SG161285A1 - Conductive contact holder and conductive contact unit - Google Patents

Conductive contact holder and conductive contact unit

Info

Publication number
SG161285A1
SG161285A1 SG201002665-6A SG2010026656A SG161285A1 SG 161285 A1 SG161285 A1 SG 161285A1 SG 2010026656 A SG2010026656 A SG 2010026656A SG 161285 A1 SG161285 A1 SG 161285A1
Authority
SG
Singapore
Prior art keywords
conductive contact
conductive
holder
contact holder
holding
Prior art date
Application number
SG201002665-6A
Other languages
English (en)
Inventor
Hiroshi Nakayama
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of SG161285A1 publication Critical patent/SG161285A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/045—Sockets or component fixtures for RF or HF testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
SG201002665-6A 2005-04-28 2006-04-27 Conductive contact holder and conductive contact unit SG161285A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005133165A JP4757531B2 (ja) 2005-04-28 2005-04-28 導電性接触子ホルダおよび導電性接触子ユニット

Publications (1)

Publication Number Publication Date
SG161285A1 true SG161285A1 (en) 2010-05-27

Family

ID=37308018

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201002665-6A SG161285A1 (en) 2005-04-28 2006-04-27 Conductive contact holder and conductive contact unit

Country Status (8)

Country Link
US (1) US8087956B2 (ja)
EP (1) EP1879038A4 (ja)
JP (1) JP4757531B2 (ja)
KR (1) KR100945518B1 (ja)
CN (1) CN101160532B (ja)
SG (1) SG161285A1 (ja)
TW (1) TWI294522B (ja)
WO (1) WO2006118220A1 (ja)

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WO2007125974A1 (ja) * 2006-04-28 2007-11-08 Nhk Spring Co., Ltd. 導電性接触子ホルダ
JP5361710B2 (ja) * 2007-04-19 2013-12-04 日本発條株式会社 導電性接触子および導電性接触子ユニット
KR101106506B1 (ko) * 2008-08-07 2012-01-20 박상량 평판 접이식 코일스프링, 이를 이용한 포고핀 및 그 제조방법
TWI391668B (zh) * 2008-11-21 2013-04-01 King Yuan Electronics Co Ltd 具有高耐電流能力之電連接導體與提高電連接導體之耐電流能力的方法
TWI424166B (zh) * 2008-11-26 2014-01-21 Nhk Spring Co Ltd 探針單元用基座構件及探針單元
KR101149760B1 (ko) * 2009-07-03 2012-06-01 리노공업주식회사 검사용 탐침 장치
JP5686009B2 (ja) * 2011-03-18 2015-03-18 富士通株式会社 基板ユニット、及び、基板ユニットの製造方法
WO2013011985A1 (ja) * 2011-07-19 2013-01-24 日本発條株式会社 接触構造体ユニット
JP5972366B2 (ja) * 2012-05-22 2016-08-17 日本発條株式会社 ソケット取付構造およびばね部材
JP2014016204A (ja) * 2012-07-06 2014-01-30 Micronics Japan Co Ltd 電気的接触子及び電気的接触子の接触方法
US9674943B2 (en) * 2012-12-06 2017-06-06 Intel Corporation Actuation mechanisms for electrical interconnections
TWM461790U (zh) * 2013-04-26 2013-09-11 De-Xing Xiao 具弧狀接觸稜線之測試探針
JP5781128B2 (ja) * 2013-08-19 2015-09-16 本田技研工業株式会社 電流供給装置及び半導体素子製造方法
EP3367051B1 (en) 2013-12-02 2020-07-22 Austin Star Detonator Company Methods for wireless blasting
TW201533449A (zh) * 2014-02-24 2015-09-01 Mpi Corp 具有彈簧套筒式探針之探針裝置
TWI600218B (zh) * 2014-08-08 2017-09-21 日本發條股份有限公司 連接端子
CN107148575B (zh) * 2014-11-07 2021-03-12 株式会社村田制作所 探针
JP6475479B2 (ja) * 2014-11-27 2019-02-27 株式会社ヨコオ 検査ユニット
TWI702402B (zh) 2015-05-07 2020-08-21 義大利商探針科技公司 特別用於減少間距應用的具有垂直探針的測試頭
JP6881972B2 (ja) * 2016-12-27 2021-06-02 株式会社エンプラス 電気接触子及び電気部品用ソケット
JP7055596B2 (ja) * 2017-04-10 2022-04-18 日本発條株式会社 導電性接触子ホルダおよび導電性接触子ユニット
JP2020521986A (ja) * 2017-05-26 2020-07-27 スミスズ インターコネクト アメリカズ インコーポレイテッドＳｍｉｔｈｓ Ｉｎｔｅｒｃｏｎｎｅｃｔ Ａｍｅｒｉｃａｓ， Ｉｎｃ． インピーダンス制御テストソケット
JP7302117B2 (ja) * 2018-07-31 2023-07-04 株式会社Totoku 半導体デバイスの検査治具
JP7271824B2 (ja) * 2018-07-31 2023-05-12 東京特殊電線株式会社 半導体デバイスの検査治具
CN111162419B (zh) * 2018-11-08 2022-07-12 上海雷迪埃电子有限公司 射频连接器及两电路板间的射频连接结构
SG11202105529RA (en) 2018-11-27 2021-06-29 Nhk Spring Co Ltd Probe unit
WO2020185816A1 (en) * 2019-03-11 2020-09-17 Samtec, Inc. Impedance controlled electrical contact
US11150269B2 (en) * 2019-08-15 2021-10-19 Mpi Corporation Probe head for high frequency signal test and medium or low frequency signal test at the same time
TWI799834B (zh) * 2020-05-22 2023-04-21 南韓商李諾工業股份有限公司 測試座以及其製造方法
CN111969345B (zh) * 2020-07-06 2022-02-11 中航光电科技股份有限公司 一种新结构平行电路板间用电源信号混装连接器
JP2023003466A (ja) 2021-06-24 2023-01-17 株式会社ヨコオ ソケット

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JPH06216205A (ja) * 1993-01-13 1994-08-05 Tokyo Electron Yamanashi Kk プローブカードインターフェース装置
JPH07218536A (ja) * 1994-02-04 1995-08-18 Toudai Musen Kk コンタクトプローブ取付ホルダー
JPH08136578A (ja) * 1994-11-07 1996-05-31 Toudai Musen Kk コンタクトプローブの取付ホルダー
JP3090630B2 (ja) * 1997-05-30 2000-09-25 ユーエイチティー株式会社 Ｂｇａ、ｃｓｐ等におけるｉｃチップ実装基板の導通検査システム
JP4124520B2 (ja) 1998-07-30 2008-07-23 日本発条株式会社 導電性接触子のホルダ及びその製造方法
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JP2002124552A (ja) 2000-10-13 2002-04-26 Seiko Instruments Inc プローブカード及び半導体検査装置
US6507207B2 (en) 2001-02-20 2003-01-14 Vinh T. Nguyen Contact probe pin for wafer probing apparatus
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EP1496366A4 (en) * 2002-04-16 2005-09-14 Nhk Spring Co Ltd HOLDER FOR CONDUCTIVE CONTACT
WO2003087853A1 (en) * 2002-04-16 2003-10-23 Nhk Spring Co., Ltd Holder for conductive contact
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Also Published As

Publication number Publication date
EP1879038A1 (en) 2008-01-16
WO2006118220A1 (ja) 2006-11-09
EP1879038A4 (en) 2011-03-09
KR20070119049A (ko) 2007-12-18
JP4757531B2 (ja) 2011-08-24
CN101160532A (zh) 2008-04-09
JP2006308486A (ja) 2006-11-09
TWI294522B (en) 2008-03-11
US8087956B2 (en) 2012-01-03
CN101160532B (zh) 2010-11-10
KR100945518B1 (ko) 2010-03-09
TW200700736A (en) 2007-01-01
US20100041251A1 (en) 2010-02-18

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