SG142270A1 - Integrated method for removal of halogen residues from etched substrates by thermal process - Google Patents

Integrated method for removal of halogen residues from etched substrates by thermal process

Info

Publication number
SG142270A1
SG142270A1 SG200717058-2A SG2007170582A SG142270A1 SG 142270 A1 SG142270 A1 SG 142270A1 SG 2007170582 A SG2007170582 A SG 2007170582A SG 142270 A1 SG142270 A1 SG 142270A1
Authority
SG
Singapore
Prior art keywords
substrate
removal
halogen
residues
thermal process
Prior art date
Application number
SG200717058-2A
Other languages
English (en)
Inventor
Mark Naoshi Kawaguchi
Kin Pong Lo
Brett Christian Hoogensen
Sandy M Wen
Steven H Kim
Kenneth J Bahng
Matthew Fenton Davis
Thorsten Lill
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/553,132 external-priority patent/US7655571B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG142270A1 publication Critical patent/SG142270A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/963—Removing process residues from vertical substrate surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG200717058-2A 2006-10-26 2007-10-19 Integrated method for removal of halogen residues from etched substrates by thermal process SG142270A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/553,132 US7655571B2 (en) 2006-10-26 2006-10-26 Integrated method and apparatus for efficient removal of halogen residues from etched substrates
US11/676,161 US7846845B2 (en) 2006-10-26 2007-02-16 Integrated method for removal of halogen residues from etched substrates in a processing system

Publications (1)

Publication Number Publication Date
SG142270A1 true SG142270A1 (en) 2008-05-28

Family

ID=38969782

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200717058-2A SG142270A1 (en) 2006-10-26 2007-10-19 Integrated method for removal of halogen residues from etched substrates by thermal process
SG2011078573A SG176425A1 (en) 2006-10-26 2007-10-19 Integrated method for removal of halogen residues from etched substrates by thermal process

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2011078573A SG176425A1 (en) 2006-10-26 2007-10-19 Integrated method for removal of halogen residues from etched substrates by thermal process

Country Status (7)

Country Link
US (1) US7846845B2 (enExample)
EP (1) EP1916703A3 (enExample)
JP (1) JP2008109136A (enExample)
KR (1) KR101010419B1 (enExample)
CN (1) CN102243989B (enExample)
SG (2) SG142270A1 (enExample)
TW (1) TWI348735B (enExample)

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Also Published As

Publication number Publication date
TWI348735B (en) 2011-09-11
US7846845B2 (en) 2010-12-07
KR101010419B1 (ko) 2011-01-21
US20080099040A1 (en) 2008-05-01
JP2008109136A (ja) 2008-05-08
CN102243989B (zh) 2015-05-20
SG176425A1 (en) 2011-12-29
TW200837828A (en) 2008-09-16
KR20080037565A (ko) 2008-04-30
CN102243989A (zh) 2011-11-16
EP1916703A3 (en) 2009-05-06
EP1916703A2 (en) 2008-04-30

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