SG114523A1 - Polishing composition and polishing method employing it - Google Patents

Polishing composition and polishing method employing it

Info

Publication number
SG114523A1
SG114523A1 SG200200485A SG200200485A SG114523A1 SG 114523 A1 SG114523 A1 SG 114523A1 SG 200200485 A SG200200485 A SG 200200485A SG 200200485 A SG200200485 A SG 200200485A SG 114523 A1 SG114523 A1 SG 114523A1
Authority
SG
Singapore
Prior art keywords
polishing
method employing
composition
polishing composition
polishing method
Prior art date
Application number
SG200200485A
Other languages
English (en)
Inventor
Kawase Akihiro
Okamura Masao
Inoue Yutaka
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18891966&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG114523(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG114523A1 publication Critical patent/SG114523A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Weting (AREA)
SG200200485A 2001-02-02 2002-01-24 Polishing composition and polishing method employing it SG114523A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001027276A JP3440419B2 (ja) 2001-02-02 2001-02-02 研磨用組成物およびそれを用いた研磨方法

Publications (1)

Publication Number Publication Date
SG114523A1 true SG114523A1 (en) 2005-09-28

Family

ID=18891966

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200200485A SG114523A1 (en) 2001-02-02 2002-01-24 Polishing composition and polishing method employing it

Country Status (8)

Country Link
US (1) US6852009B2 (fr)
EP (1) EP1229094B1 (fr)
JP (1) JP3440419B2 (fr)
CN (1) CN1266243C (fr)
DE (1) DE60225956T2 (fr)
MY (1) MY129070A (fr)
SG (1) SG114523A1 (fr)
TW (1) TWI245335B (fr)

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JP4668528B2 (ja) * 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド 研磨用組成物
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JP4814502B2 (ja) * 2004-09-09 2011-11-16 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
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JP4487753B2 (ja) * 2004-12-10 2010-06-23 株式会社Ｓｕｍｃｏ シリコンウェーハ用のアルカリエッチング液及び該エッチング液を用いたエッチング方法
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US7351662B2 (en) * 2005-01-07 2008-04-01 Dupont Air Products Nanomaterials Llc Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization
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US7452481B2 (en) 2005-05-16 2008-11-18 Kabushiki Kaisha Kobe Seiko Sho Polishing slurry and method of reclaiming wafers
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KR100641348B1 (ko) * 2005-06-03 2006-11-03 주식회사 케이씨텍 Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법
JP2007103515A (ja) * 2005-09-30 2007-04-19 Fujimi Inc 研磨方法
JP2007214205A (ja) * 2006-02-07 2007-08-23 Fujimi Inc 研磨用組成物
JP4582798B2 (ja) * 2006-02-09 2010-11-17 ニチコン株式会社 電解コンデンサの駆動用電解液及びこれを用いた電解コンデンサ
JP4582797B2 (ja) * 2006-02-09 2010-11-17 ニチコン株式会社 電解コンデンサの駆動用電解液及びこれを用いた電解コンデンサ
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JP5518334B2 (ja) 2006-07-05 2014-06-11 デュポン エア プロダクツ ナノマテリアルズ，リミティド ライアビリティ カンパニー シリコンウエハ用研磨組成物、シリコンウエハの研磨方法およびシリコンウエハ用研磨組成物キット
JP5335183B2 (ja) * 2006-08-24 2013-11-06 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法
JP5204960B2 (ja) * 2006-08-24 2013-06-05 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法
KR100839355B1 (ko) * 2006-11-28 2008-06-19 삼성전자주식회사 기판의 재생 방법
JP5148948B2 (ja) * 2007-08-23 2013-02-20 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 研磨用スラリーのリサイクル方法
US8017524B2 (en) * 2008-05-23 2011-09-13 Cabot Microelectronics Corporation Stable, high rate silicon slurry
JP5474400B2 (ja) * 2008-07-03 2014-04-16 株式会社フジミインコーポレーテッド 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法
EP2352167B1 (fr) * 2008-11-10 2017-02-15 Asahi Glass Company, Limited Composition abrasive et procédé de fabrication d'un dispositif à circuit intégré semi-conducteur
JP5492603B2 (ja) * 2010-03-02 2014-05-14 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
US8232208B2 (en) * 2010-06-15 2012-07-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stabilized chemical mechanical polishing composition and method of polishing a substrate
JP5551042B2 (ja) * 2010-09-30 2014-07-16 株式会社クラレ 化学的機械的研磨法およびそれに用いられるスラリー
WO2012127398A1 (fr) * 2011-03-22 2012-09-27 Basf Se Composition de polissage chimique-mécanique (cmp) comprenant une polyamine polymère
JP2011181948A (ja) * 2011-04-25 2011-09-15 Fujimi Inc 研磨用組成物及びそれを用いた研磨パッドの目詰まり低減方法
ES2868093T3 (es) 2012-09-17 2021-10-21 Grace W R & Co Medio y dispositivos de cromatografía
CN104768536B (zh) 2012-09-17 2019-03-29 格雷斯公司 官能化微粒状载体材料和其制备和使用方法
EP3094390B1 (fr) 2014-01-16 2021-07-07 W.R. Grace & CO. - CONN. Supports de chromatographie d'affinité et dispositifs de chromatographie
US11389783B2 (en) 2014-05-02 2022-07-19 W.R. Grace & Co.-Conn. Functionalized support material and methods of making and using functionalized support material
WO2016132676A1 (fr) * 2015-02-19 2016-08-25 株式会社フジミインコーポレーテッド Composition de polissage de tranches de silicium et procédé de polissage
US10695744B2 (en) 2015-06-05 2020-06-30 W. R. Grace & Co.-Conn. Adsorbent biprocessing clarification agents and methods of making and using the same
US10683439B2 (en) 2018-03-15 2020-06-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
WO2020120641A1 (fr) 2018-12-12 2020-06-18 Basf Se Polissage mécano-chimique de substrats contenant du cuivre et du ruthénium
EP3894494A1 (fr) 2018-12-12 2021-10-20 Basf Se Polissage mécano-chimique de substrats contenant du cuivre et du ruthénium
KR20210102947A (ko) 2018-12-12 2021-08-20 바스프 에스이 구리 및 루테늄을 함유하는 기판의 화학적 기계적 폴리싱
JPWO2023032714A1 (fr) * 2021-09-01 2023-03-09

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Publication number Priority date Publication date Assignee Title
EP0401147B1 (fr) * 1989-03-07 1995-12-20 International Business Machines Corporation Procédé pour le polissage chémico-mécanique d'un substrat d'un composant électronique, et composition de polissage pour ce procédé
US5916819A (en) * 1996-07-17 1999-06-29 Micron Technology, Inc. Planarization fluid composition chelating agents and planarization method using same
WO1999032570A1 (fr) * 1997-12-23 1999-07-01 Akzo Nobel N.V. Composition pour polissage mecanique et chimique
GB2341190A (en) * 1998-09-01 2000-03-08 Fujimi Inc A polishing composition for polishing a memory hard disk
WO2000024842A1 (fr) * 1998-10-23 2000-05-04 Arch Specialty Chemicals, Inc. Systeme de boue de polissage chimico-mecanique comprenant une solution activatrice
EP1006166A1 (fr) * 1998-12-01 2000-06-07 Fujimi Incorporated Composition de polissage et procédé de polissage utilisant cette composition
GB2354526A (en) * 1999-09-27 2001-03-28 Fujimi America Inc Polishing compositions for magnetic disks

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Publication number Priority date Publication date Assignee Title
EP0401147B1 (fr) * 1989-03-07 1995-12-20 International Business Machines Corporation Procédé pour le polissage chémico-mécanique d'un substrat d'un composant électronique, et composition de polissage pour ce procédé
US5916819A (en) * 1996-07-17 1999-06-29 Micron Technology, Inc. Planarization fluid composition chelating agents and planarization method using same
WO1999032570A1 (fr) * 1997-12-23 1999-07-01 Akzo Nobel N.V. Composition pour polissage mecanique et chimique
GB2341190A (en) * 1998-09-01 2000-03-08 Fujimi Inc A polishing composition for polishing a memory hard disk
WO2000024842A1 (fr) * 1998-10-23 2000-05-04 Arch Specialty Chemicals, Inc. Systeme de boue de polissage chimico-mecanique comprenant une solution activatrice
EP1006166A1 (fr) * 1998-12-01 2000-06-07 Fujimi Incorporated Composition de polissage et procédé de polissage utilisant cette composition
GB2354526A (en) * 1999-09-27 2001-03-28 Fujimi America Inc Polishing compositions for magnetic disks

Also Published As

Publication number Publication date
MY129070A (en) 2007-03-30
JP2002226836A (ja) 2002-08-14
JP3440419B2 (ja) 2003-08-25
EP1229094A3 (fr) 2003-10-22
DE60225956T2 (de) 2009-05-20
EP1229094B1 (fr) 2008-04-09
DE60225956D1 (de) 2008-05-21
EP1229094A2 (fr) 2002-08-07
US6852009B2 (en) 2005-02-08
CN1369534A (zh) 2002-09-18
US20020151252A1 (en) 2002-10-17
CN1266243C (zh) 2006-07-26
TWI245335B (en) 2005-12-11

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