SG139621A1 - Thermal treatment for bonding interface stabilization - Google Patents

Thermal treatment for bonding interface stabilization

Info

Publication number
SG139621A1
SG139621A1 SG200703822-7A SG2007038227A SG139621A1 SG 139621 A1 SG139621 A1 SG 139621A1 SG 2007038227 A SG2007038227 A SG 2007038227A SG 139621 A1 SG139621 A1 SG 139621A1
Authority
SG
Singapore
Prior art keywords
thermal treatment
bonding interface
interface stabilization
stabilization
bonding
Prior art date
Application number
SG200703822-7A
Other languages
English (en)
Inventor
Eric Neyret
Sebastien Kerdiles
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG139621A1 publication Critical patent/SG139621A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/477—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Recrystallisation Techniques (AREA)
  • Formation Of Insulating Films (AREA)
  • Adhesives Or Adhesive Processes (AREA)
SG200703822-7A 2006-07-13 2007-05-28 Thermal treatment for bonding interface stabilization SG139621A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0606440A FR2903809B1 (fr) 2006-07-13 2006-07-13 Traitement thermique de stabilisation d'interface e collage.

Publications (1)

Publication Number Publication Date
SG139621A1 true SG139621A1 (en) 2008-02-29

Family

ID=37745927

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200703822-7A SG139621A1 (en) 2006-07-13 2007-05-28 Thermal treatment for bonding interface stabilization

Country Status (8)

Country Link
US (3) US8216916B2 (ko)
EP (2) EP1879225A1 (ko)
JP (1) JP2008021992A (ko)
KR (1) KR100890792B1 (ko)
CN (1) CN101106073B (ko)
FR (1) FR2903809B1 (ko)
SG (1) SG139621A1 (ko)
TW (1) TWI344206B (ko)

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FR2895563B1 (fr) * 2005-12-22 2008-04-04 Soitec Silicon On Insulator Procede de simplification d'une sequence de finition et structure obtenue par le procede
FR2903809B1 (fr) * 2006-07-13 2008-10-17 Soitec Silicon On Insulator Traitement thermique de stabilisation d'interface e collage.
US9406574B1 (en) 2007-08-09 2016-08-02 Cypress Semiconductor Corporation Oxide formation in a plasma process
US8119538B1 (en) * 2007-08-09 2012-02-21 Cypress Semiconductor Corporation Oxide formation in a plasma process
EP2161741B1 (en) * 2008-09-03 2014-06-11 Soitec Method for fabricating a semiconductor on insulator substrate with reduced SECCO defect density
FR2938118B1 (fr) * 2008-10-30 2011-04-22 Soitec Silicon On Insulator Procede de fabrication d'un empilement de couches minces semi-conductrices
FR2938119B1 (fr) * 2008-10-30 2011-04-22 Soitec Silicon On Insulator Procede de detachement de couches semi-conductrices a basse temperature
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
FR2989516B1 (fr) * 2012-04-11 2014-04-18 Soitec Silicon On Insulator Procede de fabrication d'une structure soi mettant en oeuvre deux rta
CN111312852B (zh) * 2019-11-26 2020-10-20 中国科学院上海微系统与信息技术研究所 氧化镓半导体结构、日盲光电探测器及制备方法

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JP4934966B2 (ja) * 2005-02-04 2012-05-23 株式会社Ｓｕｍｃｏ Ｓｏｉ基板の製造方法
FR2895563B1 (fr) * 2005-12-22 2008-04-04 Soitec Silicon On Insulator Procede de simplification d'une sequence de finition et structure obtenue par le procede
FR2896619B1 (fr) * 2006-01-23 2008-05-23 Soitec Silicon On Insulator Procede de fabrication d'un substrat composite a proprietes electriques ameliorees
FR2903809B1 (fr) * 2006-07-13 2008-10-17 Soitec Silicon On Insulator Traitement thermique de stabilisation d'interface e collage.

Also Published As

Publication number Publication date
KR20080007094A (ko) 2008-01-17
US7863158B2 (en) 2011-01-04
US20080014718A1 (en) 2008-01-17
KR100890792B1 (ko) 2009-03-31
JP2008021992A (ja) 2008-01-31
EP1879225A1 (fr) 2008-01-16
TWI344206B (en) 2011-06-21
EP2256798A1 (fr) 2010-12-01
CN101106073B (zh) 2012-05-30
TW200805625A (en) 2008-01-16
FR2903809B1 (fr) 2008-10-17
US20080014713A1 (en) 2008-01-17
US8461018B2 (en) 2013-06-11
FR2903809A1 (fr) 2008-01-18
US20110233720A1 (en) 2011-09-29
CN101106073A (zh) 2008-01-16
US8216916B2 (en) 2012-07-10

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