SG11201906281RA - Activation of wafer particle defects for spectroscopic composition analysis - Google Patents

Activation of wafer particle defects for spectroscopic composition analysis

Info

Publication number
SG11201906281RA
SG11201906281RA SG11201906281RA SG11201906281RA SG11201906281RA SG 11201906281R A SG11201906281R A SG 11201906281RA SG 11201906281R A SG11201906281R A SG 11201906281RA SG 11201906281R A SG11201906281R A SG 11201906281RA SG 11201906281R A SG11201906281R A SG 11201906281RA
Authority
SG
Singapore
Prior art keywords
particle
international
wafer
composition analysis
spectroscopic
Prior art date
Application number
SG11201906281RA
Other languages
English (en)
Inventor
Kurt Haller
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201906281RA publication Critical patent/SG11201906281RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/65—Raman scattering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
SG11201906281RA 2017-01-30 2018-01-26 Activation of wafer particle defects for spectroscopic composition analysis SG11201906281RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/419,355 US10551320B2 (en) 2017-01-30 2017-01-30 Activation of wafer particle defects for spectroscopic composition analysis
PCT/US2018/015570 WO2018140805A1 (en) 2017-01-30 2018-01-26 Activation of wafer particle defects for spectroscopic composition analysis

Publications (1)

Publication Number Publication Date
SG11201906281RA true SG11201906281RA (en) 2019-08-27

Family

ID=62977757

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201906281RA SG11201906281RA (en) 2017-01-30 2018-01-26 Activation of wafer particle defects for spectroscopic composition analysis

Country Status (8)

Country Link
US (1) US10551320B2 (enExample)
EP (1) EP3549160B1 (enExample)
JP (1) JP6916886B2 (enExample)
KR (1) KR102353259B1 (enExample)
CN (1) CN110313058B (enExample)
SG (1) SG11201906281RA (enExample)
TW (1) TWI764979B (enExample)
WO (1) WO2018140805A1 (enExample)

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CN114544208A (zh) * 2021-11-04 2022-05-27 万向一二三股份公司 一种超声焊接机稳定性检测装置和方法
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TWI833390B (zh) * 2022-02-23 2024-02-21 南亞科技股份有限公司 製造缺陷原因之識別系統以及非暫時性電腦可讀媒體
US12118709B2 (en) 2022-02-23 2024-10-15 Nanya Technology Corporation Method for identifying cause of manufacturing defects
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CN116660285B (zh) * 2023-07-26 2023-11-17 浙江大学 一种晶圆特征光谱在线检测装置
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Also Published As

Publication number Publication date
US20180217065A1 (en) 2018-08-02
EP3549160A1 (en) 2019-10-09
CN110313058A (zh) 2019-10-08
EP3549160A4 (en) 2020-07-08
EP3549160B1 (en) 2022-01-05
CN110313058B (zh) 2022-06-28
JP6916886B2 (ja) 2021-08-11
WO2018140805A1 (en) 2018-08-02
TWI764979B (zh) 2022-05-21
US10551320B2 (en) 2020-02-04
KR102353259B1 (ko) 2022-01-18
KR20190104628A (ko) 2019-09-10
TW201832304A (zh) 2018-09-01
JP2020505607A (ja) 2020-02-20

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