SG11201807874YA - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
SG11201807874YA
SG11201807874YA SG11201807874YA SG11201807874YA SG11201807874YA SG 11201807874Y A SG11201807874Y A SG 11201807874YA SG 11201807874Y A SG11201807874Y A SG 11201807874YA SG 11201807874Y A SG11201807874Y A SG 11201807874YA SG 11201807874Y A SG11201807874Y A SG 11201807874YA
Authority
SG
Singapore
Prior art keywords
resin composition
photosensitive resin
photosensitive
composition
resin
Prior art date
Application number
SG11201807874YA
Inventor
Yohei Kiuchi
Yu Shoji
Kimio Isobe
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of SG11201807874YA publication Critical patent/SG11201807874YA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
SG11201807874YA 2016-03-28 2017-03-24 Photosensitive resin composition SG11201807874YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016063640 2016-03-28
PCT/JP2017/012086 WO2017170249A1 (en) 2016-03-28 2017-03-24 Photosensitive resin composition

Publications (1)

Publication Number Publication Date
SG11201807874YA true SG11201807874YA (en) 2018-10-30

Family

ID=59965633

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807874YA SG11201807874YA (en) 2016-03-28 2017-03-24 Photosensitive resin composition

Country Status (7)

Country Link
US (1) US10948821B2 (en)
JP (1) JP6699661B2 (en)
KR (1) KR102373030B1 (en)
CN (1) CN108885401B (en)
SG (1) SG11201807874YA (en)
TW (1) TWI724143B (en)
WO (1) WO2017170249A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018155547A1 (en) * 2017-02-23 2018-08-30 日立化成デュポンマイクロシステムズ株式会社 Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component
JP7069557B2 (en) * 2017-03-31 2022-05-18 Ｈｄマイクロシステムズ株式会社 Photosensitive resin composition, manufacturing method of pattern cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic components.
JP7069657B2 (en) * 2017-11-15 2022-05-18 昭和電工マテリアルズ株式会社 Method for manufacturing negative photosensitive resin composition and semiconductor device member
JP7319381B2 (en) * 2019-10-18 2023-08-01 富士フイルム株式会社 Negative curable composition, cured film, laminate, method for producing cured film, and semiconductor device
JP7429048B2 (en) * 2020-03-27 2024-02-07 互応化学工業株式会社 Method for manufacturing laminate and printed wiring board
TW202138193A (en) * 2020-03-27 2021-10-16 日商互應化學工業股份有限公司 Layered product, manufacturing method of printed wiring board, and printed wiring board

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JPH01105242A (en) * 1987-07-15 1989-04-21 Hitachi Chem Co Ltd Photosensitive resin composition
JP2915480B2 (en) 1990-03-30 1999-07-05 昭和電工株式会社 UV curable composition
JP2828740B2 (en) * 1990-06-14 1998-11-25 住友ベークライト株式会社 Positive photosensitive resin composition
JP4380178B2 (en) * 2002-03-28 2009-12-09 日立化成デュポンマイクロシステムズ株式会社 Positive photosensitive resin composition, pattern manufacturing method, and electronic component
WO2005088396A1 (en) * 2004-03-12 2005-09-22 Toray Industries, Inc. Positive light-sensitive resin composition, relief pattern using the same, and solid imaging element
JP4840255B2 (en) * 2007-05-29 2011-12-21 Ｊｓｒ株式会社 Pattern forming method and resin composition used therefor
JP2007328363A (en) * 2007-08-02 2007-12-20 Toray Ind Inc Photosensitive heat-resistant polymer composition
JP5339781B2 (en) * 2008-05-30 2013-11-13 富士フイルム株式会社 Colored curable composition, color filter, and solid-state imaging device
JP5484355B2 (en) * 2008-12-10 2014-05-07 関西ペイント株式会社 Silsesquioxane compound having a polymerizable functional group
JP2011194681A (en) * 2010-03-18 2011-10-06 Fujifilm Corp Laser engraving resin composition, laser engraving relief printing plate original plate and manufacturing method thereof, and relief printing plate and making method thereof
KR101810402B1 (en) * 2010-05-13 2017-12-19 닛산 가가쿠 고교 가부시키 가이샤 Photosensitive resin composition and display device
KR101799361B1 (en) 2010-12-24 2017-11-20 가부시키가이샤 아데카 Photosensitive resin composition
JP5920345B2 (en) * 2011-06-15 2016-05-18 日立化成デュポンマイクロシステムズ株式会社 Photosensitive resin composition, method for producing patterned cured film using the resin composition, and electronic component
WO2013031737A1 (en) * 2011-08-30 2013-03-07 旭硝子株式会社 Negative photosensitive resin composition, partition wall and optical element
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TWI671343B (en) * 2014-06-27 2019-09-11 日商富士軟片股份有限公司 Thermosetting resin composition, cured film, method for producing cured film, and semiconductor device
JP6344108B2 (en) * 2014-07-18 2018-06-20 三菱ケミカル株式会社 Photosensitive resin composition, cured product obtained by curing the same, black matrix, and image display device
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Also Published As

Publication number Publication date
TWI724143B (en) 2021-04-11
US20190025697A1 (en) 2019-01-24
KR20180128006A (en) 2018-11-30
CN108885401A (en) 2018-11-23
TW201802598A (en) 2018-01-16
JP6699661B2 (en) 2020-05-27
WO2017170249A1 (en) 2017-10-05
KR102373030B1 (en) 2022-03-11
US10948821B2 (en) 2021-03-16
JPWO2017170249A1 (en) 2019-03-22
CN108885401B (en) 2021-06-01

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