.

According to the present invention, the photosensitive resin film may be produced by a method including exposing and developing the dried coating film to produce a patterned resin film, and curing the patterned resin film.

A photosensitive resin film according to another aspect of the present invention is produced using the above photosensitive resin composition.

The photosensitive resin film may be used for an insulating material of a display device.

A display device according to another aspect of the present invention includes a photosensitive resin film formed from the photosensitive resin composition as an insulating layer.

Other details of the embodiments of the present invention are included in the following detailed description.

In the photosensitive resin composition according to the present invention, when a photosensitive resin film of a display device is formed using a slit coating method, defects such as stains in the photosensitive resin film are prevented and foreign matters are generated by dry coagulation of the slit nozzles, The slit coating speed is increased and a photosensitive resin film having excellent film formability and coating film uniformity can be produced.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In the present specification, 'boiling point' means a temperature at which a liquid phase compound starts to undergo phase change under 1 atm (760 mmHg), 'viscosity' means a temperature at 25 ° C. using a Ubbelohde viscometer Means the measured value.

The present invention includes a binder resin, a photoactive compound, and a solvent, wherein the binder resin comprises at least one compound selected from the group consisting of polyimide, polybenzoxazole, and a precursor thereof, (B) a second organic solvent having a boiling point of less than 170 to 190 占 폚 and a viscosity at 25 占 폚 of 1.1 mPa 占 퐏 and less than 1.5 mPa 占 퐏; And (c) 5 to 20% by weight of a third organic solvent having a boiling point of 190 to 220 ° C and a viscosity at 25 ° C of 1.5 to 4.0 mPa · s, based on the total weight of the photosensitive resin composition do.

The present invention also provides a method for producing a photosensitive resin film comprising the steps of coating the above-mentioned photosensitive resin composition on a substrate by a slit coating method to form a coating film, and drying the coating film.

The present invention also provides a photosensitive resin film produced using the above-mentioned photosensitive resin composition.

The present invention also provides a display device comprising a photosensitive resin film produced using the above photosensitive resin composition as an insulating layer.

Hereinafter, a photosensitive resin composition according to embodiments of the present invention, a method of manufacturing a photosensitive resin film using the same, a photosensitive resin film produced using the photosensitive resin film, and a display device including the same will be described in detail.

According to one embodiment of the present invention, there is provided a binder resin composition comprising (1) a binder resin, (2) a photoactive compound, and (3) a solvent, wherein the binder resin is a polyimide, a polybenzoxazole and a precursor thereof (A) 10 to 50% by weight of a first organic solvent having a boiling point of 115 to less than 160 DEG C, (b) a boiling point of less than 160 to 190 DEG C, 30 to 70% by weight of a second organic solvent having a viscosity at 25 DEG C of 1.1 mPa.s or more and less than 1.5 mPa.s, and (c) a viscosity of 190 to 220 DEG C and a viscosity at 25 DEG C of 1.5 to 4.0 mPa.s and 5 to 20% by weight of a third organic solvent having a weight-average molecular weight of 1,000 to 5,000. Hereinafter, each component will be described in detail.

(1) Binder resin

In the above-mentioned photosensitive resin composition, the binder resin is an alkali-soluble binder resin. Specifically, at least one compound selected from the group consisting of polyimide, polybenzoxazole and a precursor thereof may be contained, and a copolymer containing two or more repeating units derived from these compounds may also be included . As the binder resin, a precursor may be used as the composition, or a chemically imidized soluble polyimide may be used to make the composition. That is, the binder resin used in the composition according to the present invention may be a polyimide precursor or polyimide.

The polyimide is a resin having an imide ring cyclic structure. The diamines and the acid dianhydrides may be reacted in a solvent such as N, N-dimethylacetamide (DMAc), N, N-dimethylformamide or N-methylpyrrolidone (NMP), gamma butyrolactone Examples of the organic solvent include glycol methyl ether acetate (PGMEA), dimethylsulfoxide, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, , Butyl lactate, methyl-1,3-butyleneglycol acetate, 1,3-butylene glycol-3-monomethyl ether, methyl pyruvate, ethyl pyruvate and methyl-3-methoxy propionate The polyimide precursor prepared by the polymerization reaction is heat-treated to be imidized or a dehydrating condensing agent such as dicyclohexylcarbodiimide or a base such as triethylamine is further added as a catalyst, And then imidizing it. Accordingly, the polyimide may comprise a residue of an acid in the molecule and a residue of a diamine.

The diamine usable for the production of the polyimide is a compound containing an aromatic, aliphatic or alicyclic divalent organic group together with two amino groups bonded to the organic group, specifically 2,2'-bis (trifluoro Methyl) -4,4'-diaminobiphenyl, m-phenylenediamine, p-phenylenediamine, m-xylylenediamine, p-xylylenediamine, 1,5-diaminonaphthalene, 3 , 3'-dimethylbenzidine, 4,4'- (or 3,4'-, 3,3'-, 2,4'- or 2,2'-) diaminodiphenylmethane, 4,4'- (Or 3,4'-, 3,3'-, 2,4'- or 2,2'-) diaminodiphenyl ether, 4,4'- (or 3,4'-, 3,3'- , 2,4'- or 2,2'-) diaminodiphenyl sulfide, 4,4 '- (or 3,4'-, 3,3'-, 2,4'- or 2,2'- ) Diaminodiphenylsulfone, 1,1,1,3,3,3-hexafluoro-2,2-bis (4-aminophenyl) propane, 2,2-bis (4- ) Phenyl) propane, 4,4'-benzophenonediamine , 4,4'-di- (4-aminophenoxy) phenylsulfone, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 4,4'-di- ) Phenylsulfone, 2,4-diaminotoluene, 2,5-diaminotoluene, 2,6-diaminotoluene, benzidine, 4,4'-diaminopterphenyl, 2,5- 4'-bis (p-aminophenoxy) biphenyl, or hexahydro-4,7-methanedanilene dimethylene diamine. These may be used singly or in combination of two or more.

Of the above diamines, diamines in which at least one hydrogen atom in the molecule is substituted with a fluorinated alkyl group having 1 to 10 carbon atoms such as a trifluoromethyl group may be more preferable in terms of the photosensitivity and the chemical resistance improvement effect of the polyimide.

Also, the acid dianhydride which can be used for the production of the polyimide may be a tetracarboxylic dianhydride containing an aromatic, aliphatic or alicyclic tetravalent organic group. Specific examples thereof include butane tetracarboxylic dianhydride, pentanetetracarboxylic acid Dianhydride, hexane tetracarboxylic dianhydride, cyclopentane tetracarboxylic dianhydride, bicyclopentane tetracarboxylic dianhydride, cyclopropane tetracarboxylic dianhydride, methylcyclohexanetetracarboxylic acid Ricin dihydride, 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride, 3,4,9,10-perylene tetracarboxylic dianhydride, 4,4'-sulfonyl Diphthalic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 1,2,5,6-naphthalene Naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,5,6-tetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, , Pyridine tetracarboxylic dianhydride, m-terphenyl-3,3 ', 4,4'-tetracarboxylic dianhydride, p-terphenyl-3,3', 4,4'-tetra 4,4'-oxydiphthalic dianhydride, 1,1,1,3,3,3-hexafluoro-2,2-bis [(2,3 or 3,4- Bis [4- (2,3- or 3,4-dicarboxyphenoxy) phenyl] propane dianhydride, or 1,1,1,3,3-tetramethylpiperidine dihydroide, Hexafluoro-2,2-bis [4- (2,3- or 4-dicarboxyphenoxy) phenyl] propanedialdehyde, and the like, Can be mixed and used.

As the binder resin, polybenzoxazole is a resin having a cyclic structure of an intramolecular oxazole ring. A polyhydroxyamide which is a precursor of polybenzoxazole prepared by reacting a bisaminophenol compound with an acid anhydride is subjected to a heat treatment at a temperature of 300 ° C or higher or a chemical treatment such as adding an anhydrous phosphoric acid, a base or a carbodiimide compound or the like . Accordingly, the polybenzoxazole may include residues of acid and residues of bisaminophenol in the molecule.

As the acid dianhydride which can be used in the production of the polybenzoxazole, the same one as described above can be used.

The bisaminophenols usable in the preparation of the polybenzoxazole are specifically bis (3-amino-4-hydroxyphenyl) hexafluoropropane, bis (3-amino-4-hydroxyphenyl) sulfone, bis Amino-4-hydroxyphenyl) propane, bis (3-amino-4-hydroxyphenyl) methylene, bis Containing diamines such as biphenyl and bis (3-amino-4-hydroxyphenyl) fluorene, 3-carboxy-4,4'-diaminodiphenyl ether and other carboxyl group-containing diamines, 4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,4'-diamine diphenyl ether, 4,4'-diaminodiphenyl ether, 3,4'-diamine diphenyl ether, Aminodiphenylmethane, 4,4'-diaminodiphenylmethane, 3,4'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone, 3,4'-diaminodiphenylsulfide, 4,4'-diamine (4-aminophenoxy) benzene, benzene, m-phenylenediamine, p-phenylenediamine, 1,5-naphthalenediamine, 2,6-naphthalenediamine, bis (4-aminophenoxy) phenyl} sulfone, bis (3-aminophenoxy) phenylsulfone, bis (4-aminophenoxy) benzene, 2,2'-dimethyl-4,4'-diaminobiphenyl, 2,2'-diethyl-4,4'-diaminobiphenyl, Diaminobiphenyl, 3,3'-diethyl-4,4'-diaminobiphenyl, 2,2 ', 3,3'-tetramethyl-4,4'-diaminobis Phenyl, 3,3 ', 4,4'-tetramethyl-4,4'-diaminobiphenyl, 2,2'-di (trifluoromethyl) -4,4'- diaminobiphenyl, A compound in which a part of the hydrogen atoms of the aromatic ring is substituted with an alkyl group or a halogen atom, and the like, but the present invention is not limited thereto.

Such polyimides, polybenzoxazoles, and precursors thereof may be encapsulated by a terminal blocking agent such as a monoamine, acid anhydride, acid chloride, or monocarboxylic acid having a hydroxyl group, a carboxyl group, a sulfonic acid group or a thiol group at its terminal have. By end-sealing with such a functional group, the dissolution rate of the resin in an aqueous alkali solution can be easily adjusted to a desired range.

The content of the terminal endblock agent is preferably 5 to 50 mol% based on the mole of all the monomers used in the production of the polyimide, polybenzoxazole and the precursor thereof, the viscosity of the composition is suitable when the photosensitive resin composition is applied, A photosensitive resin composition having physical properties can be obtained.

If the weight average molecular weight of the polyimide, polybenzoxazole, or polymer thereof is too low, the binder resin may have low heat resistance and chemical resistance. If the weight average molecular weight is too high, the binder resin may not exhibit solubility, The viscosity of the photosensitive resin composition may be excessively increased and uniform application may be difficult. In view of the effect of the weight average molecular weight of the binder resin on the photosensitive resin composition and the resin film, it is preferable that the binder resin has a weight average molecular weight of 1,000 to 50,000 g / mol.

The above-mentioned binder resin may further contain a conventional alkali-soluble resin such as a radically polymerizable polymer having an acrylic acid, a phenol-novolac resin, a polyhydroxystyrene or a polysiloxane within the range not hindering the effect of the photosensitive resin composition according to the present invention .

(2) Photoactive compound

In the photosensitive resin composition, a photoactive compound is insoluble in alkali but generates an acid upon exposure to light and changes to alkali-soluble. Further, the above-mentioned binder resin is soluble in alkali but when it is mixed with a photoactive compound, its solubility in alkaline is remarkably lowered due to physical interaction. As a result, dissolution of the exposed portion of the photosensitive resin film is promoted by decomposition of the photoactive compound, but the unexposed portion remains alkaline insoluble because of no such chemical change action.

Specific examples of the photoactive compound include o-quinonediazide derivatives, 1,2-naphthoquinone diazide derivatives, allyldiazonium salts, diallyl iodonium salts, triallyl sulfonium salts, o-nitrobenzyl esters, Benzyl ester, trihalomethyl group-substituted s-triazine derivatives, imidosulfonate derivatives, compounds represented by the following formulas (1a) to (1i), or condensation products obtained by condensation reaction of at least one of them:

(Wherein e is an integer of 1 to 1000 in the repeating unit, and

및

로 이루어진 군에서 선택되는 하나이다)D each independently represent a hydrogen atom,

And

Lt; RTI ID = 0.0 >

The photoactive compound may be included in an amount of 1 to 50 parts by weight based on 100 parts by weight of the binder resin. If the content of the photoactive compound is too low, the photosensitivity is lowered. As a result, the resolution may be lowered. If the content of the photoactive compound is too high, the heat resistance is lowered and the light absorption of the photosensitive resin composition becomes too high, There is a possibility that this may become narrow. Therefore, it may be preferable that the photoactive compound is contained in the above-mentioned content range.

(3) Solvent

Generally, the solvent used in the photosensitive resin composition has higher volatility as the boiling point is lower. As a result, since the organic solvent can be removed from the coated film of the photosensitive resin composition in a short period of time, the occurrence of pin marks in the photosensitive resin film can be prevented in the subsequent vacuum drying step and the heating and drying step. However, when the volatilization rate of the solvent is too fast, the difference in the volatilization rate of the solvent on the surface of the coating film becomes large, and the resin film tends to be unevenly formed. When the boiling point of the solvent is too low, the solubility of the binder resin and the photoactive compound is lowered, and the solid content tends to precipitate. The precipitated solids are attached to the slit nozzle, and as a result, a streak of the coating film due to the foreign matter attached to the slit nozzle is generated, and the uniformity of the film thickness of the photosensitive resin film is lowered.

On the other hand, the photosensitive resin composition according to the present invention includes a mixed solvent in which three or more kinds of solvents having different boiling points and viscosity characteristics are mixed in an optimized amount, so that when the photosensitive resin film is formed by the slit coating method, It is possible to prevent the occurrence of stains of the pattern due to the generation of foreign matter and the rapid volatilization of the solvent, and the volatilization of the solvent in the drying step after the application easily occurs, thereby shortening the processing time and providing an excellent pattern.

Specifically, the solvent includes the solvents (a) to (c), respectively, under the following conditions:

(a) 10 to 50% by weight of a first organic solvent having a boiling point of less than 115 to 160 캜,

(b) 30 to 70 wt.% of a second organic solvent having a boiling point of less than 160 to 190 DEG C, a viscosity at 25 DEG C of 1.1 mPa s or more and less than 1.5 mPa s, and

(c) 5 to 20% by weight of a third organic solvent having a boiling point of 190 to 220 ° C and a viscosity at 25 ° C of 1.5 to 4.0 m · Ps.

The first organic solvent has a low boiling point at a low boiling point of less than 115 to 160 캜. As a result, the time required for the pressure-sensitive drying of the coating film of the pressure-sensitive resin composition can be shortened. However, when the content is too high, there is a fear that the storage stability of the photosensitive resin composition is lowered, and the difference in the volatilization rate between the surface and the inside of the coated film of the photosensitive resin composition becomes large, and the photosensitive resin film may be uneven. Accordingly, the first organic solvent may be contained in an amount of 10 to 50 wt% based on the total weight of the solvent. If the content of the first organic solvent is less than 10% by weight, there is a fear that productivity may be lowered due to an increase in the time required for drying under reduced pressure. If the content is more than 50% by weight, unevenness may occur on the surface of the photosensitive resin film.

Specific examples of the first solvent include propylene glycol monomethyl ether acetate (boiling point: 145 캜, viscosity: 1.1 mPa s), monobutyl acetate (boiling point: 124 캜), propylene glycol monomethyl ether (121 캜), ethylene glycol methyl ether 125 DEG C), ethylene glycol ethyl ether (135 DEG C), ethylene glycol diethyl ether (121 DEG C), methyl-3-n-butyl acetate (125 DEG C), ethylene glycol methyl ether acetate (145 DEG C), isoamyl acetate 143 ° C), 2-methoxyethyl acetate (145 ° C), methoxypropionate (144 ° C), ethyl butyrate (120 ° C), propyl butyrate ), Methyl lactate (145 캜), dibutyl ether (140 캜), cyclopentanone (131 캜), 2-hexanone (127 캜) Hexanone (145 占 폚), or 4-heptanone (145 占 폚), but the present invention is not limited thereto. Whichever it is available. Of these, propylene glycol monomethyl ether may be more preferable in terms of storage stability and viscosity stability of the photosensitive resin composition.

The second solvent has a boiling point of less than 160 to 190 캜, and a viscosity at 25 캜 of 1.1 mPa s to less than 1.5 mPa s.

When the viscosity at 25 캜 is less than 1.1 mPa,, the solubility of the binder resin described above is lowered, and as a result, the uniformity of the thickness of the photosensitive resin film and the stability of the photosensitive resin composition may be deteriorated. On the other hand, when the viscosity is 1.5 mPa · s or more, the viscosity of the photosensitive resin composition rises and it is difficult to apply the composition, and as a result, there is a fear that the processability is lowered. In addition, bubbles may be generated in the vacuum drying step.

In addition, since the solvent is volatilized and removed from the first solvent having a low boiling point during the decompression drying process, the amount of the second and third solvents increases. In this case, by using a second solvent having a viscosity of less than 1.5 m Pa at 25 캜, a photosensitive resin film excellent in film thickness uniformity can be produced by imparting appropriate fluidity to the photosensitive resin composition, . Accordingly, it is preferable to optimize the content of the second solvent having such a low viscosity as described above.

Specifically, the second organic solvent may be contained in an amount of 30 to 70% by weight based on the total weight of the solvent. If the content of the second organic solvent is less than 30% by weight, foaming may occur during drying under reduced pressure. If the content is more than 70% by weight, unevenness may occur on the surface of the photosensitive resin film or film thickness uniformity of the photosensitive resin film may deteriorate.

Specific examples of the second solvent include diethylene glycol dimethyl ether (boiling point: 162 캜, viscosity: 1.17 mPa s), dipropylene glycol dimethyl ether (boiling point: 171 캜, viscosity: 1.27 mPa s), diethylene glycol methyl ethyl ether (Boiling point 187 캜, viscosity 1.27 mPa s), diethylene glycol diethyl ether (boiling point 189 캜, viscosity 1.47 mPa s), butyl cellosolve (boiling point 171 캜) It can be used without particular limitation as long as it meets one boiling point and viscosity characteristic.

The third solvent has a boiling point of 190 to 220 캜 and a viscosity of 1.5 to 4.0 mPa 25 at 25 캜.

The third solvent has higher boiling point and viscosity characteristics than the first and second solvents, thereby preventing drying of the tip of the slit nozzle and clogging of the nozzle during slit coating, thereby forming vertical stripes on the coating film of the photosensitive resin composition Defects and surface defects of the resin film can be prevented. In addition, when the coating film of the photosensitive resin composition is dried, the surface drying time is delayed so that the flattening effect of the surface can be maintained and the occurrence of craters can be prevented. However, on the other hand, since the volatilization rate is slow due to the high boiling point, the process productivity may be lowered.

Therefore, it is preferable that the third organic solvent is included in an amount of 5 to 20% by weight based on the total weight of the solvent. When the content of the third organic solvent is less than 5% by weight, the content of the solvent having a relatively low boiling point increases, which may cause surface unevenness depending on the difference in the volatilization rate during drying of the coating film of the photosensitive resin composition. The reduced pressure drying time is prolonged, not only the productivity is deteriorated but also the amount of the solvent remaining in the film is increased, so that the processability is deteriorated and it may be vulnerable to environmental pollution.

Specific examples of the third organic solvent include gamma-butyrolactone (boiling point: 204 캜, viscosity: 1.5 m ∙ Ps), triethylene glycol dimethyl ether (boiling point: 216 캜, viscosity: 4.76 mPa 揃 s), N-methylpyrrolidone 202-204 占 폚), but the present invention is not limited thereto and can be used without particular limitation as long as it satisfies the above-mentioned boiling point and viscosity characteristics.

The solvent mixed under the above conditions may be preferably contained in the photosensitive resin composition in an optimized amount in consideration of coating properties of the photosensitive resin composition and inhibition of occurrence of defects in the photosensitive resin film. When the content of the solvent contained in the photosensitive resin composition is too low, the photosensitive resin composition has a high viscosity, so that a smooth surface can not be obtained at the time of coating and a problem arises in realizing a desired thickness. It is difficult to realize physical properties for forming a fine pattern. On the other hand, when the solvent is contained in an excessively high content, adhesion with the substrate is lowered, and it is difficult to obtain a uniform coating property and a desired film thickness. Therefore, the solvent may be included in an amount such that the photosensitive resin composition has a viscosity of 3 to 6 mPa · s in consideration of workability in forming a photosensitive resin film, etc. Specifically, It is more preferable for the large-area slit coating to be contained in an amount of 97 wt%.

(4) Other additives

The above-mentioned photosensitive resin composition may be used in combination with a colorant, a thermal polymerization inhibitor, a dispersant, an antioxidant, an ultraviolet absorber, an adhesion promoter, a surfactant, a leveling agent, a plasticizer, a filler, a dissolution rate regulator, a sensitizer, And may further include additives to be selected.

Specific examples of the dispersing agent include polymeric, nonionic, anionic, and cationic dispersing agents. More specifically, polyalkylene glycols and esters thereof, polyoxyalkylene polyhydric alcohols, ester alkylene oxide adducts , An alcohol alkylene oxide adduct, a sulfonic acid ester, a sulfonic acid salt, a carboxylic acid ester, a carboxylic acid salt, an alkylamide alkylene oxide adduct or an alkylamine, and any of these may be used singly or in combination of two or more Can be mixed and used.

Specific examples of the antioxidant include 2,2-thiobis (4-methyl-6-t-butylphenol), 2,6-g, t-butylphenol, As the absorbent, 2- (3-t-butyl-5-methyl-2-hydroxyphenyl) -5-chloro-benzotriazole, alkoxybenzophenone or a mixture thereof may be used.

Specific examples of the adhesion promoter include alkoxysilane-containing aromatic amine compounds, aromatic amide compounds, and aromatic-free silane compounds. Specific examples of the adhesion promoting agent include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2- (2-aminoethyl) -3-aminopropylmethyltrimethoxysilane, 3-aminopropyltriethoxysilane, N- (2-aminoethyl) 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-ethoxycyclohexyl) ethyltrimethoxysilane, 3-chloropropylmethyldimethoxy Silane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, or 3-mercaptopropyltrimethoxysilane. Of these, one kind or two or more kinds of them may be mixed Can be used.

Specifically, the surfactant serves to improve the coating property with the substrate. The surfactant can be used without particular limitation as long as it can be used in the photosensitive resin composition. Among these, fluorine surfactants or silicone surfactants are preferably used can do.

A leveling agent, a plasticizer, a filler, a dissolution rate controlling agent or a sensitizer, and the like can be used without particular limitation, as long as they can be usually used in a photosensitive resin composition.

The additive may be contained in an appropriate amount depending on the use of the photosensitive resin composition, and specifically 0.1 to 30 parts by weight based on 100 parts by weight of the binder resin.

The photosensitive resin composition having the above-described constitution can be produced by mixing the binder resin and the photoactive compound in a solvent, adding the above-mentioned additives as necessary and then mixing them. At this time, in order to increase the solubility in the solvent, the solubility increasing step such as stirring or heating at a temperature of 40 to 80 DEG C may be selectively performed.

Since the above-mentioned photosensitive resin composition includes three or more kinds of solvents having different boiling points from each other, it is possible to increase the slit coating speed when forming the photosensitive resin film by using the slit coating method, and to suppress the occurrence of stain in the photosensitive resin film .

Thus, the photosensitive resin composition is used for a protective film for a thin film transistor, a photosensitive material for forming an interlayer insulating film of a display device, a photosensitive material for forming an overcoat layer, a photosensitive material for a column spacer, a photosensitive material for forming a passivation film, A photoresist, a photosensitive material for an insulating film in a multilayer printed circuit board, a photosensitive material for an electrode protective film of an OLED, a photosensitive material for forming a barrier rib of an OLED, or a photosensitive material for a semiconductor protective film, A printing plate, a photosensitive material for a printed wiring board, a transparent photosensitive material or a PDP. Among them, the photosensitive resin composition according to the present invention is preferable as a photosensitive material for barrier ribs, and is particularly useful as a photosensitive material for barrier ribs of organic light emitting diodes.

According to another embodiment of the present invention, there is provided a photosensitive resin film formed using the above photosensitive resin composition and a method for producing the same. Here, the photosensitive resin film may be patterned to have a predetermined shape depending on the application.

Specifically, the photosensitive resin film may be prepared by applying the above-described photosensitive resin composition to a substrate to form a coating film, and drying the coating film.

The substrate may be a silicon wafer, a glass substrate, a metal substrate, a ceramic substrate, a polymer substrate (such as a polycarbonate, a polyester, or a metal), as long as it can be commonly used in the field of electronic communication, Aromatic polyamide, polyamideimide or polyimide), and the like. These substrates may be pretreated by chemical pretreatment with a silane coupling agent, plasma treatment, ion plating, sputtering, gas phase reaction, vacuum deposition or the like depending on the purpose. In addition, the substrate may have an optional thin film transistor for driving, and a nitrided silicon film may be sputtered.

The coating process may be carried out by a conventional coating method such as a spin coating method, a slit coating method, a dip coating method, a spray coating method, or a printing method, and the effect of the photosensitive resin composition according to the present invention can be maximized The slit coating method may be preferable. In the slit coating method, there is a problem that appearance defects such as a transfer mark and a strike tend to occur and the uniformity of film thickness of the photosensitive resin film after drying is low. However, when the photosensitive resin composition according to the present invention is used, A photosensitive resin film excellent in uniformity can be obtained. In addition, it is possible to suppress the generation of bubbles accompanying the vacuum drying step.

The application speed of the photosensitive resin composition by the slit coating method is preferably 10 to 400 mm / sec, and the thickness of the coating film depends on the content and viscosity of the solid content in the photosensitive resin composition, Mu m in terms of uniformity of the film thickness.

After the coating step, a drying process is performed on the coating film of the photosensitive resin composition.

Specifically, the drying step may be performed by a reduced pressure drying step. More specifically, the base material on which the coating film of the photosensitive resin composition is formed is placed in a vacuum chamber, and the solvent in the coating film is evaporated by reducing the pressure. The vacuum drying speed may vary depending on the vacuum chamber volume or the vacuum pump capability.

It is also preferable that the ultimate pressure in the vacuum chamber at the time of completion of reduced pressure drying is 65 Pa or less in the state where the coating film substrate is placed. When the ultimate pressure is within the above-mentioned range, it is possible to make the surface of the coating film dry without adhesion. As a result, surface contamination and particle generation on the surface of the resin film can be suppressed.

A drying step (pre-baking) of the coating film after the reduced pressure drying is carried out.

The heating and drying process may be performed using a hot plate, an oven, an infrared ray, or the like, and may preferably be performed at 50 to 150 ° C for about 1 to 20 minutes. If the drying process is not sufficiently carried out and a large amount of the solvent component remains, a film loss may occur in a non-exposed region in a subsequent development process to lower the residual film. On the other hand, if the drying temperature is too high, the curing reaction is promoted, .

A photosensitive resin film is formed by the coating and drying process as described above.

If patterning is required afterwards, a pattern can be formed according to a normal patterning process such as exposure, development, and drying.

Specifically, in the exposure process for patterning the photosensitive resin film, an ultraviolet ray or a visible ray having a wavelength of 200 to 500 nm may be irradiated using a photomask having a pattern to be processed, and an exposure dose of 40 to 1,000 mJ / cm 2 May be preferable. The exposure time may vary depending on the exposure apparatus used, the wavelength of the irradiation light or the exposure dose, and specifically, the exposure time may be varied within a range of 1 to 20 seconds.

In the exposure step, examples of the light source irradiated by the light irradiation means include electromagnetic waves, visible light from ultraviolet rays, electron rays, X-rays, and laser light. As the irradiation method of the light source, known means such as high-pressure mercury lamp, xenon, carbon arc lamp, halogen lamp, cold cathode tube for radiator, LED, semiconductor laser can be used.

The developing step is a step of forming a pattern by removing an exposed area from a photosensitive film that has undergone an exposure process. The developing solution may include a hydroxide of an alkali metal or an alkaline earth metal such as sodium hydroxide, potassium hydroxide or the like; Primary amines such as ethylamine and N-propylamine; Secondary amines such as diethylamine and di-n-propylamine; Tertiary amines such as trimethylamine, methyldiethylamine and dimethylethylamine; Tertiary alcohol amines such as dimethylethanolamine, methyldiethanolamine and triethanolamine; Pyrrole, piperidine, n-methylpiperidine, n-methylpyrrolidine, 1,8-diazabicyclo [5,4,0] -7- undecene, 1,5-diazabicyclo [ 3,0] -5-nonene; Aromatic tertiary amines such as pyridine, coridine, lutidine and quinoline; An aqueous solution of a quaternary ammonium salt such as tetramethylammonium hydroxide or tetraethylammonium hydroxide can be used.

At this time, the developing method can be carried out according to a conventional developing method such as a dipping method or a shower method.

After development, the substrate is dried in air or a nitrogen atmosphere, and then heated (post-baked) using a heating device such as a hot plate or an oven to form a completed photosensitive material pattern. At this time, it is preferable that the heating process is performed at 180 to 250 ° C for 10 to 90 minutes.

The photosensitive resin film formed or patterned according to the above-described method has excellent pattern forming properties as described above and can be used as an insulating film for an interlayer insulating film, an overcoat, a column spacer, a passivation film, a buffer coat film, The present invention can be used for at least one kind of electrode protection film or barrier rib of OLED, protective film of thin film transistor, and semiconductor protective film. Among them, since insulating property can be obtained due to low dielectric constant property of photosensitive resin composition, The barrier ribs of the OLED, particularly, the barrier ribs of the OLED may be more preferable.

According to another embodiment of the present invention, a display device including a photosensitive resin film formed using the photosensitive resin composition as a partition wall may be provided.

The display device can exhibit improved performance characteristics and reliability together with improved high resolution and high sensitivity characteristics by including a photosensitive resin film of high pattern forming property formed from the above photosensitive resin composition.

Hereinafter, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Synthetic example  1: soluble polyimide (P-1) Manufacturing example

12.1 g of 2,2-bis (3-amino-hydroxyphenyl) hexafluorophane and 60 g of propylene glycol monomethyl ether acetate were sequentially added to a 100 ml round-bottom flask, and the mixture was slowly stirred to completely dissolve the flask Was slowly added to 10.2 g of 3,3 ', 4,4'-diphenyl ether tetracarboxylic dianhydride while keeping it at room temperature with a water bath. To the mixed solution, 11 g of toluene and 4 g of triethylamine were added, and water was removed through Dean-Stark distillation, followed by reflux at 150 ° C. for 8 hours. After the water was removed from the Dean-Stark distillation apparatus, the solution was further refluxed for 2 hours to remove the catalyst, and then cooled at room temperature to obtain a soluble polyimide solution. The polyimide formation peak was confirmed by IR, and the weight average molecular weight measured by GPC was 30,000 and the polydispersity index (PDI) was found to be 1.5.

Synthetic example  2: Polyamic acid  Ester Manufacturing example

12.1 g of 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane and 30 g of gamma-butyrolactone were added sequentially to a 100 ml round-bottomed flask, and the mixture was slowly stirred to dissolve completely. 13.6 g of 4.4'-oxybis [(2-chlorocarbonyl) methylbenzoate] dissolved in 30 g of gamma-butyrolactone was slowly stirred while maintaining the jacket temperature of the reactor at 10 ° C. The mixed solution was stirred for 2 hours, sufficiently reacted, and further stirred at room temperature for 20 hours to prepare a polyamic acid ester. The reaction product was poured into water to precipitate and the filtered solid product was dried at 50 DEG C under vacuum. The dried solid product was dissolved in 50 g of gamma-butyrolactone to prepare a polyamic acid ester solution. The weight average molecular weight measured by GPC was 44,000 and the polydispersity index (PDI) was found to be 1.7.

Synthetic example  3: Polyamic acid Manufacturing example

12.1 g of 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane and 30 g of gamma-butyrolactone were added sequentially to a 100 ml round-bottomed flask, and the mixture was slowly stirred to dissolve completely. 10.2 g of 3,3 ', 4,4'-diphenyl ether tetracarboxylic dianhydride dissolved in 30 g of gamma-butyrolactone was slowly added to the reactor while keeping the jacket temperature of the reactor at 0 ° C and stirred. The mixed solution was stirred for 2 hours, sufficiently reacted, and further stirred at room temperature for 16 hours to prepare a polyamic acid. The peak of polyamic acid formation was confirmed by IR and the weight average molecular weight measured by GPC was 45,000 and the polydispersity index (PDI) was found to be 1.6.

Synthesis Example 4: Synthesis of polybenzoxazole precursor

12.1 g of 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane and 30 g of N-methyl-2-pyrrolidone were sequentially added to a 100 ml round bottom flask, While maintaining the jacket temperature of the reactor at 5 캜, 6.7 g of terephthaloyl chloride was dissolved in 30 g of NMP and stirred while being slowly added. The mixed solution was stirred for 1 hour and sufficiently reacted. Then, a catalytic amount of pyridine was added thereto, followed by further stirring at room temperature for 4 hours to prepare a polybenzoxazole precursor. The weight average molecular weight measured by GPC was 35,000 and the polydispersity index (PDI) was found to be 1.6.

Production Example 1: Preparation of Photosensitive Resin Composition

5 g of the soluble polyimide (P-1) prepared in Synthesis Example 1 and THPE 523 as a photoactive compound, 25 g of propylene glycol monomethyl ether acetate (PGMEA) as a mixed solvent, 27.5 g of diethylene glycol dimethyl ether (DEGDME) Was added to a mixed solvent of 5 g of butyrolactone (? -BL), stirred at room temperature for 1 hour, and filtered through a filter having a pore of 1 占 퐉 to prepare a photosensitive resin composition.

Production Example 2

A photosensitive resin composition was prepared in the same manner as in Preparation Example 1, except that the polyamic acid ester of Synthesis Example 2 was used in place of the soluble polyimide (P-1) in Production Example 1.

Production Example 3

A photosensitive resin composition was prepared in the same manner as in Preparation Example 1, except that the polyamic acid of Synthesis Example 3 was used instead of the soluble polyimide (P-1) in Synthesis Example 1.

Production Example 4

A photosensitive resin composition was prepared in the same manner as in Preparation Example 1, except that the polybenzoxazole of Synthesis Example 4 was used instead of the soluble polyimide (P-1) in Synthesis Example 1.

The compositions and contents of the photosensitive resin compositions prepared in Production Examples 1 to 4 are summarized in Table 1 below.

Production Example 1 Production Example 2 Production Example 3 Production Example 4 Binder resin
(weight%) Soluble polyimide
(10) Polyamic acid
Ester
(10) Polyamic acid
(10) Polybenzoxazole
(10) Photoactive compound
(weight%) THPE523
(4) THPE523
(4) THPE523
(4) THPE523
(4) menstruum The first solvent PGMEA
(25) PGMEA
(25) PGMEA
(25) PGMEA
(25) The second solvent DEGDME
(55) DEGDME
(55) DEGDME
(55) DEGDME
(55) Third solvent γ-BL
(6) γ-BL
(6) γ-BL
(6) γ-BL
(6) Other additives F556 F556 F556 F556

Comparative Production Examples 1 to 3

A photosensitive resin composition was prepared in the same manner as in Example 1 except that a mixed solvent was used in the composition and content as shown in Table 2 below.

Comparative Preparation Example 1 Comparative Production Example 2 Comparative Production Example 3 Binder resin
(weight%) Soluble polyimide
(10) Soluble polyimide
(10) Soluble polyimide
(10) Photoactive compound
(weight%) THPE523
(4) THPE523
(4) THPE523
(4) menstruum The first solvent PGMEA
(35) PGMEA
(45) PGMEA
(55) The second solvent DEGDME
(45) DEGDME
(35) DEGDME
(25) Third solvent γ-BL
(6) γ-BL
(6) γ-BL
(6) Other additives F556 F556 F556

Preparation of photosensitive resin film

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The photosensitive resin compositions prepared in Production Examples 1 to 4 and Comparative Production Examples 1 to 3 were coated on a glass substrate of 1100 mm x 960 mm each using a slit coater so as to have a thickness of 3 mu m after drying. At this time, the coating speed was 50 mm / sec. After completion of the application, the glass substrate on which the coated film was formed was placed in a vacuum chamber and dried under reduced pressure for 100 seconds. At this time, the pressure in the chamber after 100 seconds was adjusted to be 65 Pa. After completion of the reduced-pressure drying step, pre-baking was carried out using a hot plate at 120 DEG C for 120 seconds to obtain a photosensitive resin film.

Test Example

(1) Appearance Evaluation of Photosensitive Resin Film

The photosensitive resin films prepared in the above Examples and Comparative Examples were evaluated visually under the sodium lamp for the occurrence of defects in the appearance of the photosensitive resin film. The results are shown in Table 3 below.

In detail, the stain on the photosensitive resin film, the streaks originating from the slit nozzles, the reduced pressure dry copper pin marks, the hot plate proxy pin marks, the dry marks, and the foams were evaluated according to the following criteria:

1. No occurrence of defects such as stains or marks on the surface of the photosensitive resin film

2. Spots or marks were observed on some portions of the photosensitive resin film, and the bond-generating portions were less than 10% of the total resin film

3. Stain or marks were observed in most parts of the photosensitive resin film, and the bonding occurrence part was more than 10% to less than 50% of the total resin film

4. Stains or marks were observed over the entire photosensitive resin film, and the bond generation portion was at least 50% of the total resin film.

(2) Evaluation of film thickness uniformity of photosensitive resin film

The film thicknesses of the photosensitive resin films prepared in Examples and Comparative Examples were measured at various sites by using a film thickness measuring apparatus FTM, and the uniformity of the film thickness was evaluated therefrom.

The measurement area was measured by dividing the remaining part excluding the sides 10 mm from the outer periphery of the substrate into 100 parts, and the film thickness uniformity was calculated according to the following formula.

Average film thickness = total film thickness of 100 parts / 100

Film thickness uniformity (%) = [{(maximum film thickness - minimum film thickness) / 2} / average film thickness] × 100.

When the average value of the film thickness was 3% or less, the film thickness group uniformity was excellent. In the case of more than 3% to 3.5%, it was evaluated as being good. The results are shown in Tables 4 to 5 below.

Production Example 1 Production Example 2 Production Example 3 Production Example 4 Appearance evaluation One One One One Film thickness uniformity Great Great Great Great

Comparative Preparation Example 1 Comparative Preparation Example 2 Comparative Production Example 3 Appearance evaluation 2 3 4 Film thickness uniformity Great Great Great

As shown in Tables 4 to 5, the photosensitive resin film prepared using the photosensitive resin composition according to the present invention exhibited remarkably improved effects in terms of appearance evaluation and film thickness uniformity compared to the comparative example.

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While the present invention has been particularly shown and described with reference to specific embodiments thereof, those skilled in the art will appreciate that such specific embodiments are merely preferred embodiments and that the scope of the present invention is not limited thereby. something to do. It is therefore intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

Claims (13)

A binder resin, a photoactive compound and a solvent,
Wherein the binder resin comprises at least one compound selected from the group consisting of polyimide, polybenzoxazole and precursors thereof,
The solvent
(a) propylene glycol monomethyl ether acetate, ethylene glycol methyl ether acetate, isoamyl acetate, 2-methoxyethyl acetate, methoxypropionate, propyl butyrate, methyl lactate, dibutyl ether, 10 to 25% by weight of a first organic solvent selected from the group consisting of hexanone, 4-heptanone, and mixtures thereof,
(b) 55 to 70 wt% of a second organic solvent having a boiling point of less than 160 to 190 DEG C, a viscosity at 25 DEG C of 1.1 mPa-s or more and less than 1.5 mPa-s, and
(c) 5 to 20% by weight of a third organic solvent having a boiling point of 190 to 220 캜 and a viscosity at 25 캜 of 1.5 to 4.0 m · Ps. delete The method according to claim 1,
Wherein the second organic solvent is selected from the group consisting of diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, butyl cellosolve, and mixtures thereof. Composition. The method according to claim 1,
Wherein the third organic solvent is selected from the group consisting of gamma butyrolactone, dimethyltriglycol, N-methylpyrrolidone (NMP), and mixtures thereof. The method according to claim 1,
Wherein the binder resin has a weight average molecular weight of 1,000 to 50,000 g / mol. The method according to claim 1,
Wherein the photoactive compound is at least one selected from the group consisting of an o-quinonediazide derivative, a 1,2-naphthoquinonediazide derivative, an allyldiazonium salt, a diallyl iodonium salt, a triallyl sulfonium salt, an o-nitrobenzyl ester, Triazole derivatives, imidosulfonate derivatives, compounds represented by the following general formulas (1a) to (1i), condensation compounds of one or more compounds of the above-mentioned compounds, and mixtures thereof. Composition:

In the above formula, e is an integer of 1 to 1000 in the repeating unit;
D each independently represent a hydrogen atom,

And

≪ / RTI > The method according to claim 1,
And a viscosity of 3 to 6 mPa 占 퐏. Applying the photosensitive resin composition according to claim 1 to a substrate by a slit coating method to form a coating film, and
And drying the coating film. 9. The method of claim 8,
Wherein the drying step is carried out by sequential execution of a heating step after drying under reduced pressure. 9. The method of claim 8,
Exposing and developing the dried coating film to produce a patterned resin film, and
And a step of curing the patterned resin film. A photosensitive resin film produced by using the photosensitive resin composition according to claim 1. 12. The method of claim 11,
Wherein the photosensitive resin film is used as an insulating material of a display device. A display device comprising a photosensitive resin film formed from the photosensitive resin composition according to claim 1 as an insulating layer.