SG160355A1 - Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board - Google Patents

Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board

Info

Publication number
SG160355A1
SG160355A1 SG201001486-8A SG2010014868A SG160355A1 SG 160355 A1 SG160355 A1 SG 160355A1 SG 2010014868 A SG2010014868 A SG 2010014868A SG 160355 A1 SG160355 A1 SG 160355A1
Authority
SG
Singapore
Prior art keywords
resin composition
wiring board
printed wiring
resist pattern
photosensitive resin
Prior art date
Application number
SG201001486-8A
Other languages
English (en)
Inventor
Masahiro Miyasaka
Takashi Kumaki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006105416A external-priority patent/JP4525626B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG160355A1 publication Critical patent/SG160355A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/116—Redox or dye sensitizer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y10S430/121—Nitrogen in heterocyclic ring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
SG201001486-8A 2005-05-23 2006-05-22 Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board SG160355A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005150133 2005-05-23
JP2006105416A JP4525626B2 (ja) 2006-04-06 2006-04-06 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
SG160355A1 true SG160355A1 (en) 2010-04-29

Family

ID=37451906

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201001486-8A SG160355A1 (en) 2005-05-23 2006-05-22 Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board

Country Status (6)

Country Link
US (3) US7993809B2 (zh)
KR (4) KR100932581B1 (zh)
CN (5) CN104133342B (zh)
SG (1) SG160355A1 (zh)
TW (2) TW200702916A (zh)
WO (1) WO2006126480A1 (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4586919B2 (ja) * 2006-04-18 2010-11-24 日立化成工業株式会社 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2008126526A1 (ja) * 2007-04-04 2008-10-23 Asahi Kasei E-Materials Corporation 感光性樹脂組成物および積層体
JP5117234B2 (ja) * 2008-03-21 2013-01-16 旭化成イーマテリアルズ株式会社 感光性樹脂組成物および積層体
CN103076718B (zh) * 2008-03-21 2015-01-21 旭化成电子材料株式会社 感光性树脂组合物、感光性树脂层压体、抗蚀图案形成方法、以及印刷线路板、引线框、半导体封装体和凹凸基板的制造方法
JP5117233B2 (ja) * 2008-03-21 2013-01-16 旭化成イーマテリアルズ株式会社 感光性樹脂組成物および積層体
JP5117235B2 (ja) * 2008-03-21 2013-01-16 旭化成イーマテリアルズ株式会社 感光性樹脂組成物および積層体
CN104808444A (zh) * 2009-02-26 2015-07-29 日立化成工业株式会社 感光性树脂组合物、以及感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法
CN102844709B (zh) * 2010-04-15 2014-08-20 日合墨东株式会社 感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法及印刷电路板的制造方法
KR101444044B1 (ko) * 2010-12-16 2014-09-23 히타치가세이가부시끼가이샤 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
CN103076717A (zh) * 2011-10-26 2013-05-01 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法
JP6229256B2 (ja) * 2011-10-31 2017-11-15 日立化成株式会社 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2013084282A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント
WO2013084283A1 (ja) 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
US9341946B2 (en) * 2012-05-25 2016-05-17 Lg Chem, Ltd. Photosensitive resin composition, pattern formed using same and display panel comprising same
WO2014196464A1 (ja) * 2013-06-07 2014-12-11 株式会社Adeka 着色感光性組成物及び新規化合物
KR102582577B1 (ko) * 2014-05-23 2023-09-25 가부시끼가이샤 레조낙 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법, 투영 노광용 감광성 수지 조성물 및 감광성 엘리먼트
KR102061130B1 (ko) * 2015-05-21 2020-02-20 창저우 트론리 어드벤스드 일렉트로닉 머티어리얼스 컴퍼니, 리미티드 피라졸린계 증감제 및 그 제조방법과 응용
JP6911369B2 (ja) * 2017-02-15 2021-07-28 Tdk株式会社 積層コイル部品の製造方法
CN114585974A (zh) * 2019-10-16 2022-06-03 昭和电工材料株式会社 感光性树脂膜、抗蚀剂图案的形成方法及配线图案的形成方法
CN113929624A (zh) * 2020-07-13 2022-01-14 常州强力电子新材料股份有限公司 一种吡唑啉类化合物、感光性树脂组合物及图形化方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5575405A (en) * 1978-11-30 1980-06-06 Fuji Photo Film Co Ltd Photopolymerizable composition
JPS62100756A (ja) * 1985-10-29 1987-05-11 Matsushita Electric Ind Co Ltd 電子写真感光体
US4845011A (en) * 1987-10-23 1989-07-04 Hoechst Celanese Corporation Visible light photoinitiation compositions
US5236812A (en) * 1989-12-29 1993-08-17 E. I. Du Pont De Nemours And Company Solid imaging method and apparatus
DE4009700A1 (de) * 1990-03-27 1991-10-02 Hoechst Ag Photopolymerisierbares gemisch und daraus hergestelltes aufzeichnungsmaterial
JP2931693B2 (ja) * 1991-05-07 1999-08-09 株式会社日本化学工業所 光線遮蔽剤
KR0150344B1 (ko) * 1995-12-21 1998-10-01 이웅열 감광성 수지 조성물
EP0916480A4 (en) * 1996-07-30 2001-10-10 Hitachi Chemical Co Ltd PRODUCTION OF A ASSOCIATION FILM AND PCB
US5938761A (en) * 1997-11-24 1999-08-17 Sun Microsystems Method and apparatus for branch target prediction
JP4050370B2 (ja) 1998-01-07 2008-02-20 株式会社Ｋｒｉ 無機質含有感光性樹脂組成物および無機パターン形成方法
JP4305695B2 (ja) 1999-05-28 2009-07-29 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP4685259B2 (ja) 2000-04-19 2011-05-18 コダック株式会社 感光性平版印刷版及び印刷版の製版方法
EP1739484B1 (en) 2000-04-19 2011-08-24 AGFA Graphics NV Photosensitive lithographic printing plate and method for making a prinitng plate.
JP3503639B2 (ja) 2000-09-27 2004-03-08 日立化成工業株式会社 レジストパターン、その製造法およびその利用
JP3503640B2 (ja) * 2000-09-27 2004-03-08 日立化成工業株式会社 感光性樹脂組成物
TWI296738B (zh) * 2001-03-29 2008-05-11 Hitachi Chemical Co Ltd
US6855480B2 (en) * 2001-04-19 2005-02-15 Shipley Company, L.L.C. Photoresist composition
JP2002351070A (ja) 2001-05-30 2002-12-04 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造方法及びプリント配線板の製造方法
JP4043870B2 (ja) 2002-07-10 2008-02-06 関西ペイント株式会社 半導体レーザー用硬化型樹脂組成物及びその組成を使用したレジストパターン形成方法
US6979615B2 (en) * 2002-09-12 2005-12-27 Texas Instruments Incorporated System and method for forming a semiconductor with an analog capacitor using fewer structure steps
JP2005128508A (ja) * 2003-10-02 2005-05-19 Mitsubishi Chemicals Corp ネガ型青紫色レーザー感光性組成物、並びにそれを用いた画像形成材料、画像形成材、及び画像形成方法
JP4395384B2 (ja) 2004-01-28 2010-01-06 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び積層体
JP4223470B2 (ja) 2004-12-03 2009-02-12 株式会社半導体エネルギー研究所 ピッチｘの決定方法、半導体装置の作製方法

Also Published As

Publication number Publication date
KR100932581B1 (ko) 2009-12-17
KR100953245B1 (ko) 2010-04-16
TW200702916A (en) 2007-01-16
CN104111583B (zh) 2019-01-01
US20090029289A1 (en) 2009-01-29
KR100934046B1 (ko) 2009-12-24
CN104133342B (zh) 2018-01-23
WO2006126480A1 (ja) 2006-11-30
CN101180578A (zh) 2008-05-14
US8198008B2 (en) 2012-06-12
KR20100009547A (ko) 2010-01-27
CN104111583A (zh) 2014-10-22
TW201100961A (en) 2011-01-01
CN102012634A (zh) 2011-04-13
KR100935779B1 (ko) 2010-01-06
US20100285408A1 (en) 2010-11-11
KR20080108624A (ko) 2008-12-15
US8192916B2 (en) 2012-06-05
KR20080108623A (ko) 2008-12-15
US20100279229A1 (en) 2010-11-04
CN104133343B (zh) 2016-11-16
TWI334965B (zh) 2010-12-21
KR20070110937A (ko) 2007-11-20
CN104133343A (zh) 2014-11-05
TWI417663B (zh) 2013-12-01
US7993809B2 (en) 2011-08-09
CN104133342A (zh) 2014-11-05

Similar Documents

Publication Publication Date Title
SG160355A1 (en) Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board
MY148552A (en) Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board
WO2008078483A1 (ja) 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
MY161035A (en) Photosensitive element, method for forming resist pattern, and method for producing printed circuit board
TW200741343A (en) Photosensitive element, method for formation of resist pattern, and method for production of print circuit board
TW200801817A (en) Photosensitive thermosetting resin composition, flattened and resist film coated printed wiring board and method of preparing the same
TW200606580A (en) A chemically amplified positive resist composition, (meth)acrylate derivative and a process for producing the same
TW200702928A (en) Composition for underlayer film of resist and process for producing the same
EP1975718A3 (en) Surface-treating agent for pattern formation and pattern-forming method using the surface-treating agent
MY182915A (en) Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
MY152017A (en) Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board
TW200712772A (en) Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the composition
TW200608465A (en) Advanced oriented assist features for integrated circuit hole patterns
MY152732A (en) Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board
TW200621852A (en) Resin composition and its use
ATE487162T1 (de) Neue sulfoniumverbindung, diese enthaltende lichtempfindliche zusammensetzung und strukturbildungsverfahren unter verwendung der lichtempfindlichen zusammensetzung
DE602008003376D1 (de) Lichthärtbare Beschichtungszusammensetzung, Aufdruck und Herstellungsverfahren
MY152075A (en) Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method
MY176799A (en) Photosensitive resin element
TW200512540A (en) Photosensitive element, method of forming resist pattern, and process for producing printed wiring board
TW200617034A (en) Polymer for resist, method of forming the same, resist composition and method of fabricting substrate formed pattern
AU2003211797A1 (en) Photosensitive resin composition, process for forming photosensitive elements or resist patterns with the same, and process for production of printed wiring boards
WO2008140016A1 (ja) 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
TW200506528A (en) Positive photoresist composition and method of forming resist pattern
TW200608143A (en) Positive resist composition and method for forming resist pattern