SG139621A1 - Thermal treatment for bonding interface stabilization - Google Patents
Thermal treatment for bonding interface stabilizationInfo
- Publication number
- SG139621A1 SG139621A1 SG200703822-7A SG2007038227A SG139621A1 SG 139621 A1 SG139621 A1 SG 139621A1 SG 2007038227 A SG2007038227 A SG 2007038227A SG 139621 A1 SG139621 A1 SG 139621A1
- Authority
- SG
- Singapore
- Prior art keywords
- thermal treatment
- bonding interface
- interface stabilization
- stabilization
- bonding
- Prior art date
Links
- 230000006641 stabilisation Effects 0.000 title abstract 2
- 238000011105 stabilization Methods 0.000 title abstract 2
- 238000007669 thermal treatment Methods 0.000 title abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/477—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Recrystallisation Techniques (AREA)
- Formation Of Insulating Films (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0606440A FR2903809B1 (fr) | 2006-07-13 | 2006-07-13 | Traitement thermique de stabilisation d'interface e collage. |
Publications (1)
Publication Number | Publication Date |
---|---|
SG139621A1 true SG139621A1 (en) | 2008-02-29 |
Family
ID=37745927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200703822-7A SG139621A1 (en) | 2006-07-13 | 2007-05-28 | Thermal treatment for bonding interface stabilization |
Country Status (8)
Country | Link |
---|---|
US (3) | US8216916B2 (ko) |
EP (2) | EP2256798A1 (ko) |
JP (1) | JP2008021992A (ko) |
KR (1) | KR100890792B1 (ko) |
CN (1) | CN101106073B (ko) |
FR (1) | FR2903809B1 (ko) |
SG (1) | SG139621A1 (ko) |
TW (1) | TWI344206B (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2895563B1 (fr) * | 2005-12-22 | 2008-04-04 | Soitec Silicon On Insulator | Procede de simplification d'une sequence de finition et structure obtenue par le procede |
FR2903809B1 (fr) * | 2006-07-13 | 2008-10-17 | Soitec Silicon On Insulator | Traitement thermique de stabilisation d'interface e collage. |
US9406574B1 (en) | 2007-08-09 | 2016-08-02 | Cypress Semiconductor Corporation | Oxide formation in a plasma process |
US8119538B1 (en) * | 2007-08-09 | 2012-02-21 | Cypress Semiconductor Corporation | Oxide formation in a plasma process |
EP2161741B1 (en) * | 2008-09-03 | 2014-06-11 | Soitec | Method for fabricating a semiconductor on insulator substrate with reduced SECCO defect density |
FR2938118B1 (fr) * | 2008-10-30 | 2011-04-22 | Soitec Silicon On Insulator | Procede de fabrication d'un empilement de couches minces semi-conductrices |
FR2938119B1 (fr) * | 2008-10-30 | 2011-04-22 | Soitec Silicon On Insulator | Procede de detachement de couches semi-conductrices a basse temperature |
US7927975B2 (en) | 2009-02-04 | 2011-04-19 | Micron Technology, Inc. | Semiconductor material manufacture |
FR2989516B1 (fr) | 2012-04-11 | 2014-04-18 | Soitec Silicon On Insulator | Procede de fabrication d'une structure soi mettant en oeuvre deux rta |
CN111312852B (zh) * | 2019-11-26 | 2020-10-20 | 中国科学院上海微系统与信息技术研究所 | 氧化镓半导体结构、日盲光电探测器及制备方法 |
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US3332137A (en) * | 1964-09-28 | 1967-07-25 | Rca Corp | Method of isolating chips of a wafer of semiconductor material |
US3355636A (en) * | 1965-06-29 | 1967-11-28 | Rca Corp | High power, high frequency transistor |
US3997381A (en) * | 1975-01-10 | 1976-12-14 | Intel Corporation | Method of manufacture of an epitaxial semiconductor layer on an insulating substrate |
FR2542500B1 (fr) * | 1983-03-11 | 1986-08-29 | Thomson Csf | Procede de fabrication d'un dispositif semiconducteur du type comprenant au moins une couche de silicium deposee sur un substrat isolant |
US4649627A (en) * | 1984-06-28 | 1987-03-17 | International Business Machines Corporation | Method of fabricating silicon-on-insulator transistors with a shared element |
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US4601779A (en) * | 1985-06-24 | 1986-07-22 | International Business Machines Corporation | Method of producing a thin silicon-on-insulator layer |
US4704785A (en) * | 1986-08-01 | 1987-11-10 | Texas Instruments Incorporated | Process for making a buried conductor by fusing two wafers |
US4771016A (en) * | 1987-04-24 | 1988-09-13 | Harris Corporation | Using a rapid thermal process for manufacturing a wafer bonded soi semiconductor |
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JPH09260618A (ja) | 1996-03-19 | 1997-10-03 | Nippon Telegr & Teleph Corp <Ntt> | Soi基板の製造方法 |
JP3325793B2 (ja) | 1996-03-22 | 2002-09-17 | 三洋電機株式会社 | 非晶質半導体及びその製造方法並びに光起電力装置 |
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FR2777115B1 (fr) * | 1998-04-07 | 2001-07-13 | Commissariat Energie Atomique | Procede de traitement de substrats semi-conducteurs et structures obtenues par ce procede |
JPH11307472A (ja) | 1998-04-23 | 1999-11-05 | Shin Etsu Handotai Co Ltd | 水素イオン剥離法によってsoiウエーハを製造する方法およびこの方法で製造されたsoiウエーハ |
JP3697106B2 (ja) | 1998-05-15 | 2005-09-21 | キヤノン株式会社 | 半導体基板の作製方法及び半導体薄膜の作製方法 |
WO2000013211A2 (en) * | 1998-09-02 | 2000-03-09 | Memc Electronic Materials, Inc. | Silicon on insulator structure from low defect density single crystal silicon |
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JP3951487B2 (ja) | 1998-12-25 | 2007-08-01 | 信越半導体株式会社 | Soi基板及びその製造方法 |
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EP1158581B1 (en) * | 1999-10-14 | 2016-04-27 | Shin-Etsu Handotai Co., Ltd. | Method for producing soi wafer |
FR2827078B1 (fr) * | 2001-07-04 | 2005-02-04 | Soitec Silicon On Insulator | Procede de diminution de rugosite de surface |
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EP1542275A1 (en) * | 2003-12-10 | 2005-06-15 | S.O.I.TEC. Silicon on Insulator Technologies S.A. | A method for improving the quality of a heterostructure |
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JP2006013179A (ja) | 2004-06-28 | 2006-01-12 | Sumco Corp | Soiウェーハの製造方法 |
JP2008526010A (ja) | 2004-12-28 | 2008-07-17 | エス. オー. アイ. テック シリコン オン インシュレーター テクノロジーズ | 低いホール密度を有する薄層を得るための方法 |
JP4934966B2 (ja) * | 2005-02-04 | 2012-05-23 | 株式会社Sumco | Soi基板の製造方法 |
FR2895563B1 (fr) * | 2005-12-22 | 2008-04-04 | Soitec Silicon On Insulator | Procede de simplification d'une sequence de finition et structure obtenue par le procede |
FR2896619B1 (fr) * | 2006-01-23 | 2008-05-23 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat composite a proprietes electriques ameliorees |
FR2903809B1 (fr) * | 2006-07-13 | 2008-10-17 | Soitec Silicon On Insulator | Traitement thermique de stabilisation d'interface e collage. |
-
2006
- 2006-07-13 FR FR0606440A patent/FR2903809B1/fr active Active
-
2007
- 2007-04-19 US US11/788,292 patent/US8216916B2/en active Active
- 2007-04-30 TW TW096115394A patent/TWI344206B/zh active
- 2007-05-28 SG SG200703822-7A patent/SG139621A1/en unknown
- 2007-05-29 US US11/807,686 patent/US7863158B2/en active Active
- 2007-06-07 CN CN2007101096088A patent/CN101106073B/zh active Active
- 2007-06-12 KR KR1020070057483A patent/KR100890792B1/ko active IP Right Grant
- 2007-06-21 JP JP2007164156A patent/JP2008021992A/ja active Pending
- 2007-07-12 EP EP10177181A patent/EP2256798A1/fr not_active Withdrawn
- 2007-07-12 EP EP07112311A patent/EP1879225A1/fr not_active Withdrawn
-
2011
- 2011-06-06 US US13/153,709 patent/US8461018B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR100890792B1 (ko) | 2009-03-31 |
US8461018B2 (en) | 2013-06-11 |
TWI344206B (en) | 2011-06-21 |
EP2256798A1 (fr) | 2010-12-01 |
CN101106073A (zh) | 2008-01-16 |
TW200805625A (en) | 2008-01-16 |
KR20080007094A (ko) | 2008-01-17 |
FR2903809A1 (fr) | 2008-01-18 |
JP2008021992A (ja) | 2008-01-31 |
US7863158B2 (en) | 2011-01-04 |
US8216916B2 (en) | 2012-07-10 |
EP1879225A1 (fr) | 2008-01-16 |
US20110233720A1 (en) | 2011-09-29 |
FR2903809B1 (fr) | 2008-10-17 |
CN101106073B (zh) | 2012-05-30 |
US20080014713A1 (en) | 2008-01-17 |
US20080014718A1 (en) | 2008-01-17 |
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