SG11202105529RA - Probe unit - Google Patents
Probe unitInfo
- Publication number
- SG11202105529RA SG11202105529RA SG11202105529RA SG11202105529RA SG11202105529RA SG 11202105529R A SG11202105529R A SG 11202105529RA SG 11202105529R A SG11202105529R A SG 11202105529RA SG 11202105529R A SG11202105529R A SG 11202105529RA SG 11202105529R A SG11202105529R A SG 11202105529RA
- Authority
- SG
- Singapore
- Prior art keywords
- probe unit
- probe
- unit
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018221430 | 2018-11-27 | ||
PCT/JP2019/046235 WO2020111076A1 (en) | 2018-11-27 | 2019-11-26 | Probe unit |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202105529RA true SG11202105529RA (en) | 2021-06-29 |
Family
ID=70853993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202105529RA SG11202105529RA (en) | 2018-11-27 | 2019-11-26 | Probe unit |
Country Status (7)
Country | Link |
---|---|
US (1) | US11782074B2 (en) |
JP (1) | JP6756946B1 (en) |
CN (1) | CN113167814B (en) |
PH (1) | PH12021551144A1 (en) |
SG (1) | SG11202105529RA (en) |
TW (1) | TWI717915B (en) |
WO (1) | WO2020111076A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115335708A (en) * | 2020-03-24 | 2022-11-11 | 日本发条株式会社 | Probe unit |
KR102373067B1 (en) * | 2020-06-30 | 2022-03-14 | 리노공업주식회사 | Test socket and method for fabricating the same |
KR20230118646A (en) * | 2021-01-19 | 2023-08-11 | 닛폰 하츠죠 가부시키가이샤 | probe unit |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6037787A (en) | 1998-03-24 | 2000-03-14 | Teradyne, Inc. | High performance probe interface for automatic test equipment |
JP4575593B2 (en) * | 1998-03-24 | 2010-11-04 | テラダイン・インコーポレーテッド | Coaxial probe interface for automatic tester |
JP4251855B2 (en) | 2002-11-19 | 2009-04-08 | 株式会社ヨコオ | Manufacturing method of inspection jigs for high frequency and high speed devices |
JP2005351731A (en) * | 2004-06-10 | 2005-12-22 | Fujitsu Ltd | Test socket |
JP4535828B2 (en) | 2004-09-30 | 2010-09-01 | 株式会社ヨコオ | Inspection unit manufacturing method |
JP4145293B2 (en) | 2004-12-28 | 2008-09-03 | 株式会社ルネサステクノロジ | Semiconductor inspection apparatus and semiconductor device manufacturing method |
JP4757531B2 (en) * | 2005-04-28 | 2011-08-24 | 日本発條株式会社 | Conductive contact holder and conductive contact unit |
JP2007178163A (en) | 2005-12-27 | 2007-07-12 | Yokowo Co Ltd | Inspection unit and outer sheath tube assembly for inspection probe used for it |
JP4607004B2 (en) * | 2005-12-27 | 2011-01-05 | 株式会社ヨコオ | Inspection unit |
JP5651333B2 (en) * | 2007-07-17 | 2015-01-14 | 日本発條株式会社 | Probe unit |
US7663387B2 (en) * | 2007-09-27 | 2010-02-16 | Yokowo Co., Ltd. | Test socket |
JP2009192419A (en) * | 2008-02-15 | 2009-08-27 | Micronics Japan Co Ltd | Probe unit and inspection device |
JP2010038726A (en) | 2008-08-05 | 2010-02-18 | Japan Electronic Materials Corp | Probe card |
TWI482973B (en) | 2009-04-03 | 2015-05-01 | Nhk Spring Co Ltd | Wire material for spring, contact probe, and probe unit |
JP5427536B2 (en) | 2009-10-01 | 2014-02-26 | 東京エレクトロン株式会社 | Probe card |
EP2386846A1 (en) | 2010-05-14 | 2011-11-16 | Nordson Corporation | System and method for testing of bonds of a semiconductor assembly |
JP2012098219A (en) * | 2010-11-04 | 2012-05-24 | Yamaichi Electronics Co Ltd | Socket for semiconductor device |
JP5572066B2 (en) * | 2010-11-08 | 2014-08-13 | ルネサスエレクトロニクス株式会社 | Test board |
JP2013127408A (en) * | 2011-12-19 | 2013-06-27 | Micronics Japan Co Ltd | Wiring of probe structure unit and manufacturing method |
CN103543304B (en) * | 2012-07-13 | 2016-05-18 | 旺矽科技股份有限公司 | High-frequency probe card |
TW201504631A (en) * | 2013-07-23 | 2015-02-01 | Mpi Corp | High frequency probe card for probing photoelectric device |
JP6473364B2 (en) * | 2015-03-30 | 2019-02-20 | 日本発條株式会社 | Probe unit |
JP6601138B2 (en) * | 2015-10-16 | 2019-11-06 | 山一電機株式会社 | IC socket |
CN106771626A (en) | 2017-04-01 | 2017-05-31 | 广州市昆德科技有限公司 | The floated probe capacitance probe of semi insulating semiconductor resistivity gas control and method of testing |
JP6663084B2 (en) * | 2017-07-13 | 2020-03-11 | 日本発條株式会社 | Probe unit |
JP7125408B2 (en) | 2017-09-08 | 2022-08-24 | 株式会社エンプラス | Socket for electrical connection |
-
2019
- 2019-11-26 US US17/295,187 patent/US11782074B2/en active Active
- 2019-11-26 WO PCT/JP2019/046235 patent/WO2020111076A1/en active Application Filing
- 2019-11-26 JP JP2020520832A patent/JP6756946B1/en active Active
- 2019-11-26 SG SG11202105529RA patent/SG11202105529RA/en unknown
- 2019-11-26 CN CN201980078262.0A patent/CN113167814B/en active Active
- 2019-11-27 TW TW108143143A patent/TWI717915B/en active
-
2021
- 2021-05-19 PH PH12021551144A patent/PH12021551144A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US11782074B2 (en) | 2023-10-10 |
US20220011345A1 (en) | 2022-01-13 |
JPWO2020111076A1 (en) | 2021-02-15 |
PH12021551144A1 (en) | 2021-10-25 |
TWI717915B (en) | 2021-02-01 |
TW202022388A (en) | 2020-06-16 |
CN113167814B (en) | 2024-02-27 |
CN113167814A (en) | 2021-07-23 |
WO2020111076A1 (en) | 2020-06-04 |
JP6756946B1 (en) | 2020-09-16 |
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