TWI764979B - 用於光譜組成分析之晶圓粒子缺陷之活化 - Google Patents
用於光譜組成分析之晶圓粒子缺陷之活化 Download PDFInfo
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- TWI764979B TWI764979B TW107103149A TW107103149A TWI764979B TW I764979 B TWI764979 B TW I764979B TW 107103149 A TW107103149 A TW 107103149A TW 107103149 A TW107103149 A TW 107103149A TW I764979 B TWI764979 B TW I764979B
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/65—Raman scattering
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
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- Physics & Mathematics (AREA)
- Immunology (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/419,355 US10551320B2 (en) | 2017-01-30 | 2017-01-30 | Activation of wafer particle defects for spectroscopic composition analysis |
| US15/419,355 | 2017-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201832304A TW201832304A (zh) | 2018-09-01 |
| TWI764979B true TWI764979B (zh) | 2022-05-21 |
Family
ID=62977757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107103149A TWI764979B (zh) | 2017-01-30 | 2018-01-30 | 用於光譜組成分析之晶圓粒子缺陷之活化 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10551320B2 (enExample) |
| EP (1) | EP3549160B1 (enExample) |
| JP (1) | JP6916886B2 (enExample) |
| KR (1) | KR102353259B1 (enExample) |
| CN (1) | CN110313058B (enExample) |
| SG (1) | SG11201906281RA (enExample) |
| TW (1) | TWI764979B (enExample) |
| WO (1) | WO2018140805A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI880367B (zh) * | 2022-11-03 | 2025-04-11 | 韓國機械研究院 | 用於等離子體器件的工藝監測系統 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10438339B1 (en) | 2016-09-12 | 2019-10-08 | Apple Inc. | Optical verification system and methods of verifying micro device transfer |
| CN120107078A (zh) * | 2018-07-13 | 2025-06-06 | Asml荷兰有限公司 | Sem图像增强方法和系统 |
| IL263106B2 (en) * | 2018-11-19 | 2023-02-01 | Nova Ltd | Integrated measurement system |
| CN111007016A (zh) * | 2019-12-09 | 2020-04-14 | 暨南大学 | 一种检测透明材料表面微小颗粒杂质的装置及使用方法 |
| KR102788882B1 (ko) | 2020-03-26 | 2025-04-01 | 삼성전자주식회사 | 기판 검사 시스템 |
| CN111879749B (zh) * | 2020-07-23 | 2023-02-14 | 西安近代化学研究所 | 压装pbx炸药柱中nto晶体品质表征方法 |
| US12345658B2 (en) * | 2020-09-24 | 2025-07-01 | Kla Corporation | Large-particle monitoring with laser power control for defect inspection |
| KR20220041388A (ko) | 2020-09-25 | 2022-04-01 | 세메스 주식회사 | 광학계 교정 방법 |
| EP3995808B1 (de) * | 2020-11-09 | 2023-01-04 | Siltronic AG | Verfahren zum klassifizieren von unbekannten partikeln auf einer oberfläche einer halbleiterscheibe |
| KR102501486B1 (ko) * | 2020-12-10 | 2023-02-17 | 한국화학연구원 | 나노 입자 또는 나노 구조체에서 발생된 분광 신호 분석 시스템 및 분석 방법 |
| US11879853B2 (en) * | 2021-02-19 | 2024-01-23 | Kla Corporation | Continuous degenerate elliptical retarder for sensitive particle detection |
| CN113884443A (zh) * | 2021-05-19 | 2022-01-04 | 北京航空航天大学 | 基于磁光克尔效应的磁性晶圆大视野成像方法和成像装置 |
| CN114544208A (zh) * | 2021-11-04 | 2022-05-27 | 万向一二三股份公司 | 一种超声焊接机稳定性检测装置和方法 |
| KR102602029B1 (ko) * | 2021-11-11 | 2023-11-14 | 주식회사 에타맥스 | 광루미네선스 검사와 자동광학검사를 동시에 수행하는 마이크로 led 검사장비 |
| TWI833390B (zh) * | 2022-02-23 | 2024-02-21 | 南亞科技股份有限公司 | 製造缺陷原因之識別系統以及非暫時性電腦可讀媒體 |
| US12118709B2 (en) | 2022-02-23 | 2024-10-15 | Nanya Technology Corporation | Method for identifying cause of manufacturing defects |
| US12175652B2 (en) | 2022-02-23 | 2024-12-24 | Nanya Technology Corporation | System and non-transitory computer-readable medium for identifying cause of manufacturing defects |
| CN116660285B (zh) * | 2023-07-26 | 2023-11-17 | 浙江大学 | 一种晶圆特征光谱在线检测装置 |
| FR3155632B1 (fr) * | 2023-11-21 | 2025-11-07 | Soitec Silicon On Insulator | procédé de fabrication d’une structure composite incluant une étape de gradation |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080084555A1 (en) * | 2006-10-06 | 2008-04-10 | Woo Sik Yoo | Raman and photoluminescence spectroscopy |
| US20110292376A1 (en) * | 2010-05-26 | 2011-12-01 | Kukushkin Igor V | Apparatus and method for detecting raman and photoluminescence spectra of a substance |
| TWI639703B (zh) * | 2011-01-21 | 2018-11-01 | 賽瑞諾斯有限公司 | 樣本使用最大化之系統及方法 |
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| US6201601B1 (en) | 1997-09-19 | 2001-03-13 | Kla-Tencor Corporation | Sample inspection system |
| US6208411B1 (en) | 1998-09-28 | 2001-03-27 | Kla-Tencor Corporation | Massively parallel inspection and imaging system |
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| JP3741602B2 (ja) * | 1999-11-26 | 2006-02-01 | 日本電子株式会社 | 顕微ラマン分光システム |
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| JP2003059988A (ja) * | 2001-08-10 | 2003-02-28 | Matsushita Electric Ind Co Ltd | 半導体装置の欠陥検出法および装置 |
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| CN110313058A (zh) | 2019-10-08 |
| JP2020505607A (ja) | 2020-02-20 |
| US10551320B2 (en) | 2020-02-04 |
| EP3549160A1 (en) | 2019-10-09 |
| EP3549160A4 (en) | 2020-07-08 |
| US20180217065A1 (en) | 2018-08-02 |
| KR102353259B1 (ko) | 2022-01-18 |
| EP3549160B1 (en) | 2022-01-05 |
| JP6916886B2 (ja) | 2021-08-11 |
| WO2018140805A1 (en) | 2018-08-02 |
| CN110313058B (zh) | 2022-06-28 |
| SG11201906281RA (en) | 2019-08-27 |
| TW201832304A (zh) | 2018-09-01 |
| KR20190104628A (ko) | 2019-09-10 |
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